US20170153063A1 - Heat dissipation unit - Google Patents

Heat dissipation unit Download PDF

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Publication number
US20170153063A1
US20170153063A1 US14/952,922 US201514952922A US2017153063A1 US 20170153063 A1 US20170153063 A1 US 20170153063A1 US 201514952922 A US201514952922 A US 201514952922A US 2017153063 A1 US2017153063 A1 US 2017153063A1
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US
United States
Prior art keywords
heat
heat pipe
base seat
heat dissipation
perforations
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US14/952,922
Inventor
Sheng-Huang Lin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asia Vital Components Co Ltd
Original Assignee
Asia Vital Components Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asia Vital Components Co Ltd filed Critical Asia Vital Components Co Ltd
Priority to US14/952,922 priority Critical patent/US20170153063A1/en
Assigned to ASIA VITAL COMPONENTS CO., LTD. reassignment ASIA VITAL COMPONENTS CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: LIN, SHENG-HUANG
Publication of US20170153063A1 publication Critical patent/US20170153063A1/en
Priority to US16/199,211 priority patent/US10900719B2/en
Abandoned legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H01L21/4878—Mechanical treatment, e.g. deforming
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes

Definitions

  • the present invention relates generally to a heat dissipation unit, and more particularly to a heat dissipation unit with better heat contact plane face.
  • a current electronic apparatus has a central processing unit and other calculation chips inside. In operation, all of the central processing unit and the calculation chips will generate heat. Therefore, a heat dissipation component is needed to help in increasing the heat dissipation efficiency so as to more effectively dissipate the heat.
  • the most often used heat dissipation components are such as heat pipes, vapor chambers, heat sinks and radiating fins. These components serve to speed the heat conduction or transfer the heat to a remote end to dissipate the heat or enlarge the heat dissipation area to enhance the heat dissipation performance.
  • the heat sink is in contact with the central processing unit to conduct the heat generated by the central processing unit. The heat sink can provide larger heat dissipation area.
  • a heat pipe is combined with the heat sink.
  • the section of the heat sink in contact with the central processing unit is formed with a perforation or a channel to directly expose the heat pipe to outer side into contact with the central processing unit to conduct the heat and transfer the heat to the heat sink with larger heat dissipation area to dissipate the heat.
  • Such heat dissipation component composed of the heat pipe and the heat sink is often employed. However, such heat dissipation component still has some shortcomings needing to be improved.
  • one side of the heat sink is formed with a channel for receiving the heat pipe and the heat pipe is fixed in the channel by means of passing the heat pipe through the heat sink or perpendicularly positioning the heat pipe on the heat sink.
  • the heat pipe will partially protrude from the section of the heat sink that is in contact with the central processing unit.
  • the flatness is poor to cause heat resistance.
  • the protruding parts are processed and milled off.
  • the parts of the heat pipe that protrude from the channel of the heat sink are not positioned on the same level.
  • the wall of the heat pipe often has non-uniform thickness. Therefore, when milling off the protruding parts of the heat pipe, it quite often takes place that the heat pipe is over-milled to damage the wall of the heat pipe. In this case, the heat pipe will lose its function.
  • the heat dissipation unit of the present invention includes a heat pipe and a base seat.
  • the base seat has a first side and a second side.
  • the second side is formed with a channel and multiple perforations in communication with the first and second sides.
  • the heat pipe has a heat absorption section and a conduction section.
  • the conduction section extends from the heat absorption section in a direction to at least one end of the heat pipe distal from the heat absorption section.
  • the heat dissipation unit of the present invention improves the shortcoming of the conventional heat dissipation unit composed of a heat dissipation base board and a heat pipe that when assembled, the coplanar precision between the heat pipe and the section of the heat dissipation base board in contact with the heat source can be hardly controlled.
  • FIG. 1 is a perspective exploded view of a first embodiment of the heat dissipation unit of the present invention
  • FIG. 2 is a perspective assembled view of the first embodiment of the heat dissipation unit of the present invention
  • FIG. 3 is a sectional assembled view of the first embodiment of the heat dissipation unit of the present invention.
  • FIG. 4 is a perspective exploded view of a second embodiment of the heat dissipation unit of the present invention.
  • FIG. 5 is a sectional view showing the processing of the heat dissipation unit of the present invention.
  • FIG. 6 is another sectional view showing the processing of the heat dissipation unit of the present invention.
  • FIG. 1 is a perspective exploded view of a first embodiment of the heat dissipation unit of the present invention.
  • FIG. 2 is a perspective assembled view of the first embodiment of the heat dissipation unit of the present invention.
  • the heat dissipation unit 1 includes a heat pipe 11 and a base seat 12 .
  • the heat pipe 11 has a heat absorption section 111 and a conduction section 112 .
  • the conduction section 112 extends from the heat absorption section 111 in a direction to at least one end of the heat pipe 11 distal from the heat absorption section 111 .
  • the heat pipe 11 is selected from a group consisting of flat-plate heat pipe, D-shaped heat pipe, circular heat pipe and an assembly thereof.
  • the base seat 12 has a first side 121 and a second side 122 oppositely formed on upper and lower faces of the base seat 12 .
  • the second side 122 is formed with a channel 123 and multiple perforations 124 in communication with the first and second sides 121 , 122 .
  • the heat pipe 11 is received in the channel 123 .
  • several parts of the heat pipe 11 corresponding to the perforations 124 protrude into the perforations 124 and are received in the perforations 124 and flush with the first side 121 of the base seat 12 .
  • the sections of the base seat 12 where the perforations 124 are formed are in direct contact with at least one heat source 2 to conduct heat.
  • the protrusion sections of the heat pipe 11 are received in the perforations 124 of the base seat 12 and flush with the first side 121 of the base seat 12 .
  • the rest part of the heat pipe 11 is received in the channel 123 of the base seat 12 and flush with the second side 122 of the base seat 12 .
  • FIG. 4 is a perspective exploded view of a second embodiment of the heat dissipation unit of the present invention.
  • the heat pipe 11 is a circular heat pipe connected with the base seat 12 .
  • the heat pipe 11 partially protrudes from the channel 123 of the base seat 12 .
  • the section of the heat pipe 11 that protrudes from the channel 123 is forced into the channel 123 and filled into the perforations 124 .
  • the heat pipe 11 is shaped by the channel 123 and the perforations 124 and tightly bonded therewith.
  • the heat pipe 11 may partially extrude from the perforations 124 and protrude from the first side 121 of the base seat 12 .
  • the extruding part of the heat pipe 11 can be pressed back into the perforations 124 to be flush with the first side 121 of the base seat 12 .
  • the deformed two sides of the heat pipe 11 can be correspondingly flush with the first and second sides 121 , 122 of the base seat 12 .
  • a press processing is employed as the mechanical processing for illustration purposes (as shown in FIG. 5 ).
  • the mechanical processing is not limited to the press processing.
  • the mechanical processing can be rolling (as shown in FIG. 6 ).

Abstract

A heat dissipation unit includes a heat pipe and a base seat. The base seat has a first side and a second side. The second side is formed with a channel and multiple perforations in communication with the first and second sides. The heat pipe has a heat absorption section and a conduction section. The conduction section extends from the heat absorption section in a direction to at least one end of the heat pipe distal from the heat absorption section. Several parts of the heat pipe corresponding to the perforations are received in the perforations and flush with the first side of the base seat. The heat dissipation unit improves the shortcoming of the conventional heat dissipation component that the coplanar precision between the heat pipe and the protruding platform of the base seat is hard to control.

Description

    BACKGROUND OF THE INVENTION
  • 1. Field of the Invention
  • The present invention relates generally to a heat dissipation unit, and more particularly to a heat dissipation unit with better heat contact plane face.
  • 2. Description of the Related Art
  • A current electronic apparatus has a central processing unit and other calculation chips inside. In operation, all of the central processing unit and the calculation chips will generate heat. Therefore, a heat dissipation component is needed to help in increasing the heat dissipation efficiency so as to more effectively dissipate the heat. The most often used heat dissipation components are such as heat pipes, vapor chambers, heat sinks and radiating fins. These components serve to speed the heat conduction or transfer the heat to a remote end to dissipate the heat or enlarge the heat dissipation area to enhance the heat dissipation performance. In general, the heat sink is in contact with the central processing unit to conduct the heat generated by the central processing unit. The heat sink can provide larger heat dissipation area. In order to transfer the heat at higher heat conduction speed, a heat pipe is combined with the heat sink. In addition, the section of the heat sink in contact with the central processing unit is formed with a perforation or a channel to directly expose the heat pipe to outer side into contact with the central processing unit to conduct the heat and transfer the heat to the heat sink with larger heat dissipation area to dissipate the heat. Such heat dissipation component composed of the heat pipe and the heat sink is often employed. However, such heat dissipation component still has some shortcomings needing to be improved. That is, one side of the heat sink is formed with a channel for receiving the heat pipe and the heat pipe is fixed in the channel by means of passing the heat pipe through the heat sink or perpendicularly positioning the heat pipe on the heat sink. Under such circumstance, the heat pipe will partially protrude from the section of the heat sink that is in contact with the central processing unit. As a result, the flatness is poor to cause heat resistance. Conventionally, the protruding parts are processed and milled off. However, the parts of the heat pipe that protrude from the channel of the heat sink are not positioned on the same level. Moreover, the wall of the heat pipe often has non-uniform thickness. Therefore, when milling off the protruding parts of the heat pipe, it quite often takes place that the heat pipe is over-milled to damage the wall of the heat pipe. In this case, the heat pipe will lose its function.
    • SUMMARY OF THE INVENTION
  • It is therefore a primary object of the present invention to provide a heat dissipation unit, which has a plane face in contact with a heat source with higher flatness precision.
  • To achieve the above and other objects, the heat dissipation unit of the present invention includes a heat pipe and a base seat. The base seat has a first side and a second side. The second side is formed with a channel and multiple perforations in communication with the first and second sides. The heat pipe has a heat absorption section and a conduction section. The conduction section extends from the heat absorption section in a direction to at least one end of the heat pipe distal from the heat absorption section. Several parts of the heat pipe corresponding to the perforations are received in the perforations and flush with the first side of the base seat.
  • The heat dissipation unit of the present invention improves the shortcoming of the conventional heat dissipation unit composed of a heat dissipation base board and a heat pipe that when assembled, the coplanar precision between the heat pipe and the section of the heat dissipation base board in contact with the heat source can be hardly controlled.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • The structure and the technical means adopted by the present invention to achieve the above and other objects can be best understood by referring to the following detailed description of the preferred embodiments and the accompanying drawings, wherein:
  • FIG. 1 is a perspective exploded view of a first embodiment of the heat dissipation unit of the present invention;
  • FIG. 2 is a perspective assembled view of the first embodiment of the heat dissipation unit of the present invention;
  • FIG. 3 is a sectional assembled view of the first embodiment of the heat dissipation unit of the present invention;
  • FIG. 4 is a perspective exploded view of a second embodiment of the heat dissipation unit of the present invention;
  • FIG. 5 is a sectional view showing the processing of the heat dissipation unit of the present invention; and
  • FIG. 6 is another sectional view showing the processing of the heat dissipation unit of the present invention.
    •  DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
  • Please refer to FIGS. 1 and 2. FIG. 1 is a perspective exploded view of a first embodiment of the heat dissipation unit of the present invention. FIG. 2 is a perspective assembled view of the first embodiment of the heat dissipation unit of the present invention. As shown in the drawings, the heat dissipation unit 1 includes a heat pipe 11 and a base seat 12.
  • The heat pipe 11 has a heat absorption section 111 and a conduction section 112. The conduction section 112 extends from the heat absorption section 111 in a direction to at least one end of the heat pipe 11 distal from the heat absorption section 111. The heat pipe 11 is selected from a group consisting of flat-plate heat pipe, D-shaped heat pipe, circular heat pipe and an assembly thereof.
  • The base seat 12 has a first side 121 and a second side 122 oppositely formed on upper and lower faces of the base seat 12. The second side 122 is formed with a channel 123 and multiple perforations 124 in communication with the first and second sides 121, 122. The heat pipe 11 is received in the channel 123. In addition, several parts of the heat pipe 11 corresponding to the perforations 124 protrude into the perforations 124 and are received in the perforations 124 and flush with the first side 121 of the base seat 12.
  • The sections of the base seat 12 where the perforations 124 are formed are in direct contact with at least one heat source 2 to conduct heat.
  • In this embodiment, as shown in FIG. 3, the protrusion sections of the heat pipe 11 are received in the perforations 124 of the base seat 12 and flush with the first side 121 of the base seat 12. The rest part of the heat pipe 11 is received in the channel 123 of the base seat 12 and flush with the second side 122 of the base seat 12.
  • Please now refer to FIG. 4, which is a perspective exploded view of a second embodiment of the heat dissipation unit of the present invention. In this embodiment, the heat pipe 11 is a circular heat pipe connected with the base seat 12. When the circular heat pipe 11 is placed into the channel 123 of the base seat 12 (the channel has an arched cross section in this embodiment), the heat pipe 11 partially protrudes from the channel 123 of the base seat 12. By means of mechanical processing (pressing and rolling), the section of the heat pipe 11 that protrudes from the channel 123 is forced into the channel 123 and filled into the perforations 124. Accordingly, the heat pipe 11 is shaped by the channel 123 and the perforations 124 and tightly bonded therewith. After mechanically processed and compressed, the heat pipe 11 may partially extrude from the perforations 124 and protrude from the first side 121 of the base seat 12. At this time, again by means of mechanical processing, the extruding part of the heat pipe 11 can be pressed back into the perforations 124 to be flush with the first side 121 of the base seat 12. Accordingly, the deformed two sides of the heat pipe 11 can be correspondingly flush with the first and second sides 121, 122 of the base seat 12. In this embodiment, a press processing is employed as the mechanical processing for illustration purposes (as shown in FIG. 5). However, the mechanical processing is not limited to the press processing. Alternatively, the mechanical processing can be rolling (as shown in FIG. 6).
  • The present invention has been described with the above embodiments thereof and it is understood that many changes and modifications in the above embodiments can be carried out without departing from the scope and the spirit of the invention that is intended to be limited only by the appended claims.

Claims (4)

What is claimed is:
1. A heat dissipation unit comprising:
a base seat having a first side and a second side, the second side being formed with a channel and multiple perforations in communication with the first and second sides; and
a heat pipe having a heat absorption section and a conduction section, the conduction section extending from the heat absorption section in a direction to at least one end of the heat pipe distal from the heat absorption section, several parts of the heat pipe corresponding to the perforations protruding into the perforations and being received in the perforations and flush with the first side of the base seat.
2. The heat dissipation unit as claimed in claim 1, wherein the heat pipe is a flat-plate heat pipe or a D-shaped heat pipe.
3. The heat dissipation unit as claimed in claim 1, wherein the first and second sides of the heat pipe are oppositely formed on upper and lower faces of the base seat.
4. The heat dissipation unit as claimed in claim 1, wherein the sections of the base seat where the perforations are formed are in direct contact with at least one heat source to conduct heat.
US14/952,922 2015-11-26 2015-11-26 Heat dissipation unit Abandoned US20170153063A1 (en)

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US14/952,922 US20170153063A1 (en) 2015-11-26 2015-11-26 Heat dissipation unit
US16/199,211 US10900719B2 (en) 2015-11-26 2018-11-25 Heat dissipation unit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US14/952,922 US20170153063A1 (en) 2015-11-26 2015-11-26 Heat dissipation unit

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US16/199,211 Continuation US10900719B2 (en) 2015-11-26 2018-11-25 Heat dissipation unit

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US16/199,211 Active 2036-02-06 US10900719B2 (en) 2015-11-26 2018-11-25 Heat dissipation unit

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD819579S1 (en) * 2016-07-22 2018-06-05 Tsung-Hsien Huang Heat sink
USD833988S1 (en) * 2016-07-22 2018-11-20 Tsung-Hsien Huang Heat sink
US20210345517A1 (en) * 2020-04-29 2021-11-04 Auras Technology Co., Ltd. Heat dissipation base

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* Cited by examiner, † Cited by third party
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JP6828085B2 (en) * 2019-05-09 2021-02-10 レノボ・シンガポール・プライベート・リミテッド Heat transport equipment and electronics

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US20050201061A1 (en) * 2004-03-12 2005-09-15 Nader Nikfar RF power amplifier assembly with heat pipe enhanced pallet
US7493939B2 (en) * 2005-11-13 2009-02-24 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat sink with heat pipes
US20080093052A1 (en) * 2006-10-20 2008-04-24 Foxconn Technology Co., Ltd. Heat dissipation device with heat pipes
US20080173431A1 (en) * 2007-01-23 2008-07-24 Foxconn Technology Co., Ltd. Heat dissipation device with heat pipes
US20090260782A1 (en) * 2008-04-17 2009-10-22 Aavid Thermalloy, Llc Heat sink base plate with heat pipe
US20120216991A1 (en) * 2011-02-25 2012-08-30 Shih-Ming Chen Method for assembling heat pipe and thermo-conductive body and structure thereof
US20130126125A1 (en) * 2011-11-23 2013-05-23 Chaun-Choung Technology Corp Thin heat sink
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Publication number Priority date Publication date Assignee Title
USD819579S1 (en) * 2016-07-22 2018-06-05 Tsung-Hsien Huang Heat sink
USD833988S1 (en) * 2016-07-22 2018-11-20 Tsung-Hsien Huang Heat sink
US20210345517A1 (en) * 2020-04-29 2021-11-04 Auras Technology Co., Ltd. Heat dissipation base
US11553621B2 (en) * 2020-04-29 2023-01-10 Auras Technology Co., Ltd. Heat dissipation base

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US20190093957A1 (en) 2019-03-28

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Owner name: ASIA VITAL COMPONENTS CO., LTD., TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:LIN, SHENG-HUANG;REEL/FRAME:037145/0026

Effective date: 20151126

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION