JP3084354U - Stacked heat sink device - Google Patents

Abstract

(57) [Problem] To improve the cooling effect by increasing the air volume with a heat sink attached to a CPU, and to secure cooling air in response to a fan failure. SOLUTION: The stacked heat sink device is characterized by stacking and integrating two conventional heat sinks with embedded fans.

Description

[Detailed description of the invention]

[0001]

[Technical field to which the invention belongs]

 The present invention relates to an improvement of a heat sink with a built-in fan for cooling a heating element of an electronic component.

[0002]

[Prior art]

 As shown in FIG. 1, only one cooling fan and one heat dissipating fin were mounted on a conventional heat sink with embedded fans. However, the recent high heat generation of computers has the drawback that the airflow is insufficient and the cooling effect is low, and if the fan stops due to a failure or the like, the cooling performance is reduced and reliability is lost. FIG. 1 is a perspective view showing an embodiment of a conventional fan-embedded heat sink, and FIG. 2 is an assembled view thereof. When the heat sink 1 configured as described above is mounted on a heat-generating electronic component, the heat of the electronic component is transmitted to the heat conductor 3 and is transmitted to the heat radiation fins 4 to dissipate the heat. The fan 5 is attached and air cooling is forcibly performed.

[0003]

[Problems to be solved by the invention]

 However, recent central processing units (hereinafter referred to as CPUs) in computers tend to generate more and more heat, and conventional heat sinks with embedded fans lack the above-mentioned drawbacks, such as insufficient airflow or failure of fans. There was no security and the cooling capacity was insufficient.

[0004]

[Means for Solving the Problems]

 The conventional heat sink with a built-in fan has only one cooling fan and one radiating fin, but the present invention increases the air volume and integrates one fan by stacking and integrating the conventional heat sink with a built-in fan in two stages. Even if the fan stops due to a failure or the like, cooling can be continued by another fan, and the reliability of the heat sink is improved.

[0005]

[Embodiment]

 In general, to increase the cooling effect, some cooling fans are enlarged or cooling fans are installed in parallel, but this is contrary to recent miniaturization due to the increase in the area of the entire device. Stacking cooling fins and radiating fins as in the present invention not only reduces the mounting area, but also increases the air volume and improves the cooling effect and improves the safety in the event of a fan failure.

Next, an embodiment of the present invention will be described with reference to the accompanying drawings. FIG. 3 is a perspective view of one embodiment of the present invention, and FIG. 4 is an assembly view.

First, the overall configuration will be described with reference to FIG. 1 is a laminated heat sink device of the present invention, 2 is a base plate for attaching a heat sink (to a CPU socket), 3 is a heat conductor that conducts heat of electronic parts, 4 is a first radiating fin, and 5 is a first radiating fin. Reference numeral 1 denotes a cooling fan, reference numeral 6 denotes a second radiating fin, and reference numeral 7 denotes a second cooling fan, which are sequentially stacked by screws or the like. The heat conductor 3 is made of copper, aluminum or the like having good heat conductivity, and the heat radiation fins 4 and 6 are made of a material having good heat conductivity such as aluminum, and are generally cylindrical or square. The cooling fans 5 and 7 also often have a flat disk shape or a square shape, and are driven to rotate by receiving power supply and blow air downward.

The heat sink thus configured is mounted on the heat-generating element of the CPU, and a cooling effect is required. By stacking the heat sink in layers, an excellent heat radiation effect can be obtained without increasing the mounting area.

[0009]

[Effect of the invention]

 Since the present invention is a stacked heat sink having two radiating fins and two cooling fans as described above, the wind pressure of the second cooling fan 7 arranged at the upper part of FIG. 4 is installed at the lower part. The number of rotations of the first cooling fan 5 added to the first cooling fan 5 and arranged at the lower portion is increased, and a result that the air volume is increased by 20% is obtained. In addition, one of the two cooling fans is cooled by one of the two cooling fans. It is safe because the cooling effect can be maintained without any loss even if it stops due to a failure.

[Brief description of the drawings]

FIG. 1 is a perspective view of a fan-embedded heat sink according to a conventional embodiment.

FIG. 2 is an assembly view of a conventional fan-embedded heat sink according to one embodiment.

FIG. 3 is a perspective view of the laminated heat sink device according to the embodiment of the present invention;

FIG. 4 is an assembly view of the laminated heat sink device according to one embodiment of the present invention;

[Explanation of symbols]

 Reference Signs List 2 mounting base plate 3 heat conductor 4 first radiating fin 5 first cooling fan 6 second radiating fin 7 second cooling fan

Claims (1)

[Utility model registration claims] 1. A laminated heat sink device in which a fan embedded type heat sink is stacked in two stages and integrated.