1300894 九、發明說明： 【發明所屬之技術領域】 本發明係涉及一種散熱模組，尤係涉及一種用於對電 子元件散熱之散熱模組。 【先前技術】 隨著中央處理器（CPU)等發熱電子元件功率之不斷 提升，散熱問題越來越受到人們之重視，在筆記型電腦中 更是如此。 在散熱領域中，目前業界通常採用散熱模組對發熱電 子元件進行散熱，目前大多數筆記型電腦中所使用之散熱 模組一般係由風扇、熱管及鰭片組等組成。該熱管一端與 發熱電子元件熱接觸，另一端與該鰭片組連接。該散熱模 組藉由熱管將發熱電子元件產生之熱量傳遞至鰭片組上， 並利用風扇運轉產生之氣流與鰭片組發生熱交換以將熱量 最終散發到周圍環境中，從而達到對發熱電子元件散熱之 目的。 上述散熱模組組裝到筆記型電腦上時，需利用螺絲將 風扇之殼座等元件固定於筆記型電腦之機殼上，其結合程 序較為複雜。此外，該散熱模組製造時，需要為製作該風 扇之殼座單獨開發模具，而該風扇之殼座之結構較為複 雜，使模具開發費用增加，從而使該散熱模組之生產成本 較高，需加以改進。 【發明内容】 6 1300894 有馨於此，有必要提供一種具有結合程序簡單且可減 少生產成本之散熱模組。 該散熱模組包括一骨架、設於該骨架上之一離心風扇 及設於該離心風扇之出風口處之—散熱則組，該離心風 扇包括㊅座、设於該殼座上之—蓋板及收容於該殼座與 蓋板所形成之料空咖之—轉子，射該殼座與該骨架 為一體成型。 與習知技術相比，由於該散熱模組之離心風扇之殼座 與該月架-體成型製成’組裝時無需彻_將離心風扇 之/v又座□疋於肖木上，絲程序簡單。該骨架與離心風扇 之殼座用—套模具即可成型，無需分顺骨架與離心風扇 之殼座單觸發模具，可料難之設計及製造成本，同 時該離心風扇之殼座與骨架—體成型還減少離心風扇之殼 座這一分離之料件。 【實施方式】 圖1所不為本發明散熱模組之一較佳實施例，其包括 一骨架（R〇U⑽）10、一離心風扇20、-散熱鰭片組30 及第一熱管40與第二熱管5〇。 如圖2所示，該骨架1〇為一設有複數孔、槽及螺絲鎖 固孔之框架。如圖3所示，該骨架1()安裝於一筆記型電腦 之機殼60内’該骨架1〇為與機殼6〇分離之構件，用於固 定筆記型電腦之内部組件如主板、硬碟等。面對來自外界 之衝擊該月架10成夠給主板、硬碟以及其他内部組件以 良好保護。 1300894 . 如圖2所不，該離心風扇20可設於該骨架ι〇上，該 — 妓10對應離心風扇20之位置具有兩相鄰之側邊120、 140，該兩侧邊120，140上分別開設有一開口 122、142， 以供離心風扇20向外出風。 該離心風扇20包括一支撐部22、一殼座24、一設於 該殼座24上之蓋板26及一轉子28。該殼座24與骨架1〇 由具有局導熱性能之金屬材料如鎂合金、鋁合金等藉由壓 瞻鑄之方式一體成型，此外，該殼座24與骨架1〇也可由塑 膠一體射出成型。該支撐部22設於該殼座24之底部，該 蓋板26蓋設於該殼座24上並與該殼座24合圍形成一容置 空間，該轉子28設於該容置空間内。 該殼座24包括一底板242及一侧壁244，該侧壁244 上設有一出風口 246,該出風口 246與骨架1〇之侧邊12〇、 140上之開口 122、142相連通。該殼座24之底板242與 侧壁244垂直，其中央部位開設有一圓孔248。該支撐部 _ 22设於該圓孔248内’並藉由螺絲等固定元件（圖未示） 將該支撐部22鎖固至底板242上。該支撐部22上設有複 數開孔以作為離心風扇20之第一入風口 220，以供外界空 氣進入離心風扇20之殼座24内。該轉子28設於殼座24 與蓋板26所形成之容置空間内，並固定於該支撐部22上。 該蓋板26蓋設於該殼座24上，其由具有高導熱性能之金 屬，如銅 '鋁等製成。該蓋板26對應該轉子28之部位開 設有第二入風口 260，以供外界空氣進入離心風扇2〇之殼 座24内。該蓋板26於遠離骨架1〇之側邊140之一側向下 8 1300894 弯折並水平延伸出-平板加，該平板啦上開設有一矩 形之孔洞264。該平板262對應該孔洞施之四角之位置 分別設有-狀彈片266’所述固轉片266與該平板脱 ^鉚接、螺接等方式狀至該平板规上。姻所述固 疋彈片266及複數螺釘（圖未示），可將該平板固定 於該骨架1〇上’使一設於該平板262下部之發熱電子元件 (圖未不）與設於平板262上部之第一熱管奶熱連接。 該散熱鰭片組30由複數.鳍片31〇堆疊成弧形，每相鄰 兩轉片310之間形成一風道32〇。該散熱籍片組％設於離 心風扇20之出風口 246處，其下侧面與殼座％之底板242 相貼合。 該第一熱管40呈C形且為扁平狀，其具有一蒸發段 410及一冷凝段420，該蒸發段41〇與設於該平板262下部 之-發熱電子元件熱連接，該冷凝段·固設於散献鰭片 組30之上端面。該第二熱管5〇呈s形且也為扁平狀，其 具有與另一發熱電子元件（圖未示）熱連接之一蒸發段 及固設於散熱鰭片組30上端面之一冷凝段52〇。 該政熱模組之離心風扇20之殼座24與該骨架1〇 一體 成型製成，組裝時，該支樓部22藉由螺絲等固定元件固定 於殼座24之底板242之底部，該轉子28設於殼座24與蓋 板26 5圍形成之谷置空間内，並固定於該支撐部η上， 該散熱鰭片組30設於離心風扇20之出風口 246處，該蓋 板26蓋設於殼座24上。該第一熱管4〇之蒸發段41〇與一 發熱電子元件熱連接’其冷凝段42〇固設於該散熱鰭片組 1300894 - 30之上端面，該第二熱管50之蒸發段510與另一發熱電 子70件熱連接’其冷凝段520固設於散熱籍片組3〇之上端 面。 工作時’該第一熱管40及第二熱管50將其吸收之熱 量傳至散熱鰭片組30 ’再由離心風扇2〇產生之氣流與散 熱縛片組30之鯖片310發生熱交換’以將熱量散發到周圍 環境中。其中離心風扇20產生之氣流流經散熱轉片組3〇 _ 之氣流通道320，再經骨架1〇之兩相鄰側邊120、14〇之 開口 122、142流出。 與習知散減組概，錄絲組之離颂扇2〇之崎 座24與該骨架10 一體成型製成，組褒時無需利用螺絲將 離心風扇2〇之殼座24固定於骨架1〇上，節省筆記型電腦 之組裝工序，組裝程序簡單。另，該骨架ι〇與離心風扇 20之殼座24用-套模具即可成型，無需分別為骨架1〇與 離心風扇20之殼座24單獨開發模具’可節省模具之設計 • 及製造成本’同時該離心風扇20與骨架10 -體成型還減 少離心風扇20之殼座24這-分離之料件，從而降低生產 成本。 綜上所述，本發明符合發明專利要件，差依法提出專 利申請。惟，以上所述者僅為本發明之較佳實施例，舉凡 熟悉本案技藝之人士，在爰依本發明精神所作之等效修飾 或變化，皆應涵蓋於以下之申請專利範圍内。 【圖式簡單說明】 圖1係本發明散熱模組之立體組裝示意圖。 1300894 圖2係圖1所示散熱模組之立體分解示意圖。 圖3係圖1所示散熱模組與一機殼之組裝示意圖。 【主要元件符號說明】 骨架 10 侧邊 120、 140 開口 122、142 離心風扇 20 支撐部 22 第一入風口 220 殼座 24 底板. 242 侧壁 244 出風口 246 圓孔 248 盖板 26 第二入風口 260 平板 262 孔洞 264 固定彈片 266 轉子 28 散熱鰭片組 30 鰭片 310 風道 320 第一熱管 40 蒸發段 410、 510 冷凝段 420、 520 第二熱管 50 機殼 60 111300894 IX. Description of the Invention: [Technical Field] The present invention relates to a heat dissipation module, and more particularly to a heat dissipation module for dissipating heat from an electronic component. [Prior Art] With the continuous increase in the power of heat-generating electronic components such as a central processing unit (CPU), heat dissipation has received more and more attention, especially in notebook computers. In the field of heat dissipation, the heat dissipation module is generally used in the industry to dissipate heat-generating electronic components. Currently, the heat-dissipation modules used in most notebook computers are generally composed of a fan, a heat pipe, and a fin set. One end of the heat pipe is in thermal contact with the heat generating electronic component, and the other end is connected to the fin set. The heat dissipation module transfers heat generated by the heat-generating electronic components to the fin set by the heat pipe, and uses the airflow generated by the fan to exchange heat with the fin group to finally dissipate heat to the surrounding environment, thereby achieving heat-generating electrons. The purpose of component heat dissipation. When the above heat dissipating module is assembled to the notebook computer, the components such as the fan's housing and the like are fixed on the casing of the notebook computer by screws, and the combination procedure is complicated. In addition, when the heat dissipation module is manufactured, it is necessary to separately develop a mold for the housing of the fan, and the structure of the housing of the fan is complicated, so that the development cost of the mold is increased, so that the production cost of the heat dissipation module is high. Need to be improved. SUMMARY OF THE INVENTION 6 1300894 In this case, it is necessary to provide a heat dissipation module which has a simple combination process and can reduce the production cost. The heat dissipation module includes a skeleton, a centrifugal fan disposed on the skeleton, and a heat dissipation group disposed at an air outlet of the centrifugal fan. The centrifugal fan includes a six-seat cover disposed on the housing. And a rotor that is received by the shell and the cover plate, and the shell is integrally formed with the skeleton. Compared with the conventional technology, since the housing of the centrifugal fan of the heat dissipation module and the structure of the moon frame are formed, it is not necessary to assemble the fan/v and the seat of the centrifugal fan on the shovel. simple. The skeleton and the housing of the centrifugal fan can be formed by using a sleeve mold, and the single-trigger mold of the housing of the centrifugal fan and the centrifugal fan is not required, and the design and manufacturing cost of the casing can be difficult, and the housing and the skeleton of the centrifugal fan are Forming also reduces the separate material of the housing of the centrifugal fan. [Embodiment] FIG. 1 is not a preferred embodiment of the heat dissipation module of the present invention, and includes a skeleton (R〇U(10)) 10, a centrifugal fan 20, a heat dissipation fin set 30, and a first heat pipe 40 and a first Two heat pipes are 5 〇. As shown in Fig. 2, the skeleton 1 is a frame provided with a plurality of holes, slots and screw locking holes. As shown in FIG. 3, the skeleton 1() is installed in a casing 60 of a notebook computer. The skeleton 1 is a member separated from the casing 6 to fix internal components of the notebook computer such as a motherboard and a hard Dish and so on. In the face of the impact from the outside world, the moon frame is 10% enough to protect the motherboard, hard disk and other internal components. 1300894. As shown in FIG. 2, the centrifugal fan 20 can be disposed on the skeleton ι, and the 妓10 corresponds to the position of the centrifugal fan 20 and has two adjacent sides 120, 140 on the two sides 120, 140. Openings 122, 142 are respectively opened for the centrifugal fan 20 to vent outward. The centrifugal fan 20 includes a support portion 22, a housing 24, a cover plate 26 disposed on the housing 24, and a rotor 28. The housing 24 and the frame 1 are integrally formed by a metal material having a local thermal conductivity such as a magnesium alloy, an aluminum alloy, or the like by compression molding. Further, the housing 24 and the frame 1 can be integrally molded by molding. The support portion 22 is disposed at the bottom of the housing. The cover plate 26 is disposed on the housing 24 and defines an accommodation space. The rotor 28 is disposed in the accommodating space. The housing 24 includes a bottom plate 242 and a side wall 244. The side wall 244 defines an air outlet 246 that communicates with the openings 122, 142 of the side edges 12, 140 of the frame 1 . The bottom plate 242 of the housing 24 is perpendicular to the side wall 244, and a circular hole 248 is defined in a central portion thereof. The support portion 22 is disposed in the circular hole 248 and the support portion 22 is locked to the bottom plate 242 by a fixing member (not shown) such as a screw. The support portion 22 is provided with a plurality of openings as the first air inlet 220 of the centrifugal fan 20 for the outside air to enter the housing 24 of the centrifugal fan 20. The rotor 28 is disposed in the accommodating space formed by the housing 24 and the cover 26 and is fixed to the support portion 22. The cover plate 26 is covered on the housing 24 and is made of a metal having high thermal conductivity such as copper 'aluminum or the like. The cover plate 26 is provided with a second air inlet 260 corresponding to the portion of the rotor 28 for the outside air to enter the housing 24 of the centrifugal fan 2 . The cover plate 26 is bent downwardly from the side of the side 140 of the frame 1 from the side of the frame 1 and extends horizontally to the flat plate. A rectangular hole 264 is defined in the plate. The flat plate 262 is provided with a --shaped elastic piece 266' corresponding to the four corners of the hole, and the fixed rotating piece 266 is detached and screwed to the flat plate. The solid-state elastic piece 266 and the plurality of screws (not shown) can be fixed on the frame 1 to make a heat-generating electronic component (not shown) disposed on the lower portion of the flat plate 262 and the flat plate 262 The first heat pipe of the upper part is connected by heat. The heat dissipation fin group 30 is formed by arcing a plurality of fins 31, and a wind tunnel 32 is formed between each adjacent two rotation sheets 310. The heat radiating chip group % is disposed at the air outlet 246 of the centrifugal fan 20, and the lower side thereof is in contact with the bottom plate 242 of the housing seat %. The first heat pipe 40 has a C shape and is flat, and has an evaporation section 410 and a condensation section 420. The evaporation section 41 is thermally connected to a heat generating electronic component disposed at a lower portion of the flat plate 262. The condensation section is solid. It is disposed on the upper end surface of the diffused fin group 30. The second heat pipe 5 is s-shaped and also flat, and has an evaporation section thermally connected to another heat-generating electronic component (not shown) and a condensation section 52 fixed on the upper end surface of the heat dissipation fin set 30. Hey. The housing 24 of the centrifugal fan 20 of the political heat module is integrally formed with the frame 1 ,. When assembled, the branch portion 22 is fixed to the bottom of the bottom plate 242 of the housing 24 by a fixing component such as a screw. The rotor 28 is disposed in the valley space formed by the casing 24 and the cover plate 56, and is fixed on the support portion η. The heat dissipation fin group 30 is disposed at the air outlet 246 of the centrifugal fan 20, and the cover plate 26 is disposed. Covered on the housing 24 . The evaporation section 41 of the first heat pipe 4 is thermally connected to a heat-generating electronic component. The condensation section 42 is fixed to the upper end surface of the heat dissipation fin set 1300894 - 30, and the evaporation section 510 of the second heat pipe 50 and the other A heat-generating electronic 70-piece heat connection 'the condensation section 520 is fixed to the upper end surface of the heat-dissipating group 3〇. During operation, the first heat pipe 40 and the second heat pipe 50 transfer the absorbed heat to the heat sink fin set 30', and then the airflow generated by the centrifugal fan 2〇 is heat exchanged with the heat sink tab group 30 of the heat sink tab group 30. Dissipate heat to the surrounding environment. The airflow generated by the centrifugal fan 20 flows through the airflow passage 320 of the heat-dissipating rotor set 3〇, and flows out through the openings 122, 142 of the adjacent side edges 120, 14 of the skeleton 1〇. In combination with the conventional knowledge-reducing group, the shovel seat 2 of the shovel group is formed integrally with the skeleton 10, and the set of the centrifugal fan 2 24 24 is fixed to the skeleton without using a screw. In the above, the assembly process of the notebook computer is saved, and the assembly procedure is simple. In addition, the skeleton ι and the housing 24 of the centrifugal fan 20 can be formed by using a sleeve mold, and it is not necessary to separately develop a mold for the skeleton 1 and the housing 24 of the centrifugal fan 20, which can save the design of the mold and the manufacturing cost. At the same time, the centrifugal fan 20 and the body 10 are also formed to reduce the material of the housing 24 of the centrifugal fan 20, thereby reducing the production cost. In summary, the present invention complies with the invention patent requirements, and the patent application is made according to law. However, the above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art will be included in the following claims. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of a three-dimensional assembly of a heat dissipation module of the present invention. 1300894 FIG. 2 is a perspective exploded view of the heat dissipation module shown in FIG. 1. FIG. 3 is a schematic view showing the assembly of the heat dissipation module and the casing shown in FIG. [Main component symbol description] Skeleton 10 side 120, 140 opening 122, 142 centrifugal fan 20 support part 22 first air inlet 220 housing 24 bottom plate. 242 side wall 244 air outlet 246 round hole 248 cover plate 26 second air inlet 260 plate 262 hole 264 fixed shrapnel 266 rotor 28 heat sink fin set 30 fin 310 air duct 320 first heat pipe 40 evaporation section 410, 510 condensation section 420, 520 second heat pipe 50 casing 60 11