1300328 /九、發明說明： •【發明所屬之技術領域】 本發明涉及一種導流式散熱裝置，尤指一種具有導流 結構之散熱裝置。 【先前技術】 目前在電子元件之散熱領域，除了要求對中央處理器 (CPU)有效散熱外，還要求兼顧中央處理器周邊電子元件如 春晶體管之散熱，如大陸專利第200320102618.6號，該專利揭 •露一種風扇導風罩結構，主要包含一固定座及一罩體，所 述固定座用以固定風扇，所述罩體用以導流，該固定座具 有筒體和導執，該罩體具有套筒，該固定座藉由其筒體周 緣之卡制部及導軌與該罩體之套筒連接，該風扇導風罩只 能用於對中央處理器進行散熱，無法兼顧中央處理器周邊 電子元件之散熱。 _ 【發明内容】 有蓉於此，有必要提供一種既可對中央處理器又可對 其周邊其他電子元件進行散熱之導流式散熱裝置。 本發明之導流式散熱裝置包括一用以與電子元件接觸 之導熱板及與其連接之複數第一散熱鰭片，該等散熱鰭片 間形成有流道，一導流板自上述其中一第一散熱鰭片彎折 延伸而出，該導流板引導流經散熱鰭片間流道之部分氣流 改變方向而吹向其他電子元件。 本發明之導流式散熱裝置既可藉由第一散熱體對中央 6 1300328 •處理器進行散熱，x可藉纟導流板引導氣流對中央處理器 周邊之其他電子元件（如晶體管）進行散熱。 " 【實施方式】 凊同枯參照圖1和圖2，該導流式散熱裝置包括一散熱 器10和一風扇20同時安裝在電路板4〇上，用以同時對安' 裝於電路板40上之中央處理器42及中央處理器42周圍之 ^體管44, 46進行散熱，該風扇2〇藉由一對安裳於散熱 器10兩側之風扇固定架30安裝於散熱器1〇前側。 該散熱器ίο包括一導熱板12，一第一散熱體14，一 第一散熱體18及用以將導熱板12、第一散熱體14和第二 散熱體18連接在一起之三平行熱管16，其_ ·· 該導熱板12具有一頂面122和一底面12〇，該底面i2〇 與電路板40上之中央處理器42接觸以吸收熱量，該頂面 122設有三凹槽124,導熱板12之四角各連接一凸耳126。 導熱板12藉由穿過凸耳126之四緊固件5〇與電路板4〇連 接’並與中央處理器42保持穩固接觸。 每一熱官16呈U形設置包括一吸熱部16〇及從吸熱部 160兩鈿向上延伸之二平行放熱部162，該吸熱部16〇收容 於導熱板12之凹槽124内以吸收來自導熱板12之熱量。 該第一散熱體14由複數相互扣合之第一散熱鰭片148 堆豐排列而成，每一第一散熱鰭片148都與導熱板12保持 平行，每兩相鄰第一散熱鰭片148之間形成沿前後方向延 伸之流道140。第一散熱鰭片148上設有貫穿孔142，該貫 1300328 -穿孔U2用以收容熱管16之放熱部162,貫穿孔i42邊緣 .延伸設有環壁144,以增大第一散熱鰭片148與放熱部162 接觸表面積。該第一散熱體14兩相對側面上各形成有一凹 槽146,風扇固定架30卡制在凹槽146中，風扇2〇藉由螺 釘22與風扇固定架30連接從而實現與第一散熱體結合。 - 1同時參照圖3,位於第一散熱體14底端朝向導熱板 • 12之最近之一散熱鰭片被製成一導流散熱片15 ,該導流散 籲熱片15可以用作導流罩，將由風扇2〇產生之部分氣流導 向位於中央處理器42周圍之晶體管44、46上。該導流散 -熱片15具有與其他第一散熱鰭片148平行之一本體15〇， 該本體150與導熱板12相隔設置，本體15〇尾部邊緣彎折 延伸出一向下彎折並朝向導熱板12之導流板152,以便將 風扇20產生之部分氣流導向周圍之晶體管44上，該導流 板152呈弧形彎曲；本體15〇兩側邊緣各彎折延伸出一第 一和第一擔風板154、156，該第一和第二擔風板154、156 _與本體150垂直，並向導流板152延伸方向彎折。該第二 擋風板156沿前後方向之長度比第一擋風板154短，一隔 板158從第二擋風板156靠近導流板152之一側向第一擔 風板154方向垂直延伸設置。第一擋風板154可阻止風扇 20產生之氣流向側面發散。 该第二散熱體18可由|呂等材料一體擠製成形並形成有 複數沿前後方向延伸之流道180，該第二散熱體18包括複 數與第一散熱鰭片148相互垂直之第二散熱鰭片（圖未 標），熱管16之吸熱部160與第二散熱體18之底部焊接， 1300328 第二散熱體18之頂部與導流散熱片15之本體150底面焊 接，如此，熱管16吸收之熱量便可迅速傳至第二散熱體18 上。導流散熱片15之長度L大於導熱板12於對應方向之 長度使得第二擋風板156和所述隔板158 —部分定位於導 熱板12之側面空間，隔板158 —自由端與第二散熱體18 之側面182貼近，隔板158之底邊157與導熱板12之頂面 122貼近，如此以來，流經第二擋風板156和側面182間之 氣流被限制沿前後方向流動，由此風扇20產生之部分氣流 便可直接被導向位於中央處理器42周圍之晶體管46上。 當風扇20運轉時，其產生之一部分氣流藉由第一散熱 體14之流道140和第二散熱體18之流道180，進而將第一散 熱體14和第二散熱體18上吸收之來自中央處理器42之熱量 帶入到周圍空氣中，由此，中央處理器42產生之熱量能夠 得到迅速散發。同時，由風扇20產生之另一部分流經第二 散熱體18之氣流在導流散熱片15之導流板152引導下吹向 位於中央處理器42—側附近之晶體管44，還有一部分氣流 在第二擋風板156及隔板158之引導下將直接吹向位於中央 處理器42另一側附近之晶體管46，由此，晶體管44、46產 生之熱量能夠同時得到散發。 綜上所述，本發明符合發明專利要件，爰依法提出專 利申請。惟，以上所述者僅為本發明之較佳實施例，舉凡 熟悉本案技藝之人士，在爰依本發明精神所作之等效修飾 或變化，皆應涵蓋於以下之申請專利範圍内。 【圖式簡單說明】 1300328 圖1係本發明之導流式散熱裝置安裝在印刷電路板上之組合示意圖。 圖2係本發明之導流式散熱裝置之立體分解圖。 圖3係圖2中導流散熱片之結構圖。 【主要元件符號說明】 散熱器 10 導熱板 12 底面 120 頂面 122 凹槽 124 凸耳 126 第一散熱體 14 流道 140 貫穿孔 142 環壁 144 凹槽 146 第一散熱鰭片 148 導流散熱片 15 本體 150 導流板 152 第一擔風板 154 第二擋風板 156 底邊 157 隔板 158 熱管 16 吸熱部 160 放熱部 162 第二散熱體 18 流道 180 側面 182 風扇 20 螺釘 22 風扇固定架 30 電路板 40 中央處理器 42 晶體管 44,46 緊固件 501300328 / IX. Description of the invention: • Technical field to which the invention pertains The present invention relates to a flow-conducting heat sink, and more particularly to a heat sink having a flow guiding structure. [Prior Art] At present, in the field of heat dissipation of electronic components, in addition to the effective heat dissipation of the central processing unit (CPU), it is also required to balance the heat dissipation of the electronic components of the central processing unit such as the spring transistor, such as the mainland patent No. 200320102618.6, which discloses The utility model discloses a fan air hood structure, which mainly comprises a fixing seat and a cover body, wherein the fixing seat is used for fixing a fan, the cover body is used for guiding the flow, and the fixing seat has a cylinder body and a guide body, the cover body The utility model has a sleeve which is connected to the sleeve of the cover body by a locking portion and a guide rail of a circumference of the cylinder body. The fan air hood can only be used for dissipating heat from the central processing unit, and cannot balance the periphery of the central processing unit. Heat dissipation of electronic components. _ [Summary of the Invention] In view of this, it is necessary to provide a flow-conducting heat sink that can dissipate heat from the central processing unit and other electronic components around it. The flow guiding type heat dissipating device of the present invention comprises a heat conducting plate for contacting the electronic component and a plurality of first heat dissipating fins connected thereto, wherein the heat dissipating fins form a flow path, and a baffle plate is formed from the one of the first A heat sink fin is bent and extended, and the deflector guides a part of the airflow flowing through the flow path between the fins to change direction and blow to other electronic components. The flow guiding heat dissipating device of the present invention can dissipate heat from the central 6 1300328 • processor by the first heat dissipating body, and can guide the air flow by the baffle to dissipate heat to other electronic components (such as transistors) around the central processing unit. . < [Embodiment] Referring to Figures 1 and 2, the flow-through heat sink includes a heat sink 10 and a fan 20 mounted on the circuit board 4 , at the same time for mounting on the circuit board at the same time. The central processing unit 42 on the 40 and the central tubes 44 and 46 around the central processing unit 42 dissipate heat. The fan 2 is mounted on the heat sink 1 by a pair of fan holders 30 mounted on both sides of the heat sink 10. Front side. The heat sink ίο includes a heat conducting plate 12, a first heat sink 14, a first heat sink 18, and three parallel heat pipes 16 for connecting the heat conducting plate 12, the first heat sink 14, and the second heat sink 18 together. The heat conducting plate 12 has a top surface 122 and a bottom surface 12 〇, the bottom surface i2 接触 is in contact with the central processing unit 42 on the circuit board 40 to absorb heat, and the top surface 122 is provided with three grooves 124 for heat conduction. A lug 126 is attached to each of the four corners of the panel 12. The heat conducting plate 12 is connected to the circuit board 4 藉 by the four fasteners 5 穿过 passing through the lugs 126 and is in firm contact with the central processing unit 42. Each heat register 16 has a U-shaped arrangement including a heat absorbing portion 16 〇 and two parallel heat releasing portions 162 extending upward from the heat absorbing portion 160. The heat absorbing portion 16 〇 is received in the groove 124 of the heat conducting plate 12 to absorb heat conduction. The heat of the board 12. The first heat dissipating body 14 is formed by stacking a plurality of first heat dissipating fins 148, and each of the first heat dissipating fins 148 is parallel to the heat conducting plate 12, and each of the two adjacent first heat dissipating fins 148 A flow path 140 extending in the front-rear direction is formed therebetween. The first heat dissipation fin 148 is provided with a through hole 142 for receiving the heat radiation portion 162 of the heat pipe 16 and extending through the edge of the hole i42 to extend the first heat dissipation fin 148. The surface area is in contact with the heat release portion 162. A recess 146 is formed on each of the opposite sides of the first heat dissipating body 14. The fan holder 30 is locked in the recess 146, and the fan 2 is connected to the fan holder 30 by the screw 22 to be combined with the first heat sink. . Referring to FIG. 3 at the same time, one of the heat radiating fins located at the bottom end of the first heat radiating body 14 toward the heat conducting plate 12 is formed as a flow guiding fin 15 which can be used as a diversion flow. The cover directs a portion of the airflow generated by the fan 2 to the transistors 44, 46 located around the central processor 42. The flow-diffusion-heating sheet 15 has a body 15 平行 parallel to the other first heat-dissipating fins 148. The body 150 is disposed apart from the heat-conducting plate 12, and the tail edge of the body 15 is bent to extend downwardly and to conduct heat. The deflector 152 of the board 12 is configured to direct a portion of the airflow generated by the fan 20 to the surrounding transistor 44. The deflector 152 is curved in a curved shape; the sides of the body 15 are bent to extend a first and a first The wind deflectors 154, 156 are perpendicular to the body 150 and are bent in the direction in which the flow plates 152 extend. The length of the second wind deflector 156 in the front-rear direction is shorter than that of the first wind deflector 154, and a partition plate 158 extends perpendicularly from the side of the second wind deflector 156 adjacent to the deflector 152 toward the first wind deflector 154. Settings. The first wind deflector 154 prevents the airflow generated by the fan 20 from diverging to the side. The second heat dissipating body 18 can be integrally extruded from a material such as a ruthenium and formed with a plurality of flow channels 180 extending in the front-rear direction. The second heat dissipating body 18 includes a plurality of second heat dissipating fins perpendicular to the first heat dissipating fins 148. The heat sink 160 of the heat pipe 16 is welded to the bottom of the second heat sink 18, and the top of the second heat sink 18 is soldered to the bottom surface of the body 150 of the heat sink fin 15 so that the heat absorbed by the heat pipe 16 is absorbed. It can be quickly transferred to the second heat sink 18. The length L of the flow guiding fins 15 is greater than the length of the heat conducting plate 12 in the corresponding direction such that the second wind deflector 156 and the partition plate 158 are partially positioned in the side space of the heat conducting plate 12, and the partition 158 is the free end and the second side. The side surface 182 of the heat sink 18 is adjacent, and the bottom edge 157 of the partition 158 is adjacent to the top surface 122 of the heat conducting plate 12. Thus, the airflow flowing between the second wind deflector 156 and the side surface 182 is restricted from flowing in the front-rear direction. A portion of the airflow generated by the fan 20 can be directed to the transistor 46 located around the central processor 42. When the fan 20 is in operation, it generates a part of the airflow through the flow path 140 of the first heat sink 14 and the flow path 180 of the second heat sink 18, thereby absorbing the first heat sink 14 and the second heat sink 18 from The heat of the central processing unit 42 is carried into the surrounding air, whereby the heat generated by the central processing unit 42 can be quickly dissipated. At the same time, another portion of the airflow flowing through the second heat sink 18 generated by the fan 20 is guided by the deflector 152 of the flow guiding fin 15 to the transistor 44 located near the side of the central processing unit 42, and a part of the airflow is The second windshield 156 and the spacer 158 are directed to directly blow the transistor 46 located near the other side of the central processing unit 42, whereby the heat generated by the transistors 44, 46 can be simultaneously dissipated. In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. However, the above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art will be included in the following claims. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic diagram of a combination of a flow guiding heat sink of the present invention mounted on a printed circuit board. 2 is an exploded perspective view of the flow guiding heat sink of the present invention. Figure 3 is a structural view of the flow guiding fin of Figure 2. [Main component symbol description] Heat sink 10 Thermal plate 12 Bottom surface 120 Top surface 122 Groove 124 Lug 126 First heat sink 14 Flow path 140 Through hole 142 Ring wall 144 Groove 146 First heat sink fin 148 Guide heat sink 15 body 150 deflector 152 first wind plate 154 second wind deflector 156 bottom 157 partition 158 heat pipe 16 heat sink 160 heat release 162 second heat sink 18 flow channel 180 side 182 fan 20 screw 22 fan mount 30 Board 40 Central Processing Unit 42 Transistors 44, 46 Fasteners 50