M427769 五、新型說明： 【新型所屬之技術領域】 [0001] 創作係有關於一種散熱裝置，尤指一種具有提升熱傳效 率及改善傳統熱管因無效端之產生造成傳熱效能不彰顯 之散熱裝置。 【先前技術】 [0002] 目前，用於為電子元件（例如CPU或其他執行單元）散熱的 散熱器，多採用基座作為與電子元件接觸的導熱部件。 當基座與電子元件接觸時，由於電子元件僅與基座的底 面中央相接觸處，所以令該基座熱傳導能力有限，無法 有效將電子元件所產生的熱量由基座中央迅速地傳導到 整個基座上，以導致基座整體傳熱效率低，故業者為了 改善前述問題便對基座改良設計成為一種散熱器結構。 請參閱第1A、1B、1C圖示，習知之散熱器結構1係包 含一基座10及複數熱管12，該基座10具有一容置槽101 及一開孔102，該容置槽101係凹設在該基座10的一側上 ，用以容設該等熱管12，該開孔102則是開設在基座10的 另一側上，且連通該容置槽101，其用以容設一發熱元件 14(如中央處理器、繪圖晶片或南北橋晶片或其他可執行 運算晶體），令該發熱元件14與相對的熱管12相貼設。 其中所述第一熱管121係容設在該基座10之中央處， 且中段1211係相對該開孔102，其末兩端121 3係分別朝 該基座10相對兩側邊緣延伸，該第二、三熱管122、123 的中段1221、1231則分別設在相鄰該第一熱管121的兩 旁，且相對該開孔102，而該第二、三熱管122、123的 表單編號A0101 第3頁/共32頁 M427769 末兩端1 223、1 233係分別朝該基座10另相對兩側邊緣延 伸。 所以當發熱元件14產生熱量時，透過該第一、二、三 熱管121、122、123的中段1211、1221、1231吸附前述 熱量，並傳導至各自該第一、二、三熱管121、122、 123的末兩端1213、1 223、1233，使熱量能均勻傳導到 基座10邊緣，藉以提升熱傳效率。 雖習知的散熱器結構1可藉由該等熱管12的末兩端 1213、1223、1 233提升熱傳效率，但其效果明顯不彰， 因為該第一、二、三熱管121、122、123的末兩端1213 、1223、1233係為熱傳效率最差之部位，且該等熱管12 内部之工作流體容易滯留於兩末端1213、1223 ' 1233形 成散熱無效端，所以實際上並無法將熱量傳導至基座10 邊緣，故導致熱傳效率降低，進而散熱效能實亦不佳。 以上所述，習知技術具有下列之缺點： 1. 無法改善傳統熱管無效端之問題； 2. 熱傳效率不佳。 是以，要如何解決上述習用之問題與缺失，即為本案 之創作人與從事此行業之相關廠商所亟欲研究改善之方 向所在者》 【新型内容】 [0003] 爰此，為有效解決上述之問題，本創作之主要目的在提 供一種大幅提升熱傳效率（或導熱效率），進而得改善熱 管之無效端無傳熱效能的散熱裝置。 為達上述目的，本創作係提供一種散熱裝置，係包括 一基座及一熱管，其中前述基座具有一容置槽，該容置 表單编號A0101 第4頁/共32頁 M427769 槽係凹設在該基座的一側上，該熱管係容設在相對的容 置槽内，且其具有一第一吸熱段、一第二吸熱段、一第 三吸熱段、一第一傳熱段及一第二傳熱段，該第三吸熱 段係設在第一、二吸熱段之間，並前述第一傳熱段係從 該第一吸熱段一端向外彎繞延接至該第三吸熱段相鄰該 第一吸熱段之另一端的一端，該第二傳熱段則從該第三 吸熱段的另一端向外彎繞延接至該第二吸熱段相鄰該第 三吸熱段之一端的一端；所以透過本創作之散熱裝置的 設計，得以有效大幅提升傳熱效率，進而更得達到解決 φ 熱管的無效端無傳熱效能的效果。 【實施方式】 [0004] 本創作之上述目的及其結構與功能上的特性，將依據所 附圖式之較佳實施例予以說明。 本創作係一種散熱裝置，請參閱第2、3圖示，係顯示本 創作之第一較佳實施例之組合及分解立體示意圖；該散 熱裝置2係包括一基座21及一熱管23，該基座21具有一容 置槽210，該容置槽210係凹設在該基座21的一側上，且 其形狀係匹配該熱管23形狀所設計的。其中該熱管23容 設在容置槽210内的方式可以選擇為緊配、焊接、嵌合及 膠合其中任一。 另者前述熱管23係容設在該容置槽210内，且其具有一第 一吸熱段2311、一第二吸熱段2312、一第三吸熱段2313 、一第一傳熱段2321及一第二傳熱段2322，其中該第三 吸熱段2313係設在該第一、二吸熱段2311、2312之間， 該第一、二傳熱段2321、2322係分別迴繞設於相對的第 一、二吸熱段2311、2312的外側，亦即前述第一傳熱段 表單編號A0101 第5頁/共32頁 M427769 2321係從該第一吸熱段2311 —端向外彎繞延接至該第三 吸熱段2313相鄰該第一吸熱段2311之另一端的一端，接 著該第二傳熱段2322則從該第三吸熱段2313的另一端向 外彎繞延接至該第二吸熱段231 2相鄰該第三吸熱段231 3 之一端的一端，以形成如第2圖示大致呈8字狀或S狀的熱 管23 ;換言之，亦即該第一、二、三吸熱段2311、2312 、2313及第一、二傳熱段2321、2322係一體成型所述熱 管23。 續參閱第3圖示，前述第一、二、三吸熱段2311、 2312、2313共同界前述吸熱部231，該第一、二傳熱段 2321、2322共同界定的一傳熱部232，並該吸熱部231相 反該容置槽210的一側係直接貼設在一發熱元件3(如中央 處理器、繪圖晶片、南北橋晶片或執行處理晶片）上，'用 以直接吸附發熱元件3產生的熱量，以傳導至該傳熱部 232上，使前述熱量能均勻地且迅速擴散在整個該基座21 上，藉以達到均勻傳熱效果以提升整體熱傳效率，進而 得有效改善熱管23的無效端無傳熱效能。 故透過本創作之基座21與熱管23結合一體的設計，得 有效大幅提升散熱裝置2的效能，進而更可達到解決熱管 23的無效端無傳熱效能。 請參閱第4、5圖示，係顯示本創作之第二較佳實施例 之組合及分解立體示意圖；該較佳實施例之結構及連結 關係及其功效大致與前述第一較佳實施例相同，故在此 不重新贅述，其兩者的差異在於：前述基座21的另一側 上係對接一散熱單元5，於該較佳實施之該散熱單元5係 以散熱鰭片組做說明，但並不侷限於此；於具體實施時 表單编號A0101 第6頁/共32頁 ，亦可為一由複數散熱鰭片構成之散熱器；另外該基座 21可單獨及/或相組結散熱單元5之形式再加設一風扇（圖 中未示），以加強散熱者。 另者，所述基座21之另一側與散熱單元5的對接方式 係選擇為緊配、焊接、嵌合及黏合其中任一。 再者，所以透過前述散熱鰭片組將該熱管23傳導到基 座21上的熱量，以輻射方式迅速將吸附的熱量散發到外 面，藉以達到絕佳的散熱效果。 請參閱第6、7圖示，係顯示本創作之第三較佳實施例 之組合及分解立體示意圖；該較佳實施例之結構及連結 關係及其功效大致與前述第一較佳實施例相同，故在此 不重新贅述，其兩者的差異在於：前述基座21更設有一 開孔211，該開孔211係開設在該基座21的另一側上，亦 即該開孔211形成在該基座21之另一側的中央處且連通該 容置槽210。 另者於該本較佳實施主要是將前述第一較佳實施例之 吸熱部231相反該容置槽210的一侧直接貼設發熱元件3上 ，改設計成為對接一散熱單元5，以及該吸熱部231相對 容置槽210的一側來吸收熱源，亦即如第7圖所示，前述 開孔211容設一傳導件4，該傳導件4係以金屬材質所構成 ，且其具有絕佳的吸熱及傳導的功效。 再者前述傳導件4之一側係貼設在相對該吸熱部231— 側（即上述吸熱部231相對容置槽210之一側）上，其另一 側平切該基座21的另一侧，且與相對的發熱元件3相貼設 ，用以將吸附到發熱元件3的熱量傳導給熱管23之吸熱部 231，使該吸熱部231將接收的熱源再傳遞給傳熱部232 A0101 第7頁/共32頁 ’ u使熱量能均勻地迅速擴散在整個該基座21上，然 唆藉由該散熱單元5同時將吸附該基座21及熱管23其上的 迅速對外散熱，藉以大幅提升散熱裝置的效能者。 此外，前述基座21的一側係以焊接或黏合或嵌接的方 式與相對的散熱單元5一側相結合，同時·該熱管23之吸熱 部231及傳熱部232亦會緊貼設在對應所述散熱單元5的一 側上。其中前述散熱單元5係為一由複數散熱鰭片構成之 散熱器或—散熱鰭片組，此外該基座21可單獨及/或相組 結散熱單元5之形式再加設一風扇（圖中未示），以加強散 熱者。 清參閱第8、9圖示，係顯示本創作之第四較佳實施例 之組合及分解立體示意圖；該較佳實施例之結構及連結 關係及其功效大致與前述第一較佳實施例相同，該本較 佳實施主要是將前述第一較佳實施例之吸熱部231相反該 各置槽210的一側直接貼設發熱元件3上，改設計成為對 接一散熱單元5，以及容置槽210貫通所述基座21 ; 亦即前述容置槽210係從該基座21之一側貫通至該基 座21的另一側，令該熱管23容設並緊配在該容置槽21〇内 ，且該熱管23的一側及其另一側係分別平切該基座之 一側及其另一側，並所述吸熱部231相對容置槽21〇的一 側則與相對發熱元件3相貼設；所以透過該熱管23之吸熱 部231直接將接收到發熱元件3的熱量，傳導到所述傳熱 部232上’以使熱量能均勻地迅速擴散在整個該基座21上 ，然後藉由該散熱單元5同時將吸附該基座21及熱管23其 上的熱量迅速對外散熱，藉以大幅提升散熱裝置的效能 者。 表單编號A0101 第8買/共32頁 M427769 請參閱第10、11圖示，係顯示本創作之第五較佳實施 例之組合及分解立體示意圖；該較佳實施例之結構及連 結關係及其功效大致與前述第三較佳實施例相同，該較 佳實施例主要是將前述第三較佳實施之散熱單元5，改設 計成為一蓋體27，亦即前述基座21的一侧係對接一蓋體 27，該蓋體27設有一第一側271及一相反該第一側271之 第二側272，該第一側271係與相對該基座21—側相貼設 ，以封閉該熱管23。 於具體實施時，使用者可以依據裝設空間及散熱或傳 • 熱效果需求，設計將該第二側272上選擇貼設散熱單元（ 如散熱器；圖中未示）或熱導管（圖中未示），藉以將該蓋 體27上接收的熱量對外散熱或傳導至遠端，以有效達到 絕佳的散熱效果。 請參閱第12、13圖示，係顯示本創作之第六較佳實施 例之組合及分解立體示意圖；該較佳實施例之結構及連 結關係及其功效大致與前述第五較佳實施例相同，故在 此不重新贅述，其兩者的差異在於：前述蓋體27上設有 • 複數散熱鰭片274，該等散熱鰭片274係從該第二側272 上軸向延伸構成，其用以將該蓋體27接收熱管23上的熱 量迅速對外散熱，此外亦可在散熱鰭片274上再組設一風 扇（圖中未示），以利加速散熱提升散熱效能。 另者前述熱管23傳遞吸收熱量的方向除了對該基座21 之水平方向傳導外，同時亦具有垂直方向導熱效果，可 直接將熱量傳導至相對的蓋體27上，並透過該蓋體27其 上散熱鰭片274將熱量迅速對外散熱，藉以大幅提升散熱 效能。 表單編號A0101 第9頁/共32頁 M427769 清參閱第14A、14B、15圖示，係顯示本創作之第七 較佳實施例之組合及分解立體示意圖；該較佳實施例之 結構及連結關係及其功效大致與前述第一較佳實施例相 同，主要是將前述第一較佳實施例之熱管23改設計成為 一側為平面及另一側為非平面，以及該容置槽21〇具有的 一封閉側210 2之形狀係匹配該非平面之形狀，亦即如第 15圖所示，前述容置槽210設有一開放側21〇1及一相對 該開放側2101之封閉側210 2，該開放側21 〇 1係與該封閉 側2102共同界定所述容置槽210 ;而所述熱管23之吸熱 部231具有一第一側面2315及一相反該第一側面2315之 第二側面2316。 另者前述傳熱部232具有一第三側面2324及一相反該 第三側面2324之第四側面2325，其中該第一、三側面 2315、 2324即前述熱管23的一側為平面，並所述第一側 面2315係直接貼設在所述發熱元件3上，該第二、四側面 2316、 2325(即前述熱管23的另一側為非平面）於該較佳 實施係以呈D字狀做說明，以與相對封閉側21〇2共同相貼 設，但並不侷限於此。 再者於具體實施時之熱管23的非平面（即所述第二.、 四側面2316、2325)係可以事先根據使用者需求，設計 調整變化前述非平面的形狀態樣（如呈D字狀、半弧狀、 矩狀），進而調整該容置槽210之封幼側2102的形狀，換 言之，就是說該封閉側2102之形狀係匹配該第二、四側 面2316、2325之形狀，合先陳明。 以上所述，本創作相較於習知具有下列之優點： 1.具有大幅提升傳熱效率； 表單编號A0101 第10頁/共32頁 M427.769 2. 具有達到改善傳統熱管因無效端無傳熱效能的效果； 3. 具有大幅提升散熱效能。 惟以上所述者，僅係本創作之較佳可行之實施例而已， 舉凡利用本創作上述之方法、形狀、構造、裝置所為之 變化，皆應包含於本案之權利範圍内。 【圖式簡單說明】 [0005]第1A圖係習知之分解立體示意圖； 第1B圖係習知之另一分解立體示意圖； 第1C圖係習知之組合立體示意圖； 第2圖係本創作之第一較佳實施例之組合立體示意圖； 第3圖係本創作之第一較佳實施例之分解立體示意圖； 第4圖係本創作之第二較佳實施例之組合立體示意圖.； 第5圖係本創作之第二較佳實施例之分解立體示意圖； 第6圖係本創作之第三較佳實施例之組合立體示意圖； 第7圖係本創作之第三較佳實施例之分解立體示意圖； 第8圖係本創作之第四較佳實施例之組合立體示意圖； 第9圖係本創作之.第四較佳實施例之分解立體示意圖； 第10圖係本創作之第五較佳實施例之組合立體示意圖； 第11圖係本創作之第五較佳實施例之分解立體示意圖； 第12圖係本創作之第六較佳實施例之組合立體示意圖； 第13圖係本創作之第六較佳實施例之分解立體示意圖； 第14A圖係本創作之第七較佳實施例之組合立體示意圖； 第14B圖係本創作之第七較佳實施例之局部剖面立體示意 圖； 第15圖係本創作之第七較佳實施例之分解立體示意圖。 表單編號A0101 第11頁/共32頁 M427769 【主要元件符號說明】 [0006] 散熱裝置 … 2 傳熱部 … 232 基座 … 21 第一傳熱段 … 2321 容置槽 … 210 第二傳熱段 … 2322 開放側 … 2101 第三側面 … 2324 封閉側 … 2102 第四側面 … 2325 開孔 … 211 蓋體 … 27 熱管 … 23 第一側 … 271 吸熱部 … 231 第二側 … 272 第一吸熱段… 2311 散熱鰭片 … 274 第二吸熱段… 2312 發熱元件 … 3 第三吸熱段… 2313 傳導件 … 4 第一側面 … 2315 散熱單元 … 5 第二側面 … 2316 表單編號A0101 第12頁/共32頁M427769 V. New Description: [New Technology Field] [0001] The authoring department is concerned with a heat sink, especially a heat sink with improved heat transfer efficiency and improved heat transfer performance caused by the invalid end of the traditional heat pipe. . [Prior Art] [0002] At present, a heat sink for dissipating heat for an electronic component such as a CPU or other execution unit is often used as a heat conductive member in contact with an electronic component. When the susceptor is in contact with the electronic component, since the electronic component only contacts the center of the bottom surface of the pedestal, the thermal conductivity of the susceptor is limited, and the heat generated by the electronic component cannot be effectively transmitted from the center of the pedestal to the whole. In order to improve the above problems, the pedestal has improved the heat transfer efficiency of the susceptor as a heat sink structure. Referring to FIGS. 1A, 1B, and 1C, the conventional heat sink structure 1 includes a susceptor 10 and a plurality of heat pipes 12, and the susceptor 10 has a receiving groove 101 and an opening 102. The recessed hole 102 is disposed on one side of the base 10 for receiving the heat pipe 12, and the opening 102 is formed on the other side of the base 10 and communicates with the receiving groove 101 for receiving A heat generating component 14 (such as a central processing unit, a graphics chip or a north-south bridge chip or other executable computing crystal) is disposed such that the heat generating component 14 is attached to the opposite heat pipe 12. The first heat pipe 121 is received at the center of the base 10, and the middle section 1211 is opposite to the opening 102, and the two ends 1213 extend toward opposite sides of the base 10, respectively. The middle sections 1221 and 1231 of the second and third heat pipes 122 and 123 are respectively disposed adjacent to the first heat pipe 121 and opposite to the opening 102, and the second and third heat pipes 122 and 123 are form number A0101. / Total 32 pages M427769 The two ends 1 223, 1 233 are respectively extended toward the opposite side edges of the base 10. Therefore, when the heat generating component 14 generates heat, the heat is absorbed by the middle sections 1211, 1221, and 1231 of the first, second, and third heat pipes 121, 122, and 123, and is transmitted to the first, second, and third heat pipes 121 and 122, respectively. The two ends 1213, 1 223, and 1233 of the 123 allow heat to be uniformly conducted to the edge of the susceptor 10, thereby improving heat transfer efficiency. Although the conventional heat sink structure 1 can improve the heat transfer efficiency by the end ends 1213, 1223, and 1 233 of the heat pipes 12, the effect is obviously not obvious because the first, second, and third heat pipes 121, 122, The end ends 1213, 1223, and 1233 of 123 are the parts with the worst heat transfer efficiency, and the working fluid inside the heat pipes 12 is easily retained at the two ends 1213, 1223 ' 1233 to form a heat-dissipating end, so it is practically impossible to The heat is conducted to the edge of the pedestal 10, so that the heat transfer efficiency is lowered, and the heat dissipation performance is also poor. As described above, the prior art has the following disadvantages: 1. The problem of the ineffective end of the conventional heat pipe cannot be improved; 2. The heat transfer efficiency is not good. Therefore, how to solve the above problems and problems in the past, that is, the creators of the case and the relevant manufacturers engaged in the industry are eager to study the direction of improvement. [New content] [0003] In order to effectively solve the above The main purpose of this creation is to provide a heat sink that greatly improves the heat transfer efficiency (or heat transfer efficiency) and thus improves the heat transfer efficiency of the ineffective end of the heat pipe. In order to achieve the above object, the present invention provides a heat dissipating device, comprising a base and a heat pipe, wherein the base has a receiving groove, the receiving form number A0101, page 4 / total 32 pages, M427769 groove recess The heat pipe is disposed on the one side of the base, and the heat pipe is disposed in the opposite receiving groove, and has a first heat absorption section, a second heat absorption section, a third heat absorption section, and a first heat transfer section. And a second heat transfer section, the third heat absorption section is disposed between the first and second heat absorption sections, and the first heat transfer section is bent outwardly from one end of the first heat absorption section to the third The endothermic section is adjacent to one end of the other end of the first endothermic section, and the second heat transfer section is outwardly bent from the other end of the third endothermic section to the end of the second endothermic section adjacent to one end of the third endothermic section. Therefore, through the design of the heat sink of the present invention, the heat transfer efficiency can be greatly improved, and the heat transfer efficiency of the invalid end of the φ heat pipe can be solved. [Embodiment] The above object of the present invention, as well as its structural and functional features, will be described in accordance with the preferred embodiments of the drawings. The present invention is a heat dissipating device. Please refer to FIGS. 2 and 3 for a combination and an exploded perspective view of the first preferred embodiment of the present invention. The heat dissipating device 2 includes a base 21 and a heat pipe 23, The susceptor 21 has a receiving groove 210 recessed on one side of the base 21 and shaped to match the shape of the heat pipe 23. The manner in which the heat pipe 23 is accommodated in the accommodating groove 210 can be selected to be tight, welded, fitted, and glued. The heat pipe 23 is received in the accommodating groove 210, and has a first heat absorbing section 2311, a second heat absorbing section 2312, a third heat absorbing section 2313, a first heat transfer section 2321, and a first heat transfer section 2321. a second heat transfer section 2322, wherein the third heat absorption section 2313 is disposed between the first and second heat absorption sections 2311, 2312, and the first and second heat transfer sections 2321, 2322 are respectively disposed on the opposite first, The outer side of the two heat absorption sections 2311, 2312, that is, the first heat transfer section form number A0101, page 5 / total 32 pages M427769 2321 is bent outward from the end of the first heat absorption section 2311 to the third heat absorption The section 2313 is adjacent to one end of the other end of the first heat absorption section 2311, and then the second heat transfer section 2322 is outwardly bent from the other end of the third heat absorption section 2313 to the second heat absorption section 231 2 phase. Adjacent to one end of the third endothermic section 2313 to form a heat pipe 23 having a substantially 8-shaped or S-shaped shape as shown in FIG. 2; in other words, the first, second, and third heat-absorbing sections 2311, 2312, and 2313 And the first and second heat transfer sections 2321, 2322 integrally form the heat pipe 23. Continuing to refer to the third embodiment, the first, second, and third heat absorption sections 2311, 2312, and 2313 together define the heat absorbing portion 231, and the first and second heat transfer sections 2321, 2322 define a heat transfer portion 232. The side of the heat absorbing portion 231 opposite to the accommodating groove 210 is directly attached to a heat generating component 3 (such as a central processing unit, a drawing chip, a north-south bridge wafer or a processing wafer) for directly adsorbing the heat generating component 3. The heat is transmitted to the heat transfer portion 232, so that the heat can be uniformly and rapidly diffused throughout the base 21, thereby achieving a uniform heat transfer effect to improve the overall heat transfer efficiency, thereby effectively improving the heat pipe 23. There is no heat transfer efficiency at the end. Therefore, through the integrated design of the base 21 and the heat pipe 23 of the present invention, the performance of the heat sink 2 can be effectively improved, and the heat transfer performance of the ineffective end of the heat pipe 23 can be further solved. 4 and 5 are schematic and exploded perspective views showing a second preferred embodiment of the present invention; the structure and connection relationship of the preferred embodiment and its function are substantially the same as those of the first preferred embodiment. Therefore, the difference between the two is not described here. The difference between the two is that the other side of the pedestal 21 is connected to a heat dissipating unit 5, and the heat dissipating unit 5 is preferably illustrated by a heat dissipating fin group. However, it is not limited to this; in the specific implementation form number A0101, page 6 / total 32 pages, may also be a heat sink composed of a plurality of heat sink fins; in addition, the base 21 may be separately and / or phased A fan (not shown) is further added to the heat dissipating unit 5 to enhance the heat sink. In addition, the other side of the pedestal 21 is connected to the heat dissipating unit 5 in such a manner as to be tightly fitted, welded, fitted and bonded. Moreover, the heat conducted by the heat pipe 23 to the base 21 through the heat radiating fin group rapidly radiates the absorbed heat to the outside by radiation, thereby achieving an excellent heat dissipation effect. The combination of the third preferred embodiment of the present invention and the exploded perspective view of the third preferred embodiment of the present invention; the structure and the connection relationship of the preferred embodiment and the effect thereof are substantially the same as those of the first preferred embodiment. Therefore, the difference between the two is not described here. The difference between the two is that the base 21 is further provided with an opening 211, and the opening 211 is formed on the other side of the base 21, that is, the opening 211 is formed. The accommodating groove 210 is communicated at a center of the other side of the susceptor 21. In the preferred embodiment, the heat absorbing portion 231 of the first preferred embodiment is directly attached to the heat generating component 3 opposite to the side of the accommodating groove 210, and is designed to be connected to a heat dissipating unit 5, and The heat absorbing portion 231 absorbs the heat source from the side of the accommodating groove 210, that is, as shown in FIG. 7, the opening 211 accommodates a conductive member 4, and the conductive member 4 is made of a metal material, and has a Good heat absorption and conduction. Further, one side of the conductive member 4 is attached to the side of the heat absorbing portion 231 (ie, the side of the heat absorbing portion 231 opposite to the accommodating groove 210), and the other side of the conductive member 4 is slanted to the other side of the pedestal 21. The side is attached to the opposite heat generating component 3 for conducting heat absorbed by the heat generating component 3 to the heat absorbing portion 231 of the heat pipe 23, so that the heat absorbing portion 231 transfers the received heat source to the heat transfer portion 232 A0101. 7 pages / a total of 32 pages 'u enables the heat to be uniformly and evenly spread over the entire base 21, and then the heat dissipating unit 5 simultaneously adsorbs the base 21 and the heat pipe 23 to rapidly dissipate heat thereon, thereby greatly Improve the performance of the heat sink. In addition, one side of the pedestal 21 is coupled to the opposite side of the heat dissipating unit 5 by soldering or bonding or intrusion, and the heat absorbing portion 231 and the heat transfer portion 232 of the heat pipe 23 are also closely attached to each other. Corresponding to one side of the heat dissipation unit 5. The heat dissipating unit 5 is a heat sink or a heat sink fin group formed by a plurality of heat radiating fins, and the base 21 can be separately provided with a fan in the form of a heat sink unit 5 (in the figure). Not shown) to enhance the heat sink. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 8 is a perspective view showing a combination and an exploded perspective view of a fourth preferred embodiment of the present invention; the structure and connection relationship of the preferred embodiment and its function are substantially the same as those of the first preferred embodiment. The preferred embodiment is that the heat absorbing portion 231 of the first preferred embodiment is directly attached to the heating element 3 opposite to the side of each of the slots 210, and is designed to be connected to a heat dissipating unit 5 and to accommodate the slot. The through hole 210 is inserted through the pedestal 21; that is, the accommodating groove 210 is penetrated from one side of the pedestal 21 to the other side of the pedestal 21, so that the heat pipe 23 is accommodated and tightly fitted in the accommodating groove 21 One side of the heat pipe 23 and the other side thereof are respectively cut into one side of the base and the other side thereof, and the side of the heat absorbing portion 231 opposite to the receiving groove 21 is relatively heated. The element 3 is attached; therefore, the heat absorbing portion 231 passing through the heat pipe 23 directly conducts heat received to the heat generating element 3 to the heat transfer portion 232' so that heat can be uniformly and rapidly diffused throughout the base 21. And then, by the heat dissipating unit 5, the heat on the susceptor 21 and the heat pipe 23 is simultaneously adsorbed Foreign rapid cooling, thereby greatly enhance the effectiveness of those heat sink. Form No. A0101, No. 8 Buying/Total 32 Pages M427769 Please refer to Figures 10 and 11 for a combination and exploded perspective view of a fifth preferred embodiment of the present invention; The heat dissipation unit 5 of the third preferred embodiment is modified into a cover body 27, that is, the side of the base 21 is substantially the same as the foregoing third preferred embodiment. The cover body 27 is provided with a first side 271 and a second side 272 opposite to the first side 271. The first side 271 is attached to the side opposite to the base 21 to close The heat pipe 23. In the specific implementation, the user can design a heat dissipating unit (such as a heat sink; not shown) or a heat pipe on the second side 272 according to the installation space and the heat dissipation or heat transfer effect requirement (in the figure) Not shown), the heat received on the cover 27 is radiated or conducted to the distal end to effectively achieve an excellent heat dissipation effect. Please refer to the drawings and the exploded perspective view of the sixth preferred embodiment of the present invention; the structure and the connection relationship of the preferred embodiment and the effect thereof are substantially the same as those of the fifth preferred embodiment. Therefore, the difference between the two is not described here. The difference between the two is that the cover body 27 is provided with a plurality of heat dissipation fins 274, and the heat dissipation fins 274 are axially extended from the second side 272. The heat generated on the heat pipe 23 is quickly dissipated by the cover body 27, and a fan (not shown) may be further disposed on the heat dissipation fins 274 to accelerate heat dissipation and improve heat dissipation performance. In addition to the heat transfer direction of the heat pipe 23, in addition to the horizontal direction of the base 21, it also has a vertical heat conduction effect, and can directly transfer heat to the opposite cover body 27, and through the cover body 27 thereof. The heat-dissipating fins 274 rapidly dissipate heat to the outside, thereby greatly improving heat dissipation performance. Form No. A0101, page 9 of 32, M427769. Referring to Figures 14A, 14B, and 15 for a combination and exploded perspective view of a seventh preferred embodiment of the present invention; the structure and connection relationship of the preferred embodiment The heat pipe 23 of the first preferred embodiment is modified to be flat on one side and non-planar on the other side, and the accommodating groove 21 〇 has the same function as the first preferred embodiment. The shape of a closed side 210 2 matches the non-planar shape, that is, as shown in FIG. 15, the receiving groove 210 is provided with an open side 21〇1 and a closed side 210 2 opposite to the open side 2101. The open side 21 〇 1 system and the closed side 2102 together define the accommodating groove 210; and the heat absorbing portion 231 of the heat pipe 23 has a first side surface 2315 and a second side surface 2316 opposite to the first side surface 2315. The heat transfer portion 232 has a third side surface 2324 and a fourth side surface 2325 opposite to the third side surface 2324, wherein the first and third side surfaces 2315, 2324, that is, one side of the heat pipe 23 is a flat surface, and The first side surface 2315 is directly attached to the heat generating component 3, and the second and fourth side surfaces 2316 and 2325 (i.e., the other side of the heat pipe 23 is non-planar) is formed in a D shape in the preferred embodiment. It is explained that it is attached to the relatively closed side 21〇2, but is not limited thereto. Furthermore, in the specific implementation, the non-planar (that is, the second, fourth side 2316, 2325) of the heat pipe 23 can be designed and adjusted according to the user's needs in advance to change the non-planar shape state (for example, in a D shape). The shape of the closed side 2102 of the accommodating groove 210, in other words, the shape of the closed side 2102 matches the shape of the second and fourth sides 2316, 2325. Chen Ming. As mentioned above, this creation has the following advantages over the conventional ones: 1. It has greatly improved heat transfer efficiency; Form No. A0101 Page 10 of 32 M427.769 2. Has improved the traditional heat pipe due to invalid end The effect of heat transfer efficiency; 3. Has greatly improved heat dissipation. However, the above descriptions are only preferred embodiments of the present invention, and variations of the methods, shapes, structures, and devices described above are intended to be included in the scope of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS [0005] FIG. 1A is a schematic exploded perspective view of the prior art; FIG. 1B is another exploded perspective view of the prior art; FIG. 1C is a schematic perspective view of a conventional combination; 3 is a schematic exploded perspective view of a first preferred embodiment of the present invention; FIG. 4 is a combined perspective view of a second preferred embodiment of the present invention; An exploded perspective view of a second preferred embodiment of the present invention; a sixth perspective view of a third preferred embodiment of the present invention; and a seventh perspective view of a third preferred embodiment of the present invention; 8 is a perspective view showing a combination of a fourth preferred embodiment of the present invention; FIG. 9 is an exploded perspective view of the fourth preferred embodiment; FIG. 10 is a fifth preferred embodiment of the present invention. FIG. 11 is an exploded perspective view of a fifth preferred embodiment of the present invention; FIG. 12 is a schematic perspective view of a sixth preferred embodiment of the present invention; Better implementation FIG. 14A is a perspective view showing a combination of a seventh preferred embodiment of the present invention; FIG. 14B is a partial cross-sectional perspective view showing a seventh preferred embodiment of the present invention; An exploded perspective view of a seventh preferred embodiment. Form No. A0101 Page 11 of 32 M427769 [Description of main component symbols] [0006] Heat sink... 2 Heat transfer section... 232 Base... 21 First heat transfer section... 2321 accommodating groove... 210 Second heat transfer section 2322 Open side... 2101 Third side... 2324 Closed side... 2102 Fourth side... 2325 Opening... 211 Cover... 27 Heat pipe... 23 First side... 271 Heat sink... 231 Second side... 272 First heat sink... 2311 Cooling fins... 274 Second heat sink... 2312 Heating element... 3 Third heat sink... 2313 Conductor... 4 First side... 2315 Heat sink... 5 Second side... 2316 Form number A0101 Page 12 of 32