US20150219400A1 - Heat sink - Google Patents
Heat sink Download PDFInfo
- Publication number
- US20150219400A1 US20150219400A1 US14/423,002 US201314423002A US2015219400A1 US 20150219400 A1 US20150219400 A1 US 20150219400A1 US 201314423002 A US201314423002 A US 201314423002A US 2015219400 A1 US2015219400 A1 US 2015219400A1
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- US
- United States
- Prior art keywords
- heat
- base plate
- plate
- heat radiation
- heat sink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 230000005855 radiation Effects 0.000 claims abstract description 54
- 229910052751 metal Inorganic materials 0.000 claims abstract description 31
- 239000002184 metal Substances 0.000 claims abstract description 31
- 238000010438 heat treatment Methods 0.000 claims abstract description 10
- 239000004065 semiconductor Substances 0.000 abstract description 13
- 238000010276 construction Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 238000005476 soldering Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000004512 die casting Methods 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
- F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
- F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
- F28F1/32—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
- H01L21/4882—Assembly of heatsink parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the present invention relates to a heat sink having a heat pipe disposed in a base plate.
- Patent Document 1 Japanese Patent No. 4,999,060
- the base plate which is brought into contact with the heat pipe is desired to be formed of a material having excellent thermal conductivity (for example, copper, copper alloy or the like).
- a material having excellent thermal conductivity for example, copper, copper alloy or the like.
- the whole body of the base plate is formed of copper or copper alloy, the amount of copper to be used increases, and causes a problem that the weight and the manufacturing cost increase.
- heat sinks are strongly required to be designed in compact size.
- the heat pipe is sandwiched between the base plate and the heat radiation fin, and thus it is desired to reduce a load applied to the heat pipe.
- the present invention has been implemented to solve the above problem, and has an object to a heat sink that can reduce a load applied to a heat pipe, and also enhance the heat transfer efficiency from a heating body to a heat radiation fin.
- a heat sink comprises a base plate having a heat receiving portion to which a heating body is thermally connected, a heat pipe disposed on the base plate while partially brought into contact with the heat receiving portion, and a heat radiation fin disposed to be stacked on the base plate and the heat pipe, wherein the base plate is formed of a metal plate and has an opening portion at a site corresponding to the heat receiving portion, and the heat receiving portion formed of a metal plate having higher thermal conductivity than the base plate is placed at the opening portion so that one surface of the heat receiving plate and a surface of the base plate on which the heat pipe is mounted form substantially the same plane.
- the base plate may be formed by folding a metal plate to have a groove portion on which the heat pipe is mounted, and a mount portion which is formed at both the sides of the groove portion and on which the heat radiation fin is mounted, the opening portion is equipped in the groove portion, and the surface of the groove portion and the back surface of the mount portion are formed at the same height. Furthermore, the heat receiving plate may be fixed to the back surface of the mount portion.
- the heat radiation fin may have a plurality of fin plates equipped side by side, and the fin plates may be arranged along an extension direction of the heat pipe.
- the heat radiation fin has a plurality of reception grooves for receiving the heat pipe on a surface thereof which confronts the base plate, and a leg portion that comes into contact with the surface of the base plate may be equipped between the reception grooves.
- the base plate is formed of the metal plate and has the opening portion at the site corresponding to the heat receiving portion.
- the heat receiving portion which is formed of a metal plate having higher thermal conductivity than the base plate is equipped at the opening portion. Therefore, heat from a heating body can be efficiently transferred to the heat radiation fin through the heat receiving portion and the heat pipe.
- the heat receiving plate is arranged within substantially the same plane (substantially in-plane) as the surface of the base plate on which the heat pipe is mounted, and thus occurrence of a step on the base plate can be prevented. Even when the heat radiation fin is arranged to be stacked on the base plate and the heat pipe, an excessively load can be prevented from being imposed on the heat pipe.
- FIG. 1 is an exploded perspective view showing a heat sink according to a first embodiment.
- FIG. 2 is a perspective view showing the external appearance of the heat sink.
- FIG. 3 is a side view showing the heat sink.
- FIG. 4 is a side cross-sectional view of the heat sink.
- FIG. 5 is a plan view of a base plate before press forming.
- FIG. 6 is a side view showing a heat sink according to another embodiment.
- FIG. 7 is a side cross-sectional view of the heat sink.
- FIG. 1 is an exploded perspective view showing a heat sink 10 according to a first embodiment
- FIG. 2 is a perspective view showing the external appearance of the heat sink 10 .
- the heat sink 10 is used for an electronic device such as a personal computer or the like, for example, and it is thermally connected to a semiconductor device (heating body) 11 such as CPU or the like mounted on a circuit board (not shown) to cool the semiconductor device 11 .
- the heat sink 10 has a flat-plate type base plate 21 , plural (three in this embodiment) heat pipes 22 are arranged side by side on the base plate 21 , and plural (two in this embodiment) heat radiation fins 23 are arranged side by side while stacked on the base plate 21 and the heat pipes 22 . That is, in this construction, the heat pipes 22 are sandwiched and held between the base plate 21 and the heat radiation fins 23 as shown in FIG. 2 .
- the base plate 21 is formed by folding a metal plate of aluminum or the like through press forming. As shown in FIG. 1 , the base plate 21 has a wide groove portion 31 extending in the longitudinal direction (in the direction of Y in FIG. 1 ) substantially at the center in the short-length direction (in the direction of X in FIG. 6 ), and a pair of bank portions (mount portions) which are disposed at both the sides of the groove portion 31 and formed to be higher than the groove portion 31 . These bank portions 32 are formed at substantially the same height position, and each of the edge portions 33 thereof is folded downwards.
- the heat pipes 22 are mounted on the groove portion 31 , and the heat radiation fins 23 are mounted on the bank portions 32 .
- Hole portions 34 are formed at two positions of each bank portion 32 (totally, four positions). These hole portions 34 are holes through which fixing screws for fixing the heat sink 10 to a circuit board penetrate.
- the groove portion 31 is placed substantially at the center in the width direction of the base plate 21 , but the present invention is not limited to this style.
- the groove portion 31 may be placed at any position in the width direction.
- This type of base plate may be formed not only by folding a metal plate, but also by a die-casting method, an extrusion molding method or a cutting method.
- the die-casting method and the extrusion molding method need a cost for dies or molds, and thus these methods are not suitable for small production.
- Even the cutting method has a problem that a processing cost and a material cost are increased.
- a die-cast product is generally inferior to a metal plate in thermal conductivity, the cooling performance is fluctuated in accordance with the difference in thermal conductivity of the base plate when the other conditions are identical.
- the base plate 21 is formed by folding a metal plate through press forming.
- This construction can enhance the thermal conductivity of the base plate 21 itself, and also reduce the manufacturing cost as compared with the foregoing methods.
- the groove portion 31 and the edge portions 33 which are folded in the base plate 2 function as reinforcing ribs, so that the base plate 21 can be configured to be light and thin while securing stiffness.
- the base plate 21 has an opening portion 35 substantially at the center in the longitudinal direction of the groove portion 31 (the position corresponding to a heat receiving portion to be thermally connected to the semiconductor device 11 ), and a heat receiving plate 36 which is formed of metal having higher thermal conductivity (for example, copper) than the base plate 21 is mounted at the opening portion 35 .
- the semiconductor device 11 is connected to the back surface (lower surface in FIG. 1 ) 36 A of the heat receiving plate 36 , and the heat receiving plate 36 is fixed while the heat pipes 22 are partially brought into contact with the surface (upper surface in FIG. 1 ) 36 B of the heat receiving plate 36 .
- heat generated from the semiconductor device 11 is transferred to the heat pipes 22 through the heat receiving plate 36 .
- the heat receiving plate 36 is formed of the metal having higher thermal conductivity than the base plate 21 , the heat of the semiconductor device 11 can be rapidly transferred to the heat radiation fins 23 through the heat receiving plate 36 and the heat pipes 22 , and the cooling performance of the heat sink 10 can be enhanced.
- the weight can be reduced, and the costs for materials and manufacturing can be more greatly reduced as compared with a case where the whole body of the base plate 21 is formed of copper.
- the heat pipes 22 are members for diffusing the heat received by the heat receiving plate 36 to the heat radiation fins 23 .
- the heat pipe 22 is formed by encapsulating operating fluid such as water or the like under pressure-reduced state in a hermetically sealed container which is formed of metal having excellent thermal conductivity such as copper or the like or formed of alloy of the metal.
- the container is configured in a flat shape to reduce the height (thickness) thereof and secure a large contact area with the base plate 21 and the heat radiation fins 23 .
- the heat pipes 22 are fixed to the groove portion 31 of the base plate 21 and the heat receiving plate 36 by soldering, brazing or the like.
- the heat radiation fin 23 serves to discharge the heat transferred through the heat pipes 22 into air, and is configured to have the substantially half length of the heat pipes 22 .
- Two heat radiation fins 23 are arranged side by side in the extension direction of the heat pipes 22 .
- the heat radiation fins 23 are formed in a region containing an area just above the heat receiving plate 36 , and exist over a broad area on the base plate 21 .
- the number of the heat radiation fins 23 to be arranged may be arbitrarily changed in accordance with the length of the heat pipes 22 , and it is needless to say that they may be configured as a single heat radiation.
- Each heat radiation fin 23 has plural fin plates 43 each of which is formed to have a substantially U-shaped cross-section by folding an upper edge 41 and a lower edge 42 of a metal plate 40 of aluminum or the like substantially in parallel to each other, for example.
- These fin plates 43 are arranged side by side in the extension direction of the heat pipes 22 , and the respective fin plates 43 are fixed integrally with one another by soldering, for example. Air is allowed to flow through the gap between the adjacent fin plates 43 . Therefore, the heat transferred to the heat pipes 22 can be diffused to the whole bodies of the heat radiation fins 23 , and this heat can be heat-exchanged with air flowing through the gap between the fin plates 43 , whereby the heat can be radiated.
- Reception grooves 24 in which the heat pipes 22 are received are formed on the lower surface (confronting surface) 23 A of the heat radiation fin 23 which confronts the base plate 21 and the heat pipes 22 .
- the reception groove 24 is formed in conformity with the outer shape of the heat pipe 22 , and enhances the thermal transfer area between the heat pipe 22 and the heat radiation fin 23 .
- a leg portion 25 is equipped between the respective reception grooves 24 , and these leg portions 25 come into contact with the surface of the groove portion 31 of the base plate 21 (the surface on which the heat pipes 22 are mounted) 31 A when the heat radiation fins 23 are mounted on the bank portions 32 of the base plate 21 , whereby thermal conduction can be directly performed from the base plate 21 to the heat radiation fins 23 through the leg portions 25 , and the load of the heat radiation fins 23 is supported by the leg portions 25 , thereby reducing the load applied to the heat pipes 22 .
- the heat radiation fins 23 are fixed to the base plate 21 and each heat pipe 22 by soldering or the like, whereby the heat sink 10 is integrally configured. Furthermore, the heat radiation fins 23 are equipped with cut-out portions at the positions corresponding to the hole portions 34 formed in the base plate 21 .
- the base plate 21 is formed by folding a metal plate, the opening portion 35 is formed at the position corresponding to the heat receiving portion which is thermally connected to the semiconductor device 11 , and the heat receiving plate 36 formed of metal having higher thermal conductivity than the base plate 21 is disposed at the opening portion 35 .
- the heat sink 10 is configured by stacking the heat radiation fins 23 on the base plate 21 , and thus the heat pipes 22 are sandwiched between the base plate 21 and the heat radiation fins 23 . Therefore, it is desired to reduce the load of the heat radiation fins 23 imposed on the heat pipes 22 .
- the heat receiving plate 36 is disposed so that no step or a remarkably slight step exists between the surface (upper surface; one surface in the FIG. 36B of the heat receiving plate 36 and the surface (upper surface in the FIG. 31A of the groove portion 31 of the base plate 21 , that is, the surface 36 B of the heat receiving plate 36 and the surface 31 A of the groove portion 31 of the base plate 21 are arranged to form substantially the same plane (are arranged substantially within the same plane).
- the base plate 21 is formed by folding the metal plate so that the surface 31 A of the groove portion 31 and the back surfaces (lower surfaces in FIG. 3 ) of the bank portions 32 are located at the same height position, and the heat receiving plate 36 is configured to be larger in width than the groove portion 31 and fixed to the back surfaces 32 A of the bank portions 32 by soldering or the like.
- the surface 36 B of the heat receiving plate 36 and the surface 31 A of the groove portion 31 can form substantially the same plane (be arranged within substantially the same plane) and the heat receiving plate 36 can be arranged at the opening portion 35 of the base plate 21 by a simple work of applying the heat receiving plate 36 to the opening portion 35 from the side of the back surfaces 32 A of the bank portions 32 and fixing the heat receiving plate 36 to the back surfaces 32 A as shown in FIG. 4 . Therefore, the step between the heat receiving plate 36 and the base plate 21 can be prevented, and even when the heat radiation fins 23 are stacked and arranged on the base plate 21 and the heat pipes 22 , an excessively load can be prevented from being imposed on the heat pipes 22 .
- FIG. 5 is a plan view before press forming of the base plate 21 .
- a metal plate is punched out to have an outer shape shown in FIG. 5 , and an opening portion 35 and hole portions 34 are formed at predetermined positions.
- the punched metal plate is folded to have a desired shape by press forming.
- the punched metal plate is mountain-folded along lines 50 extending thereon while the lines 50 are spaced inwards from the edges of the metal plate by a predetermined distance, and lines 51 extending along the edge portions 35 A of the opening portion 35 , and also valley-folded along lines 52 extending thereon while the lines 52 are spaced inwards from the lines 51 by a predetermined distance, thereby forming the base plate 21 .
- recess portions 35 B extending outwards from the edge portions 35 A are formed at the four corners of the edge portions 35 A of the opening portion 35 . Accordingly, when the metal plate is folded along the lines 51 , spreading at the four corners of the opening portion 35 can be prevented, and the metal plate can be accurately folded along the edge portions 35 A of the opening portion 35 .
- the heat sink comprises the base plate 21 having the heat receiving portion to which the semiconductor device 11 is thermally connected, heat pipes 22 disposed on the base plate 21 while partially coming into contact with the heat receiving portion, and the heat radiation fins 23 disposed to be stacked on the base plate 21 and the heat pipes 22 ,
- the base plate 21 is formed of a metal plate and has the opening portion 35 at the site corresponding to the heat receiving portion, and the heat receiving plate 36 formed of a metal plate having higher thermal conductivity than the base plate 21 is equipped at the opening portion 35 . Therefore, heat from the semiconductor device 11 can be efficiently transferred to the heat radiation fins 23 through the heat receiving plate 36 and the heat pipes 22 .
- the heat receiving plate 36 forms substantially the same plane with (is arranged within substantially the same plane as) the surface 31 A of the base plate 21 on which the heat pipes 22 are mounted. Therefore, occurrence of a step on the base plate 21 is prevented, and even when the heat radiation fins 23 are arranged to be stacked on the base plate 21 and the heat pipes 22 , an excessive load can be prevented from being applied to the heat pipes 22 .
- the base plate 21 is formed by folding the metal plate, and has the groove portion 31 on which the heat pipes 22 are mounted, and the bank portions 32 which are mounted at both the sides of the groove portion 31 and on which the heat radiation fins 23 are mounted.
- the opening portion 35 is formed in the groove portion 31 , and the surface 31 A of the groove portion 31 and the back surfaces 32 A of the bank portions 32 are formed at the same height.
- the heat receiving plate 36 can be disposed at the opening portion 35 of the base plate 21 so that the surface 36 B of the heat receiving plate 36 and the surface 31 A of the groove portion 31 form substantially the same plane (are arranged within substantially the same plate) by s simple work of applying the heat receiving plate 36 from the side of the back surfaces 32 A of the bank portions 32 to the opening portion 35 and fixing the heat receiving plate 36 to the back surfaces 32 A.
- the fixing structure can be simplified, and the fixed portion is not exposed to the outside, so that the external appearance of the heat sink 10 can be enhanced.
- the heat radiation fin 23 has plural fin plates 43 arranged side by side, and these fin plates 43 are arranged along the extension direction of the heat pipes 22 . Therefore, heat transferred through the heat pipes 22 can be diffused to each of the fin plates 43 , and the heat can be heat-exchanged with air flowing through the gap between the fin plates 43 to be radiated.
- the heat radiation fin 23 has the plural reception grooves 24 for accommodating the heat pipes 22 on the lower surface 23 A thereof which confronts the base plate 21 , and the leg portions 25 which come into contact with the surface 31 A of the groove portion 31 of the base plate 21 are equipped between the reception grooves 24 A. Therefore, when the heat radiation fins 23 are mounted on the bank portions 32 of the base plate 21 , the leg portions 25 come into contact with the surface 31 A of the groove portion 31 of the base plate 21 , whereby thermal conduction can be directly performed from the base plate 21 through the leg portions 25 to the heat radiation fins 23 . Furthermore, the load of the heat radiation fins 23 can be supported by the leg portions 25 , and thus the load imposed on the heat pipes 22 can be reduced.
- the heat sink 100 of the second embodiment is different from the first embodiment in the shape of the base plate. In the second embodiment, only the structural difference will be described. The same constituent elements are represented by the same reference numerals, and the descriptions thereof are omitted.
- FIG. 6 is a side view showing the heat sink 100 according to the second embodiment
- FIG. 7 is a side cross-sectional view showing the heat sink 100 .
- the base plate 121 of this embodiment is formed by a metal plate which has not been subjected to the folding (bending) work.
- the heat receiving plate 36 is formed to have substantially the same size as the opening portion 135 formed in the base plate 121 and the heat receiving plate 36 is fixed to the opening portion 135 so that the surface 36 B of the heat receiving plate 36 and the surface (upper surface in FIG. 6 ) 121 A of the base plate 121 form substantially the same plane (are arranged within substantially the same plane).
- a backing pad is disposed at the surface 121 A side of the base plate 121 (the surface on which the heat pipes 22 are mounted), and the base plate 121 and the heat receiving plate 36 are fixed to each other from the back surface 121 B side of the base plate 121 by soldering or the like while the surface 36 B of the heat receiving plate 36 is brought into contact with the backing plate.
- the surface 36 B of the heat receiving plate 36 and the surface 121 A of the base plate 121 can form substantially the same plane (be arranged within substantially the same plane).
- the thickness of the base plate 121 can be reduced, and thus the heat sink 100 can be configured to be thin.
- the three heat pipes 22 are mounted on the base plate 21 , 121 , but the number of heat pipes 22 may be arbitrarily changed.
- the heat pipe 22 is configured to be flat, but it may be configured in a round shape.
- the opening portion 35 , 135 is equipped substantially at the center of the base plate 21 , 131 .
- the present invention is not limited to this style, and the locating position thereof may be changed in accordance with the position of the semiconductor device 11 mounted in the circuit board.
- the semiconductor device 11 mounted on the circuit board is set as a heating body.
- the present invention is not limited to this style.
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- Sustainable Development (AREA)
- Life Sciences & Earth Sciences (AREA)
- Geometry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
A heat sink that can reduce a load imposed on a heat pipe and enhance a heat transfer efficiency from a heating body to a heat radiation fin is provided.
The heat sink has a base plate 21 having a heat receiving portion to which a semiconductor device 11 is thermally connected, a heat pipe disposed on the base plate 21 while partially brought into contact with the heat receiving portion, and a heat radiation fin arranged to be stacked on the base plate 21 and the heat pipe 22. The base plate 21 is formed of a metal plate and has an opening portion 35 at the site corresponding to the heat receiving portion, and the heat receiving plate 36 which is formed of a metal plate having higher thermal conductivity than the base plate 21 is arranged to form substantially the same plane with the base plate 21.
Description
- The present invention relates to a heat sink having a heat pipe disposed in a base plate.
- There is generally known a heat sink that has a base plate having a heat receiving portion to which a heating body is thermally connected, a heat pipe disposed in the base plate so as to come into partial contact with the heat receiving portion, and a heat radiation fin which is thermally connected to the heat pipe (see
Patent Document 1, for example). - Patent Document 1: Japanese Patent No. 4,999,060
- In order to efficiently transfer heat from the heating body to the heat radiation fin through the heat pipe in this type of heat sink, the base plate which is brought into contact with the heat pipe is desired to be formed of a material having excellent thermal conductivity (for example, copper, copper alloy or the like). However, when the whole body of the base plate is formed of copper or copper alloy, the amount of copper to be used increases, and causes a problem that the weight and the manufacturing cost increase.
- Furthermore, heat sinks are strongly required to be designed in compact size. However, when the heat radiation fin is mounted while stacked on the base plate, the heat pipe is sandwiched between the base plate and the heat radiation fin, and thus it is desired to reduce a load applied to the heat pipe.
- The present invention has been implemented to solve the above problem, and has an object to a heat sink that can reduce a load applied to a heat pipe, and also enhance the heat transfer efficiency from a heating body to a heat radiation fin.
- The specification of this application contains the whole content of Japanese Patent Application No. 2012-267171 filed on Dec. 6, 2012.
- In order to attain the above object, according to the present invention, a heat sink comprises a base plate having a heat receiving portion to which a heating body is thermally connected, a heat pipe disposed on the base plate while partially brought into contact with the heat receiving portion, and a heat radiation fin disposed to be stacked on the base plate and the heat pipe, wherein the base plate is formed of a metal plate and has an opening portion at a site corresponding to the heat receiving portion, and the heat receiving portion formed of a metal plate having higher thermal conductivity than the base plate is placed at the opening portion so that one surface of the heat receiving plate and a surface of the base plate on which the heat pipe is mounted form substantially the same plane.
- In the above construction, the base plate may be formed by folding a metal plate to have a groove portion on which the heat pipe is mounted, and a mount portion which is formed at both the sides of the groove portion and on which the heat radiation fin is mounted, the opening portion is equipped in the groove portion, and the surface of the groove portion and the back surface of the mount portion are formed at the same height. Furthermore, the heat receiving plate may be fixed to the back surface of the mount portion.
- Furthermore, the heat radiation fin may have a plurality of fin plates equipped side by side, and the fin plates may be arranged along an extension direction of the heat pipe. the heat radiation fin has a plurality of reception grooves for receiving the heat pipe on a surface thereof which confronts the base plate, and a leg portion that comes into contact with the surface of the base plate may be equipped between the reception grooves.
- According to the present invention, the base plate is formed of the metal plate and has the opening portion at the site corresponding to the heat receiving portion. The heat receiving portion which is formed of a metal plate having higher thermal conductivity than the base plate is equipped at the opening portion. Therefore, heat from a heating body can be efficiently transferred to the heat radiation fin through the heat receiving portion and the heat pipe. Furthermore, the heat receiving plate is arranged within substantially the same plane (substantially in-plane) as the surface of the base plate on which the heat pipe is mounted, and thus occurrence of a step on the base plate can be prevented. Even when the heat radiation fin is arranged to be stacked on the base plate and the heat pipe, an excessively load can be prevented from being imposed on the heat pipe.
-
FIG. 1 is an exploded perspective view showing a heat sink according to a first embodiment. -
FIG. 2 is a perspective view showing the external appearance of the heat sink. -
FIG. 3 is a side view showing the heat sink. -
FIG. 4 is a side cross-sectional view of the heat sink. -
FIG. 5 is a plan view of a base plate before press forming. -
FIG. 6 is a side view showing a heat sink according to another embodiment. -
FIG. 7 is a side cross-sectional view of the heat sink. - A first embodiment according to the present invention will be described hereunder with reference to the drawings.
-
FIG. 1 is an exploded perspective view showing aheat sink 10 according to a first embodiment, andFIG. 2 is a perspective view showing the external appearance of theheat sink 10. - The
heat sink 10 is used for an electronic device such as a personal computer or the like, for example, and it is thermally connected to a semiconductor device (heating body) 11 such as CPU or the like mounted on a circuit board (not shown) to cool thesemiconductor device 11. - As shown in
FIG. 1 , theheat sink 10 has a flat-platetype base plate 21, plural (three in this embodiment)heat pipes 22 are arranged side by side on thebase plate 21, and plural (two in this embodiment)heat radiation fins 23 are arranged side by side while stacked on thebase plate 21 and theheat pipes 22. That is, in this construction, theheat pipes 22 are sandwiched and held between thebase plate 21 and theheat radiation fins 23 as shown inFIG. 2 . - The
base plate 21 is formed by folding a metal plate of aluminum or the like through press forming. As shown inFIG. 1 , thebase plate 21 has awide groove portion 31 extending in the longitudinal direction (in the direction of Y inFIG. 1 ) substantially at the center in the short-length direction (in the direction of X inFIG. 6 ), and a pair of bank portions (mount portions) which are disposed at both the sides of thegroove portion 31 and formed to be higher than thegroove portion 31. Thesebank portions 32 are formed at substantially the same height position, and each of theedge portions 33 thereof is folded downwards. Theheat pipes 22 are mounted on thegroove portion 31, and theheat radiation fins 23 are mounted on thebank portions 32. -
Hole portions 34 are formed at two positions of each bank portion 32 (totally, four positions). Thesehole portions 34 are holes through which fixing screws for fixing theheat sink 10 to a circuit board penetrate. - The
groove portion 31 is placed substantially at the center in the width direction of thebase plate 21, but the present invention is not limited to this style. Thegroove portion 31 may be placed at any position in the width direction. - This type of base plate may be formed not only by folding a metal plate, but also by a die-casting method, an extrusion molding method or a cutting method. However, the die-casting method and the extrusion molding method need a cost for dies or molds, and thus these methods are not suitable for small production. Even the cutting method has a problem that a processing cost and a material cost are increased. Furthermore, since a die-cast product is generally inferior to a metal plate in thermal conductivity, the cooling performance is fluctuated in accordance with the difference in thermal conductivity of the base plate when the other conditions are identical.
- On the other hand, according to this construction, the
base plate 21 is formed by folding a metal plate through press forming. This construction can enhance the thermal conductivity of thebase plate 21 itself, and also reduce the manufacturing cost as compared with the foregoing methods. Furthermore, thegroove portion 31 and theedge portions 33 which are folded in the base plate 2 function as reinforcing ribs, so that thebase plate 21 can be configured to be light and thin while securing stiffness. - In this construction, the
base plate 21 has anopening portion 35 substantially at the center in the longitudinal direction of the groove portion 31 (the position corresponding to a heat receiving portion to be thermally connected to the semiconductor device 11), and aheat receiving plate 36 which is formed of metal having higher thermal conductivity (for example, copper) than thebase plate 21 is mounted at theopening portion 35. Thesemiconductor device 11 is connected to the back surface (lower surface inFIG. 1 ) 36A of theheat receiving plate 36, and theheat receiving plate 36 is fixed while theheat pipes 22 are partially brought into contact with the surface (upper surface inFIG. 1 ) 36B of theheat receiving plate 36. - In the construction, heat generated from the
semiconductor device 11 is transferred to theheat pipes 22 through theheat receiving plate 36. Since theheat receiving plate 36 is formed of the metal having higher thermal conductivity than thebase plate 21, the heat of thesemiconductor device 11 can be rapidly transferred to the heat radiation fins 23 through theheat receiving plate 36 and theheat pipes 22, and the cooling performance of theheat sink 10 can be enhanced. Furthermore, the weight can be reduced, and the costs for materials and manufacturing can be more greatly reduced as compared with a case where the whole body of thebase plate 21 is formed of copper. - The
heat pipes 22 are members for diffusing the heat received by theheat receiving plate 36 to the heat radiation fins 23. For example, theheat pipe 22 is formed by encapsulating operating fluid such as water or the like under pressure-reduced state in a hermetically sealed container which is formed of metal having excellent thermal conductivity such as copper or the like or formed of alloy of the metal. The container is configured in a flat shape to reduce the height (thickness) thereof and secure a large contact area with thebase plate 21 and theheat radiation fins 23. Theheat pipes 22 are fixed to thegroove portion 31 of thebase plate 21 and theheat receiving plate 36 by soldering, brazing or the like. - The
heat radiation fin 23 serves to discharge the heat transferred through theheat pipes 22 into air, and is configured to have the substantially half length of theheat pipes 22. Twoheat radiation fins 23 are arranged side by side in the extension direction of theheat pipes 22. Theheat radiation fins 23 are formed in a region containing an area just above theheat receiving plate 36, and exist over a broad area on thebase plate 21. The number of theheat radiation fins 23 to be arranged may be arbitrarily changed in accordance with the length of theheat pipes 22, and it is needless to say that they may be configured as a single heat radiation. - Each
heat radiation fin 23 hasplural fin plates 43 each of which is formed to have a substantially U-shaped cross-section by folding anupper edge 41 and alower edge 42 of a metal plate 40 of aluminum or the like substantially in parallel to each other, for example. - These
fin plates 43 are arranged side by side in the extension direction of theheat pipes 22, and therespective fin plates 43 are fixed integrally with one another by soldering, for example. Air is allowed to flow through the gap between theadjacent fin plates 43. Therefore, the heat transferred to theheat pipes 22 can be diffused to the whole bodies of theheat radiation fins 23, and this heat can be heat-exchanged with air flowing through the gap between thefin plates 43, whereby the heat can be radiated. -
Reception grooves 24 in which theheat pipes 22 are received are formed on the lower surface (confronting surface) 23A of theheat radiation fin 23 which confronts thebase plate 21 and theheat pipes 22. Thereception groove 24 is formed in conformity with the outer shape of theheat pipe 22, and enhances the thermal transfer area between theheat pipe 22 and theheat radiation fin 23. - A
leg portion 25 is equipped between therespective reception grooves 24, and theseleg portions 25 come into contact with the surface of thegroove portion 31 of the base plate 21 (the surface on which theheat pipes 22 are mounted) 31A when theheat radiation fins 23 are mounted on thebank portions 32 of thebase plate 21, whereby thermal conduction can be directly performed from thebase plate 21 to theheat radiation fins 23 through theleg portions 25, and the load of theheat radiation fins 23 is supported by theleg portions 25, thereby reducing the load applied to theheat pipes 22. - In this embodiment, the
heat radiation fins 23 are fixed to thebase plate 21 and eachheat pipe 22 by soldering or the like, whereby theheat sink 10 is integrally configured. Furthermore, theheat radiation fins 23 are equipped with cut-out portions at the positions corresponding to thehole portions 34 formed in thebase plate 21. - In the
heat sink 10 described above, in order to enhance the thermal conductivity of the base plate 12 with an inexpensive construction, thebase plate 21 is formed by folding a metal plate, the openingportion 35 is formed at the position corresponding to the heat receiving portion which is thermally connected to thesemiconductor device 11, and theheat receiving plate 36 formed of metal having higher thermal conductivity than thebase plate 21 is disposed at the openingportion 35. - The
heat sink 10 is configured by stacking theheat radiation fins 23 on thebase plate 21, and thus theheat pipes 22 are sandwiched between thebase plate 21 and theheat radiation fins 23. Therefore, it is desired to reduce the load of theheat radiation fins 23 imposed on theheat pipes 22. - Therefore, in this construction, the
heat receiving plate 36 is disposed so that no step or a remarkably slight step exists between the surface (upper surface; one surface in theFIG. 36B of theheat receiving plate 36 and the surface (upper surface in theFIG. 31A of thegroove portion 31 of thebase plate 21, that is, thesurface 36B of theheat receiving plate 36 and thesurface 31A of thegroove portion 31 of thebase plate 21 are arranged to form substantially the same plane (are arranged substantially within the same plane). - Specifically, as shown in
FIG. 3 , thebase plate 21 is formed by folding the metal plate so that thesurface 31A of thegroove portion 31 and the back surfaces (lower surfaces inFIG. 3 ) of thebank portions 32 are located at the same height position, and theheat receiving plate 36 is configured to be larger in width than thegroove portion 31 and fixed to theback surfaces 32A of thebank portions 32 by soldering or the like. - Accordingly, the
surface 36B of theheat receiving plate 36 and thesurface 31A of thegroove portion 31 can form substantially the same plane (be arranged within substantially the same plane) and theheat receiving plate 36 can be arranged at the openingportion 35 of thebase plate 21 by a simple work of applying theheat receiving plate 36 to the openingportion 35 from the side of theback surfaces 32A of thebank portions 32 and fixing theheat receiving plate 36 to the back surfaces 32A as shown inFIG. 4 . Therefore, the step between theheat receiving plate 36 and thebase plate 21 can be prevented, and even when theheat radiation fins 23 are stacked and arranged on thebase plate 21 and theheat pipes 22, an excessively load can be prevented from being imposed on theheat pipes 22. - Next, a method of forming the
base plate 21 will be described. -
FIG. 5 is a plan view before press forming of thebase plate 21. - First, a metal plate is punched out to have an outer shape shown in
FIG. 5 , and anopening portion 35 andhole portions 34 are formed at predetermined positions. - Subsequently, the punched metal plate is folded to have a desired shape by press forming. Specifically, the punched metal plate is mountain-folded along
lines 50 extending thereon while thelines 50 are spaced inwards from the edges of the metal plate by a predetermined distance, andlines 51 extending along theedge portions 35A of the openingportion 35, and also valley-folded alonglines 52 extending thereon while thelines 52 are spaced inwards from thelines 51 by a predetermined distance, thereby forming thebase plate 21. - In this case,
recess portions 35B extending outwards from theedge portions 35A are formed at the four corners of theedge portions 35A of the openingportion 35. Accordingly, when the metal plate is folded along thelines 51, spreading at the four corners of the openingportion 35 can be prevented, and the metal plate can be accurately folded along theedge portions 35A of the openingportion 35. - As described above, the heat sink according to this embodiment comprises the
base plate 21 having the heat receiving portion to which thesemiconductor device 11 is thermally connected,heat pipes 22 disposed on thebase plate 21 while partially coming into contact with the heat receiving portion, and theheat radiation fins 23 disposed to be stacked on thebase plate 21 and theheat pipes 22, thebase plate 21 is formed of a metal plate and has the openingportion 35 at the site corresponding to the heat receiving portion, and theheat receiving plate 36 formed of a metal plate having higher thermal conductivity than thebase plate 21 is equipped at the openingportion 35. Therefore, heat from thesemiconductor device 11 can be efficiently transferred to theheat radiation fins 23 through theheat receiving plate 36 and theheat pipes 22. Furthermore, theheat receiving plate 36 forms substantially the same plane with (is arranged within substantially the same plane as) thesurface 31A of thebase plate 21 on which theheat pipes 22 are mounted. Therefore, occurrence of a step on thebase plate 21 is prevented, and even when theheat radiation fins 23 are arranged to be stacked on thebase plate 21 and theheat pipes 22, an excessive load can be prevented from being applied to theheat pipes 22. - According to this embodiment, the
base plate 21 is formed by folding the metal plate, and has thegroove portion 31 on which theheat pipes 22 are mounted, and thebank portions 32 which are mounted at both the sides of thegroove portion 31 and on which theheat radiation fins 23 are mounted. The openingportion 35 is formed in thegroove portion 31, and thesurface 31A of thegroove portion 31 and theback surfaces 32A of thebank portions 32 are formed at the same height. Therefore, theheat receiving plate 36 can be disposed at the openingportion 35 of thebase plate 21 so that thesurface 36B of theheat receiving plate 36 and thesurface 31A of thegroove portion 31 form substantially the same plane (are arranged within substantially the same plate) by s simple work of applying theheat receiving plate 36 from the side of theback surfaces 32A of thebank portions 32 to the openingportion 35 and fixing theheat receiving plate 36 to the back surfaces 32A. - According to this embodiment, since the
heat receiving plate 36 is fixed to theback surfaces 32A of thebank portions 32, the fixing structure can be simplified, and the fixed portion is not exposed to the outside, so that the external appearance of theheat sink 10 can be enhanced. - Furthermore, according to this embodiment, the
heat radiation fin 23 hasplural fin plates 43 arranged side by side, and thesefin plates 43 are arranged along the extension direction of theheat pipes 22. Therefore, heat transferred through theheat pipes 22 can be diffused to each of thefin plates 43, and the heat can be heat-exchanged with air flowing through the gap between thefin plates 43 to be radiated. - Still furthermore, according to this embodiment, the
heat radiation fin 23 has theplural reception grooves 24 for accommodating theheat pipes 22 on thelower surface 23A thereof which confronts thebase plate 21, and theleg portions 25 which come into contact with thesurface 31A of thegroove portion 31 of thebase plate 21 are equipped between the reception grooves 24A. Therefore, when theheat radiation fins 23 are mounted on thebank portions 32 of thebase plate 21, theleg portions 25 come into contact with thesurface 31A of thegroove portion 31 of thebase plate 21, whereby thermal conduction can be directly performed from thebase plate 21 through theleg portions 25 to theheat radiation fins 23. Furthermore, the load of theheat radiation fins 23 can be supported by theleg portions 25, and thus the load imposed on theheat pipes 22 can be reduced. - Another embodiment of the heat sink will be described. The
heat sink 100 of the second embodiment is different from the first embodiment in the shape of the base plate. In the second embodiment, only the structural difference will be described. The same constituent elements are represented by the same reference numerals, and the descriptions thereof are omitted. -
FIG. 6 is a side view showing theheat sink 100 according to the second embodiment, andFIG. 7 is a side cross-sectional view showing theheat sink 100. - The
base plate 121 of this embodiment is formed by a metal plate which has not been subjected to the folding (bending) work. In this embodiment, theheat receiving plate 36 is formed to have substantially the same size as theopening portion 135 formed in thebase plate 121 and theheat receiving plate 36 is fixed to theopening portion 135 so that thesurface 36B of theheat receiving plate 36 and the surface (upper surface inFIG. 6 ) 121A of thebase plate 121 form substantially the same plane (are arranged within substantially the same plane). - Specifically, a backing pad is disposed at the
surface 121A side of the base plate 121 (the surface on which theheat pipes 22 are mounted), and thebase plate 121 and theheat receiving plate 36 are fixed to each other from theback surface 121B side of thebase plate 121 by soldering or the like while thesurface 36B of theheat receiving plate 36 is brought into contact with the backing plate. In this construction, a higher skill is needed to fix the heat receiving plate as compared with the first embodiment. However, thesurface 36B of theheat receiving plate 36 and thesurface 121A of thebase plate 121 can form substantially the same plane (be arranged within substantially the same plane). - According to this embodiment, the thickness of the
base plate 121 can be reduced, and thus theheat sink 100 can be configured to be thin. - The present invention has been specifically described on the basis of the embodiments. However, the present invention is not limited to the above embodiments, and the embodiments may be modified without departing from the subject matter of the present invention.
- For example, in the above embodiments, the three
heat pipes 22 are mounted on thebase plate heat pipes 22 may be arbitrarily changed. Theheat pipe 22 is configured to be flat, but it may be configured in a round shape. - In the above embodiments, the opening
portion base plate 21, 131. However, the present invention is not limited to this style, and the locating position thereof may be changed in accordance with the position of thesemiconductor device 11 mounted in the circuit board. Furthermore, in the above embodiments, thesemiconductor device 11 mounted on the circuit board is set as a heating body. However, the present invention is not limited to this style. -
-
- 10, 100 heat sink
- 11 semiconductor device (heating body)
- 21, 121 base plate
- 22 heat pipe
- 23 heat radiation fin
- 23A lower surface (confronting surface)
- 24 reception groove
- 25 leg portion
- 31 groove portion
- 31A, 121A surface (surface on which heat pipes are arranged)
- 32 bank portion
- 32A back surface
- 35, 135 opening portion
- 36 heat receiving plate
- 36B surface
- 43 fin plate
Claims (8)
1. A heat sink comprising:
a base plate having a heat receiving portion to which a heating body is thermally connected;
a heat pipe disposed on the base plate while partially brought into contact with the heat receiving portion; and
a heat radiation fin disposed to be stacked on the base plate and the heat pipe,
wherein the base plate is formed by folding a metal plate, and has a groove portion on which the heat pipe is mounted, and a mount portion which is located at both the sides of the groove portion and on which the heat radiation fin is mounted, an opening portion is formed at a site corresponding to the heat receiving portion of the groove portion, and a surface of the groove portion and a back surface of the mount portion are formed at the same height, and the heat receiving portion formed of a metal plate having higher thermal conductivity than the base plate is placed at the opening portion so that one surface of the heat receiving plate and a surface of the base plate on which the heat pipe is mounted form substantially the same plane.
2. (canceled)
3. The heat sink according to claim 1 , wherein the heat receiving plate is fixed to the back surface of the mount portion.
4. The heat sink according to claim 1 , wherein the heat radiation fin has a plurality of fin plates equipped side by side, and the fin plates are arranged along an extension direction of the heat pipe.
5. The heat sink according to claim 1 , wherein the heat radiation fin has a plurality of reception grooves for receiving the heat pipe on a surface thereof which confronts the base plate, and a leg portion that comes into contact with the surface of the base plate is equipped between the reception grooves.
6. The heat sink according to claim 3 , wherein the heat radiation fin has a plurality of fin plates equipped side by side, and the fin plates are arranged along an extension direction of the heat pipe.
7. The heat sink according to claim 3 , wherein the heat radiation fin has a plurality of reception grooves for receiving the heat pipe on a surface thereof which confronts the base plate, and a leg portion that comes into contact with the surface of the base plate is equipped between the reception grooves.
8. The heat sink according to claim 4 , wherein the heat radiation fin has a plurality of reception grooves for receiving the heat pipe on a surface thereof which confronts the base plate, and a leg portion that comes into contact with the surface of the base plate is equipped between the reception grooves.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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JP2012267171 | 2012-12-06 | ||
JP2012-267171 | 2012-12-06 | ||
PCT/JP2013/082635 WO2014088044A1 (en) | 2012-12-06 | 2013-12-04 | Heat sink |
Publications (1)
Publication Number | Publication Date |
---|---|
US20150219400A1 true US20150219400A1 (en) | 2015-08-06 |
Family
ID=50883461
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US14/423,002 Abandoned US20150219400A1 (en) | 2012-12-06 | 2013-12-04 | Heat sink |
Country Status (4)
Country | Link |
---|---|
US (1) | US20150219400A1 (en) |
JP (1) | JP5579349B1 (en) |
CN (1) | CN204596782U (en) |
WO (1) | WO2014088044A1 (en) |
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USD805043S1 (en) * | 2016-02-22 | 2017-12-12 | Heatscape.Com, Inc. | Heatsink for optical modules |
USD819579S1 (en) * | 2016-07-22 | 2018-06-05 | Tsung-Hsien Huang | Heat sink |
USD833988S1 (en) * | 2016-07-22 | 2018-11-20 | Tsung-Hsien Huang | Heat sink |
US10314202B2 (en) | 2015-08-19 | 2019-06-04 | Fujikura Ltd. | Heat spreading module for portable electronic device |
US11076478B2 (en) * | 2019-01-14 | 2021-07-27 | Eagle Technology, Llc | Electronic assemblies having embedded passive heat pipes and associated method |
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JP6203693B2 (en) * | 2014-09-12 | 2017-09-27 | Idec株式会社 | Electrical equipment |
CN105472942B (en) * | 2014-09-26 | 2018-07-31 | 华为技术有限公司 | Radiator and electronic product |
JP2017183590A (en) * | 2016-03-31 | 2017-10-05 | 古河電気工業株式会社 | heat sink |
JP6707960B2 (en) * | 2016-04-07 | 2020-06-10 | 富士通株式会社 | Electronics |
JP6666560B2 (en) * | 2016-09-29 | 2020-03-18 | 富士通クライアントコンピューティング株式会社 | Heat dissipating component and terminal device provided with heat dissipating component |
CN107072110B (en) * | 2017-01-09 | 2023-07-25 | 四川埃姆克伺服科技有限公司 | Wall-penetrating type heat dissipation assembly for servo driver |
CN108387026B (en) * | 2017-12-22 | 2020-12-15 | 青岛海尔智能技术研发有限公司 | Heat exchange device and semiconductor refrigeration equipment with same |
CN112201928A (en) * | 2019-07-08 | 2021-01-08 | 深圳市大富科技股份有限公司 | Active antenna unit and shell thereof |
KR200496590Y1 (en) * | 2021-06-08 | 2023-03-08 | 주식회사 한미마이크로닉스 | Cooler for memory unit |
JPWO2023276940A1 (en) * | 2021-06-30 | 2023-01-05 |
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Also Published As
Publication number | Publication date |
---|---|
CN204596782U (en) | 2015-08-26 |
WO2014088044A1 (en) | 2014-06-12 |
JPWO2014088044A1 (en) | 2017-01-05 |
JP5579349B1 (en) | 2014-08-27 |
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