US20080314556A1 - Heat dissipation device having a fan for dissipating heat generated by at least two electronic components - Google Patents
Heat dissipation device having a fan for dissipating heat generated by at least two electronic components Download PDFInfo
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- US20080314556A1 US20080314556A1 US11/767,032 US76703207A US2008314556A1 US 20080314556 A1 US20080314556 A1 US 20080314556A1 US 76703207 A US76703207 A US 76703207A US 2008314556 A1 US2008314556 A1 US 2008314556A1
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- United States
- Prior art keywords
- heat
- dissipation device
- base
- heat dissipation
- fin set
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
- F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
- F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
- F28F1/32—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the present invention relates generally to a heat dissipation device, and more particularly to a heat dissipation device having a heat sink and a fan holder for facilitating mounting a fan on the heat sink, wherein the heat sink simultaneously contacts with at least two heat-generating electronic components, and the fan generates an airflow through the heat sink to dissipate heat of the heat sink absorbed from the at least two heat-generating electronic components.
- a typical heat sink comprises a base for contacting with the heat-generating component to absorb the heat generated by the heat-generating component and a plurality of parallel planar fins attached to the base by soldering or adhering.
- the fins can be integrally formed with the base by metal extrusion, such as aluminum extrusion. The fins are used for dissipating the heat to ambient air.
- the present invention relates to a heat dissipation device for simultaneously dissipating heat generated by at least two heat-generating electronic components.
- the heat dissipation device includes a base, a fin set and at least two groups of heat pipes.
- the base includes a supporting frame and at least two plates attached to a bottom of the frame for contacting with the at least two heat-generating electronic components.
- the fin set includes a plurality of fins on the base.
- the at least two groups of heat pipes respectively and thermally connect the at least two plates and the fin set together.
- a fan holder on which a fan is mounted is attached to the heat dissipation device. An airflow generated by the fan flows through the fin set to dissipate heat of fin set absorbed from the at least two heat-generating electronic components.
- FIG. 1 is an assembled view of a heat dissipation device in accordance with a preferred embodiment of the present invention
- FIG. 2 is an inverted view of the heat dissipation device of FIG. 1
- FIG. 3 is an assembled view of the heat dissipation device of FIG. 1 from another aspect
- FIG. 4 is an exploded, isometric view of the heat dissipation device of FIG. 1 ;
- FIG. 5 is an isometric view of a base of the heat dissipation device of FIG. 4 ;
- FIG. 6 is an isometric view of a fin set of the heat dissipation device of FIG. 4 ;
- FIG. 7 is an isometric view of a fan holder of the heat dissipation device of FIG. 4 .
- the heat dissipation device is mounted to two heat-generating electronic elements (not shown), to dissipate heat therefrom.
- the heat dissipation device comprises a heat sink, a fan holder 50 secured on the heat sink and a fan 60 attached to the fan holder 50 .
- the heat sink comprises a base 10 , a fin set 30 standing on the base 10 , a heat pipe assembly 20 thermally connecting the base 10 and the fin set 30 and a fin cover 40 covering top and opposite lateral sides of the fin set 30 .
- the base 10 comprises a supporting frame 13 and two plates 11 attached to a bottom of the supporting frame 13 for contacting with the two corresponding heat-generating electronic elements.
- Each of the plates 11 which is made of a good heat conductive material such as copper, is rectangular in shaped and defines three parallel receiving grooves 110 in a top surface thereof.
- the supporting frame 13 comprises two spaced and parallel shoulders 132 and two spaced and parallel bridges 134 connecting the two shoulders 132 together.
- Two fixing slots 1320 parallel to the shoulders 13 are defined in two joints of the two bridges 134 with one of the shoulders 132 for engaging with the fan holder 50 .
- a plurality of countersinks 1322 are defined in a top surface of the two shoulders 132 , adjacent to two remote edges thereof, for receiving fixtures (not labeled) to attach the heat sink onto the heat-generating electronic elements.
- the two shoulders 132 are respectively provided with two step portions 1324 that face to each other at a bottom surface thereof, for forming a receiving space (not labeled) to accommodate the plates 11 therein.
- Each of the shoulders 132 defines two mounting orifices 1326 in two opposite lateral ends thereof, respectively, for engaging with screws 100 to secure the fin cover 40 to the base 10 .
- the two bridges 134 define a rectangular opening 130 therebetween.
- Two cutoffs 131 are defined beside the bridges 134 , respectively, and between the two shoulders 132 .
- Each of the bridges 134 defines three parallel receiving grooves 1340 in a bottom surface thereof corresponding to the receiving grooves 110 of each of the plates 11 .
- the heat pipe assembly 20 includes two groups each having three heat pipes 21 .
- Each of the heat pipes 21 is U-shaped in profile and comprises an evaporating section 212 , two parallel condensing sections 214 perpendicular to the evaporating section 212 , and two curved connecting sections (not labeled) extending from two opposite ends of the evaporating section 212 and connecting the evaporating section 212 with the condensing sections 214 .
- the fin set 30 comprises a plurality of fins 32 arranged horizontally and defines two platforms 34 at a top thereof.
- the two platforms 34 are spaced from each other and separated by an elongated recessing portion 322 .
- the two platforms 34 each define two rows of receiving holes 340 adjacent to two ends thereof, for receiving the condensing sections 214 of one group of the heat pipes 21 therein.
- Each of the rows has three receiving holes 340 vertically extending through the fin set 30 and perpendicular to the fins 32 .
- the fin set 30 has a first supporting unit 36 and two second supporting units 38 at bottom thereof.
- the first supporting unit 36 is located between and spaces from the two second supporting units 38 with predetermined distance.
- the two rows of the receiving holes 340 in the fin set 30 at two opposite edges of each of the platforms 34 are spaced from each other a distance slightly larger than a width of the second supporting unit 38 .
- the two neighboring rows of the receiving holes 340 beside the recessing portion 322 are spaced from each other a distance slightly larger than a width of the first supporting unit 36 .
- the first and second supporting units 36 , 38 comprise a plurality of rectangular metallic, thin sheets (not labeled) perpendicular to the fins 32 .
- the sheets of the first and second supporting units 36 , 38 have flanges (not labeled) extending perpendicularly from lower and upper edges thereof.
- the first supporting unit 36 projects rearwards beyond the two second supporting units 38 (shown in the FIG. 3 ).
- the fin cover 40 is integrally made of a piece of metal sheet and comprises a rectangular top panel 42 and two sidewalls 44 extending perpendicularly and downwardly from two lateral opposite edges of the top panel 42 .
- the top panel 42 is provided with a connecting sheet 422 recessing downwardly from a top surface of the top panel 42 .
- the connecting sheet 422 has a width less than that of other portion of the top panel 42 and defines a locking aperture 4220 therein, for engaging with the fan holder 50 . Due to the recessing of the connecting sheet 422 , the top panel 42 forms a concave portion therein.
- the two sidewalls 44 are disposed snugly on two opposite lateral sides of the fin set 30 .
- the two sidewalls 44 each have a width increasing gradually in a same direction from a top to a bottom thereof.
- a bottom end of each of the sidewalls 44 is bended inwardly and perpendicularly and then further downwardly and perpendicularly to form a mounting leg 442 .
- Each of the mounting legs 442 defines two fixing orifices 4420 adjacent to two opposite ends thereof, for allowing the screws 100 to extend therethrough and screw into the mounting orifices 1326 of the base 10 , whereby the sidewalls 44 are secured to the base 10 .
- the fin set 30 in assembly of the heat sink, is soldered on the supporting frame 13 of the base 10 , with the first supporting unit 36 sitting across a middle of the opening 130 and being soldered to two neighboring edges of the shoulders 130 .
- the second supporting units 38 are soldered to the bridges 134 , respectively.
- the evaporating sections 212 of the two groups of heat pipes 21 are sandwiched between the two plates 11 and the two bridges 134 of the supporting frame 13 and received respectively in channels defined cooperatively by the receiving grooves 110 , 1340 of the two plates 11 and the bridges 134 of the supporting frame 13 .
- the condensing sections 214 of the two groups of heat pipes 21 respectively pass through the opening 130 and cutoffs 131 of the supporting frame 13 and are engagingly received in the receiving holes 340 of the fin set 30 ; thus, the base 10 and fin set 30 are thermally connected together by the heat pipes 21 .
- the fin cover 40 covers on the fin set 30 and is secured to the base 10 by the screws 100 extending through the fixing orifices 4420 of the mounting legs 442 of the sidewalls 44 and screwing in the mounting orifices 1326 of the base 10 .
- the top panel 42 of the fin cover 40 is placed on the platforms 34 of the fin set 30 with the connecting sheet 422 received in the recessing portion 322 of the fin set 30 .
- the fan holder 50 is formed by molded plastic material and substantially ring-shaped.
- the fan holder 50 has a ring body 51 with a through hole 52 therein for allowing airflow generated by the fan 60 to pass therethrough.
- the ring body 51 defines a plurality of engaging orifices 510 therein for engaging with corresponding fixtures 200 , thereby attaching the fan 60 onto the fan holder 50 .
- the fixtures 200 extend through holes (not labeled) defined in the fan 60 to engage in the engaging orifices 510 of the fan holder 50 , thereby fixing the fan 60 to fan holder 50 .
- the fan holder 50 is provided with a first engaging part at an upper edge of the ring body 51 and a second engaging part at a lower edge of the ring body 51 opposite to the upper edge.
- the first engaging part is a fixing arm 54 that extending perpendicularly from a top of the ring body 51 .
- the fixing arm 54 has a barb 540 extending downwardly from a middle of a bottom surface thereof and matching with the locking aperture 4220 of the fin cover 40 .
- the second engaging part is two inhibiting tabs 56 protruding downwardly from a bottom of the ring body 51 for engaging into the fixing slots 1320 of the base 10 .
- the fan 60 has a frame (not labeled) with a shape and size corresponding to that of the fan holder 50 .
- the frame defines the plurality of holes (not labeled) corresponding to the engaging orifices 510 of the fan holder 50 , for receiving the fixtures 200 therein.
- the fan holder 50 and the fan 60 are assembled into a fan assembly by the fixtures 200 extending through the holes (not labeled) of the fan 60 to engage into the engaging orifices 510 of the fan holder 50 .
- the fixing arm 54 of the fan holder 50 of the fan assembly is disposed in the concave portion of the fin cover 40 and supported by the connecting sheet 422 of the fin cover 40 with the barb 540 of the fixing arm 54 aligned with the locking orifice 4220 of the fin cover 40 .
- the fan holder 50 of the fan assembly is then pressed downwardly to force the barb 540 of the fixing arm 54 to interferentially fit into the locking orifice 4220 of the fin cover 40 .
- the barb 540 of the fixing arm 54 fits into the locking orifice 4220 of the fin cover 40 .
- the barb 540 hooks with the connecting sheet 422 of the fin cover 40 .
- the two inhibiting tabs 56 at the bottom of the fan holder 50 of the fan assembly are forced to be engagingly inserted into the two fixing slots 1320 of the frame 13 of the base 10 .
- the fan 60 combined with the fan holder 50 is thus mounted to the heat sink securely.
- the heat generated by the two heat-generating electronic elements during operation is absorbed by the two plates 11 of the base 10 ; then the heat is transferred to the fin set 30 through the heat pipes 21 and the supporting frame 13 ; finally the heat is brought into ambient by the airflow from the fan 60 through the fin set 30 .
- the fan 60 can have a larger size in comparison with prior art, which uses two small fans to dissipate heat generated by the two electronic components.
- the fan with larger size can produce the same volumetric flow rate as the small fan when the large fan has a lower rotation speed. Accordingly, noise level generated by the large fan during operation is lower than that generated by the two small fans.
- the present invention can be operated more quietly, which is important in the present critical requirement regarding noise level of working and living environment.
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Abstract
Description
- 1. Field of the Invention
- The present invention relates generally to a heat dissipation device, and more particularly to a heat dissipation device having a heat sink and a fan holder for facilitating mounting a fan on the heat sink, wherein the heat sink simultaneously contacts with at least two heat-generating electronic components, and the fan generates an airflow through the heat sink to dissipate heat of the heat sink absorbed from the at least two heat-generating electronic components.
- 2. Description of Related Art
- Electronic component includes numerous circuits operating at high speed and generating substantive heat. In many applications, it is desirable to employ a heat sink to remove heat from heat-generating electronic components, such as central processing units (CPUs), to assure that the components function properly and reliably. A typical heat sink comprises a base for contacting with the heat-generating component to absorb the heat generated by the heat-generating component and a plurality of parallel planar fins attached to the base by soldering or adhering. Alternatively, the fins can be integrally formed with the base by metal extrusion, such as aluminum extrusion. The fins are used for dissipating the heat to ambient air.
- With the development of various types of electronic modules, an array of many discrete heat-generating components may be mounted to a surface of a single circuit board. In some circumstances, more than one of the components must be cooled. A conventional thermal resolution is to provide each of the discrete heat-generating components with an individual heat sink. However, with development of electronic technology, electronic products and systems are required to become more and more compact and portable in configuration. As a result, spacing between the heat-generating components decrease dramatically, which obviously restricts sizes and efficiency of the individual heat sinks. Additionally, it is both expensive and time-consuming to attach separate heat sinks to the heat-generating components one by one.
- What is needed therefore is a heat dissipation device with an improved structure, which is able to simultaneously cool at least two heat-generating components.
- The present invention relates to a heat dissipation device for simultaneously dissipating heat generated by at least two heat-generating electronic components. The heat dissipation device includes a base, a fin set and at least two groups of heat pipes. The base includes a supporting frame and at least two plates attached to a bottom of the frame for contacting with the at least two heat-generating electronic components. The fin set includes a plurality of fins on the base. The at least two groups of heat pipes respectively and thermally connect the at least two plates and the fin set together. A fan holder on which a fan is mounted is attached to the heat dissipation device. An airflow generated by the fan flows through the fin set to dissipate heat of fin set absorbed from the at least two heat-generating electronic components.
- Other advantages and novel features of the present invention will become more apparent from the following detailed description of preferred embodiment when taken in conjunction with the accompanying drawings, in which:
- Many aspects of the present device can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present device. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
-
FIG. 1 is an assembled view of a heat dissipation device in accordance with a preferred embodiment of the present invention; -
FIG. 2 is an inverted view of the heat dissipation device ofFIG. 1 -
FIG. 3 is an assembled view of the heat dissipation device ofFIG. 1 from another aspect; -
FIG. 4 is an exploded, isometric view of the heat dissipation device ofFIG. 1 ; -
FIG. 5 is an isometric view of a base of the heat dissipation device ofFIG. 4 ; -
FIG. 6 is an isometric view of a fin set of the heat dissipation device ofFIG. 4 ; and -
FIG. 7 is an isometric view of a fan holder of the heat dissipation device ofFIG. 4 . - Referring to
FIGS. 1-4 , a heat dissipation device in accordance with a preferred embodiment of the present invention is shown. The heat dissipation device is mounted to two heat-generating electronic elements (not shown), to dissipate heat therefrom. The heat dissipation device comprises a heat sink, afan holder 50 secured on the heat sink and afan 60 attached to thefan holder 50. - The heat sink comprises a
base 10, a fin set 30 standing on thebase 10, aheat pipe assembly 20 thermally connecting thebase 10 and the fin set 30 and afin cover 40 covering top and opposite lateral sides of thefin set 30. - As shown in
FIG. 5 , thebase 10 comprises a supportingframe 13 and twoplates 11 attached to a bottom of the supportingframe 13 for contacting with the two corresponding heat-generating electronic elements. Each of theplates 11 which is made of a good heat conductive material such as copper, is rectangular in shaped and defines three parallel receivinggrooves 110 in a top surface thereof. The supportingframe 13 comprises two spaced andparallel shoulders 132 and two spaced andparallel bridges 134 connecting the twoshoulders 132 together. Twofixing slots 1320 parallel to theshoulders 13 are defined in two joints of the twobridges 134 with one of theshoulders 132 for engaging with thefan holder 50. A plurality ofcountersinks 1322 are defined in a top surface of the twoshoulders 132, adjacent to two remote edges thereof, for receiving fixtures (not labeled) to attach the heat sink onto the heat-generating electronic elements. The twoshoulders 132 are respectively provided with twostep portions 1324 that face to each other at a bottom surface thereof, for forming a receiving space (not labeled) to accommodate theplates 11 therein. Each of theshoulders 132 defines twomounting orifices 1326 in two opposite lateral ends thereof, respectively, for engaging withscrews 100 to secure thefin cover 40 to thebase 10. The twobridges 134 define arectangular opening 130 therebetween. Twocutoffs 131 are defined beside thebridges 134, respectively, and between the twoshoulders 132. Each of thebridges 134 defines threeparallel receiving grooves 1340 in a bottom surface thereof corresponding to thereceiving grooves 110 of each of theplates 11. - As shown in
FIG. 4 , theheat pipe assembly 20 includes two groups each having threeheat pipes 21. Each of theheat pipes 21 is U-shaped in profile and comprises anevaporating section 212, twoparallel condensing sections 214 perpendicular to theevaporating section 212, and two curved connecting sections (not labeled) extending from two opposite ends of theevaporating section 212 and connecting theevaporating section 212 with thecondensing sections 214. - As shown in
FIG. 6 , thefin set 30 comprises a plurality offins 32 arranged horizontally and defines twoplatforms 34 at a top thereof. The twoplatforms 34 are spaced from each other and separated by an elongated recessing portion 322. The twoplatforms 34 each define two rows of receivingholes 340 adjacent to two ends thereof, for receiving thecondensing sections 214 of one group of theheat pipes 21 therein. Each of the rows has three receivingholes 340 vertically extending through thefin set 30 and perpendicular to thefins 32. Thefin set 30 has a first supportingunit 36 and twosecond supporting units 38 at bottom thereof. The first supportingunit 36 is located between and spaces from the twosecond supporting units 38 with predetermined distance. The two rows of the receivingholes 340 in the fin set 30 at two opposite edges of each of theplatforms 34 are spaced from each other a distance slightly larger than a width of the second supportingunit 38. The two neighboring rows of the receivingholes 340 beside the recessing portion 322 are spaced from each other a distance slightly larger than a width of the first supportingunit 36. The first and second supportingunits fins 32. The sheets of the first and second supportingunits fins 32 and a lower contacting surface standing on thebase 10. The first supportingunit 36 projects rearwards beyond the two second supporting units 38 (shown in theFIG. 3 ). - As shown in
FIG. 4 thefin cover 40 is integrally made of a piece of metal sheet and comprises a rectangulartop panel 42 and twosidewalls 44 extending perpendicularly and downwardly from two lateral opposite edges of thetop panel 42. Thetop panel 42 is provided with a connectingsheet 422 recessing downwardly from a top surface of thetop panel 42. The connectingsheet 422 has a width less than that of other portion of thetop panel 42 and defines alocking aperture 4220 therein, for engaging with thefan holder 50. Due to the recessing of the connectingsheet 422, thetop panel 42 forms a concave portion therein. The twosidewalls 44 are disposed snugly on two opposite lateral sides of the fin set 30. The twosidewalls 44 each have a width increasing gradually in a same direction from a top to a bottom thereof. A bottom end of each of thesidewalls 44 is bended inwardly and perpendicularly and then further downwardly and perpendicularly to form a mountingleg 442. Each of the mountinglegs 442 defines two fixingorifices 4420 adjacent to two opposite ends thereof, for allowing thescrews 100 to extend therethrough and screw into the mountingorifices 1326 of thebase 10, whereby thesidewalls 44 are secured to thebase 10. - Particularly referring to
FIGS. 1 to 3 , in assembly of the heat sink, the fin set 30 is soldered on the supportingframe 13 of thebase 10, with the first supportingunit 36 sitting across a middle of theopening 130 and being soldered to two neighboring edges of theshoulders 130. The second supportingunits 38 are soldered to thebridges 134, respectively. The evaporatingsections 212 of the two groups ofheat pipes 21 are sandwiched between the twoplates 11 and the twobridges 134 of the supportingframe 13 and received respectively in channels defined cooperatively by the receivinggrooves plates 11 and thebridges 134 of the supportingframe 13. The condensingsections 214 of the two groups ofheat pipes 21 respectively pass through theopening 130 andcutoffs 131 of the supportingframe 13 and are engagingly received in the receivingholes 340 of the fin set 30; thus, thebase 10 and fin set 30 are thermally connected together by theheat pipes 21. Thefin cover 40 covers on the fin set 30 and is secured to thebase 10 by thescrews 100 extending through the fixingorifices 4420 of the mountinglegs 442 of thesidewalls 44 and screwing in the mountingorifices 1326 of thebase 10. Thetop panel 42 of thefin cover 40 is placed on theplatforms 34 of the fin set 30 with the connectingsheet 422 received in the recessing portion 322 of the fin set 30. - As shown in
FIG. 7 , thefan holder 50 is formed by molded plastic material and substantially ring-shaped. Thefan holder 50 has aring body 51 with a throughhole 52 therein for allowing airflow generated by thefan 60 to pass therethrough. Thering body 51 defines a plurality of engagingorifices 510 therein for engaging withcorresponding fixtures 200, thereby attaching thefan 60 onto thefan holder 50. Thefixtures 200 extend through holes (not labeled) defined in thefan 60 to engage in the engagingorifices 510 of thefan holder 50, thereby fixing thefan 60 tofan holder 50. Thefan holder 50 is provided with a first engaging part at an upper edge of thering body 51 and a second engaging part at a lower edge of thering body 51 opposite to the upper edge. In this embodiment, the first engaging part is a fixingarm 54 that extending perpendicularly from a top of thering body 51. The fixingarm 54 has abarb 540 extending downwardly from a middle of a bottom surface thereof and matching with the lockingaperture 4220 of thefin cover 40. The second engaging part is two inhibitingtabs 56 protruding downwardly from a bottom of thering body 51 for engaging into the fixingslots 1320 of thebase 10. - As shown in
FIG. 4 , thefan 60 has a frame (not labeled) with a shape and size corresponding to that of thefan holder 50. The frame defines the plurality of holes (not labeled) corresponding to the engagingorifices 510 of thefan holder 50, for receiving thefixtures 200 therein. - In assembly of the heat dissipation device, the
fan holder 50 and thefan 60 are assembled into a fan assembly by thefixtures 200 extending through the holes (not labeled) of thefan 60 to engage into the engagingorifices 510 of thefan holder 50. The fixingarm 54 of thefan holder 50 of the fan assembly is disposed in the concave portion of thefin cover 40 and supported by the connectingsheet 422 of thefin cover 40 with thebarb 540 of the fixingarm 54 aligned with thelocking orifice 4220 of thefin cover 40. Thefan holder 50 of the fan assembly is then pressed downwardly to force thebarb 540 of the fixingarm 54 to interferentially fit into thelocking orifice 4220 of thefin cover 40. As soon as thebarb 540 of the fixingarm 54 fits into thelocking orifice 4220 of thefin cover 40, thebarb 540 hooks with the connectingsheet 422 of thefin cover 40. When thebarb 540 is engaged into thelocking orifice 4220 of thefin cover 40, the two inhibitingtabs 56 at the bottom of thefan holder 50 of the fan assembly are forced to be engagingly inserted into the two fixingslots 1320 of theframe 13 of thebase 10. Thefan 60 combined with thefan holder 50 is thus mounted to the heat sink securely. - In use of the heat dissipation device, the heat generated by the two heat-generating electronic elements during operation is absorbed by the two
plates 11 of thebase 10; then the heat is transferred to the fin set 30 through theheat pipes 21 and the supportingframe 13; finally the heat is brought into ambient by the airflow from thefan 60 through the fin set 30. - Since the present invention uses a single fan to cool two heat-generating electronic components, the
fan 60 can have a larger size in comparison with prior art, which uses two small fans to dissipate heat generated by the two electronic components. The fan with larger size can produce the same volumetric flow rate as the small fan when the large fan has a lower rotation speed. Accordingly, noise level generated by the large fan during operation is lower than that generated by the two small fans. Thus, the present invention can be operated more quietly, which is important in the present critical requirement regarding noise level of working and living environment. - It is to be understood, however, that even though numerous characteristics and advantages of the present invention have been set forth in the foregoing description, together with details of the structure and function of the invention, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the invention to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
Claims (18)
Priority Applications (1)
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US11/767,032 US7891411B2 (en) | 2007-06-22 | 2007-06-22 | Heat dissipation device having a fan for dissipating heat generated by at least two electronic components |
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US11/767,032 US7891411B2 (en) | 2007-06-22 | 2007-06-22 | Heat dissipation device having a fan for dissipating heat generated by at least two electronic components |
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US20080314556A1 true US20080314556A1 (en) | 2008-12-25 |
US7891411B2 US7891411B2 (en) | 2011-02-22 |
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Cited By (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080257527A1 (en) * | 2007-04-18 | 2008-10-23 | Foxconn Technology Co., Ltd. | Heat sink assembly having a fin also functioning as a supporting bracket |
US20080316705A1 (en) * | 2007-06-22 | 2008-12-25 | Foxconn Technology Co., Ltd. | Heat dissipation device having a fan mounted thereon |
US20090166000A1 (en) * | 2007-12-27 | 2009-07-02 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat sink with heat pipes |
US20100032137A1 (en) * | 2008-08-05 | 2010-02-11 | Shih-Wei Huang | Thermally conductive module |
US20100038059A1 (en) * | 2008-08-15 | 2010-02-18 | Asia Vital Components Co., Ltd. | Reinforced thermal module structure |
US20100089043A1 (en) * | 2008-10-10 | 2010-04-15 | Dittmann Joerg | Cooling system |
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