TWI409619B - Heat dissipation device - Google Patents

Abstract

A heat dissipation device for dissipating heat from an electronic device includes a heat spreader for contacting with the electronic device, a plurality of fins, a heat pipe connecting with the heat spreader and the fins, and a fan mounted above the fins. The heat pipe includes an evaporation portion thermally connecting with the heat spreader and a condensation portion connecting with the evaporation. The condensation portion of the heat pipe has a spiral configuration. The fins are arranged on the condensation portion of the heat pipe from bottom to top.

Description

Heat sink

The present invention relates to a heat sink, and more particularly to a heat sink for dissipating heat from an electronic component.

High-power electronic components such as computer central processing units, north bridge chips, and graphics cards generate a large amount of heat during operation. If these heats are not effectively dissipated, they will directly cause a sharp rise in temperature, which will seriously affect the normal operation of electronic components. To this end, heat sinks are needed to dissipate these electronic components.

The conventional heat sink generally includes a base mounted on the electronic component, a plurality of mutually parallel fins extending upward from the base, and a fan fixed to the top surface of the heat sink. The heat generated by the electronic components is first transferred to the base and then absorbed by the heat sinks to the surrounding air. The fan increases the heat exchange rate of the heat sink, which improves heat dissipation efficiency.

However, in the above heat dissipating device, the fan blowing airflow spirals downward, and the inlet direction of the air passage between the fins is often vertically upward, so the airflow direction of the fan is at an angle to the air passage inlet between the fins, so that the fan The airflow does not easily enter the air passage of the heat sink, which reduces the air flow intensity in the air passage of the heat sink, and reduces the heat dissipation efficiency of the entire heat sink.

In view of this, it is necessary to provide a heat sink having a strong air guiding capability and high heat dissipation efficiency.

A heat dissipating device for dissipating heat from an electronic component on a circuit board, comprising: a heat conducting plate attached to the electronic component, a plurality of heat dissipating fins, a heat pipe connecting the heat conducting plate and the heat dissipating fin, and a heat dissipating fin disposed on the heat dissipating fin The heat pipe comprises a heat absorption section connected to the heat conduction plate and a heat release section connected to the heat absorption section, wherein the heat release section of the heat pipe is spirally rising, and the heat dissipation fins are arranged in a spirally rising manner on the heat release section of the heat pipe.

In the above heat dissipating device, since the heat releasing portion of the heat pipe is spirally rising, the heat dissipating fins mounted on the heat releasing portion of the heat pipe are spirally rising, and the heat dissipating fins vertically greet the airflow blown by the fan, so that the air flow can be smoothly performed. Entering between the heat dissipation fins, the heat radiated by the heat dissipation fins is better taken, and the heat dissipation efficiency of the heat dissipation device is improved.

10‧‧‧ radiator combination

12‧‧‧heat conducting plate

13‧‧‧ Mounting frame

14‧‧‧Solid fin group

16‧‧‧First heat pipe

18‧‧‧ second heat pipe

19‧‧‧ radiator

22‧‧‧ sleeve

24‧‧‧ Fixing frame

26‧‧‧ screw

30‧‧‧Fan

50‧‧‧ screws

124, 144‧‧‧ grooves

132‧‧‧ lugs

140‧‧‧Heat fins

146‧‧‧Circle

148‧‧‧Bend

160, 180‧‧ ‧ heat absorption department

164, 184‧‧‧ connection segments

166, 186‧‧ ‧ exothermic section

240‧‧‧ screw holes

1 is a combination diagram of a heat sink of the present invention.

Figure 2 is a partial assembled view of the heat sink of Figure 1.

Figure 3 is a combination diagram of the heat sink of the heat sink of Figure 2.

Figure 4 is a front elevational view of the heat sink of Figure 1.

Referring to FIG. 1 and FIG. 2, a heat dissipating device is mounted on a circuit board (not shown) for dissipating electricity on a circuit board according to a preferred embodiment of the present invention. The heat generated by the sub-component (not shown). The heat sink includes a heat sink assembly 10, a fastener 20 assembled around the heat sink assembly 10, and a fan 30 mounted on the fastener 20 and the top of the heat sink.

The heat sink assembly 10 includes a heat conducting plate 12 and two heat sinks 19 disposed above the heat conducting plate 12. Each of the heat sinks 19 includes a heat dissipating fin set 14 , a first heat pipe 16 and a second heat pipe 18 that are connected to the heat conducting plate 12 and the heat dissipating fin set 14 , wherein the heat conducting plate 12 has a substantially rectangular plate shape. The bottom is provided with four parallel spaced grooves 124. The two mounting brackets 13 are fixed to opposite ends of the bottom of the heat conducting plate 12 by screws (not shown), and the mounting brackets 13 have protrusions 132 protruding from opposite ends. The fasteners 20 are coupled to the circuit board through the lugs 132 to secure the thermally conductive plate 12 to the circuit board and in intimate contact with the electronic components.

Referring to FIG. 3 to FIG. 4 together, the heat dissipation fin set 14 of each heat sink 19 includes a plurality of heat dissipation fins 140 spaced apart from each other. Each of the heat dissipation fins 140 is disposed in a substantially rectangular shape. Two through-holes (not labeled) are disposed in the middle of each of the heat dissipation fins 140 to couple the first and second heat pipes 16, 18. Each of the heat dissipation fins 140 extends from the edge of the through hole to provide a contact wall 146 to increase the contact area between the heat dissipation fins 140 and the first and second heat pipes 16 and 18, and to separate adjacent heat dissipation fins 140. The distance is to form a ventilation duct (not shown). One side of each of the heat dissipation fins 140 is provided with a groove 144, and one end of the other side is provided with a bent portion 148 which is inclined at an angle with respect to other portions of the heat dissipation fin 140.

The first heat pipe 16 of each heat sink 19 includes a flat linear heat absorbing portion 160, a heat releasing portion 166, and a connecting portion 164 connecting the heat absorbing portion 160 and the heat releasing portion 166. The heat release section 166 has a semi-arc shape and penetrates a through hole of the heat dissipation fin 140 which is far from the bent portion 148. The connecting section 164 is bent, and the connecting section 164 and the heat releasing section 166 extend spirally from the end of the heat absorbing section 160 counterclockwise. The second heat pipe 18 includes a flat linear heat absorbing portion 180, a heat releasing portion 186, and a connecting portion 184 connecting the heat absorbing portion 180 and the heat releasing portion 186. The heat release section 186 has a semi-arc shape and penetrates the through hole of the heat dissipation fin 140 near the bent portion 148. The radius of the exothermic section 186 is greater than the radius of the exothermic section 166 of the first heat pipe 16, such that the exothermic section 186 is disposed outside of the exothermic section 166 of the first heat pipe 16. The connecting section 184 is bent and disposed. The connecting section 184 and the heat releasing section 186 extend upward from the end of the heat absorbing section 180 counterclockwise, and are spaced apart from the connecting section 164 and the heat releasing section 166 of the first heat pipe 16.

The two heat sinks 19 are oppositely fixed on the heat conducting plate 12, wherein the heat absorbing sections 160 and 180 of the first and second heat pipes 16 and 18 of the two heat sinks 19 are parallel and received in the grooves 124 of the heat conducting plate 12, and the bottom surface thereof is thermally conductive. The bottom surface of the board 12 is coplanar to form a flat bottom surface with the bottom of the heat conducting board 12 to be attached to the top surface of the electronic component to absorb heat from the electronic component. The connecting sections 164 and 184 of the first and second heat pipes 16 and 18 of each of the heat sinks 19 are respectively located on opposite sides of the heat conducting plate 12, and are partially received by the heat radiating fins 140 on the second and first heat pipes 18 and 16. In the groove 144. The heat sink fins 14 of each of the heat sinks 19 are sleeved on the heat releasing sections 166 and 186 of the first and second heat pipes 16 and 18 and are substantially semi-annular, and the heat sink fins 14 of the two heat sinks 19 are complemented by one. Ring-shaped body. Due to the first and second heat pipes 16, The heat radiating fins 166 and 186 are spirally rising, and the heat radiating fins 140 are vertically disposed on the heat releasing sections 166 and 186 of the first and second heat pipes 16 and 18, so that the heat radiating fin groups 14 are spirally arranged. Installed on the heat releasing sections 166, 186 of the first and second heat pipes 16, 18 at an angle to the horizontal plane.

The fastener 20 includes four sleeves 22 disposed on the lugs 132 of the mounting bracket 13, two curved retaining brackets 24 secured to the sleeve 22, and four long screws 26. The equal length screws 26 pass through the mounting brackets 24, each of the sleeves 22, and the lugs 132 of the mounting bracket 13 to secure the heat sink assembly 10 to the circuit board. Each of the fixing frames 24 has a curved plate shape, and screw holes 240 are provided at both ends thereof.

The fan 30 has a substantially circular outer shape, and the bottom portion thereof extends uniformly outwardly from the four fixing legs 35. The four screws 50 are screwed into the screw holes 240 of the fixing frame 24 through the fixing legs 35 of the fan 30 to fix the fan 30. Above the heat sink fin set 14 of the two heat sinks 19. The fan 30 rotates counterclockwise.

When the electronic component is in operation, the heat generated by the electronic component is transmitted to the heat dissipation fin group 14 through the heat conduction plate 12 and the heat pipe 16, and a part of the heat is radiated to the air in the air passage between the heat dissipation fins 140 through the heat dissipation fin group 14; The fan 30 provides cold air to be blown between the fins 140, and removes the heat radiated from the fins 140 to improve the heat dissipation efficiency of the heat sink. The first and second heat pipes 16 and 18 of the two heat sinks 19 spiral upward in a counterclockwise direction, and the heat radiating fins 140 are vertically sleeved on the heat releasing sections 166 and 186 of the first and second heat pipes 16 and 18. Counterclockwise spirally ascending, so that the air passage inlet between the fins 140 just vertically greets the fan 30 with a counterclockwise spiral downward flow, so that the airflow can smoothly enter between the fins 140 and take away The heat radiated from the fins 140. In particular, since the bent portion 148 of the heat dissipation fin 140 is inclined at an angle with respect to other portions of the heat dissipation fin 140, the heat dissipation fin group 14 has a larger spiral angle, and the airflow blown by the fan 30 is more appropriately introduced. In addition, the sleeve 22 of the heat dissipating device is fixed around the heat sink 19, and the first and second heat pipes 16 and 18 and the heat dissipating fin group 14 are well protected, and the heat sink 19 is prevented from being transported during the heat dissipating device. got damage.

In summary, the present invention conforms to the requirements of the invention patent, and proposes a patent application according to law. The above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art will be included in the following claims.

12‧‧‧heat conducting plate

13‧‧‧ Mounting frame

14‧‧‧Solid fin group

16‧‧‧First heat pipe

18‧‧‧ second heat pipe

19‧‧‧ radiator

22‧‧‧ sleeve

24‧‧‧ Fixing frame

26‧‧‧ screw

30‧‧‧Fan

35‧‧‧Fixed feet

50‧‧‧ screws

124‧‧‧ Groove

132‧‧‧ lugs

240‧‧‧ screw holes

Claims (8)

A heat dissipating device for dissipating heat from an electronic component on a circuit board, comprising: a heat conducting plate attached to the electronic component, a plurality of heat dissipating fins, a heat pipe connecting the heat conducting plate and the heat dissipating fin, and a heat dissipating fin disposed on the heat dissipating fin The heat pipe includes a heat absorption section connected to the heat conduction plate and a heat release section connected to the heat absorption section, wherein the heat pipe has a spiral rising shape, and the heat dissipation fins are arranged in a spirally rising manner on the heat pipe. The exothermic section, wherein the heat-dissipating section of the heat pipe is semi-circular, the heat-dissipating fin is mounted on the heat-dissipating section in a semi-annular shape, and further comprises another identical heat pipe and heat-dissipating fins mounted on the heat pipe, The heat pipe and the heat dissipating fins are oppositely disposed, and the heat dissipating fins are complemented by a ring-shaped body, and each heat pipe further comprises a connecting portion connecting the heat absorbing portion and the heat releasing portion, wherein the heat dissipating fins are provided with a groove at the bottom to receive another heat pipe Part of the connection segment. The heat dissipating device of claim 1, wherein the end portion of each of the heat dissipating fins is provided with a bent portion, and the bent portion is inclined at an angle with respect to other portions of the heat dissipating fin. The heat dissipating device according to claim 1, wherein the connecting portion and the heat releasing portion extend in a spiral shape. The heat dissipating device of claim 1, wherein the bottom of the heat conducting plate is provided with a groove for receiving the heat absorbing portion of the heat pipe, and the bottom surface of the heat absorbing portion of the heat pipe is coplanar with the bottom surface of the heat conducting plate. The heat sink of claim 1, further comprising four fasteners for fixing the heat sink to the electronic component, each fastener comprising a sleeve And a long screw connected to the circuit board through the sleeve. The heat dissipating device of claim 5, further comprising two arc-shaped fixing brackets fixed on the sleeve, the fan being fixed on the arc-shaped fixing brackets. The heat dissipating device of claim 1, wherein the heat releasing portion of the heat pipe spirals counterclockwise, and the fan blows the fins counterclockwise. The heat dissipating device of claim 1, wherein the heat dissipating fins are perpendicular to a heat releasing portion of the heat pipe to be contacted, and a plurality of air passages inclined to the fan are formed between the heat dissipating fins.