USD924186S1 - Board card - Google Patents
Board card Download PDFInfo
- Publication number
- USD924186S1 USD924186S1 US29/727,175 US202029727175F USD924186S US D924186 S1 USD924186 S1 US D924186S1 US 202029727175 F US202029727175 F US 202029727175F US D924186 S USD924186 S US D924186S
- Authority
- US
- United States
- Prior art keywords
- board card
- view
- card
- board
- ornamental design
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Description
Claims (1)
- The ornamental design for a board card, as shown and described.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/727,175 USD924186S1 (en) | 2020-03-09 | 2020-03-09 | Board card |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/727,175 USD924186S1 (en) | 2020-03-09 | 2020-03-09 | Board card |
Publications (1)
Publication Number | Publication Date |
---|---|
USD924186S1 true USD924186S1 (en) | 2021-07-06 |
Family
ID=76606595
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/727,175 Active USD924186S1 (en) | 2020-03-09 | 2020-03-09 | Board card |
Country Status (1)
Country | Link |
---|---|
US (1) | USD924186S1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD965541S1 (en) * | 2022-01-19 | 2022-10-04 | Yizhou Wang | Heat sink |
Citations (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD398589S (en) * | 1997-05-27 | 1998-09-22 | Dodson Douglas A | Cooling device |
US20040130876A1 (en) * | 2003-01-03 | 2004-07-08 | Davison Peter A. | Heat sink attachment device |
USD573110S1 (en) * | 2007-07-27 | 2008-07-15 | Nidec Corporation | Heat sink |
USD579423S1 (en) * | 2007-11-19 | 2008-10-28 | Foxconn Technology Co., Ltd. | Heat sink |
US20100000715A1 (en) * | 2008-07-04 | 2010-01-07 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device |
US20130020056A1 (en) * | 2011-07-22 | 2013-01-24 | Foxconn Technology Co., Ltd. | Heat dissipation device |
US20130043006A1 (en) * | 2011-08-15 | 2013-02-21 | Foxconn Technology Co., Ltd. | Heat disspation device |
US20130048251A1 (en) * | 2011-08-29 | 2013-02-28 | Foxconn Technology Co., Ltd. | Heat dissipation device incorporating heat spreader |
US20130146252A1 (en) * | 2011-12-09 | 2013-06-13 | Hon Hai Precision Industry Co., Ltd. | Heat sink assembly with mistake-proof structure |
US20130163207A1 (en) * | 2011-12-26 | 2013-06-27 | Hon Hai Precision Industry Co., Ltd. | Heat sink |
US20130250523A1 (en) * | 2012-03-23 | 2013-09-26 | Wistron Corp. | Heat dissipating assembly and elastic fastening member thereof |
USD747278S1 (en) * | 2014-09-19 | 2016-01-12 | General Electric Company | Heat sink |
US20160262289A1 (en) * | 2015-03-02 | 2016-09-08 | Tai-Sol Electronics Co., Ltd. | Heat spreader-based heat sink module |
US20170102186A1 (en) * | 2015-10-09 | 2017-04-13 | Tsung-Hsien Huang | Heat sink assembly |
USD805042S1 (en) * | 2015-10-27 | 2017-12-12 | Tsung-Hsien Huang | Combined heat exchanger base and embedded heat pipes |
US20180054920A1 (en) * | 2016-08-19 | 2018-02-22 | Delta Electronics, Inc. | Heat sink module and manufacturing method thereof |
USD819579S1 (en) * | 2016-07-22 | 2018-06-05 | Tsung-Hsien Huang | Heat sink |
US20180173281A1 (en) * | 2016-12-16 | 2018-06-21 | Ablecom Technology Inc. | Fixing frame for heat sink |
USD833988S1 (en) * | 2016-07-22 | 2018-11-20 | Tsung-Hsien Huang | Heat sink |
US20190206763A1 (en) * | 2016-09-12 | 2019-07-04 | Huawei Technologies Co., Ltd. | Heat Sink, Heat Dissipation Apparatus, Heat Dissipation System, And Communications Device |
-
2020
- 2020-03-09 US US29/727,175 patent/USD924186S1/en active Active
Patent Citations (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD398589S (en) * | 1997-05-27 | 1998-09-22 | Dodson Douglas A | Cooling device |
US20040130876A1 (en) * | 2003-01-03 | 2004-07-08 | Davison Peter A. | Heat sink attachment device |
USD573110S1 (en) * | 2007-07-27 | 2008-07-15 | Nidec Corporation | Heat sink |
USD579423S1 (en) * | 2007-11-19 | 2008-10-28 | Foxconn Technology Co., Ltd. | Heat sink |
US20100000715A1 (en) * | 2008-07-04 | 2010-01-07 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device |
US20130020056A1 (en) * | 2011-07-22 | 2013-01-24 | Foxconn Technology Co., Ltd. | Heat dissipation device |
US20130043006A1 (en) * | 2011-08-15 | 2013-02-21 | Foxconn Technology Co., Ltd. | Heat disspation device |
US20130048251A1 (en) * | 2011-08-29 | 2013-02-28 | Foxconn Technology Co., Ltd. | Heat dissipation device incorporating heat spreader |
US20130146252A1 (en) * | 2011-12-09 | 2013-06-13 | Hon Hai Precision Industry Co., Ltd. | Heat sink assembly with mistake-proof structure |
US20130163207A1 (en) * | 2011-12-26 | 2013-06-27 | Hon Hai Precision Industry Co., Ltd. | Heat sink |
US20130250523A1 (en) * | 2012-03-23 | 2013-09-26 | Wistron Corp. | Heat dissipating assembly and elastic fastening member thereof |
USD747278S1 (en) * | 2014-09-19 | 2016-01-12 | General Electric Company | Heat sink |
US20160262289A1 (en) * | 2015-03-02 | 2016-09-08 | Tai-Sol Electronics Co., Ltd. | Heat spreader-based heat sink module |
US20170102186A1 (en) * | 2015-10-09 | 2017-04-13 | Tsung-Hsien Huang | Heat sink assembly |
USD805042S1 (en) * | 2015-10-27 | 2017-12-12 | Tsung-Hsien Huang | Combined heat exchanger base and embedded heat pipes |
USD819579S1 (en) * | 2016-07-22 | 2018-06-05 | Tsung-Hsien Huang | Heat sink |
USD833988S1 (en) * | 2016-07-22 | 2018-11-20 | Tsung-Hsien Huang | Heat sink |
US20180054920A1 (en) * | 2016-08-19 | 2018-02-22 | Delta Electronics, Inc. | Heat sink module and manufacturing method thereof |
US20190206763A1 (en) * | 2016-09-12 | 2019-07-04 | Huawei Technologies Co., Ltd. | Heat Sink, Heat Dissipation Apparatus, Heat Dissipation System, And Communications Device |
US20180173281A1 (en) * | 2016-12-16 | 2018-06-21 | Ablecom Technology Inc. | Fixing frame for heat sink |
Non-Patent Citations (2)
Title |
---|
"Mustang-M2BM-MX2", first released 2019. iEiWorld.com (https://www.ieiworld.com/en/news/con_show.php?op=showone&cid=1090) (Year: 2019). * |
"Sophon AI Computing Module SM5", first accessed Feb. 23, 2021. Sophon.com (https://sophon.ai/product/introduce/sm5.html) (Year: 2021). * |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD965541S1 (en) * | 2022-01-19 | 2022-10-04 | Yizhou Wang | Heat sink |
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Legal Events
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FEPP | Fee payment procedure |
Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |