JP3168201U - Heat dissipation module - Google Patents

Abstract

An electronic device cooling heat dissipating module that effectively reduces heat resistance, enhances overall heat conduction efficiency, and realizes an extremely excellent heat dissipating effect. A radiating fin group and a base are provided. The base 21 includes a bottom 213 and a plurality of slits 211 that penetrate the base 21. The radiating fin group 22 includes a plurality of radiating fins 221, and each radiating fin 221 includes a radiating end 223 and a heat absorbing end 224. The endothermic end 224 protrudes through the slit 211 and is bent and attached to the bottom portion 213. The heat absorbed by the heat absorbing end 224 is directly transmitted to the heat radiating end 223 of the heat radiating fin to be radiated, thereby effectively reducing the thermal resistance and improving the heat conduction efficiency and the heat radiating effect. [Selection] Figure 5

Description

The present invention relates to a heat dissipation module for cooling electronic devices, and more particularly to a heat dissipation module that can reduce thermal resistance and effectively increase heat conduction efficiency.

Generally, a heat radiator is attached to the surface of a heating element (for example, a CPU, a south / north bridge chip), so that heat generated from the heating element is effectively radiated. The heat generating element can operate at an appropriate temperature by performing heat dissipation.

Generally, conventional radiators are classified into two types: an integrated radiator and a fitting radiator in which a radiating fin is attached to a base. The integrated radiator has a base. One side surface of the base is in direct contact with the heat generation source, and heat radiation fins that radiate the heat absorbed by the base to the outside are extended from the other side surface of the base.
Please refer to FIG. 1 and FIG. As shown in FIGS. 1 and 2, the fitting type radiator 1 includes a base 10 and a plurality of radiating fins 12. The base 10 has a plurality of concave grooves 101. The plurality of concave grooves 101 are recessed on one side surface of the base 10. The concave groove 101 is used for fitting a plurality of heat radiation fins 12. The other side surface of the base 10 is attached to a corresponding heat generating element 14 (for example, CPU, south / north bridge chip, etc.) and absorbs heat generated from the heat generating element 14.

Each radiating fin 12 has a heat absorbing end 121 and a heat radiating end 122 located on the opposite side of the heat absorbing end 121. The heat-absorbing end 121 is accommodated and fixed in the concave groove 101 of the base 10, whereby the heat dissipation module 1 is configured. When heat is generated from the heating element 14, first, the heat generated from the heating element 14 is absorbed by the base 10 and then transmitted to the corresponding heat absorbing ends 121 in the plurality of grooves 101. Next, the heat is transmitted from the plurality of heat absorbing ends 121 to the heat radiating ends 122 and finally radiated from the plurality of heat radiating ends 122 to the outside.

The heat generating element 14 can be radiated by the above-described two types of conventional radiators. However, the conventional heat radiator has a defect that the heat radiation effect is not excellent. As a cause thereof, when a conventional radiator radiates heat from the heat generating element 14, heat generated from the heat generating element 14 is transmitted to the plurality of heat radiating fins 12 through the base 10, and thus in this heat transfer process, It is mentioned that thermal resistance increases. Thereby, the conventional heat radiator is not excellent in heat conduction efficiency, and the heat radiation effect is limited.

That is, the conventional heat dissipation module has the following disadvantages (1) to (3).
(1) The heat conduction efficiency is not excellent.
(2) Since heat is transmitted through the base, the thermal resistance is increased.
(3) The heat dissipation effect is not excellent.

The inventors of the present invention and those skilled in the art have conducted research and development in order to solve the above-described conventional problems and disadvantages.

JP 2001-57405 A

A main object of the present invention is to provide a heat dissipation module that can reduce thermal resistance and effectively increase heat conduction efficiency.
The next object of the present invention is to provide a heat dissipation module capable of realizing an extremely excellent heat dissipation effect.

In order to solve the above-described problems, the heat dissipation module of the present invention includes a base and a heat dissipation fin group. The base has a plurality of slits penetrating the base and a bottom portion. The radiating fin group has a plurality of radiating fins. Each radiating fin has a radiating end and a heat absorbing end located on the opposite side of the radiating end. The endothermic end penetrates the slit and is curved and stuck to the bottom. That is, the heat radiation module is configured by integrally joining the base and the heat radiation fin group.

The heat absorbed by the heat absorbing ends of the plurality of heat radiating fins is directly transmitted to the heat radiating ends and radiated. As a result, the heat dissipation module has a reduced thermal resistance and an increased heat conduction efficiency, and can achieve an extremely excellent heat dissipation effect.

It is a perspective view which shows the conventional heat dissipation module. It is sectional drawing which shows the state which has arrange | positioned the conventional thermal radiation module on a heat generating element. 1 is a perspective view showing a heat dissipation module according to a first embodiment of the present invention. It is a perspective view which shows another aspect of the thermal radiation module by 1st Embodiment of this invention. It is sectional drawing which shows the state which has arrange | positioned the thermal radiation module of FIG. 3 on a heat generating element. 1 is an exploded perspective view showing a heat dissipation module according to a first embodiment of the present invention. It is a perspective view which shows the thermal radiation module by 2nd Embodiment of this invention. It is a perspective sectional view showing a heat dissipation module by a 2nd embodiment of the present invention. It is a disassembled perspective view which shows the thermal radiation module by 2nd Embodiment of this invention.

DESCRIPTION OF EMBODIMENTS Embodiments showing the objects, features, and effects of the present invention will be described in detail with reference to the drawings.

(First embodiment)
Please refer to FIG. 3 and FIG. FIG. 3 is a perspective view illustrating the heat dissipation module according to the first embodiment of the present invention. FIG. 5 is a cross-sectional view showing a state in which the heat dissipation module of FIG. 3 is arranged on the heating element. As shown in FIGS. 3 and 5, the heat dissipation module 2 according to the first embodiment of the present invention includes a base 21 and a heat dissipation fin group 22. The base 21 has a plurality of slits 211 and a bottom portion 213. The plurality of slits 211 penetrate the base 21. The plurality of slits 211 are arranged on the base 21 at equal intervals (see FIG. 3) or at unequal intervals (see FIG. 4).

The radiating fin group 22 has a plurality of radiating fins 221. Each heat radiation fin 221 has a heat radiation end 223 and a heat absorption end 224. A heat radiation portion 226 is formed by the heat radiation ends 223 of the plurality of heat radiation fins 221. The heat dissipating unit 226 is used to dissipate heat by performing heat exchange between the absorbed heat and external air. The endothermic end 224 penetrates the slit 211 and is curved and stuck to the bottom 213. That is, when the heat radiating module 2 according to the first embodiment of the present invention is manufactured, first, the heat absorbing ends 224 of the plurality of heat radiating fins 221 pass through the slits 211 and protrude to the outside of the corresponding slits 211. Next, the endothermic end 224 protruding to the outside of the slit 211 is curved by mechanical processing (roller processing, press processing, etc.), and is attached to the bottom portion 213 of the base 21. Thereby, the plurality of heat radiation fins 221 are stably and integrally joined to the base 21. The heat dissipation module 2 is configured by the above structure.

Please refer to FIG. 3, FIG. 5 and FIG. As can be seen from FIG. 5, the heat absorption end 224 protruding to the outside of the slit 211 is perpendicular to the heat radiation fin 221. Further, the heat absorbing portion 227 is formed by the heat absorbing ends 224 of the plurality of heat radiation fins 221. The heat absorption part 227 is affixed on the heat generating element 3 (for example, CPU, south / north bridge chip, GPU, other heat generation sources, etc.). The heat generated from the heat generating element 3 is directly absorbed by the heat absorbing portion 227 of the heat radiating fin 221 and then directly transmitted to the upper heat radiating portion 226 to be radiated to the outside.

In the heat dissipation module 2 of the present invention, the heat absorbed by the heat absorbing portion 227 of the heat radiating fin 221 is directly transmitted to the upper heat radiating portion 226, thereby effectively reducing the thermal resistance and increasing the overall heat conduction efficiency, An extremely excellent heat dissipation effect can be realized.

(Second Embodiment)
Please refer to FIG. FIG. 7 is a perspective view showing a heat dissipation module according to the second embodiment of the present invention. FIG. 8 is a perspective cross-sectional view illustrating a heat dissipation module according to a second embodiment of the present invention. FIG. 9 is an exploded perspective view showing a heat dissipation module according to the second embodiment of the present invention. Since the structure, connection relationship, and symbols of the heat dissipation module according to the second embodiment of the present invention are substantially the same as those of the first embodiment, the same parts will not be described in detail here. The heat dissipation module 2 according to the second embodiment of the present invention is different from the first embodiment in that the base 21 includes a plurality of joining grooves 24 and at least one concave groove 25 and includes at least one heat pipe 26. The plurality of joining grooves 24 are recessed between the corresponding slits 211 and the outside of the base 21. The corresponding heat absorbing ends 224 are inserted and fixed in the plurality of joining grooves 24, thereby fixing the plurality of radiating fins 221. The concave groove 25 is recessed in the bottom 213 and communicates with the slit 211. The endothermic end 224 is curved and pasted in the corresponding concave groove 25.

  In the second embodiment of the present invention, four concave grooves 25 are provided, and four heat pipes 26 are combined. However, it is not limited only to this aspect, The number of the concave grooves 25 and the heat pipes 26 can be determined based on the heat radiation space and the desired heat radiation effect.

  Please refer to FIG. 8 and FIG. The heat pipe 26 described above includes an evaporation unit 261 and a condensing unit 262. The condensing unit 262 is provided through the heat radiating unit 226. That is, when the heat pipe 26 is provided, one end of the condensing unit 262 passes through the heat radiating ends 223 of the plurality of heat radiating fins 221 in order. Further, the evaporation portions 261 are provided in the corresponding concave grooves 25. The evaporation unit 261 has a first side surface and a second side surface. The first side surface is affixed to the plurality of endothermic ends 224 (that is, the endothermic portion 227), and the second side surface is affixed to the corresponding heating element 3.

  When heat is generated from the heating element 3, first, the heat absorbed by the evaporation unit 261 of the heat pipe 26 is transmitted onto the condensing unit 262. Next, the heat transmitted to the condensing unit 262 is transmitted to the heat dissipating unit 226 penetrating through the upper portion and radiated to the outside. At the same time, the heat absorption part 227 also absorbs part of the heat on the evaporation part 261. That is, a part of the heat absorbed by the heat absorbing unit 227 is directly transmitted to the heat radiating unit 226. Thereafter, heat exchange between the heat absorbed by the heat dissipating unit 226 and the external air is performed, and heat is dissipated. Thereby, double heat absorption is performed, and thermal resistance can be reduced. Further, the overall heat conduction efficiency is increased, and an extremely excellent heat dissipation effect can be realized.

As can be seen from the above, the heat dissipation module of the present invention has the following advantages (1) to (3) as compared with the prior art.
(1) The heat conduction efficiency can be increased.
(2) Thermal resistance can be reduced.
(3) It has an extremely excellent heat dissipation effect.

  The above description shows a preferred embodiment of the present invention, and all the modifications using the method, shape, structure and apparatus of the present invention described above are also included in the scope of the present invention.

2 heat radiation module 21 base 211 slit 213 bottom 22 heat radiation fin group 221 heat radiation fin 223 heat radiation end 224 heat absorption end 226 heat radiation part 227 heat absorption part 24 joint groove 25 concave groove 26 heat pipe 261 evaporation part 262 condensing part 3 heating element

Claims (9)

An electronic device cooling heat dissipation module including a base and a heat dissipation fin group,
The base has a plurality of slits penetrating the base at its bottom,
The radiating fin group includes a plurality of radiating fins,
Each of the heat dissipating fins has a heat dissipating end and a heat absorbing end, and the heat absorbing end passes through the slit, is curved, and is attached to the bottom of the base.   The heat radiating module according to claim 1, wherein the heat absorbing end is perpendicular to the heat radiating fin.   The heat radiating module according to claim 1, wherein a heat absorbing portion is formed by the heat absorbing ends of the plurality of radiating fins.   The heat radiation module according to claim 1, wherein a heat radiation portion is formed by a heat radiation end of the plurality of heat radiation fins.   2. The heat dissipation module according to claim 1, wherein the heat absorbing portion is attached to a corresponding heat generating element and used to absorb heat of the heat generating element.   The heat dissipating module according to claim 1, wherein the plurality of slits penetrate the base and are arranged at equal intervals.   The heat dissipation module according to claim 1, wherein the plurality of slits penetrate the base and are arranged at unequal intervals. The base further includes a plurality of joining grooves and at least one recessed groove that is recessed at the bottom of the base and communicates with the slit;
In the concave groove, the heat absorption end of the radiating fin is curved and pasted through the slit,
The heat dissipation module according to claim 1, wherein the plurality of joining grooves are recessed between the corresponding slit and the outside of the base. And further comprising at least one heat pipe having an evaporating part and a condensing part,
The evaporating part is provided in the corresponding concave groove, and has a first side surface attached to the heat absorbing end of the radiating fin and a second side surface attached to the corresponding heat generating element. Have
The heat radiating module according to claim 8, wherein the condensing part is penetrated at a heat radiating end of the plurality of heat radiating fins.

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