USD924186S1 - Board card - Google Patents

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Publication number
USD924186S1
USD924186S1 US29/727,175 US202029727175F USD924186S US D924186 S1 USD924186 S1 US D924186S1 US 202029727175 F US202029727175 F US 202029727175F US D924186 S USD924186 S US D924186S
Authority
US
United States
Prior art keywords
board card
view
card
board
ornamental design
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/727,175
Inventor
Xiaobing Feng
Kun HE
Jun He
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Cambricon Technologies Corp Ltd
Original Assignee
Cambricon Technologies Corp Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cambricon Technologies Corp Ltd filed Critical Cambricon Technologies Corp Ltd
Priority to US29/727,175 priority Critical patent/USD924186S1/en
Assigned to CAMBRICON TECHNOLOGIES CORPORATION LIMITED reassignment CAMBRICON TECHNOLOGIES CORPORATION LIMITED ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: FENG, XIAOBING, HE, JUN, HE, Kun
Application granted granted Critical
Publication of USD924186S1 publication Critical patent/USD924186S1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Description

FIG. 1 is a perspective view of the board card in accordance with the present design;
FIG. 2 is another perspective view thereof;
FIG. 3 is another perspective view thereof;
FIG. 4 is a left side view thereof;
FIG. 5 is a right side view thereof;
FIG. 6 is a back view thereof;
FIG. 7 is a front view thereof;
FIG. 8 is a top view thereof; and,
FIG. 9 is a bottom view thereof.

Claims (1)

    CLAIM
  1. The ornamental design for a board card, as shown and described.
US29/727,175 2020-03-09 2020-03-09 Board card Active USD924186S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/727,175 USD924186S1 (en) 2020-03-09 2020-03-09 Board card

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/727,175 USD924186S1 (en) 2020-03-09 2020-03-09 Board card

Publications (1)

Publication Number Publication Date
USD924186S1 true USD924186S1 (en) 2021-07-06

Family

ID=76606595

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/727,175 Active USD924186S1 (en) 2020-03-09 2020-03-09 Board card

Country Status (1)

Country Link
US (1) USD924186S1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD965541S1 (en) * 2022-01-19 2022-10-04 Yizhou Wang Heat sink

Citations (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD398589S (en) * 1997-05-27 1998-09-22 Dodson Douglas A Cooling device
US20040130876A1 (en) * 2003-01-03 2004-07-08 Davison Peter A. Heat sink attachment device
USD573110S1 (en) * 2007-07-27 2008-07-15 Nidec Corporation Heat sink
USD579423S1 (en) * 2007-11-19 2008-10-28 Foxconn Technology Co., Ltd. Heat sink
US20100000715A1 (en) * 2008-07-04 2010-01-07 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
US20130020056A1 (en) * 2011-07-22 2013-01-24 Foxconn Technology Co., Ltd. Heat dissipation device
US20130043006A1 (en) * 2011-08-15 2013-02-21 Foxconn Technology Co., Ltd. Heat disspation device
US20130048251A1 (en) * 2011-08-29 2013-02-28 Foxconn Technology Co., Ltd. Heat dissipation device incorporating heat spreader
US20130146252A1 (en) * 2011-12-09 2013-06-13 Hon Hai Precision Industry Co., Ltd. Heat sink assembly with mistake-proof structure
US20130163207A1 (en) * 2011-12-26 2013-06-27 Hon Hai Precision Industry Co., Ltd. Heat sink
US20130250523A1 (en) * 2012-03-23 2013-09-26 Wistron Corp. Heat dissipating assembly and elastic fastening member thereof
USD747278S1 (en) * 2014-09-19 2016-01-12 General Electric Company Heat sink
US20160262289A1 (en) * 2015-03-02 2016-09-08 Tai-Sol Electronics Co., Ltd. Heat spreader-based heat sink module
US20170102186A1 (en) * 2015-10-09 2017-04-13 Tsung-Hsien Huang Heat sink assembly
USD805042S1 (en) * 2015-10-27 2017-12-12 Tsung-Hsien Huang Combined heat exchanger base and embedded heat pipes
US20180054920A1 (en) * 2016-08-19 2018-02-22 Delta Electronics, Inc. Heat sink module and manufacturing method thereof
USD819579S1 (en) * 2016-07-22 2018-06-05 Tsung-Hsien Huang Heat sink
US20180173281A1 (en) * 2016-12-16 2018-06-21 Ablecom Technology Inc. Fixing frame for heat sink
USD833988S1 (en) * 2016-07-22 2018-11-20 Tsung-Hsien Huang Heat sink
US20190206763A1 (en) * 2016-09-12 2019-07-04 Huawei Technologies Co., Ltd. Heat Sink, Heat Dissipation Apparatus, Heat Dissipation System, And Communications Device

Patent Citations (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD398589S (en) * 1997-05-27 1998-09-22 Dodson Douglas A Cooling device
US20040130876A1 (en) * 2003-01-03 2004-07-08 Davison Peter A. Heat sink attachment device
USD573110S1 (en) * 2007-07-27 2008-07-15 Nidec Corporation Heat sink
USD579423S1 (en) * 2007-11-19 2008-10-28 Foxconn Technology Co., Ltd. Heat sink
US20100000715A1 (en) * 2008-07-04 2010-01-07 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
US20130020056A1 (en) * 2011-07-22 2013-01-24 Foxconn Technology Co., Ltd. Heat dissipation device
US20130043006A1 (en) * 2011-08-15 2013-02-21 Foxconn Technology Co., Ltd. Heat disspation device
US20130048251A1 (en) * 2011-08-29 2013-02-28 Foxconn Technology Co., Ltd. Heat dissipation device incorporating heat spreader
US20130146252A1 (en) * 2011-12-09 2013-06-13 Hon Hai Precision Industry Co., Ltd. Heat sink assembly with mistake-proof structure
US20130163207A1 (en) * 2011-12-26 2013-06-27 Hon Hai Precision Industry Co., Ltd. Heat sink
US20130250523A1 (en) * 2012-03-23 2013-09-26 Wistron Corp. Heat dissipating assembly and elastic fastening member thereof
USD747278S1 (en) * 2014-09-19 2016-01-12 General Electric Company Heat sink
US20160262289A1 (en) * 2015-03-02 2016-09-08 Tai-Sol Electronics Co., Ltd. Heat spreader-based heat sink module
US20170102186A1 (en) * 2015-10-09 2017-04-13 Tsung-Hsien Huang Heat sink assembly
USD805042S1 (en) * 2015-10-27 2017-12-12 Tsung-Hsien Huang Combined heat exchanger base and embedded heat pipes
USD819579S1 (en) * 2016-07-22 2018-06-05 Tsung-Hsien Huang Heat sink
USD833988S1 (en) * 2016-07-22 2018-11-20 Tsung-Hsien Huang Heat sink
US20180054920A1 (en) * 2016-08-19 2018-02-22 Delta Electronics, Inc. Heat sink module and manufacturing method thereof
US20190206763A1 (en) * 2016-09-12 2019-07-04 Huawei Technologies Co., Ltd. Heat Sink, Heat Dissipation Apparatus, Heat Dissipation System, And Communications Device
US20180173281A1 (en) * 2016-12-16 2018-06-21 Ablecom Technology Inc. Fixing frame for heat sink

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
"Mustang-M2BM-MX2", first released 2019. iEiWorld.com (https://www.ieiworld.com/en/news/con_show.php?op=showone&cid=1090) (Year: 2019). *
"Sophon AI Computing Module SM5", first accessed Feb. 23, 2021. Sophon.com (https://sophon.ai/product/introduce/sm5.html) (Year: 2021). *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD965541S1 (en) * 2022-01-19 2022-10-04 Yizhou Wang Heat sink

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