JP5558536B2 - Heat dissipation device - Google Patents

Description

  The present invention relates to a heat radiating device, and in particular, a first guide plate and a second guide plate that are directed to a plate surface portion above a plurality of fins of a heat sink so as to face a direction of an axial wind generated from a fan and are inclined at a predetermined angle in opposite directions. Since the guide plate is provided, the ventilation resistance is reduced and the amount of ventilation is increased, so that the noise is reduced and the heat dissipation effect can be enhanced.

  Currently, computer-related science and technology is growing at an ever-increasing rate. The computer has been developed in such a way that the calculation function is further enhanced and the calculation speed is further increased. As application areas related to computers develop rapidly, the temperatures generated when CPUs, image processors, etc. perform arithmetic processing are becoming increasingly higher. For this reason, it is an extremely important issue in the industry to operate a computer normally within an allowable temperature with a suitable heat dissipation system. Further, it is necessary to improve the fins of the heat sink so that the heat dissipation system can realize suitable heat dissipation efficiency and manufacturing cost in response to the spread of computers.

  Generally, in a conventional heat dissipation structure, a heat sink is attached to a heat source (CPU, image processor, chip, etc.) on a circuit board, a fan is positioned on the heat sink, and the fan and the heat sink are combined, An optimal heat dissipation structure is formed. Please refer to FIG. FIG. 8 is an exploded perspective view showing a conventional heat dissipation structure. As can be seen from FIG. 8, the conventional heat sink A is often manufactured by integral molding (aluminum extrusion molding, mold molding, etc.). The heat sink A stands upright with a plurality of fins A2 spaced from the base A1. In addition, the arrangement method of the fins A2 is an arrangement method in which a flat upper surface is formed. The fan C is positioned on the flat upper surface portion of the fin A2. The heat sink A is mounted on the circuit board B, and the base A1 is attached to the upper surface of the chip B1. Thereby, the thermal energy generated from the chip B1 is transmitted onto the heat sink A. Further, when the fan C is operated, the axial airflow spirally flows downward, and the air after heat exchange flows to the outside from the passage formed between the adjacent fins A2. However, the central portion of the base A1 on which the chip B1 is attached is the portion that absorbs the most heat energy, and the heat energy is transmitted to the periphery of the base A1 and the plurality of fins A2. The fin A2 on the center portion of the base A1 absorbs heat energy faster. For this reason, heat accumulates in the central portion of the heat sink A, and the heat dissipation area of the entire heat sink A cannot be used effectively, resulting in poor heat dissipation effect.

  In order to increase the entire heat radiation area, a plurality of fins A2 are provided on the base A1 of the heat sink A. However, since the area of the base A1 is limited, the plurality of fins A2 are densely installed. For this reason, the downward axial airflow generated by the operation of the fan C is affected, and the airflow resistance is formed without smoothly entering the passage between the adjacent fins A2, and an extremely large noise is generated. . Further, since the upper surface of the fin A2 is flat, the axial airflow is concentrated at the central portion of the plurality of fins A2 and only part of the heat sink A can be dissipated. Thereby, thermal energy is accumulated in the central portion of the heat sink A, and effective heat radiation cannot be performed, so that the heat radiation efficiency is poor.

  As can be seen from the above, the above-described conventional heat sink has room for improvement, and there has been a demand for improvement of defects.

  The inventor of the present invention has devised the heat radiating device of the present invention from many years of experience and unremitting research in view of the problems and drawbacks of using the conventional heat radiating device.

A main object of the present invention is to provide a first guide plate and a first guide plate inclined at a predetermined angle in directions opposite to each other in the direction of the axial air flow generated from the fan on the plate surface portion above the plurality of fins of the heat sink. In addition to the fact that the guide plate of 2 is provided and the heat radiation passage is formed between the adjacent fins, when the fan arranged in the upper portion of the fin is operated, the ventilation resistance is reduced and the ventilation amount is increased. On the circuit board, the noise generated by receiving irregular disturbances when the fan blows is reduced, the stability during operation of the fan is ensured, and the ventilation rate in the heat dissipation passage is increased. It is an object of the present invention to provide a heat dissipating device in which the heat energy accumulated in the heat source is quickly discharged to the outside and the heat dissipating effect of the entire heat dissipating device is enhanced.
Another object of the present invention is to form a recessed accommodation space in the upper part of the fin of the heat sink, position the fan in the accommodation space, and the fan is a first guide plate and a second guide plate on the fin. When the heat source of the circuit board is operated, the contact surface of the heat sink on the surface of the circuit board is pasted on the surface of the heat source on the circuit board. Is transmitted to the plurality of fins, the heat radiation area is increased, and heat is exchanged by the heat pipe penetrating the heat radiating stand and the heat sink, and the axial wind generated from the fan is generated on the plurality of fins. It is an object of the present invention to provide a heat dissipation device that assists quick heat dissipation of the heat sink.

  In order to solve the above-described problem, the invention of claim 1 is a heat dissipation device including a heat sink, a heat dissipation base, and a fan, the heat sink having a plurality of fins arranged at intervals, and below the fins. The part is provided with a heat radiating stand that is pasted on the surface of the heat source on the circuit board. At least one fan is positioned above the fins, and the axial wind for cooling is sent from the fan onto the heat sink. A heat dissipation path is formed between adjacent fins of the heat sink, and a plate surface portion above the fins faces the direction of the axial airflow generated from the fan, and has predetermined directions in at least two opposite directions. By providing the first guide plate and the second guide plate inclined at an angle, the ventilation resistance is reduced and the ventilation amount is increased, so that the noise generated when the fan blows is reduced and the heat is reduced. Energy is a heat radiating device, characterized in that is rapidly discharged to the outside.

  According to the second aspect of the present invention, at least one recessed housing space is formed above the fin of the heat sink, the fan is positioned in the housing space, and the fan includes the first guide plate on the fin and the first guide plate. The fan has a base base and a fan blade body, and the base base is positioned directly on the heat sink or a frame is provided in the lower part of the base base. The heat sink is positioned on the heat sink, and a cover plate is provided outside the fan. At least one through hole is provided in a portion corresponding to the fan blade body on the cover plate. A counter connecting portion to which the heat sink is coupled is provided, and one side of at least one heat pipe is provided between the counter connecting portion and the heat sink, from the counter connecting portion. Other side of the heat pipe is on being pierced the fin, a heat dissipation apparatus according to claim 1, characterized in that it is coupled together.

  According to a third aspect of the present invention, a fan-shaped connection portion is formed at a portion where the first guide plate and the second guide plate of the heat sink are connected to the fin, and the connection portion is a connection plate, a hole or a groove. The heat radiating device according to claim 1, wherein the heat radiating device is provided.

  In the heat dissipation device of the present invention, the first guide plate and the second guide plate facing the direction of the axial air flow generated from the fan are provided on the plate surface portion above the fin, thereby reducing the air flow resistance and the air flow rate. Therefore, noise generated when the fan blows is reduced, and heat energy can be quickly discharged to the outside.

1 is a perspective view showing a heat dissipation device according to an embodiment of the present invention. It is a disassembled perspective view which shows the thermal radiation apparatus by one Embodiment of this invention. It is a disassembled perspective view which shows the thermal radiation apparatus by one Embodiment of this invention. It is a disassembled perspective view which shows the heat sink of the thermal radiation apparatus by one Embodiment of this invention. It is sectional drawing which shows the thermal radiation apparatus by one Embodiment of this invention. It is a disassembled perspective view which shows the state which mounts the thermal radiation apparatus by one Embodiment of this invention on a circuit board. It is a perspective view which shows the state which the fan of the thermal radiation apparatus by one Embodiment of this invention ventilates to a heat sink. It is a perspective exploded view showing the conventional heat dissipation structure.

  In order to clarify the technology and structure employed in the present invention to achieve the objects and effects of the present invention, embodiments of the present invention will be described in detail with reference to the drawings.

  Please refer to FIG. FIG. 1 is a perspective view showing a heat dissipation device according to an embodiment of the present invention. FIG. 2 is an exploded perspective view showing a heat dissipation device according to an embodiment of the present invention. FIG. 3 is an exploded perspective view showing a heat dissipation device according to an embodiment of the present invention. FIG. 4 is an exploded perspective view showing a heat sink of the heat dissipation device according to the embodiment of the present invention. FIG. 5 is a cross-sectional view illustrating a heat dissipation device according to an embodiment of the present invention. As can be seen from FIGS. 1 to 5, the heat dissipating device according to one embodiment of the present invention includes a heat sink 1, a heat dissipating base 2, and a fan 3.

  The heat sink 1 has a plurality of fins 11 arranged at intervals. At least one recessed housing space 10 is formed in the upper portion of the fin 11. A heat radiation passage 110 is formed between the adjacent fins 11. Further, at least two of the first guide plate 111 and the second guide plate 112 inclined at a predetermined angle in opposite directions are provided on the plate surface portion above the fin 11. A fan-shaped connecting portion 113 is formed at a portion where both side surfaces of the first guide plate 111 and the second guide plate 112 are connected to the fin 11. The connection part 113 may be in the form of a connection plate, a hole, a groove, or the like.

  A counter connection portion 12 to which the heat radiating table 2 is coupled is provided in the lower portion of the center of the plurality of fins 11 described above. A plurality of engaging grooves 121 in a penetrating state are provided laterally on the opposing connection portion 12. On both outer sides of the first guide plate 111 and the second guide plate 112 on the side opposite to the engagement groove 121 of each fin 11, penetrating joint holes 114 are respectively provided laterally. In addition, screw holes 115 are respectively provided laterally on the fins 11 on both the front and rear sides of the heat sink 1. A screw 116 is provided in the screw hole 115.

  The bottom of the radiator 2 has a contact surface 21. Further, a joint 22 having at least one lateral positioning groove 221 is provided in the upper part of the contact surface 21. The heat pipe 4 is provided through the positioning groove 221. That is, one side portion of the heat pipe 4 is disposed in a space formed between the engagement groove 121 and the positioning groove 221 of the opposing connection portion 12 of the heat sink 1. Further, the other side portion of the heat pipe 4 away from the opposing connection portion 12 is penetrated into the corresponding joining hole 114 on the fin 11 and is integrally coupled.

  The fan 3 includes a base base 31 and a fan blade body 32. Each corner portion of the base 31 is provided with a through hole 311 through which a screw 312 is penetrated. Thereby, each fan 3 is positioned directly in the accommodation space 10 on the heat sink 1. Further, the base 3 and the heat sink 1 are integrally screwed and fixed by screwing the screw 312 to the upper part between the two fins 11. Alternatively, at least one frame 33 is provided in the lower part of the base base 31 of the fan 3 and the screw 312 is screwed into the corresponding screwing hole 331 on the frame 33, so that the base base 31 and the frame 33 are integrated. Screw and fix. Next, the perforations 333 on the side plates 332 that are curved and extended on both sides of the frame 33 are aligned with the screw holes 115 on the fins 11 on both front and rear sides of the heat sink 1, and the screws 116 are placed on the side plates 332. After being penetrated through the perforation 333, it is screwed into the screw hole 115 on the fin 11. Thereby, the fan 3 and the heat sink 1 can be screwed and fixed integrally. Further, a cover plate 34 is provided outside the fan 3. A portion corresponding to the fan blade body 32 on the cover plate 34 is provided with at least one through hole 341.

  Please refer to FIG. 2 and FIGS. FIG. 2 is an exploded perspective view showing a heat dissipation device according to an embodiment of the present invention. FIG. 5 is a cross-sectional view illustrating a heat dissipation device according to an embodiment of the present invention. FIG. 6 is an exploded perspective view showing a state where the heat dissipation device according to the embodiment of the present invention is mounted on the circuit board. FIG. 7 is a perspective view illustrating a state in which the fan of the heat dissipation device according to the embodiment of the present invention blows air to the heat sink. As can be seen from FIGS. 2 and 5 to 7, at least one heat source 51 (CPU, image processor, chip, etc.) is provided on the circuit board 5. In the heat sink 1, the heat radiation source 2 on the circuit board 5 is operated by fixing the heat radiation table 2 on the circuit board 5 and sticking the contact surface 21 at the bottom of the heat radiation table 2 to the surface of the heat generation source 51. At this time, the heat energy generated from the heat source 51 is absorbed via the heat radiating table 2. The heat energy is transmitted onto the plurality of fins 11 of the heat sink 1 having a large heat radiation area, and the heat pipe 4 performs heat exchange. At the same time, when the fan 3 is operated, a cooling axial flow flows on the plurality of fins 11, and heat dissipation by the heat sink 1 is assisted.

  The plate surface portion above the plurality of fins 11 of the heat sink 1 according to the embodiment of the present invention is provided with at least two first guide plates 111 and 112 that are inclined at predetermined angles in opposite directions. . Further, the fan 3 is positioned in the accommodation space 10 above the fin 11. The fan 3 faces the upper portions of the first guide plate 111 and the second guide plate 112. As a result, the axial wind generated from the fan 3 flows spirally clockwise or counterclockwise and reaches the plurality of fins 11. When the axial wind enters the heat radiation passage 110 between the adjacent fins 11, the inflow air is increased by the first guide plate 111 and the second guide plate 112 facing the direction of the axial wind generated from the fan 3, The amount of air entering the heat radiation passage 110 increases. Thereby, the hot air after heat exchange accumulated in the plurality of fins 11 is quickly discharged from the heat radiation passage 110 to the outside. Alternatively, the cold air of the axial flow exchanges heat in the region where the temperature of the heat radiating table 2 is highest, and the hot air is quickly discharged to the outside along the heat radiation passage 110. Thereby, the heat energy accumulated in the heat generation source 51 on the circuit board 5 is quickly discharged to the outside, and the heat dissipation efficiency of the entire heat dissipation device is increased. Further, since the flow resistance is reduced, it is possible to reduce the irregular interference of the fluid, so that it is possible to ensure the stability when the fan 3 is operated and to generate the air during blowing. The noise problem can be solved effectively. Moreover, since the heat dissipation rate by the convection generated from the fan 3 is accelerated, the heat dissipation effect of the entire heat dissipation device can be enhanced.

  Please refer to FIG. 2, FIG. 5 and FIG. As shown in FIGS. 2, 5, and 7, the plate surface portion above the plurality of fins 11 of the heat sink 1 according to the embodiment of the present invention has at least two mutually facing axial flow directions generated from the fan. A first guide plate 111 and a second guide plate 112 inclined by a predetermined angle in the opposite direction are provided. Thereby, since ventilation resistance reduces and ventilation volume increases, noise can be reduced. Moreover, since the air flow rate in the heat dissipation passage formed between the adjacent fins 110 increases, the heat dissipation effect of the entire heat dissipation device can be enhanced.

  The above embodiments do not limit the scope of the claims of the present invention, and changes and modifications that are equivalent effects within the scope of the present invention are included in the scope of the claims of the present invention.

  As can be seen from the above description, the heat dissipating device of the present invention can surely achieve the desired effect and purpose, and can be said to be an excellent invention. It also meets the patent requirements.

DESCRIPTION OF SYMBOLS 1 Heat sink 10 Accommodating space 11 Fin 110 Heat radiation path 111 1st guide plate 112 2nd guide plate 113 Connection part 114 Joining hole 115 Screwing hole 116 Screw 12 Opposing connection part 121 Engaging groove 2 Heat sink 21 Contact surface 22 Joining 221 Positioning groove 3 Fan 31 Base base 311 Through hole 312 Screw 32 Fan blade body 33 Frame 331 Screw hole 332 Side plate 333 Perforation 34 Lid plate 341 Through hole 4 Heat pipe 5 Circuit board 51 Heat source A Heat sink A1 Base A2 Fin B Circuit board B1 Chip C Fan

Claims (3)

A heat radiating device including a heat sink, a heat radiating stand, and a fan,
The heat sink has a plurality of fins arranged at intervals, and the lower part of the fins is provided with the heat radiating stand attached on the surface of the heat source on the circuit board, and above the fins. At least one of the fans is provided in the portion, and the cooling axial flow is sent from the fan to the heat sink to radiate heat,
A heat dissipation path is formed between adjacent fins of the heat sink, and the plate surface portion above each fin is inclined at a predetermined angle in at least two opposite directions facing the direction of the axial wind generated from the fan. A first guide plate and a second guide plate are provided to reduce ventilation resistance and increase ventilation volume, reduce noise generated when the fan blows air, and quickly discharge heat energy to the outside. A heat dissipation device characterized by that.   At least one recessed housing space is formed in the upper portion of the fin of the heat sink, the fan is provided in the housing space, and the fan includes the first guide plate and the second on the fin. The fan has a base base and a fan blade body, and the base base is directly provided on the heat sink or a frame provided in a lower part of the base base. Provided on the heat sink, a cover plate is provided outside the fan, and at least one through hole is provided in a portion corresponding to the fan blade body on the cover plate. The lower portion is provided with an opposing connection portion to which the heat dissipation table is coupled, and at least one heat pipe is provided between the opposing connection portion and the heat dissipation table. The one side part is penetrated, The other side part of the said heat pipe away from the said opposing connection part is penetrated by the said fin, and is couple | bonded integrally. Heat dissipation device. A fan-shaped connecting portion is formed at a portion where the fins are connected to both sides of the first guide plate and the second guide plate of the heat sink, and the connecting portion is in the form of a connecting plate, a hole or a groove. 2. The heat dissipation device according to claim 1, wherein the heat dissipation device is provided.

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