JP3084354U - Stacked heat sink device - Google Patents
Stacked heat sink deviceInfo
- Publication number
- JP3084354U JP3084354U JP2001005924U JP2001005924U JP3084354U JP 3084354 U JP3084354 U JP 3084354U JP 2001005924 U JP2001005924 U JP 2001005924U JP 2001005924 U JP2001005924 U JP 2001005924U JP 3084354 U JP3084354 U JP 3084354U
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- cooling
- fan
- heat
- sink device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
(57)【要約】
【課題】 CPUに取付けられたヒートシンクで風量を
増大して冷却効果を向上さすと共にファン故障時に対応
した冷却風の確保が問題となる。
【解決手段】 従来のファン埋め込み型ヒートシンクを
2段積み重ね一体化したことを特徴とする積層型ヒート
シンク装置。
(57) [Problem] To improve the cooling effect by increasing the air volume with a heat sink attached to a CPU, and to secure cooling air in response to a fan failure. SOLUTION: The stacked heat sink device is characterized by stacking and integrating two conventional heat sinks with embedded fans.
Description
【0001】[0001]
本考案は電子部品の発熱素子を冷却するためのファン埋め込み型ヒートシンク の改良に関するものである。 The present invention relates to an improvement of a heat sink with a built-in fan for cooling a heating element of an electronic component.
【0002】[0002]
従来のファン埋め込み型ヒートシンクとしては図1のように冷却ファンと放熱 フィンがそれぞれ1個しか装着されていなかった。しかし最近のコンピューター の高発熱化に対しては風量が不足して冷却効果が少なかったり、ファンが故障等 により停止すると冷却性能が低下して信頼性が無くなる欠点があった。図1は従 来のファン埋め込み型ヒートシンクの一実施例を示す斜視図で図2はその組み立 て図である。このように構成したヒートシンク1を発熱する電子部品に取付ける と電子部品の熱が熱伝導体3に伝達され、放熱フィン4に伝導されて熱放散する が冷却効果を増大さすために一般的に冷却ファン5が取付けられ強制的に空冷を 行っている。 As shown in FIG. 1, only one cooling fan and one heat dissipating fin were mounted on a conventional heat sink with embedded fans. However, the recent high heat generation of computers has the drawback that the airflow is insufficient and the cooling effect is low, and if the fan stops due to a failure or the like, the cooling performance is reduced and reliability is lost. FIG. 1 is a perspective view showing an embodiment of a conventional fan-embedded heat sink, and FIG. 2 is an assembled view thereof. When the heat sink 1 configured as described above is mounted on a heat-generating electronic component, the heat of the electronic component is transmitted to the heat conductor 3 and is transmitted to the heat radiation fins 4 to dissipate the heat. The fan 5 is attached and air cooling is forcibly performed.
【0003】[0003]
しかし最近のコンピューターの中央演算処理装置(以下CPUと称す)は益々 発熱量が増える傾向にあり、従来のファン埋め込み型ヒートシンクでは上記の欠 点である風量が不足したり、ファンが故障した時の安全保障が無く冷却能力は不 十分であった。 However, recent central processing units (hereinafter referred to as CPUs) in computers tend to generate more and more heat, and conventional heat sinks with embedded fans lack the above-mentioned drawbacks, such as insufficient airflow or failure of fans. There was no security and the cooling capacity was insufficient.
【0004】[0004]
従来のファン埋め込み型ヒートシンクは冷却ファン及び放熱フィンがそれぞれ 1個のみであったが、本考案は従来のファン埋め込み型ヒートシンクを2段に積 み重ね一体化したので風量を増大させると共にファン1個が故障等で停止しても 他のファンで冷却は持続させる事が可能でヒートシンクの信頼性が向上する。 The conventional heat sink with a built-in fan has only one cooling fan and one radiating fin, but the present invention increases the air volume and integrates one fan by stacking and integrating the conventional heat sink with a built-in fan in two stages. Even if the fan stops due to a failure or the like, cooling can be continued by another fan, and the reliability of the heat sink is improved.
【0005】[0005]
一般的に冷却効果を増大させるには冷却ファンを大きくしたり冷却ファンを並 列に設置したりしたものがあるが、これは装置全体の面積が大きくなり最近の小 型化とは逆行するが本考案のように冷却ファン及び放熱フィンを積み重ねる事は 取付面積のコンパクト化と共に風量が従来より増大し冷却効果が高まると共にフ ァン故障時の安全性が向上する。 In general, to increase the cooling effect, some cooling fans are enlarged or cooling fans are installed in parallel, but this is contrary to recent miniaturization due to the increase in the area of the entire device. Stacking cooling fins and radiating fins as in the present invention not only reduces the mounting area, but also increases the air volume and improves the cooling effect and improves the safety in the event of a fan failure.
【0006】 次に本考案の実施の形態を添付の図面を用いて説明する。図3は本考案の一実 施例の斜視図、図4は組み立て図である。Next, an embodiment of the present invention will be described with reference to the accompanying drawings. FIG. 3 is a perspective view of one embodiment of the present invention, and FIG. 4 is an assembly view.
【0007】 まず図4を用いて全体構成について説明する。1は本考案の積層型ヒートシン ク装置で2はヒートシンクを(CPUのソケットに)取付けるベース板、3は電 子部品の熱を伝導する熱伝導体、4は第1の放熱フィン、5は第1の冷却ファン 、6は第2の放熱フィン、7は第2の冷却ファンで順次ねじ止め等で積み重ねら れている。熱伝導体3は熱伝導性の良い銅、アルミ等を使用し4及び6の放熱フ ィンはアルミニウム等の熱伝導率の良い物を使用し全体として円筒形あるいは四 角形のものが多い。5及び7の冷却ファンも平円盤形状あるいは四角形が多く電 源供給を受けて回転駆動し下方に向けて送風する。First, the overall configuration will be described with reference to FIG. 1 is a laminated heat sink device of the present invention, 2 is a base plate for attaching a heat sink (to a CPU socket), 3 is a heat conductor that conducts heat of electronic parts, 4 is a first radiating fin, and 5 is a first radiating fin. Reference numeral 1 denotes a cooling fan, reference numeral 6 denotes a second radiating fin, and reference numeral 7 denotes a second cooling fan, which are sequentially stacked by screws or the like. The heat conductor 3 is made of copper, aluminum or the like having good heat conductivity, and the heat radiation fins 4 and 6 are made of a material having good heat conductivity such as aluminum, and are generally cylindrical or square. The cooling fans 5 and 7 also often have a flat disk shape or a square shape, and are driven to rotate by receiving power supply and blow air downward.
【0008】 このように構成されたヒートシンクをCPUの発熱素子上に取付け冷却効果を 求めるが層状に積み重ねることにより取付面積を増大させることなく優れた放熱 効果が得られるThe heat sink thus configured is mounted on the heat-generating element of the CPU, and a cooling effect is required. By stacking the heat sink in layers, an excellent heat radiation effect can be obtained without increasing the mounting area.
【0009】[0009]
本考案は上記のように2個の放熱フィンと2個の冷却ファンを設置した積層型 ヒートシンクであるので図4の上部に配置された第2の冷却ファン7の風圧が下 部に設置された第1冷却ファン5に加算され下部に配置された第1冷却ファン5 の回転数が増加し風量を20%増量する結果も得られると共に2個の冷却ファン の内1いずれか一方の冷却ファンが故障停止しても冷却効果が全く無くなること 事なく持続出来るので安全である。 Since the present invention is a stacked heat sink having two radiating fins and two cooling fans as described above, the wind pressure of the second cooling fan 7 arranged at the upper part of FIG. 4 is installed at the lower part. The number of rotations of the first cooling fan 5 added to the first cooling fan 5 and arranged at the lower portion is increased, and a result that the air volume is increased by 20% is obtained. In addition, one of the two cooling fans is cooled by one of the two cooling fans. It is safe because the cooling effect can be maintained without any loss even if it stops due to a failure.
【図1】従来の一実施例のファン埋めみ型ヒートシンク
の斜図FIG. 1 is a perspective view of a fan-embedded heat sink according to a conventional embodiment.
【図2】従来の一実施例のファン埋め込み型ヒートシン
クの組立図FIG. 2 is an assembly view of a conventional fan-embedded heat sink according to one embodiment.
【図3】本考案の一実施例の積層型ヒートシンク装置の
斜図FIG. 3 is a perspective view of the laminated heat sink device according to the embodiment of the present invention;
【図4】本考案の一実施例の積層型ヒートシンク装置の
組立図FIG. 4 is an assembly view of the laminated heat sink device according to one embodiment of the present invention;
2 取付ベース板 3 熱伝導体 4 第1の放熱フィン 5 第1の冷却ファン 6 第2の放熱フィン 7 第2の冷却ファン Reference Signs List 2 mounting base plate 3 heat conductor 4 first radiating fin 5 first cooling fan 6 second radiating fin 7 second cooling fan
Claims (1)
ファン埋め込み型ヒートシンクを2段に積み重ねて一体
化した積層型ヒートシンク装置。1. A laminated heat sink device in which a fan embedded type heat sink is stacked in two stages and integrated.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001005924U JP3084354U (en) | 2001-08-03 | 2001-08-03 | Stacked heat sink device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001005924U JP3084354U (en) | 2001-08-03 | 2001-08-03 | Stacked heat sink device |
Publications (1)
Publication Number | Publication Date |
---|---|
JP3084354U true JP3084354U (en) | 2002-03-22 |
Family
ID=43235829
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2001005924U Expired - Fee Related JP3084354U (en) | 2001-08-03 | 2001-08-03 | Stacked heat sink device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP3084354U (en) |
-
2001
- 2001-08-03 JP JP2001005924U patent/JP3084354U/en not_active Expired - Fee Related
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |