TWM606810U - Structure of heat dissipating module - Google Patents

Abstract

This creation provides a heat dissipation module structure, which includes a radiator and a fastener. The radiator has a bottom side edge formed with at least one extension, and both sides of the fastener base are respectively extended with side edges and formed with a A groove, the radiator and a circuit board are arranged in the groove, and the side is formed with at least one eaves, at least one fin and at least one baffle, and an inclined part is extended on the fin, the The end edge of the oblique part is relatively clamped with its extended part, whereby when the heat sink and the circuit board are arranged in the groove, the circuit board is arranged on the eaves, and the circuit board The electronic components on the upper side are attached to the bottom of the radiator, and the front side of the circuit board can be blocked by the blocking part, and the extension part of the radiator is clamped by the inclined part, so as to achieve convenient disassembly and assembly. Stable buckle and reduce production cost, and achieve the effect of effective limit and prevent displacement.

Description

Heat dissipation module structure

This creation is related to a heat dissipation module, especially a heat dissipation module structure that is easy to disassemble and assemble, can be stably buckled, reduce production costs, and can effectively limit and prevent displacement.

With the rapid development of the electronic information industry, the processing capacity of electronic components such as the central processing unit is constantly improving. When the electronic components are in operation, heat energy is generated. When the heat energy of the electronic components is too high, the processing efficiency and life of the electronic components will be affected. Heat conduction elements that absorb and dissipate the electronic components are used for heat conduction and heat dissipation. The heat conduction elements are usually heat dissipation devices such as radiators or heat-conducting plates, but these heat dissipation devices cannot be directly fixed to the electronic components. It needs to be fixed by a screw lock, and the component screw of the screw lock must be disassembled or assembled with a tool. If there is no tool at hand, it cannot be disassembled or assembled. It is very inconvenient. Therefore, the industry will also use the fastener to The heat sink is fixed to the circuit board. For example, the invention of the Republic of China Patent Application No. 95106292 discloses a heat sink fastening device, which includes a first fastener, a second fastener and a handle. The first fastener has a bottom pressure The elastic arm, one end of the elastic arm is bent and extended to form a first buckle foot, and the other end has a receiving surface; the second fastener is arranged at one end of the first fastener with the receiving surface. The handle is connected to the second fastener, and one end is provided with an eccentric wheel pressing against the bearing surface. The eccentric wheel is formed with a convex point near its free end. The convex point is formed by the second fastener when the eccentric wheel rotates. One side slides to the opposite side and is locked with one side edge of the second fastener, and when the eccentric wheel rotates, a section of the edge in contact with the receiving surface forms a flanging to effectively fix the heat sink and the circuit board. The buckle is relatively inconvenient in disassembly and assembly, and the manufacturing cost is relatively increased.

Therefore, how to improve the above-mentioned shortcomings is the technical difficulty that the creator of this case wants to solve.

In this regard, in order to effectively solve the above-mentioned problems, the main purpose of this creation is to provide a heat dissipation module structure that is convenient to disassemble and assemble, can stably buckle, reduce production costs, and can effectively limit and prevent displacement.

In order to achieve the above-mentioned purpose, this invention provides a heat dissipation module structure, which includes a heat sink and a fastener, wherein the heat sink has a bottom, a plurality of heat dissipation fins extend vertically at the bottom surface, and the bottom side At least one extension is horizontally extended, and the buckle has a base, and one side is vertically extended at both sides of the base, and a groove is formed on the base between the two sides, and the groove is arranged There is the heat sink and a circuit board, and at least one eave is formed on the side relative to the groove, and a plurality of fins are formed on the side at intervals, and a plurality of fins are respectively extended The oblique portion, the end edge of the oblique portion is relatively clamped with its extended portion, and at least one baffle is formed at the front end of the side edge, and the circuit board is arranged oppositely between the bottom and the base, and the circuit board The bottom surface is oppositely arranged on the eaves, so that the bottom of the radiator can be attached to at least one heating electronic component on the top surface of the circuit board and fixed with the circuit board between the inclined portion and the eaves, and The baffle is attached to the front side of the circuit board, whereby when the heat sink and the circuit board are arranged in the groove, the circuit board is arranged on the eaves, and the upper side of the circuit board The electronic components are attached to the bottom of the radiator, and the front side of the circuit board can be blocked by the blocking part, and the extension part of the radiator is clamped by the inclined part, thereby achieving convenient disassembly and assembly and stable buckle Combine and reduce production costs, and achieve the effect of effective limit and prevent displacement.

According to an embodiment of the heat dissipation module structure of the invention, a groove is formed between the fin and the side edge.

According to an embodiment of the heat dissipation module structure of the invention, the circuit board and the heat sink are fixedly arranged in the groove, and the width between the two side extensions and the width of the circuit board and the groove The width is the same.

According to an embodiment of the heat dissipation module structure of the present invention, the inclined portion extends the fin integrally, and the inclined portion extends in the direction of the groove.

According to an embodiment of the heat dissipation module structure of the invention, the bottom of the heat sink may be provided with a heat-conducting element, one side of the heat-conducting element is attached to the bottom of the heat sink, and the other side is attached to the top surface of the circuit board At least one heat-generating electronic element is provided, and the bottom surface of the circuit board is provided with the heat-generating electronic element, and the heat-conducting element is provided between the heat-generating electronic element and the base.

According to an embodiment of the heat dissipation module structure of the present invention, at least one embedding groove is provided on the exhibition part for the inclined parts to be clamped.

According to an embodiment of the heat dissipation module structure of the invention, the baffle is formed on the side and extends toward the groove.

According to an embodiment of the heat dissipation module structure of the invention, a side groove is formed at the position of the side edge and the base relative to the eaves, and the eaves integrally extends the side of the side groove.

According to an embodiment of the heat dissipation module structure of the invention, a fixing hole is formed at one end of the circuit board.

According to an embodiment of the heat dissipation module structure of the present invention, a set of contact holes is formed on the base of the fastener, and the set of contact holes is formed opposite to the bottom of the fixing hole.

According to an embodiment of the heat dissipation module structure of the present invention, the baffle is attached to the front side of the heat sink.

The above-mentioned purpose of this creation and its structural and functional characteristics will be described based on the preferred embodiments of the accompanying drawings.

Please refer to Figures 1 to 3, which are the three-dimensional assembly schematic diagram, the three-dimensional exploded schematic diagram, and the assembly cross-sectional schematic diagram 1 of the preferred embodiment of this creation. It can be clearly seen from the figure that the heat dissipation module structure 1 It mainly includes a radiator 2 and a fastener 3 and a circuit board 4.

A bottom 21 is formed under the radiator 2, and a plurality of heat dissipation fins 22 extend vertically upward from the bottom 21 of the radiator 2, and at least one extension 23 extends horizontally outward on both sides of the bottom 21.

The bottom 21 of the buckle 3 is formed with a base 31, and the buckle 3 has a side 32 extending vertically upward at the positions on both sides of the base 31, and the side 32 is formed with at least one eaves at the joint with the base 31 Part 321 and a side groove 322, and the fastener 3 has a groove 33 formed between the base 31 and the two sides 32, and the eaves 321 integrally extends the side 32 of the side groove 322 toward the groove In addition, the main body is formed with a plurality of fins 34 on the side 32. At least one inclined portion 341 extends on the fins 34. The inclined portion 341 extends in the direction of the groove 33, and the wing A groove 342 is formed between the sheet 34 and the side 32, and at least one stopper 35 is formed at the front end of the side 32. The stopper 35 is formed on the side 32 and extends toward the groove 33, and the The buckle 3 is formed with a set of contact holes 36 on the base 31, and the circuit board 4 is arranged in the groove 33, and the bottom 21 of the heat sink 2 is attached to at least the top surface of the circuit board 4 A heat-generating electronic component 41, and the width between the two side extensions 23 of the heat sink 2 is consistent with the width of the circuit board 4 and the width of the groove 33, and the circuit board 4 is formed on one side of the baffle 35 There is a fixing hole 42, and the fixing hole 42 is formed on the set of connecting holes 36. After the set of connecting holes 36 and the fixing holes 42 are fixed by fixing elements, the fastener 3 and the circuit board 4 can be effectively positioned The relative position.

Please also refer to the aforementioned drawings and the diagrams shown in Figures 4 and 5, which are schematic diagrams 1 and 2 of the preferred embodiment of this creation. It can be clearly seen from the diagram that the circuit board 4 When set on the fastener 3, the circuit board 4 can be assembled above the fastener 3, and when the circuit board 4 passes through the inclined portion 341, the circuit board 4 is pressed against the inclined portion 341 and Drive the fin 34 to move on the side 32 until the circuit board 4 passes through the inclined portion 341, the fin 34 and the inclined portion 341 return to their original positions, and the circuit board 4 is disposed oppositely On the eaves 321, the circuit board 4 can further restrict its position in the groove 33 through the stopper 35, so that the setting position of the circuit board 4 does not exceed the fastener 3, and can also pass through the The baffle 35 prevents the circuit board 4 from being displaced in the groove 33; or, the circuit board 4 can be assembled behind the fastener 3, so that the circuit board 4 passes through the fastener 3 and is relatively disposed on the eaves 321, the circuit board 4 can be further restricted by the stopper 35 in its position in the groove 33, so that the position of the circuit board 4 does not exceed the fastener 3, and can also pass through the stopper 35 To prevent the circuit board 4 from being displaced in the groove 33, in addition, the heat sink 2 can be assembled in the groove 33. Similarly, the extended portion 23 of the heat sink 2 squeezes the inclined portion 341 and drive the wing 34 to move on the side 32 until the spread portion 23 passes through the inclined portion 341, and the inclined portion 341 returns to the original position. At this time, the inclined portion 341 is relatively locked to the On the extension portion 23 so that the bottom 21 of the heat sink 2 can be attached to the heating electronic component 41 on the top surface of the circuit board 4 and fixed between the inclined portion 341 and the eaves portion 321 with the circuit board 4, Thereby, when the heat sink 2 and the circuit board 4 are disposed in the groove 33, the circuit board 4 is disposed on the eaves 321, and the heating electronic component 41 on the upper side of the circuit board 4 is The bottom 21 of the radiator 2 is attached, and the extension 23 of the radiator 2 is clamped by the inclined portion 341, so that the circuit board 4 and the radiator 2 are assembled by the fastener 3 For the purpose of connecting and fixing, and at the same time achieve the effect of convenient disassembly and assembly, stable buckling and reduction of production cost, and the front side of the circuit board 4 can be blocked by the stopper, thereby achieving effective limit and displacement prevention In addition, the thermal energy of the heating electronic component 41 can achieve thermal convection through the arrangement of the side grooves 322 at the same time, so as to improve the heat dissipation efficiency of the heat dissipation module structure 1.

Please also refer to the aforementioned drawings and Fig. 6, which is the second assembly sectional view of the preferred embodiment of this creation, in which a heat conducting element 5 can be provided at the bottom 21 and the top of the circuit board 4, and The heat conducting element 5 on the bottom 21 is attached to the heating electronic component 41 and the groove 33 on the bottom surface of the circuit board 4, and the heat conducting element 5 on the top is attached to the heating electronic component 41 and the heat sink on the top surface of the circuit board 4 The bottom 21 of 2 so that the heat-generating electronic component 41 can conduct heat conduction through the fastener 3 and the heat sink 2 at the same time. In addition, at least one embedding groove can be provided on the extension portion 23. The inclined portions 341 are clamped so that the circuit board 4 and the heat sink 2 are assembled and fixed by the fastener 3.

Please also refer to the aforementioned drawings and Fig. 7, which is the third implementation diagram of the preferred embodiment of the creation, in which the circuit board 4 can be further restricted by the stopper 35 in its position in the groove 33 , So that the position of the circuit board 4 does not exceed the clip 3, and the position formed by the stopper 35 can extend upward, so that the heat sink 2 can be restricted to the groove through the stopper 35 33, so that the setting position of the radiator 2 does not exceed the clip 3, and the stopper 35 can also prevent the radiator 2 from moving in the groove 33, thereby achieving effective limit and prevention The effect of displacement.

The above has been a detailed description of this creation, but the above is only one of the preferred embodiments of this creation, and should not limit the scope of implementation of this creation, that is, all equal changes and modifications made in accordance with the scope of this creation application Etc., should still be covered by the patent of this creation.

1: Heat dissipation module structure 2: radiator 21: bottom 22: cooling fins 23: Exhibition Department 3: Buckle 31: Base 32: side 321: Eaves 322: Side Slot 33: Groove 34: Wings 341: Oblique 342: ditch 35: baffle 36: Assembly hole 4: circuit board 41: Heating electronic components 42: fixed hole 5: Thermal conductive parts

Figure 1 is a schematic diagram of the three-dimensional combination of the preferred embodiment of this creation. Figure 2 is a three-dimensional exploded schematic diagram of the preferred embodiment of the creation. Fig. 3 is a schematic diagram 1 of the assembled cross-sectional view of the preferred embodiment of the present creation. Figure 4 is the first implementation diagram of the preferred embodiment of this creation. Figure 5 is the second implementation diagram of the preferred embodiment of this creation. Figure 6 is a schematic diagram of a second assembly cross-sectional view of the preferred embodiment of this creation. Figure 7 is the third implementation diagram of the preferred embodiment of this creation.

1: Heat dissipation module structure

2: radiator

21: bottom

22: cooling fins

23: Exhibition Department

3: Buckle

31: Base

32: side

321: Eaves

322: Side Slot

33: Groove

34: Wings

341: Oblique

342: ditch

35: baffle

4: circuit board

41: Heating electronic components

Claims (11)

A heat dissipation module structure includes: A heat sink, the heat sink has a bottom and a plurality of heat dissipation fins extending vertically from the bottom surface, and the bottom side has at least one horizontal extension; A buckle, the buckle has a base, two sides of the base respectively extend vertically with one side and a groove is formed between the two sides for the heat sink and a circuit board to be arranged, and the side is provided with At least one eaves is used to match the bottom surface of the circuit board, and a plurality of fins spaced apart are formed on the side, and an oblique part for clamping the extension is extended on the fins, and the side At least one baffle is formed at the front end of the side, and the bottom of the heat sink is attached to at least one heating electronic component on the top surface of the circuit board and fixed with the circuit board between the inclined portion and the eaves, and The baffle is attached to the front side of the circuit board. The heat dissipation module structure according to claim 1, wherein a groove is formed between the fin and the side edge. The heat dissipation module structure according to claim 1, wherein the circuit board and the heat sink are fixedly arranged in the groove, and the width between the two side extensions and the width of the circuit board and the groove The width is the same. The heat dissipation module structure according to claim 1, wherein the inclined portion extends the fin integrally, and the inclined portion extends in the direction of the groove. The heat dissipation module structure according to claim 1, wherein the bottom of the heat sink may be provided with a heat conducting element, one side of the heat conducting element is attached to the bottom of the heat sink, and the other side is attached to the top surface of the circuit board At least one heat-generating electronic element is provided, and the bottom surface of the circuit board is provided with the heat-generating electronic element, and the heat-conducting element is provided between the heat-generating electronic element and the base. The heat dissipation module structure according to claim 1, wherein at least one embedding groove is provided on the extension portion for the inclined portions to be clamped. The heat dissipation module structure according to claim 1, wherein the baffle is formed on the side and extends toward the groove. The heat dissipation module structure according to claim 1, wherein a side groove is formed at the position of the side edge and the base relative to the eaves, and the eaves integrally extends the side of the side groove. The heat dissipation module structure according to claim 1, wherein a fixing hole is formed at one end of the circuit board. The heat dissipation module structure according to claim 9, wherein the fastener has a set of holes formed on the base, and the set of holes is formed opposite to the bottom of the fixing hole. The heat dissipation module structure according to claim 1, wherein the baffle is attached to the front side of the heat sink.

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