CN204596782U - Radiator - Google Patents
Radiator Download PDFInfo
- Publication number
- CN204596782U CN204596782U CN201390000739.1U CN201390000739U CN204596782U CN 204596782 U CN204596782 U CN 204596782U CN 201390000739 U CN201390000739 U CN 201390000739U CN 204596782 U CN204596782 U CN 204596782U
- Authority
- CN
- China
- Prior art keywords
- base plate
- heat pipe
- radiating fin
- radiator
- heated sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000005452 bending Methods 0.000 claims description 11
- 239000004065 semiconductor Substances 0.000 abstract description 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 238000005476 soldering Methods 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 239000000758 substrate Substances 0.000 description 4
- 238000001816 cooling Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000007493 shaping process Methods 0.000 description 3
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000004512 die casting Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009740 moulding (composite fabrication) Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 230000002269 spontaneous effect Effects 0.000 description 1
- 210000001364 upper extremity Anatomy 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000012224 working solution Substances 0.000 description 1
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
- F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
- F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
- F28F1/32—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
- H01L21/4882—Assembly of heatsink parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- Sustainable Development (AREA)
- Life Sciences & Earth Sciences (AREA)
- Geometry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Radiator is provided, which inhibits the load putting on heat pipe, and achieve the raising of the heat transfer efficiency from heater to radiating fin.Possess: base plate (21), it has and semiconductor element (11) hot linked heated parts; Heat pipe (22), its mode contacted with heated parts with a part is configured at base plate (21); With radiating fin (23), it is configured at base plate (21) and heat pipe (22) overlappingly, base plate (21) is formed by metallic plate, there is at the position corresponding to heated parts peristome (35), be configured to roughly be in same with base plate (21) by heated sheet (36) at this peristome (35), described heated sheet (36) is formed by the metallic plate that thermal conductivity is higher than base plate (21).
Description
Technical field
The utility model relates to radiator, and it possesses the heat pipe being configured at base plate.
Background technology
Usually, known a kind of radiator, described radiating appliance is standby: base plate, and it has the hot linked heated parts with heater; Heat pipe, its mode contacted with described heated parts with a part is configured in described base plate; And radiating fin, itself and this heat pipe hot link (for example, referring to patent documentation 1).
Prior art document
Patent documentation
Patent documentation 1: Japanese Patent No. 4999060 publications
Utility model content
The problem that utility model will solve
In this radiator, in order to future, the heat of spontaneous hot body is passed to radiating fin expeditiously through heat pipe, preferably, utilizes the material (such as, copper or copper alloy etc.) of thermal conductivity excellence to form the base plate with heat pipe contact.But if all utilize copper or copper alloy to form base plate, then the use amount of copper increases, and there is the problem of weight and manufacturing cost increase.
On the other hand, when radiating fin being configured at overlappingly base plate when being strongly required radiator and being miniaturized, because heat pipe is sandwiched between base plate and radiating fin, therefore, the load putting on heat pipe is preferably suppressed.
The utility model completes to solve above-mentioned problem just, its object is to provide following radiator: the load that can suppress to put on heat pipe, and can improve the heat transfer efficiency from heater to radiating fin.
For solving the means of problem
In this manual, the full content of the Japanese invention application/Patent 2012-267171 of application on December 6th, 2012 is comprised.
In order to reach above-mentioned purpose, the feature of radiator of the present utility model is, described radiating appliance is standby: base plate, and it has the hot linked heated parts with heater; Heat pipe, its mode contacted with described heated parts with a part is configured at described base plate; And radiating fin, it is configured on described base plate and described heat pipe overlappingly, and described base plate by metallic plate bending being formed, and possesses: groove portion, is wherein configured with described heat pipe; And mounting portion, it is placed with described radiating fin in the both sides in this groove portion, the position corresponding to described heated parts in described groove portion is provided with peristome, and the back side of the surface in this groove portion and described mounting portion is formed in identical height and position, in described peristome, be configured with the heated sheet formed by the metallic plate that thermal conductivity is higher than described base plate, a face of this heated sheet and the face being provided with described heat pipe of described base plate are roughly in same.
In addition, described heated sheet also can be fixed in the back side of described mounting portion.
In addition, also can be, described radiating fin possesses the multiple fin plates be set up in parallel, and these fin plates configure along the bearing of trend of described heat pipe.
In addition, also can be, described radiating fin possesses the multiple holding tanks holding described heat pipe in the opposed faces opposed with described base plate, and described radiating fin is provided with the leg abutted with the surface of described base plate between these holding tanks.
Utility model effect
According to the utility model, because base plate is formed by metallic plate, at the position corresponding to heated parts, there is peristome, this peristome is provided with heated sheet, described heated sheet is formed by the metallic plate that thermal conductivity is higher than base plate, and the heat therefore from heater can be passed to radiating fin expeditiously through heated sheet and heat pipe.And, because heated sheet is configured in the face (roughly coplanar) roughly the same with the face being provided with heat pipe of base plate, therefore, it is possible to prevent the ladder on base plate poor, even if when radiating fin being configured at overlappingly base plate and heat pipe, superfluous load applying also can be prevented in heat pipe.
Accompanying drawing explanation
Fig. 1 is the exploded perspective view of the radiator of the first execution mode.
Fig. 2 is the stereoscopic figure of radiator.
Fig. 3 is the end view of radiator.
Fig. 4 is the sectional view of radiator.
Fig. 5 is the vertical view before the drawing of base plate.
Fig. 6 is the end view of the radiator of another execution mode.
Fig. 7 is the sectional view of radiator.
Embodiment
Below, come with reference to the accompanying drawings to be described an execution mode of the present utility model.
[the first execution mode]
Fig. 1 is the exploded perspective view of the radiator 10 of the first execution mode, and Fig. 2 is the stereoscopic figure of radiator 10.
Radiator 10, for electronic equipments such as such as PC, carries out the cooling of this semiconductor element 11 with semiconductor element (heater) 11 hot links such as the CPU be equipped on not shown circuit substrate (central processing unit).
As shown in Figure 1, radiator 10 possesses flat base plate 21, this base plate 21 is arranged in parallel with multiple (being 3 in the present embodiment) heat pipe 22, is arranged in parallel with multiple (being 2 in the present embodiment) radiating fin 23 overlappingly with this base plate 21 and heat pipe 22.That is, in this configuration, as shown in Figure 2, heat pipe 22 is sandwiched between base plate 21 and radiating fin 23 and is kept.
The metallic plate bendings such as aluminium are formed by drawing by base plate 21.As shown in Figure 1, this base plate 21 possesses: the groove portion 31 of wide cut, and it extends along long side direction (being Y-direction in the drawings) in the substantial middle of short side direction (being X-direction in the drawings); With a pair weir portion (mounting portion) 32, it is formed higher than this groove portion 31 in the both sides in this groove portion 31.These weir portions 32 are formed in roughly the same height and position, and the edge 33 in this weir portion 32 bends respectively to below.Be configured with heat pipe 22 in groove portion 31, be placed with radiating fin 23 in weir portion 32.
In addition, 2 places (amounting to 4 places) hole portion 34 is formed respectively in each weir portion 32.This some holes portion 34 is for for the through hole of fixing screw radiator 10 being fixed on circuit substrate.
In addition, groove portion 31 is arranged on the substantial middle of the Width of base plate 21, but is not limited thereto, and also can be arranged on any position of this Width.
Except metallic plate bending, except this base plate that is shaped, also can be formed this base plate by the method for such as casting forming, extrusion molding or shaping by stock removal.But, if by casting forming or extrusion molding, then producing the die cost for being shaped, existing and being not suitable for a small amount of situation of producing.In addition, even if also can produce the problem of processing cost and material cost increase when shaping by stock removal.Further, usually, because die casting product are poorer than metallic plate thermal conductivity, therefore, when other condition is identical, the cooling performance of radiator is made to produce difference due to the difference of the thermal conductivity of base plate.
In contrast, in this configuration, by drawing, metallic plate bending is formed base plate 21.In the structure shown here, compared with the above case, the thermal conductivity of base plate 21 self can be improved, and can manufacturing cost be suppressed.Further, because the groove portion 31 and edge 33 that utilize base plate 21 bending process play the function as ribs, therefore, it is possible to guarantee the rigidity of base plate 21 and realize lightness, slimming.
In this configuration, peristome 35 is possessed in the substantial middle (position corresponding to the heated parts being thermally connected to semiconductor element 11) of the long side direction in the groove portion 31 of base plate 21, be configured with heated sheet 36 at this peristome 35, described heated sheet 36 is formed by the metal (such as copper) that thermal conductivity is higher than base plate 21.Be connected with above-mentioned semiconductor element 11 at the back side (the being lower surface in the drawings) 36A of this heated sheet 36, be fixed with a part for heat pipe 22 at surface (being upper surface in the drawings) 36B with the state of contact.
In the structure shown here, the heat sent from semiconductor element 11 is delivered to heat pipe 22 by heated sheet 36.Because this heated sheet 36 is formed by the metal that thermal conductivity is higher than base plate 21, therefore, it is possible to the heat of semiconductor element 11 is promptly delivered to radiating fin 23 by heated sheet 36 and heat pipe 22, the cooling performance of radiator 10 can be improved.In addition, being formed compared with the situation of whole base plate 21 with utilizing copper, the reduction of lightness and material, manufacturing cost can be realized.
Heat pipe 22 is the parts to radiating fin 23 of the thermal diffusion for making heated sheet 36 be subject to.The metal that the working solutions such as water are sealing into the heat conductivity excellences such as such as copper by heat pipe 22 under a reduced pressure or the inside of the airtight container of alloy be made up of above-mentioned metal are formed.Guarantee that in order to suppress height (thickness) base plate 21 is large with the contact area of radiating fin 23, shape of container becomes flat.This heat pipe 22 is fixed in the groove portion 31 of base plate 21 and heated sheet 36 by soldering, soldering etc.
Radiating fin 23 is by the Thermal release of the transmission by heat pipe 22 in air, and it is formed as the length of the roughly half of heat pipe 22, and the bearing of trend of this heat pipe 22 is arranged in parallel with two.Radiating fin 23 is formed at the region comprised directly over heated sheet 36, and the region on base plate 21 exists on a large scale.Radiating fin 23 suitably can change the quantity of configuration according to the length of heat pipe 22, certainly, also can be the radiating fin of independent.
Each radiating fin 23 possesses multiple fin plate 43, and the upper limb 41 of the metallic plates such as such as aluminium 40 and lower edge 42 bend and are formed as roughly U-shaped, cross section by described multiple fin plate 43 respectively substantially in parallel.
These fin plates 43 configure side by side on the bearing of trend of heat pipe 22, and each fin plate 43 is fixed as one by such as soldering.Air can be circulated by the gap between adjacent fin plate 43.Therefore, for radiating fin 23, the thermal diffusion being passed to heat pipe 22 can being made to whole radiating fin 23, by making the air flowed in this heat and the gap between above-mentioned fin plate 43 carry out heat exchange, thus can dispel the heat.
The holding tank 24 holding this heat pipe 22 is possessed at lower surface (opposed faces) 23A opposed with base plate 21 and heat pipe 22 of radiating fin 23.This holding tank 24 is formed accordingly with the profile of heat pipe 22, improves the heat transfer area of heat pipe 22 and radiating fin 23.
In addition, between each holding tank 24, be respectively arranged with leg 25, when making radiating fin 23 be placed in the weir portion 32 of base plate 21, these legs 25 abut with surface (being provided with the face of the heat pipe 22) 31A in the groove portion 31 of this base plate 21.Thereby, it is possible to by leg 25 from base plate 21 to radiating fin 23 direct heat transfer, and utilize leg 25 to support the load of radiating fin 23, reduce the load of opposite heat tube 22 applying.
In the present embodiment, radiating fin 23 is fixed in base plate 21 and each heat pipe 22 respectively by soldering etc., thus radiator 10 is integrally constituted.In addition, on radiating fin 23, the position corresponding with the hole portion 34 being arranged at base plate 21 is provided with breach 26.
In addition, in above-mentioned radiator 10, in order to the heat conductivity utilizing structure at a low price to improve base plate 21, base plate 21 is formed by bending metallic plate, and at the position corresponding to the heated parts being thermally connected to semiconductor element 11, peristome 35 is set, configure heated sheet 36 at this peristome 35, described heated sheet 36 is formed by the metal that thermal conductivity is higher than base plate 21.
In addition, by making radiator 10 become structure radiating fin 23 being configured at overlappingly base plate 21, thus heat pipe 22 is sandwiched between base plate 21 and radiating fin 23, therefore, preferably, suppresses radiating fin 23 to be applied to the load of heat pipe 22.
Therefore, in this configuration, heated sheet 36 is configured to: the surface of this heated sheet 36 (is upper surface in the drawings; A face) surface (the being upper surface in the drawings) 31A in groove portion 31 of 36B and base plate 21 do not have the surperficial 31A in ladder difference or the poor surperficial 36B of atomic little state, i.e. heated sheet 36 of ladder and the groove portion 31 of base plate 21 to be roughly in same (roughly coplanar).
Specifically, as shown in Figure 3, metallic plate bends and forms base plate 21 by the mode being in identical height and position with the surperficial 31A in groove portion 31 and the back side (the being lower surface in the drawings) 32A in weir portion 32, heated sheet 36 is formed larger than the width in groove portion 31, and is fixed on the back side 32A in weir portion 32 by soldering etc.
Therefore, as shown in Figure 4, heated sheet 36 is posted by peristome 35 from the 32A side, the back side in weir portion 32, by being fixed on the so simple operation of this back side 32A, the surperficial 36B of the heated sheet 36 and surperficial 31A in groove portion 31 being roughly in same (roughly coplanar), this heated sheet 36 can being configured in the peristome 35 of base plate 21.Therefore, it is possible to prevent heated sheet 36 poor with the ladder of base plate 21, even if when radiating fin 23 being configured in overlappingly base plate 21 and heat pipe 22, superfluous load applying also can be prevented in heat pipe 22.
Below, the formation method of base plate 21 is described.
Fig. 5 is the vertical view before the drawing of base plate 21.
First, metallic plate stamping-out is become the profile shown in Fig. 5, and form peristome 35 and hole portion 34 in the position of regulation.
Then, the shape desired by the metallic plate bending process gone out by stamping-out by drawing is become.Specifically, by by the convex folding of line 51 from the edge of metallic plate along the line 50 inside predetermined distance and the edge 35A along peristome 35, and by from this line 51 along the recessed folding of line 52 inside predetermined distance, thus shaping base plate 21.
In this case, the recess 35B extended laterally from this edge 35A is formed at the corner place of the edge 35A of peristome 35.Thus, when bending with above-mentioned line 51, can prevent the vicinity, corner of peristome 35 from heaving, can bend exactly along the edge 35A of peristome 35.
Above, according to the present embodiment, possess: base plate 21, it has heated parts hot linked with semiconductor element 11; Heat pipe 22, its mode contacted with heated parts with a part is configured at base plate 21; With radiating fin 23, it is configured in base plate 21 and heat pipe 22 overlappingly, base plate 21 is formed by metallic plate, at the position corresponding to heated parts, there is peristome 35, this peristome 35 is provided with heated sheet 36, described heated sheet 36 is formed by the metallic plate that thermal conductivity is higher than base plate 21, therefore, it is possible to the heat from semiconductor element 11 is passed to radiating fin 23 expeditiously through heated sheet 36 and heat pipe 22.And, because heated sheet 36 is configured in the face (roughly coplanar) roughly the same with the face 31A being provided with heat pipe 22 of base plate 21, therefore, it is possible to prevent the ladder on base plate 21 poor, even if when radiating fin 23 being configured at overlappingly base plate 21 and heat pipe 22, superfluous load applying also can be prevented in heat pipe 22.
In addition, according to the present embodiment, base plate 21 possesses: groove portion 31, and it is formed by bending metallic plate, is configured with heat pipe 22 in described groove portion 31; With weir portion 32, its both sides in this groove portion 31 mounting radiating fin 23, in groove portion 31, peristome 35 is set, and the surperficial 31A in this groove portion 31 and back side 32A in weir portion 32 is formed in identical height and position, therefore by heated sheet 36 being posted by peristome 35 from the 32A side, the back side in weir portion 32 and being fixed on the so simple operation of this back side 32A, just this heated sheet 36 can be configured in the peristome 35 of base plate 21, the surperficial 36B of the heated sheet 36 and surperficial 31A in groove portion 31 is roughly in same (roughly coplanar).
In addition, according to the present embodiment, because heated sheet 36 is fixed on the back side 32A in weir portion 32, therefore, it is possible to be simplified to fix structure, and surface is not exposed to due to standing part, therefore, it is possible to improve the outward appearance of radiator 10.
In addition, according to the present embodiment, radiating fin 23 possesses the multiple fin plates 43 be set up in parallel, these fin plates 43 configure along the bearing of trend of heat pipe 22, therefore, it is possible to make the heat of transmission be diffused into each fin plate 43 through heat pipe 22, by making the air flowed in this heat and the gap between fin plate 43 carry out heat exchange, thus can dispel the heat.
In addition, according to the present embodiment, the multiple holding tanks 24 holding heat pipe 22 are possessed at the lower surface 23A opposed with base plate 21 of radiating fin 23, the leg 25 abutted with the surperficial 31A in the groove portion 31 of base plate 21 is provided with between these holding tanks 24, therefore, when radiating fin 23 being placed in the weir portion 32 of base plate 21, abutted by the surperficial 31A of leg 25 with the groove portion 31 of this base plate 21, thus can from base plate 21 by leg 25 to radiating fin 23 directly heat transfer.Further, by the load utilizing leg 25 to support radiating fin 23, thus the load of opposite heat tube 22 applying can be reduced.
[the second execution mode]
Below, the other execution mode of radiator is described.The shape of the base plate of the radiator 100 of this second execution mode is different from the first above-mentioned execution mode.Therefore, in this second embodiment, only structure difference is described, identical label is marked to identical structure and omits the description.
Fig. 6 is the end view of the radiator 100 of the second execution mode, and Fig. 7 is the sectional view of radiator 100.
Utilize the metallic plate not implementing bending process to form the base plate 121 of present embodiment.In this embodiment, heated sheet 36 is formed as the size roughly the same with the peristome 135 being arranged at base plate 121, this heated sheet 36 is fixed on peristome 135, and the surface of the surperficial 36B of this heated sheet 36 and base plate 121 (being upper surface in the drawings) 121A is roughly in same (roughly coplanar).
Specifically, in surface (being provided with the face of heat pipe 22) the 121A side arrangement of baffles of base plate 121, under the state making the surperficial 36B of heated sheet 36 abut with this baffle plate, from the 121B side, the back side of base plate 121 by the fixed base plates such as soldering 121 and heated sheet 36.In the structure shown here, compared with the first above-mentioned execution mode, heated sheet 36 fixedly need technology, but the surperficial 36B of the heated sheet 36 and surperficial 121A of base plate 121 can be made simply roughly to be in same (roughly coplanar).
According to the present embodiment, the thickness of base plate 121 can be suppressed, correspondingly realize the slimming of radiator 100.
According to execution mode, the utility model is illustrated particularly above, but the utility model is not limited to above-mentioned execution mode, can changes in the scope not departing from its purport.
Such as, in the above-described embodiment, be formed as the structure be configured in by three heat pipes 22 on base plate 21,121, but also suitably can change the radical of heat pipe 22.Further, heat pipe 22 is flat pattern, but, can certainly be round.
In addition, in the above-described embodiment, peristome 35,135 is arranged on the substantial middle of base plate 21,121, but is not limited thereto, also can according to be configured at circuit substrate semiconductor element 11 position and change.In addition, in the above-described embodiment, be formed as being configured at the structure of semiconductor element 11 as heater of circuit substrate, but, be certainly not limited thereto.
Label declaration
10,100 radiators
11 semiconductor elements (heater)
21,121 base plates
22 heat pipes
23 radiating fins
23A lower surface (opposed faces)
24 holding tanks
25 legs
31 groove portions
31A, 121A surface (being configured with the face of heat pipe)
32 weirs portion
The 32A back side
35,135 peristomes
36 heated sheets
36B surface
43 fin plates
Claims (5)
1. a radiator, is characterized in that,
Described radiating appliance is standby: base plate, and it has the hot linked heated parts with heater; Heat pipe, its mode contacted with described heated parts with a part is configured at described base plate; And radiating fin, it is configured on described base plate and described heat pipe overlappingly,
Described base plate by metallic plate bending being formed, and possesses: groove portion, is wherein configured with described heat pipe; And mounting portion, it is placed with described radiating fin in the both sides in this groove portion, the position corresponding to described heated parts in described groove portion is provided with peristome, and the back side of the surface in this groove portion and described mounting portion is formed in identical height and position,
In described peristome, be configured with the heated sheet formed by the metallic plate that thermal conductivity is higher than described base plate, a face of this heated sheet and the face being provided with described heat pipe of described base plate are roughly in same.
2. radiator according to claim 1, is characterized in that,
Described heated sheet is fixed in the back side of described mounting portion.
3. radiator according to claim 1 and 2, is characterized in that,
Described radiating fin possesses the multiple fin plates be set up in parallel, and these fin plates configure along the bearing of trend of described heat pipe.
4. radiator according to claim 1 and 2, is characterized in that,
Described radiating fin possesses the multiple holding tanks holding described heat pipe in the opposed faces opposed with described base plate, described radiating fin is provided with the leg abutted with the surface of described base plate between these holding tanks.
5. radiator according to claim 3, is characterized in that,
Described radiating fin possesses the multiple holding tanks holding described heat pipe in the opposed faces opposed with described base plate, described radiating fin is provided with the leg abutted with the surface of described base plate between these holding tanks.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP2012-267171 | 2012-12-06 | ||
| JP2012267171 | 2012-12-06 | ||
| PCT/JP2013/082635 WO2014088044A1 (en) | 2012-12-06 | 2013-12-04 | Heat sink |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204596782U true CN204596782U (en) | 2015-08-26 |
Family
ID=50883461
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201390000739.1U Expired - Fee Related CN204596782U (en) | 2012-12-06 | 2013-12-04 | Radiator |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20150219400A1 (en) |
| JP (1) | JP5579349B1 (en) |
| CN (1) | CN204596782U (en) |
| WO (1) | WO2014088044A1 (en) |
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| CN108387026A (en) * | 2017-12-22 | 2018-08-10 | 青岛海尔智能技术研发有限公司 | Heat-exchanger rig and semiconductor refrigerating equipment with the heat-exchanger rig |
| CN109168288A (en) * | 2014-09-26 | 2019-01-08 | 华为技术有限公司 | Radiator and electronic product |
| CN112201928A (en) * | 2019-07-08 | 2021-01-08 | 深圳市大富科技股份有限公司 | Active antenna unit and shell thereof |
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| JP5945047B1 (en) * | 2015-08-19 | 2016-07-05 | 株式会社フジクラ | Thermal diffusion plate for portable electronic devices |
| USD805043S1 (en) * | 2016-02-22 | 2017-12-12 | Heatscape.Com, Inc. | Heatsink for optical modules |
| JP2017183590A (en) * | 2016-03-31 | 2017-10-05 | 古河電気工業株式会社 | heat sink |
| JP6707960B2 (en) * | 2016-04-07 | 2020-06-10 | 富士通株式会社 | Electronics |
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| US6626233B1 (en) * | 2002-01-03 | 2003-09-30 | Thermal Corp. | Bi-level heat sink |
| US6918429B2 (en) * | 2003-11-05 | 2005-07-19 | Cpumate Inc. | Dual-layer heat dissipating structure |
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| JP4495021B2 (en) * | 2005-03-30 | 2010-06-30 | 古河電気工業株式会社 | Heat sink for vehicle mounting |
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| US7942194B2 (en) * | 2007-04-10 | 2011-05-17 | Fujikura Ltd. | Heat sink |
| US20080310105A1 (en) * | 2007-06-14 | 2008-12-18 | Chia-Chun Cheng | Heat dissipating apparatus and water cooling system having the same |
| US7643293B2 (en) * | 2007-12-18 | 2010-01-05 | Hon Hai Precision Industry Co., Ltd. | Heat dissipation device and a method for manufacturing the same |
| CN101528018A (en) * | 2008-03-07 | 2009-09-09 | 富准精密工业(深圳)有限公司 | Heat radiating device and manufacturing method thereof |
| US8002019B2 (en) * | 2008-03-20 | 2011-08-23 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device |
| JP5227672B2 (en) * | 2008-06-17 | 2013-07-03 | 古河電気工業株式会社 | Heat pipe fixing method and heat sink |
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| TW201037256A (en) * | 2010-05-14 | 2010-10-16 | Asia Vital Components Co Ltd | Heat dissipating device and manufacturing method thereof |
-
2013
- 2013-12-04 US US14/423,002 patent/US20150219400A1/en not_active Abandoned
- 2013-12-04 WO PCT/JP2013/082635 patent/WO2014088044A1/en active Application Filing
- 2013-12-04 CN CN201390000739.1U patent/CN204596782U/en not_active Expired - Fee Related
- 2013-12-04 JP JP2014517299A patent/JP5579349B1/en active Active
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109168288A (en) * | 2014-09-26 | 2019-01-08 | 华为技术有限公司 | Radiator and electronic product |
| CN109168288B (en) * | 2014-09-26 | 2020-07-14 | 华为技术有限公司 | Radiator and electronic product |
| CN107072110A (en) * | 2017-01-09 | 2017-08-18 | 四川埃姆克伺服科技有限公司 | A kind of wall-penetrating type radiating subassembly for servo-driver |
| CN108387026A (en) * | 2017-12-22 | 2018-08-10 | 青岛海尔智能技术研发有限公司 | Heat-exchanger rig and semiconductor refrigerating equipment with the heat-exchanger rig |
| CN108387026B (en) * | 2017-12-22 | 2020-12-15 | 青岛海尔智能技术研发有限公司 | Heat exchange device and semiconductor refrigeration equipment with same |
| CN112201928A (en) * | 2019-07-08 | 2021-01-08 | 深圳市大富科技股份有限公司 | Active antenna unit and shell thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| US20150219400A1 (en) | 2015-08-06 |
| JP5579349B1 (en) | 2014-08-27 |
| WO2014088044A1 (en) | 2014-06-12 |
| JPWO2014088044A1 (en) | 2017-01-05 |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150826 Termination date: 20211204 |
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| CF01 | Termination of patent right due to non-payment of annual fee |