TWD181171S - Radiator(2) - Google Patents

Radiator(2)

Info

Publication number
TWD181171S
TWD181171S TW105304757F TW105304757F TWD181171S TW D181171 S TWD181171 S TW D181171S TW 105304757 F TW105304757 F TW 105304757F TW 105304757 F TW105304757 F TW 105304757F TW D181171 S TWD181171 S TW D181171S
Authority
TW
Taiwan
Prior art keywords
radiator
base
keyholes
embedded
creation
Prior art date
Application number
TW105304757F
Other languages
Chinese (zh)
Inventor
Tsung-Hsien Huang
Original Assignee
黃崇賢
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 黃崇賢 filed Critical 黃崇賢
Publication of TWD181171S publication Critical patent/TWD181171S/en

Links

Abstract

【物品用途】;本創作係指一種散熱器(2)的外觀設計，該散熱器主要是提供電子裝置的發熱元件(電子元件)進行散熱降溫。;【設計說明】;如附圖所示，本創作係一種散熱器(2)的外觀設計，該散熱器係於底座的上端面設有複數個密集相鄰並排的較長散熱鰭片，底座兩側各有複數個鎖孔，在鎖孔與鎖孔之間亦可並排植設較短散熱鰭片，其創作特點乃在於散熱器的底座下端面係嵌入結合3支相互環繞的彎曲熱管，其中間為一S型彎曲熱管，而在S型的兩端臂則分別再環繞一U型彎曲熱管所共同形成，且3支熱管均嵌入貼平於底座的下端面，依此組成的散熱器，不僅結構合理，整體外觀形狀亦具新穎獨特表徵。[Purpose of article]; This creation refers to the appearance design of a radiator (2). The radiator is mainly used to provide heat dissipation and cooling for the heating elements (electronic components) of electronic devices. ;[Design Description];As shown in the attached figure, this creation is an appearance design of a radiator (2). The radiator is equipped with a plurality of long heat dissipation fins densely adjacent and side by side on the upper end of the base. There are a plurality of keyholes on each side, and short cooling fins can also be planted side by side between the keyholes. The creative feature is that the lower end of the base of the radiator is embedded with three curved heat pipes that surround each other. There is an S-shaped curved heat pipe in the middle, and the arms at both ends of the S-shape are respectively surrounded by a U-shaped curved heat pipe. The three heat pipes are embedded and flat against the lower end of the base, thus forming a radiator. , not only the structure is reasonable, but the overall appearance shape is also novel and unique.

TW105304757F 2016-07-22 2016-08-18 Radiator(2) TWD181171S (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201630339279 2016-07-22

Publications (1)

Publication Number Publication Date
TWD181171S true TWD181171S (en) 2017-02-01

Family

ID=59677879

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105304757F TWD181171S (en) 2016-07-22 2016-08-18 Radiator(2)

Country Status (3)

Country Link
US (1) USD819579S1 (en)
JP (1) JP1584897S (en)
TW (1) TWD181171S (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD880436S1 (en) * 2018-11-15 2020-04-07 RB Distribution, Inc. Heat sink for a control module
USD953280S1 (en) * 2020-01-17 2022-05-31 Furukawa Electric Co., Ltd Heat sink
USD924186S1 (en) * 2020-03-09 2021-07-06 Cambricon Technologies Corporation Limited Board card

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD496338S1 (en) * 2003-03-10 2004-09-21 Asia Vital Components Co., Ltd. Double-winged radiator for central processing unit
USD487885S1 (en) * 2003-03-14 2004-03-30 Datech Technology Co., Ltd. Heat pipe heat sink assembly
US7746640B2 (en) * 2007-07-12 2010-06-29 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device with heat pipes
USD573110S1 (en) * 2007-07-27 2008-07-15 Nidec Corporation Heat sink
US20090050305A1 (en) * 2007-08-24 2009-02-26 Forcecon Technology Co., Ltd. Heat pipe structure of a heat radiator
USD579423S1 (en) * 2007-11-19 2008-10-28 Foxconn Technology Co., Ltd. Heat sink
TWD125793S1 (en) * 2008-01-07 2008-11-01 訊凱國際股份有限公司 Radiator
US8286693B2 (en) * 2008-04-17 2012-10-16 Aavid Thermalloy, Llc Heat sink base plate with heat pipe
US20100126700A1 (en) * 2008-11-24 2010-05-27 Li-Ling Chen Heat-radiating base plate and heat sink using the same
US20120067550A1 (en) * 2010-09-22 2012-03-22 David Shih Heat sink structure embedded with heat pipes
TW201235824A (en) * 2011-02-25 2012-09-01 Asia Vital Components Co Ltd Heat dissipating module and its manufacturing method
TWI460388B (en) * 2011-12-30 2014-11-11 Asia Vital Components Co Ltd Thermal module
JP5579349B1 (en) * 2012-12-06 2014-08-27 古河電気工業株式会社 heatsink
US20140202666A1 (en) * 2013-01-22 2014-07-24 Asia Vital Components Co., Ltd. Thermal module
USD715750S1 (en) * 2013-11-26 2014-10-21 Kilpatrick Townsend & Stockton Llp Power heat sink with imbedded fly cut heat pipes
USD747278S1 (en) * 2014-09-19 2016-01-12 General Electric Company Heat sink
EP3147621B1 (en) * 2015-09-24 2019-09-11 ABB Schweiz AG Cooling device and method for cooling at least two power electronic devices
CN105258539B (en) * 2015-10-09 2018-07-31 东莞汉旭五金塑胶科技有限公司 Heat radiator
US20170153063A1 (en) * 2015-11-26 2017-06-01 Asia Vital Components Co., Ltd. Heat dissipation unit
US9909815B2 (en) * 2015-12-01 2018-03-06 Asia Vital Components Co., Ltd. Assembling structure of heat dissipation device

Also Published As

Publication number Publication date
JP1584897S (en) 2017-08-28
USD819579S1 (en) 2018-06-05

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