TWI461648B - Heat-dissipating device - Google Patents

Description

Heat sink

The invention relates to a heat dissipating device, in particular to a heat dissipating device which has the advantages of improving the heat transfer efficiency and improving the heat transfer performance of the conventional heat pipe due to the invalid end.

Currently, heat sinks for dissipating heat from electronic components such as CPUs or other actuators often use a susceptor as a thermally conductive component in contact with electronic components. When the susceptor is in contact with the electronic component, since the electronic component only contacts the center of the bottom surface of the pedestal, the thermal conductivity of the susceptor is limited, and the heat generated by the electronic component cannot be effectively transmitted from the center of the pedestal to the whole. In order to improve the above problems, the pedestal has improved the heat transfer efficiency of the susceptor as a heat sink structure.

Referring to FIGS. 1A, 1B, and 1C, the conventional heat sink structure 1 includes a base 10 and a plurality of heat pipes 12. The base 10 has a receiving groove 101 and an opening 102. The recessed hole 102 is disposed on one side of the base 10 for receiving the heat pipe 12, and the opening 102 is formed on the other side of the base 10 and communicates with the receiving groove 101 for receiving A heat generating component 14 (such as a central processing unit, a graphics chip or a north-south bridge chip or other executable computing crystal) is disposed such that the heat generating component 14 is attached to the opposite heat pipe 12.

The first heat pipe 121 is received at the center of the base 10, and the middle portion 1211 is opposite to the opening 102, and the two ends 1213 are respectively extended toward opposite side edges of the base 10, the second , three heat pipes 122, 123 The middle sections 1221 and 1231 are respectively disposed adjacent to the first heat pipe 121 and opposite to the opening 102, and the end ends 1223 and 1233 of the second and third heat pipes 122 and 123 are respectively facing the base 10 It also extends on opposite side edges.

Therefore, when the heat generating component 14 generates heat, the heat is absorbed by the middle sections 1211, 1221, and 1231 of the first, second, and third heat pipes 121, 122, and 123, and is transmitted to the first, second, and third heat pipes 121 and 122, respectively. The end ends 1213, 1223, and 1233 of the 123 allow heat to be uniformly conducted to the edge of the susceptor 10, thereby improving heat transfer efficiency.

Although the conventional heat sink structure 1 can improve the heat transfer efficiency by the end ends 1213, 1223, and 1233 of the heat pipes 12, the effect is obviously insufficient because the first, second, and third heat pipes 121, 122, and 123 The last two ends 1213, 1223, and 1233 are the parts with the worst heat transfer efficiency, and the working fluid inside the heat pipes 12 is easily retained at the two ends 1213, 1223, and 1233 to form a heat-dissipating end, so that heat cannot be actually taken. Conducted to the edge of the pedestal 10, resulting in reduced heat transfer efficiency, and thus poor heat dissipation performance.

As described above, the prior art has the following disadvantages: 1. The problem of the ineffective end of the conventional heat pipe cannot be improved; 2. The heat transfer efficiency is not good.

Therefore, how to solve the above problems and problems in the past, that is, the inventors of this case and the relevant manufacturers engaged in this industry are eager to study the direction of improvement.

Accordingly, in order to effectively solve the above problems, the main object of the present invention is to provide a method for greatly improving heat transfer efficiency (or heat transfer efficiency), thereby improving heat. A heat sink with no heat transfer efficiency at the invalid end of the tube.

In order to achieve the above object, the present invention provides a heat dissipating device, comprising a base and a heat pipe, wherein the base has a receiving groove, and the receiving groove is recessed on one side of the base, the heat pipe The system is disposed in the opposite receiving groove, and has a first heat absorption section, a second heat absorption section, a third heat absorption section, a first heat transfer section and a second heat transfer section, and the third heat absorption section The segment is disposed between the first and second heat absorption segments, and the first heat transfer segment is bent outwardly from one end of the first heat absorption segment to one end of the third heat absorption segment adjacent to the other end of the first heat absorption segment. The second heat transfer section is bent outwardly from the other end of the third heat absorption section to an end of the second heat absorption section adjacent to one end of the third heat absorption section, wherein the first heat absorption section is the heat pipe a front end, the second endothermic section is the end of the heat pipe, and the front end and the end of the heat pipe and the third endothermic section together define a heat absorbing portion that directly or indirectly adsorbs heat generated by a heat generating component, and The first and second heat transfer sections collectively define a heat transfer portion; Design of the heat sink, the heat transfer efficiency can be effectively increased dramatically, even more ineffective solution have reached the end of the heat pipe free of the effect of heat transfer effectiveness.

The above object of the present invention, as well as its structural and functional features, will be described in accordance with the preferred embodiments of the drawings.

The present invention is a heat dissipating device. Referring to FIGS. 2 and 3, there is shown a combined and exploded perspective view of a first preferred embodiment of the present invention; the heat dissipating device 2 includes a base 21 and a heat pipe 23, The susceptor 21 has a receiving groove 210 recessed on one side of the base 21 . And its shape is designed to match the shape of the heat pipe 23. The manner in which the heat pipe 23 is accommodated in the accommodating groove 210 can be selected as follows: tight fitting, welding, fitting, and gluing.

The heat pipe 23 is received in the accommodating groove 210, and has a first heat absorbing section 2311, a second heat absorbing section 2312, a third heat absorbing section 2313, a first heat transfer section 2321, and a first heat transfer section. The second heat transfer section 2322, wherein the first heat absorption section is the front end of the heat pipe, the second heat absorption section is the end of the heat pipe, and the third heat absorption section 2313 is disposed in the first and second heat absorption sections 2311. Between 2312, the first and second heat transfer sections 2321, 2322 are respectively wound around the outer sides of the opposite first and second heat absorption sections 2311, 2312, that is, the first heat transfer section 2321 is from the first heat absorption section. One end of the 2311 is bent outwardly to an end of the third endothermic section 2313 adjacent to the other end of the first endothermic section 2311, and then the second heat transfer section 2322 is outwardly from the other end of the third endothermic section 2313. Extending the end to one end of the second endothermic section 2312 adjacent to one end of the third endothermic section 2313 to form a heat pipe 23 having a substantially 8-shaped or S-shaped shape as shown in FIG. 2; in other words, the first The second and third heat absorption sections 2311, 2312, 2313 and the first and second heat transfer sections 2321, 2322 integrally form the heat pipe 23.

Continuing to refer to FIG. 3, the first, second, and third heat absorption sections 2311, 2312, and 2313 (ie, the front end and the end of the heat pipe and the third heat absorption section) together define the heat absorbing portion 231, and the first and second heat transfer portions The heat transfer portion 232 is defined by the segments 2321, 2322, and the heat absorbing portion 231 is directly attached to a heat generating component 3 (such as a central processing unit, a graphics chip, a north-south bridge chip, or the like). Processing the wafer) for directly adsorbing the heat generating component 3 The heat is transmitted to the heat transfer portion 232, so that the heat can be uniformly and rapidly diffused throughout the base 21, thereby achieving a uniform heat transfer effect to improve the overall heat transfer efficiency, thereby effectively improving the heat pipe 23. There is no heat transfer efficiency at the invalid end.

Therefore, through the integrated design of the pedestal 21 and the heat pipe 23 of the present invention, the efficiency of the heat dissipating device 2 can be greatly improved, and the heat transfer performance of the ineffective end of the heat pipe 23 can be further solved.

4 and 5 are schematic and exploded perspective views showing a second preferred embodiment of the present invention; the structure and connection relationship of the preferred embodiment and its efficacy are substantially the same as those of the first preferred embodiment. Therefore, the difference between the two is not described here. The difference between the two is that the other side of the pedestal 21 is connected to a heat dissipating unit 5, and the heat dissipating unit 5 is preferably illustrated by a heat dissipating fin group. However, it is not limited thereto; in a specific implementation, it may also be a heat sink formed by a plurality of heat dissipation fins; and the base 21 may be separately provided with a fan in the form of a heat dissipation unit 5 alone and/or Not shown in the figure) to enhance the heat sink.

In addition, the other side of the pedestal 21 is connected to the heat dissipating unit 5 in a manner of being tightly matched, welded, fitted, and bonded.

Moreover, the heat conducted by the heat pipe 23 to the susceptor 21 through the heat dissipation fin group rapidly radiates the absorbed heat to the outside through radiation, thereby achieving an excellent heat dissipation effect.

6 and 7 are schematic and exploded perspective views showing a third preferred embodiment of the present invention; the structure and connection relationship of the preferred embodiment and its efficacy are substantially the same as those of the first preferred embodiment. Therefore, it is not heavy here. The difference between the two is that the pedestal 21 is further provided with an opening 211 which is formed on the other side of the pedestal 21, that is, the opening 211 is formed on the pedestal 21. The accommodating groove 210 is connected to the center of the other side.

In the preferred embodiment, the heat absorbing portion 231 of the first preferred embodiment is directly attached to the heat generating component 3 opposite to the side of the accommodating groove 210, and is designed to be connected to a heat dissipating unit 5, and The heat absorbing portion 231 absorbs the heat source from the side of the accommodating groove 210, that is, as shown in FIG. 7, the opening 211 accommodates a conductive member 4, and the conductive member 4 is made of a metal material, and has a Good heat absorption and conduction.

Further, one side of the conductive member 4 is attached to the side of the heat absorbing portion 231 (ie, the heat absorbing portion 231 is opposite to one side of the accommodating groove 210), and the other side of the conductive member 4 is affixed to the other side of the pedestal 21. The side is attached to the opposite heat generating component 3 for conducting heat absorbed by the heat generating component 3 to the heat absorbing portion 231 of the heat pipe 23, so that the heat absorbing portion 231 indirectly transfers the received heat source to the heat transfer portion 232. Therefore, the heat can be uniformly and rapidly diffused throughout the susceptor 21, and then the heat of the susceptor 21 and the heat pipe 23 is quickly dissipated by the heat dissipating unit 5, thereby greatly improving the efficiency of the heat sink. .

In addition, one side of the pedestal 21 is coupled to the opposite side of the heat dissipating unit 5 by soldering or bonding or intrusion, and the heat absorbing portion 231 and the heat transfer portion 232 of the heat pipe 23 are also closely arranged. On one side of the heat dissipation unit 5. The heat dissipating unit 5 is a heat sink or a heat sink fin group formed by a plurality of heat radiating fins, and the base 21 can be separately and/or phased. A fan (not shown) is further added to the form of the heat dissipating unit 5 to enhance the heat sink.

8 and 9 are schematic and exploded perspective views showing a fourth preferred embodiment of the present invention; the structure and connection relationship of the preferred embodiment and its efficacy are substantially the same as those of the first preferred embodiment. The preferred embodiment is that the heat absorbing portion 231 of the first preferred embodiment is directly attached to the heat generating component 3 opposite to the side of the accommodating groove 210, and is designed to be connected to a heat dissipating unit 5 and a receiving groove. 210 penetrates the base 21; That is, the accommodating groove 210 penetrates from one side of the susceptor 21 to the other side of the susceptor 21, so that the heat pipe 23 is accommodated and fits in the accommodating groove 210, and one of the heat pipes 23 The side and the other side of the pedestal 21 are respectively slanted to the side of the pedestal 21 and the other side thereof, and the side of the heat absorbing portion 231 opposite to the accommodating groove 210 is attached to the opposite heating element 3; The heat absorbing portion 231 of the heat pipe 23 directly conducts heat received to the heat generating component 3 to the heat transfer portion 232 so that heat can be uniformly and rapidly diffused throughout the susceptor 21, and then simultaneously by the heat radiating unit 5 The heat absorbed on the susceptor 21 and the heat pipe 23 is quickly dissipated to the outside, thereby greatly improving the performance of the heat sink.

10 and 11 are schematic and exploded perspective views showing a fifth preferred embodiment of the present invention; the structure and connection relationship of the preferred embodiment and its efficacy are substantially the same as those of the third preferred embodiment described above. The heat dissipation unit 5 of the third preferred embodiment is modified into a cover body 27, that is, one side of the base 21 is butted against a cover body 27, and the cover body 27 is provided with a cover body 27. a first side 271 and a second opposite the first side 271 The side 272 is attached to the side opposite to the base 21 to close the heat pipe 23.

In a specific implementation, the user can design a heat dissipating unit (such as a heat sink (not shown) or a heat pipe on the second side 272 according to the installation space and the heat dissipation or heat transfer effect requirement (not shown) The heat received on the cover 27 is externally dissipated or conducted to the distal end to effectively achieve an excellent heat dissipation effect.

12 and 13 are schematic and exploded perspective views showing a sixth preferred embodiment of the present invention; the structure and connection relationship of the preferred embodiment and its function are substantially the same as those of the fifth preferred embodiment. Therefore, the difference between the two is not described here. The difference between the two is that the cover body 27 is provided with a plurality of heat dissipation fins 274, and the heat dissipation fins 274 are axially extended from the second side 272. The cover body 27 receives the heat from the heat pipe 23 to quickly dissipate heat, and a fan (not shown) may be further disposed on the heat dissipation fin 274 to accelerate the heat dissipation and improve the heat dissipation performance.

In addition to the heat transfer direction of the heat pipe 23, in addition to the horizontal direction of the base 21, it also has a vertical heat conduction effect, which can directly transfer heat to the opposite cover body 27, and through the cover body 27 The heat-dissipating fins 274 rapidly dissipate heat to the outside, thereby greatly improving heat dissipation performance.

14A, 14B, and 15 are schematic and exploded perspective views showing a seventh preferred embodiment of the present invention; the structure and connection relationship of the preferred embodiment and its efficacy are substantially the same as the first preferred embodiment described above. In the same way, the heat pipe 23 of the first preferred embodiment is mainly designed as one side. The plane and the other side are non-planar, and the shape of a closed side 2102 of the accommodating groove 210 matches the non-planar shape, that is, as shown in FIG. 15, the accommodating groove 210 is provided with an open side 2101 and a closed side 2102 of the open side 2101, the open side 2101 and the closed side 2102 together define the accommodating groove 210; and the heat absorbing portion 231 of the heat pipe 23 has a first side 2315 and an opposite A second side 2316 of a side 2315.

The heat transfer portion 232 has a third side surface 2324 and a fourth side surface 2325 opposite to the third side surface 2324, wherein the first and third side surfaces 2315, 2324 are one side of the heat pipe 23, and the The first side surface 2315 is directly attached to the heat generating component 3, and the second and fourth side surfaces 2316 and 2325 (that is, the other side of the heat pipe 23 is non-planar) is formed in a D shape in the preferred embodiment. The description is to be attached to the relatively closed side 2102, but is not limited thereto.

Furthermore, the non-planar (ie, the second and fourth sides 2316, 2325) of the heat pipe 23 in the specific implementation may be designed and adjusted according to the user's requirements in advance to change the non-planar shape state (for example, in a D shape, The shape of the closed side 2102 of the accommodating groove 210 is adjusted, in other words, the shape of the closed side 2102 matches the shape of the second and fourth sides 2316, 2325. .

As described above, the present invention has the following advantages compared with the conventional ones: 1. It has a significant improvement in heat transfer efficiency; 2. It has the effect of improving the heat transfer performance of the conventional heat pipe due to the invalid end; 3. It has greatly improved heat dissipation performance.

It is to be understood that the above-described methods, shapes, configurations, and devices of the present invention are intended to be included within the scope of the present invention.

2‧‧‧heating device

21‧‧‧Base

210‧‧‧ accommodating slots

2101‧‧‧Open side

2102‧‧‧ Closed side

211‧‧‧ openings

23‧‧‧ Heat pipe

231‧‧‧heat absorption department

2311‧‧‧First heat absorption section

2312‧‧‧second heat absorption section

2313‧‧‧The third endothermic section

2315‧‧‧ first side

2316‧‧‧ second side

232‧‧‧Transfer Department

2321‧‧‧First heat transfer section

2322‧‧‧second heat transfer section

2324‧‧‧ third side

2325‧‧‧ fourth side

27‧‧‧ Cover

271‧‧‧ first side

272‧‧‧ second side

274‧‧‧Heat fins

3‧‧‧heating components

4‧‧‧Transmission parts

5‧‧‧heating unit

1A is a schematic exploded perspective view of the prior art; FIG. 1B is another exploded perspective view of the prior art; FIG. 1C is a schematic perspective view of a conventional combination; FIG. 2 is a schematic perspective view of a first preferred embodiment of the present invention; 3 is an exploded perspective view of a first preferred embodiment of the present invention; FIG. 4 is a schematic perspective view of a second preferred embodiment of the present invention; and FIG. 5 is a second preferred embodiment of the present invention. 3 is a schematic perspective view of a third preferred embodiment of the present invention; FIG. 7 is an exploded perspective view of a third preferred embodiment of the present invention; and FIG. 8 is a fourth comparison of the present invention. 3 is a schematic exploded perspective view of a fourth preferred embodiment of the present invention; FIG. 10 is a schematic perspective view of a fifth preferred embodiment of the present invention; FIG. 11 is a perspective view of the present invention FIG. 12 is a perspective view showing a combination of a sixth preferred embodiment of the present invention; and FIG. 13 is an exploded perspective view of a sixth preferred embodiment of the present invention; Picture of this hair BRIEF DESCRIPTION OF THE DRAWINGS FIG. 14B is a partial cross-sectional perspective view of a seventh preferred embodiment of the present invention; and FIG. 15 is an exploded perspective view of a seventh preferred embodiment of the present invention.

2‧‧‧heating device

21‧‧‧Base

210‧‧‧ accommodating slots

23‧‧‧ Heat pipe

231‧‧‧heat absorption department

2311‧‧‧First heat absorption section

2312‧‧‧second heat absorption section

2313‧‧‧The third endothermic section

232‧‧‧Transfer Department

2321‧‧‧First heat transfer section

2322‧‧‧second heat transfer section

3‧‧‧heating components

Claims (15)

A heat dissipating device includes: a pedestal having a accommodating groove recessed on one side of the pedestal; a heat pipe is received in the accommodating groove, and has a first heat absorption section, a second heat absorption section, a third heat absorption section, a first heat transfer section and a second heat transfer section, the third heat absorption section being disposed between the first and second heat absorption sections, The first heat transfer section is outwardly bent from one end of the first heat absorption section to one end of the third heat absorption section adjacent to the other end of the first heat absorption section, and the second heat transfer section is from the third heat absorption section. The other end of the heat pipe is outwardly bent to the end of the second heat absorption section adjacent to one end of the third heat absorption section; and the first heat absorption section is the front end of the heat pipe, and the second heat absorption section is the end of the heat pipe And the front end and the end of the heat pipe and the third heat absorption segment jointly define a heat absorbing portion that directly or indirectly adsorbs heat generated by a heat generating component, and the first and second heat transfer segments jointly define a heat transfer unit. The heat sink of claim 1, wherein the base is further provided with an opening, the opening is formed on the other side of the base, and communicates with the receiving groove. The heat dissipating device of claim 2, wherein the opening is provided with a conductive member, one side of the conductive member is attached to one side opposite to the heat absorbing portion, and the other side is attached to The heat absorbing portion indirectly adsorbs heat of the heat generating element with respect to the heat generating element. The heat dissipating device according to claim 1, wherein the receiving groove The side of the base is passed from one side of the base to the other side of the base, and one side of the heat pipe and the other side thereof are respectively cut to one side of the base and the other side thereof. The heat sink of claim 1, wherein the base is butted against a cover, the cover is provided with a first side and a second side opposite the first side, the first side is opposite One side of the base is attached to close the heat pipe. The heat dissipation device of claim 5, wherein the cover body is provided with a plurality of heat dissipation fins, and the heat dissipation fins are axially extended from the second side. The heat dissipating device of claim 3, wherein one side of the base is connected to a heat dissipating unit, and the heat dissipating unit is a heat sink or a heat dissipating fin group formed by a plurality of heat dissipating fins. The heat dissipating device of claim 1 or 4, wherein the other side of the pedestal is connected to a heat dissipating unit, wherein the heat dissipating unit is a heat sink or a heat dissipating fin group formed by a plurality of heat dissipating fins. . The heat dissipating device of claim 1, wherein the first, second and third heat absorption sections and the first and second heat transfer sections integrally form the heat pipe. The heat dissipating device of claim 1, wherein the accommodating groove is provided with an open side and a closed side, and the open side and the closed side jointly define the accommodating groove. The heat dissipating device of claim 10, wherein the heat absorbing portion has a first side surface and a second side surface, the heat transfer portion having a third side surface and a fourth side opposite the third side surface, and The second and fourth sides are attached to the closed side. The heat dissipating device of claim 11, wherein the second and fourth sides are D-shaped, and the shape of the closed side matches the shape of the second and fourth sides. The heat sink of claim 1, wherein the heat pipe is substantially S-shaped. The heat dissipating device of claim 1, wherein the shape of the receiving groove matches the shape of the heat pipe. The heat dissipating device of claim 1, wherein the heat pipe is accommodated in the receiving groove by any one of tight fitting, welding, fitting and gluing.