TW201304671A - Heat sink assembly - Google Patents

Heat sink assembly Download PDF

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Publication number
TW201304671A
TW201304671A TW100124703A TW100124703A TW201304671A TW 201304671 A TW201304671 A TW 201304671A TW 100124703 A TW100124703 A TW 100124703A TW 100124703 A TW100124703 A TW 100124703A TW 201304671 A TW201304671 A TW 201304671A
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TW
Taiwan
Prior art keywords
fin
heat sink
heat
base
air inlet
Prior art date
Application number
TW100124703A
Other languages
Chinese (zh)
Inventor
Chih-Hang Chao
Wei-Cheng Cheng
Chih-Hsiang Chiang
Original Assignee
Hon Hai Prec Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hon Hai Prec Ind Co Ltd filed Critical Hon Hai Prec Ind Co Ltd
Priority to TW100124703A priority Critical patent/TW201304671A/en
Priority to US13/444,088 priority patent/US20130014920A1/en
Publication of TW201304671A publication Critical patent/TW201304671A/en

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • F28F1/32—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A heat sink assembly includes a heat sink, a first fan, and a second fan. The heat sink includes a first base, a first pipe, and a fin assembly. The first pipe is inserted in the fin assembly. A first input opening and a first output opening are defined in the first fan. The first input opening is perpendicular to the first output opening. A second input opening and a second output opening are defined in the second fan. The second input opening is parallel to the second output opening. The first input opening and the second input opening correspond to the fin assembly.

Description

散熱器組合Radiator combination

本發明是關於一種散熱器組合，尤指一種具有風扇之散熱器組合。The present invention relates to a heat sink assembly, and more particularly to a heat sink assembly having a fan.

隨著科學技術之進步，電腦會朝著體積小、厚度薄及主機與顯示器一體化之方向發展。與此同時，電腦之功能越來越多，CPU（Central Processing Unit，中央處理器）不斷升級，CPU之功耗不斷加大，然安裝散熱器之空間卻越來越小，加大了散熱之難度。With the advancement of science and technology, computers will develop in the direction of small size, thin thickness and integration of host and display. At the same time, the functions of the computer are more and more, the CPU (Central Processing Unit) is continuously upgraded, and the power consumption of the CPU is continuously increased. However, the space for installing the heat sink is getting smaller and smaller, and the heat dissipation is increased. Difficulty.

傳統筆記本電腦之CPU散熱模組包括一貼於CPU晶片上之散熱器及一散熱風扇。所述散熱風扇裝設於所述散熱器上，所述散熱風扇從上往下對所述散熱器吹風，由於空間之局限性，散熱效果不是很理想，CPU有時溫度過高而不能正常工作。The CPU thermal module of the conventional notebook computer includes a heat sink attached to the CPU chip and a cooling fan. The cooling fan is mounted on the heat sink, and the heat dissipation fan blows the heat sink from top to bottom. Due to space limitations, the heat dissipation effect is not ideal, and the CPU sometimes has a high temperature and cannot work normally. .

鑒於以上內容，有必要提供一種散熱效果好之散熱器組合。In view of the above, it is necessary to provide a heat sink combination with good heat dissipation effect.

一種散熱器組合，包括一散熱器、一第一散熱風扇及一第二散熱風扇，所述散熱器組合包括一第一基座、一裝設於所述第一基座上之第一熱管及一鰭片組合，所述第一熱管插設於所述鰭片組合，所述第一散熱風扇設有一第一進風口及一垂直所述第一進風口之第一出風口，所述第二散熱風扇設有一第二進風口及一平行所述第二進風口之第二出風口，所述第一進風口及所述第二進風口對應所述鰭片組合。A heat sink assembly includes a heat sink, a first heat dissipation fan and a second heat dissipation fan, the heat sink assembly including a first base, a first heat pipe mounted on the first base, and a fin assembly, the first heat pipe is inserted into the fin assembly, and the first heat dissipation fan is provided with a first air inlet and a first air outlet perpendicular to the first air inlet, the second The cooling fan is provided with a second air inlet and a second air outlet parallel to the second air inlet, and the first air inlet and the second air inlet correspond to the fin combination.

與習知技術相比，本發明散熱器組合包括一第一散熱風扇、一第二散熱風扇及一散熱器，所述第一散熱風扇與第二散熱風扇之進風口與出風口之位置關係不同，於空間一定之情況下，達到更好地散熱效果。The heat sink assembly of the present invention includes a first heat dissipation fan, a second heat dissipation fan, and a heat sink, and the positional relationship between the air inlet and the air outlet of the first heat dissipation fan and the second heat dissipation fan is different from that of the prior art. In the case of a certain space, achieve better heat dissipation.

請參閱圖1及圖2，本發明散熱器組合較佳實施例包括一散熱器10、一第一散熱風扇30及一第二散熱風扇50。Referring to FIG. 1 and FIG. 2 , a preferred embodiment of the heat sink assembly of the present invention includes a heat sink 10 , a first heat dissipation fan 30 , and a second heat dissipation fan 50 .

所述散熱器10包括一第一基座11、兩個裝設於所述第一基座11上之第一熱管12、一第二基座13、一裝設於所述第二基座13上之第二熱管14及一鰭片組合15。The heat sink 10 includes a first base 11 , two first heat pipes 12 mounted on the first base 11 , a second base 13 , and a second base 13 . The second heat pipe 14 and a fin combination 15 are provided.

所述第一基座11包括一第一基座本體111及四個自所述第一基座本體111延伸形成之第一固定部113，所述第一固定部113分佈於所述第一基座本體111之四角。每一第一固定部113設有一第一固定件115。所述第一基座本體111用於安裝於一第一發熱元件（圖未示）上進行散熱。The first base 11 includes a first base body 111 and four first fixing portions 113 extending from the first base body 111. The first fixing portion 113 is distributed on the first base. The four corners of the seat body 111. Each of the first fixing portions 113 is provided with a first fixing member 115. The first base body 111 is mounted on a first heat generating component (not shown) for heat dissipation.

所述第二基座13包括一第二基座本體131及四個自所述第二基座本體131延伸形成之第二固定部133，所述第二固定部133分佈於所述第二基座本體131之四角。每一第二固定部133設有一第二固定件135。所述第二基座本體131用於安裝於一第二發熱元件（圖未示）上進行散熱。The second base 13 includes a second base body 131 and four second fixing portions 133 extending from the second base body 131. The second fixing portion 133 is distributed on the second base. The four corners of the seat body 131. Each of the second fixing portions 133 is provided with a second fixing member 135. The second base body 131 is mounted on a second heat generating component (not shown) for heat dissipation.

所述鰭片組合15包括一第一鰭片組151及一第二鰭片組153。所述第一鰭片組151之單個鰭片之面積小於所述第二鰭片組153之單個鰭片之面積。所述鰭片組合15設有兩個貫通所述第一鰭片組151及所述第二鰭片組153之第一通孔155，所述第一通孔155用於插設所述第一熱管12。所述第二鰭片組153設有一第二通孔157，所述第二通孔157用於插設所述第二熱管14。所述第二通孔157設於所述第一通孔155之上側且未延伸至所述第一鰭片組151。所述第二通孔157之延伸方向與所述第一通孔155之延伸方向平行。所述鰭片組合15大致呈L形。The fin assembly 15 includes a first fin set 151 and a second fin set 153. The area of the single fin of the first fin set 151 is smaller than the area of the single fin of the second fin set 153. The fin assembly 15 is provided with two first through holes 155 penetrating the first fin group 151 and the second fin group 153, and the first through hole 155 is configured to insert the first through hole 155. Heat pipe 12. The second fin group 153 is provided with a second through hole 157 for inserting the second heat pipe 14 . The second through hole 157 is disposed on an upper side of the first through hole 155 and does not extend to the first fin group 151 . The extending direction of the second through hole 157 is parallel to the extending direction of the first through hole 155. The fin assembly 15 is generally L-shaped.

所述第一散熱風扇30設有一第一進風口31及一第一出風口33。所述第一進風口31對應所述第一鰭片組151。所述第一進風口31垂直所述第一出風口33。The first cooling fan 30 is provided with a first air inlet 31 and a first air outlet 33. The first air inlet 31 corresponds to the first fin set 151. The first air inlet 31 is perpendicular to the first air outlet 33.

所述第二散熱風扇50設有一第二進風口51及一第二出風口53。所述第二進風口51對應所述第二鰭片組153。所述第二進風口51平行所述第二出風口53。The second cooling fan 50 is provided with a second air inlet 51 and a second air outlet 53. The second air inlet 51 corresponds to the second fin set 153. The second air inlet 51 is parallel to the second air outlet 53.

請參閱圖1至圖3，組裝時，將所述第一熱管12及所述第二熱管14分別插設於所述第一通孔155及所述第二通孔157中，將所述第一散熱風扇30之第一進風口31靠近所述第一鰭片組151，將所述第二散熱風扇50之第二進風口51靠近所述第二鰭片組153。Referring to FIG. 1 to FIG. 3 , the first heat pipe 12 and the second heat pipe 14 are respectively inserted into the first through hole 155 and the second through hole 157 during assembly, and the first The first air inlet 31 of the heat dissipation fan 30 is adjacent to the first fin group 151 , and the second air inlet 51 of the second heat dissipation fan 50 is adjacent to the second fin group 153 .

所述散熱器組合包括兩個鰭片組及兩個散熱風扇，該設計於空間一定之情況下，達到更好地散熱效果。The heat sink assembly includes two fin sets and two heat dissipating fans, and the design achieves better heat dissipation effect in a certain space.

綜上所述，本發明確已符合發明專利要求，爰依法提出專利申請。惟，以上所述者僅為本發明之較佳實施方式，舉凡熟悉本發明技藝之人士，爰依本發明之精神所作之等效修飾或變化，皆應涵蓋於以下之申請專利範圍內。In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above-mentioned preferred embodiments of the present invention are intended to be within the scope of the following claims.

10．．．散熱器10. . . heat sink

11．．．第一基座11. . . First base

111．．．第一基座本體111. . . First base body

113．．．第一固定部113. . . First fixed part

115．．．第一固定件115. . . First fixture

12．．．第一熱管12. . . First heat pipe

13．．．第二基座13. . . Second base

131．．．第二基座本體131. . . Second base body

133．．．第二固定部133. . . Second fixed part

135．．．第二固定件135. . . Second fixture

14．．．第二熱管14. . . Second heat pipe

15．．．鰭片組合15. . . Fin combination

151．．．第一鰭片組151. . . First fin set

153．．．第二鰭片組153. . . Second fin set

155．．．第一通孔155. . . First through hole

157．．．第二通孔157. . . Second through hole

30．．．第一散熱風扇30. . . First cooling fan

31．．．第一進風口31. . . First air inlet

33．．．第一出風口33. . . First air outlet

50．．．第二散熱風扇50. . . Second cooling fan

51．．．第二進風口51. . . Second air inlet

53．．．第二出風口53. . . Second outlet

圖1係本發明散熱器組合較佳實施例之一立體分解圖。BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is an exploded perspective view of a preferred embodiment of a heat sink assembly of the present invention.

圖2係本發明散熱器組合較佳實施例之另一立體分解圖。2 is another perspective exploded view of a preferred embodiment of the heat sink assembly of the present invention.

圖3係圖1之立體組裝圖。Figure 3 is a perspective assembled view of Figure 1.

10．．．散熱器10. . . heat sink

11．．．第一基座11. . . First base

12．．．第一熱管12. . . First heat pipe

13．．．第二基座13. . . Second base

14．．．第二熱管14. . . Second heat pipe

15．．．鰭片組合15. . . Fin combination

30．．．第一散熱風扇30. . . First cooling fan

31．．．第一進風口31. . . First air inlet

33．．．第一出風口33. . . First air outlet

50．．．第二散熱風扇50. . . Second cooling fan

51．．．第二進風口51. . . Second air inlet

Claims (8)

一種散熱器組合，包括一散熱器、一第一散熱風扇及一第二散熱風扇，其改進在於：所述散熱器組合包括一第一基座、一裝設於所述第一基座上之第一熱管及一鰭片組合，所述第一熱管插設於所述鰭片組合，所述第一散熱風扇設有一第一進風口及一垂直所述第一進風口之第一出風口，所述第二散熱風扇設有一第二進風口及一平行所述第二進風口之第二出風口，所述第一進風口及所述第二進風口對應所述鰭片組合。A heat sink assembly includes a heat sink, a first heat dissipation fan and a second heat dissipation fan, wherein the heat sink assembly includes a first base and a first base mounted on the first base The first heat pipe and the one fin are combined, the first heat pipe is inserted into the fin assembly, and the first heat dissipation fan is provided with a first air inlet and a first air outlet perpendicular to the first air inlet. The second air-dissipating fan is provided with a second air inlet and a second air outlet parallel to the second air inlet, and the first air inlet and the second air inlet are combined with the fins. 如申請專利範圍第1項所述之散熱器組合，其中所述鰭片組合包括一第一鰭片組及一第二鰭片組，所述第一鰭片組之單個鰭片之面積大於所述第二鰭片組之單個鰭片之面積，所述第一散熱風扇對應所述第一鰭片組，所述第二散熱風扇對應所述第二鰭片組。The heat sink assembly of claim 1, wherein the fin assembly comprises a first fin set and a second fin set, and the area of the single fin of the first fin set is larger than The area of the single fin of the second fin set, the first heat dissipation fan corresponds to the first fin set, and the second heat dissipation fan corresponds to the second fin set. 如申請專利範圍第2項所述之散熱器組合，其中所述鰭片組合設有一貫通所述第一鰭片組及所述第二鰭片組之第一通孔，所述第一熱管插設於所述第一通孔中。The heat sink assembly of claim 2, wherein the fin assembly is provided with a first through hole penetrating the first fin set and the second fin set, and the first heat pipe is inserted Provided in the first through hole. 如申請專利範圍第3項所述之散熱器組合，其中所述散熱器還包括一第二基座及一裝設於所述第二基座上之第二熱管，所述鰭片組合還設有一貫通所述第二鰭片組之第二通孔，所述第二熱管插設於所述第二通孔中。The heat sink assembly of claim 3, wherein the heat sink further comprises a second base and a second heat pipe mounted on the second base, the fin combination is further provided There is a second through hole penetrating the second fin group, and the second heat pipe is inserted into the second through hole. 如申請專利範圍第4項所述之散熱器組合，其中所述第二通孔僅設於所述第二鰭片組，所述第二通孔之延伸方向與所述第一通孔之延伸方向平行。The heat sink assembly of claim 4, wherein the second through hole is only disposed in the second fin group, and the extending direction of the second through hole and the extension of the first through hole The directions are parallel. 如申請專利範圍第2項所述之散熱器組合，其中所述鰭片組合呈L形。The heat sink assembly of claim 2, wherein the fin combination is L-shaped. 如申請專利範圍第1項所述之散熱器組合，其中所述第一基座包括一第一基座本體及四個自所述第一基座本體延伸形成之第一固定部，所述第一固定部分佈於所述第一基座本體之四角。The heat sink assembly of claim 1, wherein the first base comprises a first base body and four first fixing portions extending from the first base body, the first A fixed portion is disposed at the four corners of the first base body. 如申請專利範圍第7項所述之散熱器組合，其中每一第一固定部設有一用於安裝於一安裝板上之第一固定件。The heat sink assembly of claim 7, wherein each of the first fixing portions is provided with a first fixing member for mounting on a mounting plate.
TW100124703A 2011-07-13 2011-07-13 Heat sink assembly TW201304671A (en)

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US13/444,088 US20130014920A1 (en) 2011-07-13 2012-04-11 Heat sink assembly

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Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6117288B2 (en) * 2015-07-14 2017-04-19 古河電気工業株式会社 Cooling system
US11867467B2 (en) 2015-07-14 2024-01-09 Furukawa Electric Co., Ltd. Cooling device with superimposed fin groups
USD805043S1 (en) * 2016-02-22 2017-12-12 Heatscape.Com, Inc. Heatsink for optical modules
CN212991086U (en) * 2018-01-31 2021-04-16 古河电气工业株式会社 Heat radiator

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060032616A1 (en) * 2004-08-11 2006-02-16 Giga-Byte Technology Co., Ltd. Compound heat-dissipating device
CN2736926Y (en) * 2004-10-09 2005-10-26 鸿富锦精密工业（深圳）有限公司 Radiator fixing device
JP4267629B2 (en) * 2006-01-31 2009-05-27 株式会社東芝 Electronics
CN101370371B (en) * 2007-08-17 2011-06-08 富准精密工业(深圳)有限公司 Heat radiation model set and radiator used for the same
CN101772292B (en) * 2009-01-05 2013-06-05 富准精密工业(深圳)有限公司 Radiating device

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