TWM544192U - Combination structure of heat-dissipation device - Google Patents
Combination structure of heat-dissipation device Download PDFInfo
- Publication number
- TWM544192U TWM544192U TW105219379U TW105219379U TWM544192U TW M544192 U TWM544192 U TW M544192U TW 105219379 U TW105219379 U TW 105219379U TW 105219379 U TW105219379 U TW 105219379U TW M544192 U TWM544192 U TW M544192U
- Authority
- TW
- Taiwan
- Prior art keywords
- heat
- circuit board
- heat sink
- assembly structure
- inclined portion
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
本創作係有關於一種散熱裝置，尤指一種拆裝方便且可穩定扣合與減少製作成本之散熱裝置組合結構。 The present invention relates to a heat dissipating device, and more particularly to a heat dissipating device combination structure which is convenient to disassemble and can be stably fastened and reduced in manufacturing cost.
隨著電子資訊產業快速發展，中央處理器等電子元件處理能力不斷提升，而當電子元件進行運作時會產生熱能，而當電子元件熱能過高時便會影響其處理效率與壽命，因此業者會使用對其電子元件進行吸熱與散熱之熱傳導元件進行導熱與散熱，而其熱傳導元件通常為散熱器或導熱板等散熱裝置，但該等散熱裝置並無法直接與電子元件固定設置，其兩者間需以螺鎖之方式進行固定，而螺鎖之元件螺釘則必須透過工具使得以進行拆卸或組裝，若手邊無工具時則無法進行拆卸或組裝相當不便利，也因此業界也會利用扣具將散熱器固定至電路板上，如中華民國專利申請案號95106292發明一案揭示一種散熱器扣合裝置，包括一第一扣件，一第二扣件及一把手，該第一扣件具有一下壓之彈性臂，該彈性臂一端彎折延伸形成一第一扣腳，另一端具有一承接面；該第二扣件設置於該第一扣件具有承接面之一端。該把手與第二扣件連接，並於其一端設置有抵壓於承接面之偏心輪，該偏心輪靠近其自由端形成有凸點，該凸點在偏心輪旋轉時，由第二扣件一側滑到相對另一側並與第二扣件一側邊緣相卡掣，且該偏心 輪旋轉時與承接面接觸之一段邊緣形成翻邊，以有效固定其散熱器與電路板，但其扣具在拆裝上都相對的不便，且在製造成本上也相對的提高。 With the rapid development of the electronic information industry, the processing power of electronic components such as central processing units continues to increase, and when electronic components operate, heat energy is generated. When the thermal energy of electronic components is too high, it will affect its processing efficiency and longevity. Therefore, the industry will The heat conduction element that absorbs heat and dissipates heat of the electronic component is used for heat conduction and heat dissipation, and the heat conduction element is usually a heat sink such as a heat sink or a heat conduction plate, but the heat dissipation device cannot be directly fixed to the electronic component. It needs to be fixed by screw lock, and the component screw of the screw lock must be passed through the tool for disassembly or assembly. If there is no tool at hand, it is not convenient to disassemble or assemble, so the industry will also use the buckle. The heat sink is fixed to the circuit board. The invention discloses a heat sink fastening device, which includes a first fastener, a second fastener and a handle. The first fastener has a lower pressure. a resilient arm, the elastic arm is bent to extend at one end to form a first buckle, and the other end has a receiving surface; A fastener having a fastener disposed at the first end of the receiving surface. The handle is connected to the second fastening member, and is provided at one end thereof with an eccentric wheel pressing against the receiving surface, the eccentric wheel is formed with a bump near the free end thereof, and the convex point is rotated by the second fastening member when the eccentric wheel rotates One side slides to the opposite side and is engaged with one side edge of the second fastener, and the eccentricity When the wheel rotates, a flange is formed on the edge of the contact surface to effectively fix the heat sink and the circuit board, but the buckle is relatively inconvenient in disassembly and assembly, and the manufacturing cost is relatively increased.
故，如何將上述缺失問題加以改進，乃為本案創作人所欲解決之技術困難點之所在。 Therefore, how to improve the above-mentioned missing problems is the technical difficulty point that the creators of this case want to solve.
爰此，為有效解決上述之問題，本創作之主要目的在提供一種拆裝方便且可穩定扣合與減少製作成本之散熱裝置組合結構。 Therefore, in order to effectively solve the above problems, the main purpose of the present invention is to provide a heat dissipating device combination structure which is convenient to disassemble and can be stably buckled and reduced in manufacturing cost.
為達上述目的，本創作係提供一種散熱裝置組合結構，係包括：一散熱器及一扣具，其中該散熱器具有一底部，該底部表面位置處垂直延伸有複數散熱鰭片，並該底部側邊水平延伸有至少一展部，而該扣具具有一底座，該底座兩側邊位置處分別垂直延伸有一側邊，且該底座上於該兩側邊間形成有一凹槽，該凹槽內設置有所述該散熱器及一電路板，且該側邊相對於凹槽位置處形成有至少一簷部，並該側邊相對底座另一端位置處延伸有複數翼片，該等翼片上分別延伸設置有一斜部，該斜部之端緣係相對卡設其展部，而該電路板係相對設置該底部與該底座間，且該電路板之底面相對設置於該簷部上，以使該散熱器之底部可貼附所述該電路板頂面上之至少一發熱電子元件且與該電路板固定於該斜部與該簷部間，藉此，所述該散熱器與該電路板設置於所述該凹槽內時，其電路板係設置於該簷部上，而該電路板上側之電子元件則貼附所述散熱器之底部，並該散熱器之展部係由該斜部卡設，進而達到拆裝方便且可穩定扣合與減少製作成本之功效者。 In order to achieve the above object, the present invention provides a heat dissipating device assembly structure, comprising: a heat sink and a buckle, wherein the heat sink has a bottom portion, and a plurality of heat dissipation fins extend vertically at the bottom surface position, and the bottom side The side of the groove has a base, and the side of the base has a side extending vertically, and a groove is formed on the side of the base. The heat sink and a circuit board are disposed, and the side is formed with at least one crotch portion at a position relative to the groove, and the side edge has a plurality of fins extending at a position opposite to the other end of the base, and the fins respectively An inclined portion is disposed, the edge of the inclined portion is oppositely disposed with respect to the protruding portion, and the circuit board is oppositely disposed between the bottom portion and the base, and the bottom surface of the circuit board is oppositely disposed on the bottom portion, so that The bottom of the heat sink can be attached to the at least one heat-generating electronic component on the top surface of the circuit board and fixed between the inclined portion and the flange portion, whereby the heat sink and the circuit board Set in the stated In the slot, the circuit board is disposed on the crotch portion, and the electronic component on the side of the circuit board is attached to the bottom of the heat sink, and the protruding portion of the heat sink is clamped by the inclined portion, thereby achieving It is easy to assemble and disassemble and can be used for stable fastening and reducing production costs.
1‧‧‧散熱裝置組合結構 1‧‧‧ Heat sink assembly structure
2‧‧‧散熱器 2‧‧‧heatsink
21‧‧‧底部 21‧‧‧ bottom
22‧‧‧散熱鰭片 22‧‧‧ Heat sink fins
23‧‧‧展部 23‧‧‧ Exhibition Department
231‧‧‧嵌槽 231‧‧‧Inlay
3‧‧‧扣具 3‧‧‧ buckle
31‧‧‧底座 31‧‧‧Base
32‧‧‧側邊 32‧‧‧ side
321‧‧‧簷部 321‧‧‧檐
322‧‧‧側槽 322‧‧‧ side slot
33‧‧‧翼片 33‧‧‧Flap
331‧‧‧斜部 331‧‧‧ oblique
332‧‧‧槽孔 332‧‧‧Slots
333‧‧‧引導部 333‧‧‧Guidance Department
34‧‧‧凹槽 34‧‧‧ Groove
4‧‧‧電路板 4‧‧‧ boards
41‧‧‧發熱電子元件 41‧‧‧Fever electronic components
42‧‧‧電性接點 42‧‧‧Electrical contacts
43‧‧‧固定孔 43‧‧‧Fixed holes
5‧‧‧導熱件 5‧‧‧Heat conductive parts
第1圖係本創作較佳實施例之立體組合示意圖。 Figure 1 is a schematic perspective view of a preferred embodiment of the present invention.
第2圖係本創作較佳實施例之立體分解示意圖。 Figure 2 is a perspective exploded view of the preferred embodiment of the present invention.
第3圖係本創作較佳實施例之組合剖視示意圖。 Figure 3 is a schematic cross-sectional view of a preferred embodiment of the present invention.
第4圖係本創作另一較佳實施例之局部立體示意圖。 Figure 4 is a partial perspective view of another preferred embodiment of the present invention.
第5圖係本創作另一較佳實施例之立體組合示意圖。 Figure 5 is a schematic perspective view of another preferred embodiment of the present invention.
第6圖係本創作另一較佳實施例之組合剖視示意圖一。 Figure 6 is a schematic cross-sectional view of a preferred embodiment of another preferred embodiment of the present invention.
第7圖係本創作另一較佳實施例之組合剖視示意圖二。 Figure 7 is a schematic cross-sectional view of a second preferred embodiment of the present invention.
第8圖係本創作再一較佳實施例之局部立體示意圖。 Figure 8 is a partial perspective view of still another preferred embodiment of the present invention.
第9圖係本創作再一較佳實施例之立體組合示意圖。 Figure 9 is a perspective view of a further preferred embodiment of the present invention.
第10圖係本創作較佳實施例之實施示意圖。 Figure 10 is a schematic diagram of the implementation of the preferred embodiment of the present invention.
第11圖係本創作較佳實施例之進一步實施示意圖。 Figure 11 is a schematic view of further implementation of the preferred embodiment of the present invention.
請參閱第1圖至第3圖所示，係為本創作較佳實施例之立體組合示意圖及立體分解示意圖及組合剖視示意圖，由圖中可清楚看出，所述散熱裝置組合結構1主要包括有一散熱器2及一扣具3，該散熱器2具有一底部21，該底部21表面垂直延伸有複數散熱鰭片22，且該底部21兩側位置處水平向外延伸有至少一展部23，而該扣具3具有一底座31，該底座31於兩側位置處分別垂直延伸有一側邊32，且該底座31上於兩側邊32之間形成有一凹槽34，並該側邊32上形成有至少一簷部321與一側槽322，該簷部321係一體延伸該側槽322側邊 且往該凹槽34方向延伸，另該側邊32於底座31另一端位置處形成有複數翼片33，該等翼片33上延伸有至少一斜部331，該斜部331係往所述該凹槽34方向延伸，並該翼片33於所述該斜部331位置處形成有一槽孔332，而該斜部331係一體延伸該翼片33相對該槽孔332一側邊32位置處，又該翼片33相對該側邊32另一端彎曲延伸而出有一引導部333，而該兩側引導部333之端緣所界定之寬度大於所述凹槽34之寬度，而該散熱器2與一電路板4係設置於該凹槽34內時，且其電路板4與該散熱器2間設置有一導熱件5，其導熱件5係可為導熱片或導熱膠等相關可導熱之元件，另其中該兩側展部23間之寬度與該電路板4之寬度與該凹槽34之寬度一致，而該電路板4與該散熱器2之底部21係可由所述引導部333方便進入所述凹槽34內，其中該電路板4通過所述該斜部331時，其電路板4係擠壓所述該斜部331至該槽孔332內，直至該電路板4通過所述該斜部331後，其斜部331回復至原始位置，而將其電路板4相對設置於該簷部321上，而後將該散熱器2通過所述該斜部331，同樣的，該散熱器2之展部23係擠壓所述該斜部331至該槽孔332內，直至該展部23通過所述該斜部331後，其斜部331回復至原始位置，此時，該斜部331相對卡設該展部23上，以使該散熱器2之底部21可經由一導熱件44貼附所述該電路板4頂面上之至少一發熱電子元件41且與該電路板4固定於該斜部331與該簷部321間，藉此，所述該散熱器2與該電路板4設置於所述該凹槽34內時，其電路板4係設置於該簷部321上，而該電路板4上側之電子元件則貼附所述散熱器2之底部21，並該散熱器2之展部 23係由該斜部331卡設，以使該電路板4與該散熱器2係由所述該扣具3達到組接固定之目的，且同時達到拆裝方便且可穩定扣合與減少製作成本之功效者，另外，其發熱電子元件41之熱能同時又能透過其側槽322之設置而達到熱能對流，以提升其散熱裝置組合結構1散熱效率之功效者，又且該電路板4之長度係大於所述扣具3之長度，且其電路板4所凸出長度之區域分別設置有複數電性接點42與至少一固定孔43，而其電性接點42與固定孔43則可方便電性連接外部與定位之功效者。 Please refer to FIG. 1 to FIG. 3 , which are schematic diagrams of a three-dimensional combination and a schematic exploded view and a schematic cross-sectional view of a preferred embodiment of the present invention. As can be clearly seen from the figure, the heat dissipating device assembly structure 1 is mainly The heat sink 2 has a bottom portion 21, and a plurality of heat dissipation fins 22 extend perpendicularly from the surface of the bottom portion 21, and at least one portion of the bottom portion 21 extends horizontally outward. 23, the clip 3 has a base 31. The base 31 has a side edge 32 extending perpendicularly at two sides, and a recess 34 is formed on the base 31 between the side edges 32, and the side is formed. 32 is formed with at least one crotch portion 321 and one side groove 322, and the crotch portion 321 integrally extends the side of the side groove 322 And extending in the direction of the groove 34, the side edge 32 is formed with a plurality of fins 33 at the other end of the base 31. The fins 33 extend at least one inclined portion 331 extending toward the The groove 34 extends in the direction of the groove 34, and the slot 33 is formed with a slot 332 at the position of the inclined portion 331, and the inclined portion 331 integrally extends the position of the flap 33 relative to the side 32 of the slot 332. The flange 33 extends along the other end of the side edge 32 to form a guiding portion 333, and the edge of the two side guiding portions 333 defines a width larger than the width of the groove 34, and the heat sink 2 When a circuit board 4 is disposed in the recess 34, and a heat conducting member 5 is disposed between the circuit board 4 and the heat sink 2, the heat conducting member 5 can be a heat conductive sheet or a heat conductive adhesive. The width between the two side portions 23 and the width of the circuit board 4 are the same as the width of the recess 34, and the circuit board 4 and the bottom portion 21 of the heat sink 2 are conveniently accessible by the guiding portion 333. In the recess 34, when the circuit board 4 passes through the inclined portion 331, the circuit board 4 presses the inclined portion 331 to the In the hole 332, after the circuit board 4 passes the the inclined portion 331, the inclined portion 331 returns to the original position, and the circuit board 4 is oppositely disposed on the crotch portion 321, and then the heat sink 2 passes through the In the same manner, the extending portion 23 of the heat sink 2 presses the inclined portion 331 into the slot 332 until the protruding portion 23 passes through the inclined portion 331 and the inclined portion thereof The 331 is returned to the original position. At this time, the inclined portion 331 is oppositely disposed on the protruding portion 23, so that the bottom portion 21 of the heat sink 2 can be attached to at least the top surface of the circuit board 4 via a heat conducting member 44. a heat-generating electronic component 41 is fixed between the inclined portion 331 and the flange portion 321 with the circuit board 4, whereby when the heat sink 2 and the circuit board 4 are disposed in the recess 34, The circuit board 4 is disposed on the crotch portion 321 , and the electronic component on the upper side of the circuit board 4 is attached to the bottom portion 21 of the heat sink 2 , and the extension portion of the heat sink 2 The 23 is latched by the inclined portion 331 so that the circuit board 4 and the heat sink 2 are assembled and fixed by the buckle 3, and at the same time, the disassembly and assembly is convenient and stable and can be stably buckled and reduced. In addition, the heat of the heat-generating electronic component 41 can simultaneously achieve thermal energy convection through the arrangement of the side grooves 322 to improve the heat-dissipating efficiency of the heat-dissipating device assembly structure 1, and the circuit board 4 The length is greater than the length of the clip 3, and the area of the protruding length of the circuit board 4 is respectively provided with a plurality of electrical contacts 42 and at least one fixing hole 43, and the electrical contacts 42 and the fixing holes 43 are It can be easily connected to the external and positioning functions.
再請參閱第4圖至第7圖所示，係為本創作另一較佳實施例之局部立體示意圖及立體組合示意圖及組合剖視示意圖一及組合剖視示意圖二，由圖中可清楚看出，其中所述斜部331係一體延伸於該翼片33之端緣，且其斜部331係往所述該凹槽34方向延伸，並該斜部331係可以與翼片33間具有一適當間距或緊鄰方式成形，以當該電路板4與該散熱器2之展部23通過所述該斜部331時，其電路板4與該展部23係擠壓所述該斜部331往翼片33移動，直至該展部23通過所述該斜部331後，其斜部331回復至原始位置，此時，該斜部331相對卡設該展部23上，以使該散熱器2之底部21可貼附所述該電路板4頂面上之至少一發熱電子元件41且與該電路板4固定於該斜部331與該簷部321間，藉此，所述該散熱器2與該電路板4設置於所述該凹槽34內時，其電路板4係設置於該簷部321上，而該電路板4上側之電子元件則貼附所述散熱器2之底部21，並該散熱器2之展部23係由該斜部331卡設，以使該電路板4與該散熱器2係由所述該扣具3達到組接固定之目的，且同時達到拆裝方便且可穩定扣合與減少製作成本之功效者。 Please refer to FIG. 4 to FIG. 7 , which are schematic diagrams of a partial perspective view and a three-dimensional combination of the preferred embodiment of the present invention, and a schematic cross-sectional view of the combination and a schematic cross-sectional view of the second embodiment, which can be clearly seen from the figure. The inclined portion 331 extends integrally with the end edge of the fin 33, and the inclined portion 331 extends toward the groove 34, and the inclined portion 331 can have a space with the flap 33. When the circuit board 4 and the extension portion 23 of the heat sink 2 pass through the inclined portion 331 , the circuit board 4 and the protruding portion 23 press the inclined portion 331 toward the inclined portion 331 The flap 33 is moved until the inclined portion 331 passes through the inclined portion 331 and the inclined portion 331 returns to the original position. At this time, the inclined portion 331 is oppositely disposed on the protruding portion 23 to make the heat sink 2 The bottom portion 21 can be attached to the at least one heat-generating electronic component 41 on the top surface of the circuit board 4 and is fixed between the inclined portion 331 and the flange portion 321 with the circuit board 4, whereby the heat sink 2 When the circuit board 4 is disposed in the recess 34, the circuit board 4 is disposed on the crotch portion 321 and the electronic device on the upper side of the circuit board 4 The component is attached to the bottom portion 21 of the heat sink 2, and the protruding portion 23 of the heat sink 2 is latched by the inclined portion 331 so that the circuit board 4 and the heat sink 2 are attached to the buckle 3. The purpose of the assembly is fixed, and at the same time, the disassembly and assembly is convenient, and the effect of stable fastening and reducing the manufacturing cost is achieved.
再請參閱第8圖及第9圖所示，係為本創作再一較佳實施例之局部立體示意圖及立體組合示意圖，由圖中可清楚看出，其中所述側邊32上形成可直接成形有所述簷部321為實施方式，或其斜部331係一體延伸該翼片33相對該槽孔332之兩側邊32位置處為實施方式，以當該斜部331相對卡設該展部23上，該散熱器2之底部21貼附所述該電路板4頂面上之至少一發熱電子元件41(請參閱第2圖所示)且與該電路板4固定於該斜部331與該簷部321間。 8 and 9 are a partial perspective view and a perspective view of a preferred embodiment of the present invention. It can be clearly seen from the figure that the side 32 is directly formed. The shank portion 321 is formed as an embodiment, or the inclined portion 331 integrally extends the position of the tab 33 relative to the two side edges 32 of the slot 332 as an embodiment, so that when the inclined portion 331 is oppositely mounted The bottom portion 21 of the heat sink 2 is attached to at least one heat-generating electronic component 41 on the top surface of the circuit board 4 (see FIG. 2) and is fixed to the inclined portion 331 with the circuit board 4. With the crotch 321 .
再請參閱第10圖及第11圖所示，係為本創作較佳實施例之實施示意圖及進一步實施示意圖，由圖中可清楚看出，其中所述該展部23上可設置有至少一嵌槽231供所述該等斜部331卡設，以使該電路板4與該散熱器2係由所述該扣具3達到組接固定之目的，另外，該電路板4之底面設置有所述發熱電子元件41，該等發熱電子元件41與該底座31間設置有所述導熱件5，以使該發熱電子元件41同時可以藉由該扣具3與該散熱器2進行導熱之效果者。 Referring to FIG. 10 and FIG. 11 , it is a schematic diagram of a preferred embodiment of the present invention and a further embodiment of the present invention. It can be clearly seen from the figure that at least one of the portions 23 can be disposed on the exhibition portion 23 . The slot 231 is provided for the inclined portion 331 to ensure that the circuit board 4 and the heat sink 2 are assembled and fixed by the clip 3. Further, the bottom surface of the circuit board 4 is provided with The heat-generating electronic component 41 is disposed between the heat-generating electronic component 41 and the base 31, so that the heat-generating electronic component 41 can simultaneously conduct heat by the buckle 3 and the heat sink 2. By.
需陳明者，以上所述僅為本案之較佳實施例，並非用以限制本創作，若依本創作之構想所作之改變，在不脫離本創作精神範圍內，例如：對於構形或佈置型態加以變換，對於各種變化，修飾與應用，所產生等效作用，均應包含於本案之權利範圍內，合予陳明。 It should be noted that the above is only the preferred embodiment of the present case and is not intended to limit the creation. If the changes made in accordance with the concept of the creation are within the scope of the spirit of the creation, for example, for the configuration or arrangement The type is transformed, and the equivalent effect of various changes, modifications and applications shall be included in the scope of the case and shall be combined with Chen Ming.
1‧‧‧散熱裝置組合結構 1‧‧‧ Heat sink assembly structure
2‧‧‧散熱器 2‧‧‧heatsink
21‧‧‧底部 21‧‧‧ bottom
22‧‧‧散熱鰭片 22‧‧‧ Heat sink fins
23‧‧‧展部 23‧‧‧ Exhibition Department
3‧‧‧扣具 3‧‧‧ buckle
31‧‧‧底座 31‧‧‧Base
32‧‧‧側邊 32‧‧‧ side
321‧‧‧簷部 321‧‧‧檐
322‧‧‧側槽 322‧‧‧ side slot
33‧‧‧翼片 33‧‧‧Flap
331‧‧‧斜部 331‧‧‧ oblique
332‧‧‧槽孔 332‧‧‧Slots
333‧‧‧引導部 333‧‧‧Guidance Department
34‧‧‧凹槽 34‧‧‧ Groove
4‧‧‧電路板 4‧‧‧ boards
41‧‧‧發熱電子元件 41‧‧‧Fever electronic components
42‧‧‧電性接點 42‧‧‧Electrical contacts
43‧‧‧固定孔 43‧‧‧Fixed holes
5‧‧‧導熱件 5‧‧‧Heat conductive parts
Claims (10)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW105219379U TWM544192U (en) | 2016-12-20 | 2016-12-20 | Combination structure of heat-dissipation device |
| KR2020170000450U KR200490472Y1 (en) | 2016-12-20 | 2017-01-24 | Assembly for a radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW105219379U TWM544192U (en) | 2016-12-20 | 2016-12-20 | Combination structure of heat-dissipation device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWM544192U true TWM544192U (en) | 2017-06-21 |
Family
ID=59688764
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW105219379U TWM544192U (en) | 2016-12-20 | 2016-12-20 | Combination structure of heat-dissipation device |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR200490472Y1 (en) |
| TW (1) | TWM544192U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI633831B (en) * | 2017-09-29 | 2018-08-21 | 威剛科技股份有限公司 | Heat-dissipating device for expansion card and expansion card assembly with heat-dissipating function |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109436087B (en) * | 2018-11-26 | 2023-10-10 | 东风商用车有限公司 | Steering hydraulic oil cooling device for commercial vehicle |
| CN109436088B (en) * | 2018-11-26 | 2023-10-10 | 东风商用车有限公司 | Steering main pipeline system communicated with radiator |
| CN110908474A (en) * | 2019-12-23 | 2020-03-24 | 湖南翰博薇微电子科技有限公司 | Intelligent interaction module and case with same |
| CN114826970A (en) * | 2022-04-30 | 2022-07-29 | 任旭 | Performance detection device of 5G communication device |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0864732A (en) | 1994-08-26 | 1996-03-08 | Mitsubishi Electric Corp | Semiconductor integrated circuit device |
| US7498673B2 (en) | 2006-11-21 | 2009-03-03 | International Business Machines Corporation | Heatplates for heatsink attachment for semiconductor chips |
| KR101248416B1 (en) * | 2011-08-10 | 2013-03-28 | 김종국 | Heat emission apparatus having clip |
| TW201338691A (en) | 2012-03-09 | 2013-09-16 | Askey Technology Jiangsu Ltd | Assembled electromagnetic shielding case |
-
2016
- 2016-12-20 TW TW105219379U patent/TWM544192U/en unknown
-
2017
- 2017-01-24 KR KR2020170000450U patent/KR200490472Y1/en active IP Right Grant
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI633831B (en) * | 2017-09-29 | 2018-08-21 | 威剛科技股份有限公司 | Heat-dissipating device for expansion card and expansion card assembly with heat-dissipating function |
| US10152097B1 (en) | 2017-09-29 | 2018-12-11 | Adata Technology Co., Ltd. | Heat-dissipating device for expansion card and expansion card assembly with heat-dissipating function |
Also Published As
| Publication number | Publication date |
|---|---|
| KR200490472Y1 (en) | 2019-11-15 |
| KR20180001949U (en) | 2018-06-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWM544192U (en) | Combination structure of heat-dissipation device | |
| TWI633831B (en) | Heat-dissipating device for expansion card and expansion card assembly with heat-dissipating function | |
| US7394656B1 (en) | Heat dissipation device | |
| US9992912B1 (en) | Heat dissipating device combined structure | |
| US20130306291A1 (en) | Strip heatsink | |
| TW201319786A (en) | Heat dissipation device | |
| TW201302033A (en) | Heat-dissipation unit and assembly of the heat-dissipation unit and chip set | |
| TWI504852B (en) | Thermal dissipating module | |
| TW201347646A (en) | Heat dissipation device assembly | |
| TW201315360A (en) | Heat dissipation device | |
| TWI600368B (en) | Radiator combination structure | |
| TWI492035B (en) | Base and heat dissipating module having the same | |
| TWI517783B (en) | Fixing assembly | |
| TWM541187U (en) | Combination structure of heat radiator | |
| US9072176B2 (en) | Assembling structure of heat dissipation device | |
| TWM606810U (en) | Structure of heat dissipating module | |
| CN220731183U (en) | Heat dissipation piece, heat dissipation structure and solid state disk assembly | |
| TWM547823U (en) | Elastic heat sink module with heat pipes | |
| TW200930236A (en) | Heat pipe type heat dissipation device and fastening device for mounting the heat pipe | |
| TW201220030A (en) | Heat dissipation apparatus assembly | |
| TW201926596A (en) | Memory heat-dissipating device | |
| TWI612271B (en) | Heat dissipating module capable of enhancing heat dissipating efficiency | |
| TWM606044U (en) | Storage drive having modular heat dissipation component | |
| TW201412235A (en) | Electronic device | |
| TWM564257U (en) | Structure of high-performance heat sink |