USD805043S1 - Heatsink for optical modules - Google Patents

Heatsink for optical modules Download PDF

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Publication number
USD805043S1
USD805043S1 US29/555,487 US201629555487F USD805043S US D805043 S1 USD805043 S1 US D805043S1 US 201629555487 F US201629555487 F US 201629555487F US D805043 S USD805043 S US D805043S
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US
United States
Prior art keywords
heatsink
optical modules
view
modules
optical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/555,487
Inventor
Ali Mira
Yashar Mira
Michael Mira
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HeatscapeCom Inc
Original Assignee
HeatscapeCom Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by HeatscapeCom Inc filed Critical HeatscapeCom Inc
Priority to US29/555,487 priority Critical patent/USD805043S1/en
Assigned to HEATSCAPE.COM, INC. reassignment HEATSCAPE.COM, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: MIRA, ALI, MIRA, MICHAEL, MIRA, YASHAR
Application granted granted Critical
Publication of USD805043S1 publication Critical patent/USD805043S1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Description

FIG. 1 is an enlarged top perspective view of a heatsink for optical modules showing our new design;
FIG. 2 is a rear elevational view thereof;
FIG. 3 is a front elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a top plan view thereof;
FIG. 7 is a bottom plan view thereof;
FIG. 8 is an enlarged bottom perspective view thereof; and,
FIG. 9 is a disassembled view corresponding to FIG. 1.

Claims (1)

    CLAIM
  1. The ornamental design for a heatsink for optical modules, as shown and described.
US29/555,487 2016-02-22 2016-02-22 Heatsink for optical modules Active USD805043S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/555,487 USD805043S1 (en) 2016-02-22 2016-02-22 Heatsink for optical modules

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/555,487 USD805043S1 (en) 2016-02-22 2016-02-22 Heatsink for optical modules

Publications (1)

Publication Number Publication Date
USD805043S1 true USD805043S1 (en) 2017-12-12

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Application Number Title Priority Date Filing Date
US29/555,487 Active USD805043S1 (en) 2016-02-22 2016-02-22 Heatsink for optical modules

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD819578S1 (en) * 2016-07-14 2018-06-05 Enermax Technology Corporation Heat dissipating fin
USD1024985S1 (en) 2019-01-17 2024-04-30 Telefonaktiebolaget Lm Ericsson (Publ) Heat sink

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020093789A1 (en) * 2001-01-12 2002-07-18 Sloan Robert C. Apparatus and method for cooling a heat generating component
US20030121643A1 (en) * 2002-01-03 2003-07-03 Connors Matthew Joseph Bi-level heat sink
USD673515S1 (en) * 2011-02-18 2013-01-01 Apple Inc. Component of an electronic device
US20130014920A1 (en) * 2011-07-13 2013-01-17 Hon Hai Precision Industry Co., Ltd. Heat sink assembly
USD698740S1 (en) * 2012-05-23 2014-02-04 Alpoint Technologies, LLC Heat sink
US20140202666A1 (en) * 2013-01-22 2014-07-24 Asia Vital Components Co., Ltd. Thermal module
USD715750S1 (en) * 2013-11-26 2014-10-21 Kilpatrick Townsend & Stockton Llp Power heat sink with imbedded fly cut heat pipes
USD722574S1 (en) * 2013-11-26 2015-02-17 Heatscape, Inc. Power heat sink with hybrid vapor chamber—heat pipe module
US20150219400A1 (en) * 2012-12-06 2015-08-06 Furukawa Electric Co., Ltd. Heat sink
USD747278S1 (en) * 2014-09-19 2016-01-12 General Electric Company Heat sink
US20170097195A1 (en) * 2015-10-06 2017-04-06 Asia Vital Components Co., Ltd. Knockdown heat dissipation unit

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020093789A1 (en) * 2001-01-12 2002-07-18 Sloan Robert C. Apparatus and method for cooling a heat generating component
US20030121643A1 (en) * 2002-01-03 2003-07-03 Connors Matthew Joseph Bi-level heat sink
USD673515S1 (en) * 2011-02-18 2013-01-01 Apple Inc. Component of an electronic device
US20130014920A1 (en) * 2011-07-13 2013-01-17 Hon Hai Precision Industry Co., Ltd. Heat sink assembly
USD717745S1 (en) * 2011-12-01 2014-11-18 Alpoint Technologies, LLC Heat sink
USD698740S1 (en) * 2012-05-23 2014-02-04 Alpoint Technologies, LLC Heat sink
US20150219400A1 (en) * 2012-12-06 2015-08-06 Furukawa Electric Co., Ltd. Heat sink
US20140202666A1 (en) * 2013-01-22 2014-07-24 Asia Vital Components Co., Ltd. Thermal module
USD715750S1 (en) * 2013-11-26 2014-10-21 Kilpatrick Townsend & Stockton Llp Power heat sink with imbedded fly cut heat pipes
USD722574S1 (en) * 2013-11-26 2015-02-17 Heatscape, Inc. Power heat sink with hybrid vapor chamber—heat pipe module
USD747278S1 (en) * 2014-09-19 2016-01-12 General Electric Company Heat sink
US20170097195A1 (en) * 2015-10-06 2017-04-06 Asia Vital Components Co., Ltd. Knockdown heat dissipation unit

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD819578S1 (en) * 2016-07-14 2018-06-05 Enermax Technology Corporation Heat dissipating fin
USD1024985S1 (en) 2019-01-17 2024-04-30 Telefonaktiebolaget Lm Ericsson (Publ) Heat sink

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