JP1584897S - - Google Patents

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Publication number
JP1584897S
JP1584897S JPD2016-18061F JP2016018061F JP1584897S JP 1584897 S JP1584897 S JP 1584897S JP 2016018061 F JP2016018061 F JP 2016018061F JP 1584897 S JP1584897 S JP 1584897S
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JPD2016-18061F
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Japanese (ja)
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Links

JPD2016-18061F 2016-07-22 2016-08-25 Active JP1584897S (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201630339279 2016-07-22

Publications (1)

Publication Number Publication Date
JP1584897S true JP1584897S (en) 2017-08-28

Family

ID=59677879

Family Applications (1)

Application Number Title Priority Date Filing Date
JPD2016-18061F Active JP1584897S (en) 2016-07-22 2016-08-25

Country Status (3)

Country Link
US (1) USD819579S1 (en)
JP (1) JP1584897S (en)
TW (1) TWD181171S (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD880436S1 (en) * 2018-11-15 2020-04-07 RB Distribution, Inc. Heat sink for a control module
USD953280S1 (en) * 2020-01-17 2022-05-31 Furukawa Electric Co., Ltd Heat sink
USD924186S1 (en) * 2020-03-09 2021-07-06 Cambricon Technologies Corporation Limited Board card

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD496338S1 (en) * 2003-03-10 2004-09-21 Asia Vital Components Co., Ltd. Double-winged radiator for central processing unit
USD487885S1 (en) * 2003-03-14 2004-03-30 Datech Technology Co., Ltd. Heat pipe heat sink assembly
US7746640B2 (en) * 2007-07-12 2010-06-29 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device with heat pipes
USD573110S1 (en) * 2007-07-27 2008-07-15 Nidec Corporation Heat sink
US20090050305A1 (en) * 2007-08-24 2009-02-26 Forcecon Technology Co., Ltd. Heat pipe structure of a heat radiator
USD579423S1 (en) * 2007-11-19 2008-10-28 Foxconn Technology Co., Ltd. Heat sink
USD582359S1 (en) * 2008-01-07 2008-12-09 Cooler Master Co., Ltd. Heat dissipator
US8286693B2 (en) * 2008-04-17 2012-10-16 Aavid Thermalloy, Llc Heat sink base plate with heat pipe
US20100126700A1 (en) * 2008-11-24 2010-05-27 Li-Ling Chen Heat-radiating base plate and heat sink using the same
US20120067550A1 (en) * 2010-09-22 2012-03-22 David Shih Heat sink structure embedded with heat pipes
TW201235824A (en) * 2011-02-25 2012-09-01 Asia Vital Components Co Ltd Heat dissipating module and its manufacturing method
TWI460388B (en) * 2011-12-30 2014-11-11 Asia Vital Components Co Ltd Thermal module
JP5579349B1 (en) * 2012-12-06 2014-08-27 古河電気工業株式会社 heatsink
US20140202666A1 (en) * 2013-01-22 2014-07-24 Asia Vital Components Co., Ltd. Thermal module
USD715750S1 (en) * 2013-11-26 2014-10-21 Kilpatrick Townsend & Stockton Llp Power heat sink with imbedded fly cut heat pipes
USD747278S1 (en) * 2014-09-19 2016-01-12 General Electric Company Heat sink
EP3147621B1 (en) * 2015-09-24 2019-09-11 ABB Schweiz AG Cooling device and method for cooling at least two power electronic devices
CN105258539B (en) * 2015-10-09 2018-07-31 东莞汉旭五金塑胶科技有限公司 Radiator
US20170153063A1 (en) * 2015-11-26 2017-06-01 Asia Vital Components Co., Ltd. Heat dissipation unit
US9909815B2 (en) * 2015-12-01 2018-03-06 Asia Vital Components Co., Ltd. Assembling structure of heat dissipation device

Also Published As

Publication number Publication date
TWD181171S (en) 2017-02-01
USD819579S1 (en) 2018-06-05

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