TWI514120B - Cooling module - Google Patents

Description

Thermal module

The invention relates to a heat dissipation module, in particular to a heat dissipation module with a fixing member.

With the rapid development of the electronics industry, heat treatment for electronic devices has also received increasing attention. For example, in recent years, the micro projector technology has matured, and the corresponding system wafer has a high wattage of heating power, so a heat dissipation module is usually provided to reduce the operating temperature of the system wafer.

Generally, the heat dissipation module cooperates with the heat absorption block to absorb the heat of the system wafer, and the heat absorption block is attached to the heat generating component, and the heat pipe is connected with the heat absorption block to conduct heat. Most of the heat pipe and the heat absorbing block are welded by low temperature solder. When the temperature of the heat dissipation module is too high, the solder melting easily causes the heat pipe and the heat absorbing block to loose or even separate, which causes the heat of the system chip to be dissipated in time, which affects the service life of the electronic product. .

In view of this, it is necessary to provide a structurally stable heat dissipation module.

A heat dissipation module for dissipating heat from a system wafer, comprising a heat absorption block and a heat pipe connected to the heat absorption block, the heat absorption block comprising a first groove, the heat pipe comprising an evaporation section, and the evaporation section of the heat pipe is accommodated in In the first recess, the heat dissipation module further includes a fastening plate that is attached to the heat absorbing block, an extending portion extending from two sides of the fastening plate, and a bent portion at an end of the extending portion, and an extension portion on both sides of the fastening plate The two sides of the heat absorbing block are attached, and the bent portions on both sides of the buckle plate are bent in a direction close to each other to chuck the heat absorbing block.

Compared with the prior art, the heat dissipation module includes a fastening plate, an extending portion extending from the fastening plate, and a bent portion at an end of the extending portion. The fastening plate and the heat absorbing block cooperate to receive the heat pipe, and the two sides of the fastening plate The bent portions are bent in a direction close to each other to chuck the heat absorbing block, thereby enhancing the stability of the heat pipe and the heat absorbing block of the heat dissipation module.

As shown in FIG. 1 , a heat dissipation module 100 of the present invention includes a heat dissipation fin assembly 10 and a heat pipe 20 extending through the heat dissipation fin assembly 10 , and is connected to the heat pipe 20 . A heat absorbing block 30 and a fixing member 40 fastened on the heat absorbing block 30.

Specifically, please refer to FIG. 2 and FIG. 3 , the heat dissipation fin set 10 includes an upper surface 11 , a lower surface 12 , and a plurality of heat dissipation fins 13 interposed between the upper surface 11 and the lower surface 12 . The upper surface 11 and the lower surface 12 are both flat and parallel to each other. The plurality of heat dissipation fins 13 are sandwiched between the upper surface 11 and the lower surface 12 and perpendicular to the upper surface 11 and the lower surface 12. The plurality of heat dissipation fins 13 are parallel to each other, and a gap 14 is formed between the adjacent heat dissipation fins 13 . Each of the heat dissipation fins 13 defines two flanges 15 to form two channels 16 extending through the plurality of heat dissipation fins 13 . In the embodiment, the flanges 15 are each cylindrical and are used to penetrate the heat pipe 20 . .

The heat pipe 20 includes a condensation section 21, an evaporation section 22, and a connection section 23 connecting the evaporation section 22 and the condensation section 21. The condensing section 21 includes a first condensing section 211 and a second condensing section 212. The two condensing sections 21 have a straight rod-like structure and are parallel to each other, and the first condensing section 211 and the second condensing section 212 are worn. The two channels 16 of the heat dissipation fin set 10 are disposed to conduct heat to the plurality of heat dissipation fins 13 in time. The evaporation section 22 is a columnar structure, the angle between the evaporation section 22 and the first condensation section 211 is an acute angle, and the angle between the evaporation section 22 and the second condensation section 212 is an obtuse angle. . The evaporation section 22 is for contacting the heat absorbing block 30 to absorb heat that conducts the heat absorbing block 30. The connecting section 23 includes a first connecting section 231 and a second connecting section 232. The first connecting section 231 smoothly connects one end of the evaporation section 22 with the first condensation section 211, and the second connection section 232 is smoothly connected. The other end of the evaporation section 22 and the second condensation section 212 are both curved and the degree of bending of the first connection section 231 is greater than the degree of bending of the second connection section 232.

The heat absorbing block 30 has a substantially rectangular block shape and includes a first surface 31 and a second surface 32 opposite to the first surface 31. The first surface 31 is a flat surface, which is in contact with a system wafer (not shown). The second surface 32 is recessed toward the first surface 31 to form a first recess 33. The first surface The groove 33 has a semi-circular cross section for engaging with the fixing member 40 to sleeve the heat pipe 20.

The fixing member 40 includes a fastening plate 41 and four pins 42 extending from the four corner edges of the fastening plate 41 toward the heat absorbing block 30.

The fastening plate 41 is substantially in the shape of a rectangular plate, and is recessed in a direction away from the heat absorbing block 30 at a position corresponding to the first groove 33 of the heat absorbing block 30 to form a second groove 411. The second groove 411 is formed. The second recess 411 and the first recess 33 together define a columnar receiving space to receive the evaporation section 22 of the heat pipe 20.

Referring to FIG. 4 , the four pins 42 are formed from the four corner edges of the fastening plate 41 toward the heat absorbing block 30 , and the pins 42 have a J-shaped barb shape. Each of the leads 42 includes an extending portion 421 attached to the side of the heat absorbing block 30, a bent portion 422 bent from the end of the extending portion 421, and a direction perpendicular to the extending portion 421 from the end of the bent portion 422 A fixing portion 423 extending away from the heat absorbing block 30. The extending portion 421 is perpendicular to the fastening plate 41 and has a length equal to the thickness at the four corners of the heat absorbing block 30. The bent portion 422 has a barb shape, and the two bent portions 422 located on the same side of the second groove 411 are relatively bent in a direction close to each other to hold the heat absorbing block 30. The fixing portion 423 extends from the end of the bent portion 422 in a direction perpendicular to the extending portion 421 away from the heat absorbing block 30 for engaging with other electronic devices to enhance the stability of the heat dissipation module 100.

During assembly, the two condensation sections 21 of the heat pipe 20 are passed through the two passages 16 of the heat dissipation fin set 10, and the evaporation section 22 of the heat pipe 20 is pre-installed in the first groove 33 of the heat absorption block 30. It can be fixed by solder paste soldering. The fixing member 40 is then fastened to the heat absorbing block 30, and the side of the evaporation section 22 facing away from the first recess 33 is embedded in the second recess 411 of the fixing member 40, that is, the fixing The fastening plate 41 of the piece 40 and the second surface 32 of the heat absorbing block 30 are respectively located on both sides of the evaporation section 22. Pressing the fastening plate 41 and the four pins 42 of the fixing member 40, the bent portion 422 of the pin 42 is fastened to the edge of the first surface 31 of the heat absorbing block 30, and the fastening plate 41 of the fixing member 40 is tight. The second surface 32 of the heat absorbing block 30 is attached. Finally, the fixing portion 423 of the fixing member 40 is engaged with other electronic devices and the first surface 31 of the heat absorption block 30 is attached to the system wafer.

In operation, the system wafer generates heat and conducts heat to the heat absorbing block 30. The heat absorbing block 30 rapidly absorbs heat and is transferred to the evaporation section 22 of the heat pipe 20, thereby transferring heat to the two condensation sections 21 of the heat pipe 20. The condensing section 21 transfers heat to the fin group 10 to dissipate into the surrounding air and remove heat from time to time.

The heat dissipation module 100 includes a heat absorption block 30 having a first groove 33 and a fixing member 40 having a second groove 411. The first groove 33 and the second groove 411 are combined to form a columnar shape. The hollow structure is sleeved with the evaporation section 22 of the heat pipe 20, and the four corner edges of the fixing member 40 extend toward the heat absorbing block 30 to form a plurality of pins 42 each including a barb-shaped bent portion 422. The plurality of bent portions 422 are engaged with the heat absorbing block 30, and the solder paste can be used to enhance the stability of the connection between the heat pipe 20 and the heat absorbing block 30, thereby enhancing the stability of the heat dissipation module 100.

In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. The above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art will be included in the following claims.

100. . . Thermal module

10. . . Heat sink fin set

20. . . Heat pipe

30. . . Heat absorbing block

40. . . Fastener

11. . . Upper surface

12. . . lower surface

13. . . Heat sink fin

14. . . gap

15. . . Flange

16. . . aisle

twenty one. . . Condensation section

twenty two. . . Evaporation section

twenty three. . . Connection segment

211. . . First condensation section

212. . . Second condensation section

231. . . First connection segment

232. . . Second connection segment

31. . . First surface

32. . . Second surface

33. . . First groove

41. . . Buckle plate

42. . . Pin

411. . . Second groove

421. . . Extension

422. . . Bending section

423. . . Fixed part

FIG. 1 is an assembled, isometric view of a heat dissipation module according to an embodiment of the invention.

2 is an exploded perspective view of the heat dissipation module shown in FIG. 1.

3 is an exploded perspective view showing another angle of the heat dissipation module shown in FIG. 1.

4 is a partial enlarged view of the fixing member of the heat dissipation module shown in FIG. 1.

100. . . Thermal module

10. . . Heat sink fin set

20. . . Heat pipe

30. . . Heat absorbing block

40. . . Fastener

Claims (9)

A heat dissipation module for dissipating heat from a system wafer, comprising a heat absorption block and a heat pipe connected to the heat absorption block, the heat absorption block comprising a first groove, the heat pipe comprising an evaporation section, and the evaporation section of the heat pipe is accommodated in The improvement of the first groove includes: a fastening plate that is attached to the heat absorbing block, an extending portion extending from two sides of the fastening plate, and a bending portion at an end of the extending portion, the fastening plate The side extension portion is attached to both sides of the heat absorbing block, and the bent portions on both sides of the fastening plate are bent in a direction close to each other to chuck the heat absorbing block. The heat dissipation module of claim 1, wherein the heat absorption block comprises a first surface and a second surface opposite to the first surface, and the first groove is disposed on the second surface. The first surface is for conforming to the system wafer, and the second surface is attached to the fastening plate. The heat dissipation module of claim 2, wherein the fastening plate is provided with a second groove corresponding to the position of the first groove, and the first groove and the second groove are surrounded by a column. The receiving space is configured to receive an evaporation section of the heat pipe. The heat dissipation module of claim 1, wherein the heat pipe comprises two condensation sections parallel to each other and two connection sections connecting the evaporation section and the two condensation ends. The heat dissipation module of claim 4, wherein the evaporation section is a columnar structure, and the evaporation section is received in a columnar hollow structure formed by combining the first groove and the second groove. . The heat dissipation module of claim 4, wherein the two connecting segments comprise a first connecting segment and a second connecting segment, wherein the first and second connecting segments are curved and the first The degree of bending of a connecting section is greater than the degree of bending of the second connecting section. The heat dissipation module of claim 4, further comprising a heat dissipation fin set, wherein the heat dissipation fin set comprises a plurality of heat dissipation fins disposed in parallel with each other, and the adjacent heat dissipation fins are left between There is a gap. The heat dissipation module of claim 7, wherein each of the heat dissipation fins has two flanges, and the flanges of the fins collectively enclose two passages through the heat dissipation fin group, the heat pipe Two condensation sections are disposed in the two passages. The heat dissipation module of claim 1, further comprising a fixing portion extending from a distal end of the bending portion in a direction perpendicular to the extending portion away from the heat absorbing block.