JP2017183590A - heat sink - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a heat sink which obtains high flexibility of installation positions of heat pipes in a base plate while preventing increase of a thickness of the base plate.SOLUTION: A heat sink includes: a plate-like base plate; heat radiation fins thermally connected with the base plate and having cutout parts; and heat pipes thermally connected with the base plate and the heat radiation fins. The heat pipes are respectively disposed at the cutout parts of the heat radiation fins.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a heat sink for cooling a heating element.

  In recent years, various electronic devices have been equipped with a large number of heating elements, such as electronic parts with high heat generation and high power consumption, as the functionality and speed of processing have increased, and the amount of heat generation has been increasing. Yes. Therefore, it is increasingly important to cool the heating element such as an electronic component having a high calorific value to keep the operation of the heating element such as the electronic component normal.

  When a module having a heating element such as an electronic component is cooled by a heat sink, a screw hole is formed in the heat sink, and the module having the electronic component is screwed to the heat sink and thermally connected to the heat sink. (Patent Document 1).

  Moreover, a power device such as an IGBT may be used as the high heat generation electronic component. When a power device is cooled by a heat sink, the power device is larger and heavier than a conventional electronic component, so that it is required to be more stably fixed to the heat sink. Therefore, it is necessary to form a large number of screw holes in the base plate of the heat sink, screw the power device to the base plate, and thermally connect the power device to the heat sink.

  On the other hand, when the size of a heating element such as an electronic component is smaller than the size of the base plate, it is necessary to spread the heat in the entire surface direction of the base plate, so that a heat pipe may be installed on the base plate. As a method of installing the heat pipe, a groove for embedding the entire heat pipe is provided on the surface of the base plate along the surface of the base plate, or a through hole that is a hole that penetrates the base plate is provided in the surface direction of the base plate. ing. Moreover, as an installation method of the heat pipe, an aspect in which the heat pipe is sandwiched between two base plates may be used.

  However, as described above, in order to thermally connect the power device to the heat sink, it is necessary to form a large number of screw holes in the base plate of the heat sink. It was necessary to form a heat pipe installation groove or through hole so as to avoid the hole. However, in this case, since the installation position of the heat pipe in the base plate is restricted, there is a problem that heat cannot be sufficiently spread in the surface direction of the base plate, and the shape of the heat pipe is complicated. In addition, in order to form a groove or through hole for installing a heat pipe without being restricted by the screw hole portion of the base plate, that is, without being restricted by the installation position of the heating element, the thickness of the base plate is equal to the depth of the screw hole. Therefore, there is a problem that the weight and size of the heat sink are increased.

JP 2010-287821 A

  In view of the above circumstances, an object of the present invention is to provide a heat sink that can provide an excellent degree of freedom in the installation position of the heat pipe in the base plate while preventing an increase in the thickness of the base plate.

  An aspect of the present invention includes a flat base plate, a heat radiation fin having a notch portion thermally connected to the base plate, and a heat pipe thermally connected to the base plate and the heat radiation fin. And the heat pipe is a heat sink disposed in a notch portion of the radiating fin.

  An aspect of the present invention is a heat sink in which the heat pipe is flattened.

  An aspect of the present invention is a heat sink in which the heat pipe is disposed on a surface of the base plate, and the heat radiating fin has a portion in contact with the surface of the base plate at a portion other than the notch.

  An aspect of the present invention is a heat sink in which the heat dissipating fins are erected in a direction perpendicular to the surface of the base plate and the longitudinal direction of the heat pipe is parallel to the surface of the base plate.

  An aspect of the present invention is a heat sink in which the shape of the notch is a semi-elliptical or rectangular shape.

  An aspect of the present invention is a heat sink in which the heat pipe has a curved portion and is thermally connected to the base plate and a top portion of the radiating fin.

  An aspect of the present invention is a heat sink for cooling a power device.

  An aspect of the present invention is a heat sink having a thickness that allows the base plate to form a screw hole for fixing the power device.

  An aspect of the present invention is a heat sink in which the heat pipe has a portion overlapping the screw hole in the thickness direction of the base plate.

  According to the aspect of the present invention, the notch portion is provided in the heat radiating fin, and the heat pipe is disposed in the notch portion. Therefore, even if the screw hole for fixing the heating element is formed in the base plate, the thickness of the base plate It is possible to obtain a heat sink excellent in the degree of freedom of the installation position on the base plate of the heat pipe while preventing the increase in the length.

  According to the aspect of the present invention, since the heat pipe is flattened, the thermal connectivity to the radiation fin and the base plate is improved.

  According to the aspect of the present invention, the heat dissipating fin has a portion that is in contact with the surface of the base plate at a portion other than the notch portion, so that even if the notch portion is provided in the heat dissipating fin, excellent thermal connectivity to the base plate. Is obtained.

  According to the aspect of the present invention, the heat pipe has a curved portion and is thermally connected to the base plate and the top of the heat radiating fin, so that the heat radiating efficiency at the top of the heat radiating fin is improved. Overall heat dissipation efficiency is improved.

It is a disassembled perspective view of the heat sink which concerns on the example of 1st Embodiment of this invention. It is explanatory drawing which shows the 1st example of a usage method which connected the heat generating body to the heat sink which concerns on the example of 1st Embodiment of this invention. It is explanatory drawing which shows the 2nd example of a usage method which connected the heat generating body to the heat sink which concerns on the example of 1st Embodiment of this invention.

  Hereinafter, a heat sink according to a first embodiment of the present invention will be described with reference to the drawings.

  As shown in FIG. 1, the heat sink 1 according to the first embodiment includes a flat base plate 10, radiating fins 11 (a plurality in FIG. 1) thermally connected to the base plate 10, and the base plate 10 and the radiating heat. Heat pipes 12 (plural in FIG. 1) thermally connected to the fins 11 are provided, and each radiating fin 11 is provided with a notch 13 (plural in FIG. 1).

  In the heat sink 1, a plurality of heat pipes 12 are thermally connected to the surface side of a flat base plate 10. In FIG. 1, each heat pipe 12 directly contacts the surface of the base plate 10, so that the base plate 10 and the heat pipe 12 are thermally connected. That is, each heat pipe 12 is placed on the surface of the base plate 10. Accordingly, the heat pipe 12 is entirely protruded from the surface of the base plate 10. In addition, the shape of the heat pipe 12 in the longitudinal direction, that is, the shape in plan view, is linear, and the longitudinal direction of the heat pipe 12 (that is, the heat transport direction) is parallel to the surface of the base plate 10. Yes.

  The heat pipe 12 is flattened in order to obtain excellent thermal connectivity to the base plate 10 and the radiating fins 11. The heat pipes 12 are arranged in parallel from one end of the base plate 10 to the other end so that their longitudinal directions are parallel or substantially parallel to each other. Therefore, in the heat sink 1, the heat received by the base plate 10 from the heating element (not shown in FIG. 1) is transported toward the surface of the base plate 10 by the heat pipe 12, and the entire base plate 10 is soaked.

  In the heat sink 1, a plurality of rectangular radiating fins 11 are erected in a direction perpendicular to the surface of the base plate on the surface side of the flat base plate 10 to form a radiating fin group 14. By attaching the lower end 15 of the radiating fin 11, that is, the end on the base plate 10 side, to the surface side of the base plate 10, the radiating fin 11 is erected on the base plate 10, and the radiating fin 11 is thermally connected to the base plate 10. Has been. Each radiation fin 11 is arranged on the surface side of the base plate 10 so that the surfaces of the radiation fins 11 are in a parallel or substantially parallel positional relationship. Further, the heat radiating fins 11 are arranged in parallel from one end of the base plate 10 to the other end.

  Each radiating fin 11 has a notch 13 formed at the lower end 15. The position of the notch 13 is provided so as to correspond to the arrangement position of the heat pipe 12, and the number of notches 13 is set according to the number of heat pipes 12 installed. Furthermore, the dimension of the notch 13 corresponds to the dimension of the cross section in the radial direction of the heat pipe 12. Therefore, the size of the notch 13 in the direction parallel to the surface of the base plate 10 is the size of the cross section in the radial direction of the heat pipe 12 in the direction parallel to the surface of the base plate 10, and in the direction perpendicular to the surface of the base plate 10. The dimension of the notch 13 is the dimension of the radial cross section of the heat pipe 12 in the direction perpendicular to the surface of the base plate 10.

  In each radiating fin 11, a heat pipe 12 is disposed in each notch 13. Therefore, the heat pipe 12 and the radiation fin 11 are thermally connected at the notch 13 of the radiation fin 11. In the heat sink 1, the heat pipe 12 and the radiating fin 11 are thermally connected by the inner surface of the notch 13 being in direct contact with the outer surface of the heat pipe 12.

  On the other hand, the lower end portion 15 of the radiating fin 11 is in direct contact with the surface of the base plate 10 at a portion other than the notch portion 13. Therefore, the lower end portion 15 of the radiating fin 11 is directly and thermally connected to the base plate 10 at a portion other than the notch portion 13.

  Although the shape of the notch 13 is not particularly limited, the heat sink 1 is substantially semi-elliptical in order to improve the thermal connectivity to the heat pipe 12 corresponding to the heat pipe 12 being flattened. Alternatively, a substantially rectangular shape is preferable, and in FIG.

  The radiation fins 11 and the base plate 10 are both flat plates made of a metal material having good thermal conductivity, and are made of, for example, aluminum, aluminum alloy, copper, copper alloy, or the like. Moreover, it is although it does not specifically limit as a material of the container of the heat pipe 12, For example, copper, copper alloy, aluminum, aluminum alloy, nickel, nickel alloy, stainless steel etc. can be mentioned. The working fluid sealed in the container can be appropriately selected according to the compatibility with the material of the container. Examples thereof include water, alternative chlorofluorocarbon, perfluorocarbon, and cyclopentane. Moreover, the fixing method to the base plate 10 of the radiation fin 11 is not specifically limited, For example, fixing by soldering or plastic deformation (for example, caulking etc.), fixing using adhesives, such as an epoxy resin, etc. are mentioned. it can.

  In the heat sink 1, the heat pipe 12 is disposed in the notch 13 provided in the heat radiating fin 11, so that a screw hole (not shown in FIG. 1) for fixing the heating element is provided in the base plate 10. The degree of freedom of the installation position of the heat pipe 12 on the base plate 10 can be obtained without increasing the thickness of the base plate 10.

  Next, as an example of how to use the heat sink of the present invention, a mode in which a heating element is connected to the heat sink 1 according to the first embodiment will be described with reference to the drawings.

  As a first example of use of connecting a heat generating element to the heat sink 1, as shown in FIG. 2, the heat generating element is provided on the back surface side of the base plate 10 of the heat sink 1, that is, on the opposite side of the side where the radiation fins 11 are disposed. (For example, a power device such as an IGBT) 101 is thermally connected. In FIG. 2, a plurality of large and small heating elements 101 are thermally connected to each other so that any side portion of each heating element 101 is parallel to the longitudinal direction of the heat pipe 12. Each heating element 101 is installed. Further, each heating element 101 is screwed to the base plate 10 by a plurality of screw holes 102 for fixing the heating elements provided on the back surface side of the base plate 10. Therefore, the thickness of the base plate 10 is not particularly limited, but when the heating element 101 is a power device such as an IGBT, the base plate 10 has a thickness that can form a screw hole having a depth sufficient to fix the power device. For example, it is preferable to have a thickness of 15 mm or more.

  As shown in FIG. 2, the heat sink 1 can freely position the heat pipe 12 in the thickness direction of the base plate 10 so as to overlap the position of the screw hole 102, that is, without being restricted by the position of the screw hole 102. Can be set. That is, even if the screw hole 102 for fixing the heating element is provided in the base plate 10, the degree of freedom of the installation position of the heat pipe 12 in the base plate 10 can be obtained without increasing the thickness of the base plate 10.

  In the heat sink 1, the heat pipe 12 can be freely arranged in the base plate 10 regardless of the position of the screw hole 102 for fixing the heating element. Therefore, the installation direction of the heating element 101 is not particularly limited, and the heating element is connected. As a second example of usage, as shown in FIG. 3, at least some of the heating elements 101 are arranged so that the side portions of the heating elements 101 are oblique with respect to the longitudinal direction of the heat pipe 12. May be. By arranging the heating element 101 in an oblique direction, the heating element 101 and the heat pipe 12 can effectively overlap each other in the thickness direction of the base plate 10, and the heat sink 1 heats the surface of the base plate 10. It can be spread more smoothly. Thereby, since heat transfer from the base plate 10 to the fins is performed effectively, the heat dissipation efficiency is improved.

  Further, the number of the heating elements 101 installed and the installation position of the heating elements 101 on the base plate 10 are not particularly limited, and can be selected as appropriate according to the use state of the heat sink 1. Since there are various types of power devices such as IGBTs, it has been necessary to design the power devices so as not to interfere with the heat pipe 12 in the past. Therefore, it is not necessary to change the design of the heat sink 1 every time the heating element 101 is changed. For example, one type of heat sink 1 can be used for various types of IGBTs, etc. It becomes possible to correspond to the power device.

  Next, another embodiment of the heat sink of the present invention will be described. In the heat sink according to the first embodiment, the shape of the heat pipe in the longitudinal direction (that is, the shape in plan view) is linear, but the shape is not particularly limited. For example, the shape is L-shaped or U-shaped. The shape which has a curved part, such as a shape, may be sufficient.

  Further, in the heat sink according to the first embodiment, the heat pipe is linear, and among the radiating fins, the lower end portion thereof, that is, the end portion on the base plate side, is thermally connected to the heat pipe. Instead of this, the heat pipe has a shape having two straight portions such as a U-shape and one curved portion, and not only the lower end portion of the radiating fin but also the upper end portion (top portion) of the radiating fin, that is, the base plate Even the end opposite to the end on the side may be thermally connected to the heat pipe. By the said aspect, the thermal radiation efficiency in the upper end part (top part) of a thermal radiation fin improves, As a result, the thermal radiation efficiency of the whole thermal radiation fin improves.

  In the heat sink according to the first embodiment, the heat pipes are arranged in parallel from one end of the base plate to the other end so that their longitudinal directions are parallel or substantially parallel to each other. The arrangement of the heat pipe is not particularly limited, and can be appropriately selected according to the use situation. For example, the arrangement of the heat pipes is such that the longitudinal directions thereof have a predetermined angle (for example, more than 0 ° to 90 °). May be.

  The heat sink of the present invention can obtain an excellent degree of freedom in the installation position of the heat pipe in the base plate while preventing an increase in the thickness of the base plate even if a screw hole for fixing the heating element is formed in the base plate. Therefore, the utility value is particularly high, for example, for cooling power devices such as IGBTs which are large and heavy electronic components.

1 heat sink 10 base plate 11 radiating fin 12 heat pipe 13 notch

Claims (9)

A flat base plate, a heat radiation fin having a notch portion that is thermally connected to the base plate, and a heat pipe thermally connected to the base plate and the heat radiation fin,
A heat sink in which the heat pipe is disposed in a cutout portion of the radiating fin.   The heat sink according to claim 1, wherein the heat pipe is flattened.   The heat sink according to claim 1 or 2, wherein the heat pipe is disposed on a surface of the base plate, and the heat radiating fin has a portion in contact with the surface of the base plate at a portion other than the notch.   The heat radiating fin is provided upright in a direction perpendicular to the surface of the base plate, and the longitudinal direction of the heat pipe has a portion parallel to the surface of the base plate. Heat sink described in.   The heat sink according to any one of claims 1 to 4, wherein the shape of the notch is semi-elliptical or rectangular.   The heat sink according to any one of claims 1 to 5, wherein the heat pipe has a curved portion and is thermally connected to the base plate and a top portion of the radiating fin.   The heat sink according to any one of claims 1 to 6, which is used for cooling a power device.   The heat sink according to claim 7, wherein the base plate has a thickness capable of forming a screw hole for fixing the power device.   The heat sink according to claim 8, wherein the heat pipe has a portion overlapping the screw hole in a thickness direction of the base plate.

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