•1320302 λ、發明說明： 【發明所屬之技術領域】 本發明係涉及一種散熱模組，尤係涉及一種用於發熱 電子元件散熱之散熱模組。 【先前技術】BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat dissipation module, and more particularly to a heat dissipation module for heat dissipation of a heat-generating electronic component. [Prior Art]
隨者中央處理器（CPU)等發熱電子元件功率之不斷 提高，散熱問題越來越受到人們之重視，在電腦中尤為如 此，為了在有限之空間内高效地帶走系統產生之熱量，目 前業界主要採用由吸熱塊、散熱片、熱管及風扇組成之散 熱模組，將其安裝於CPU上，使吸熱塊與CPU良好接觸 以吸收CPU所產生之熱量。該方式之熱傳遞路徑為：CPU 產生之熱量經熱管傳到散熱片，再由風扇產生之氣流將傳 至散熱片之熱量帶走。 為了提高熱量從CPU到熱管間之傳導效率，在CPU 與熱管之間還設有一用熱傳導率比較高之材料製成之吸熱 塊。該吸熱塊呈水平板狀設計，具有一平面底面，與CPU 之外表面熱連接。CPU裝設於一電路板上，藉由一扣具將 該電路板與該吸熱塊鎖合在一起。該扣具與該吸熱塊之兩 對邊或者四個角相靠接。如此一來扣具施加在與吸熱塊相 接觸之部分之壓力要比其他部分大’亦即扣具施加在吸熱 塊上之壓力不均衡，其在中央部分之壓力要比兩邊或者四 個角上之壓力要小。吸熱塊周緣產生向下之輕微之彎曲變 形’而中央部分則輕微向上突起’從而與CPU之間形成微 小之間隙’使得吸熱塊之中央部分與CPU之間由於接觸不 6 • 1320302 夠緊密產生了相對較大之熱阻。然而一般情況下吸熱塊之 中央部分正對CPU之發熱核心，尤其對雙核之CPU來說， 其中心部分有兩個熱源點，易於在其中央部位形成熱區。 在以上之熱傳導路徑中，CPU與吸熱塊之間之熱阻， 往往在散熱模組中占很大之比重，CPU與吸熱塊在傳熱過 程中接觸是否緊密，對整體熱阻之大小有很大之影響。故 ^'此有效減小其接觸熱阻，就能大大提高散熱模組之散熱With the continuous improvement of the power of heat-generating electronic components such as central processing unit (CPU), the problem of heat dissipation has been paid more and more attention by people. This is especially true in computers, in order to efficiently remove the heat generated by the system in a limited space. The heat dissipation module consisting of a heat absorbing block, a heat sink, a heat pipe and a fan is mainly installed on the CPU, so that the heat absorbing block is in good contact with the CPU to absorb the heat generated by the CPU. The heat transfer path of this mode is that the heat generated by the CPU is transmitted to the heat sink through the heat pipe, and the air generated by the fan takes away the heat transferred to the heat sink. In order to improve the conduction efficiency of heat from the CPU to the heat pipe, a heat absorbing block made of a material having a relatively high thermal conductivity is provided between the CPU and the heat pipe. The heat absorbing block has a horizontal plate shape with a flat bottom surface and is thermally connected to the outer surface of the CPU. The CPU is mounted on a circuit board, and the circuit board is locked with the heat absorbing block by a buckle. The buckle is abutted against two or four corners of the heat absorbing block. In this way, the pressure exerted by the buckle on the portion in contact with the heat absorbing block is greater than that of the other portions, that is, the pressure exerted by the buckle on the heat absorbing block is unbalanced, and the pressure in the central portion is higher than the two sides or the four corners. The pressure is small. The periphery of the heat absorbing block produces a slight downward bending deformation and the central portion slightly protrudes upwards to form a slight gap between the CPU and the CPU. This makes the central portion of the heat absorbing block and the CPU not close to each other due to the contact 6 • 1320302. Relatively large thermal resistance. However, in general, the central portion of the heat absorbing block faces the heating core of the CPU. Especially for the dual-core CPU, the central portion has two heat source points, and it is easy to form a hot zone in the central portion thereof. In the above heat conduction path, the thermal resistance between the CPU and the heat absorbing block often occupies a large proportion in the heat dissipation module, and the CPU and the heat absorbing block are in close contact during the heat transfer process, and the overall thermal resistance is very large. Big influence. Therefore, 'this effectively reduces the thermal resistance of the contact, which can greatly improve the heat dissipation of the heat dissipation module.
>文率。 【發明内容】 ^ 有必要提供一種能與電子元件緊密接觸夕 散熱模組。 綱之 …、杈組’包括用於與發熱元件熱連接之—吸 :與該°及熱塊熱連接之—熱管以及與賴管熱連接 ^一凸起該吸熱塊與發熱元件連接之表面上設有向外之 二與該二應於發熱元件之熱源點位置，該熱 之一冷凝端熱連接t蒸發端以及與韻片組熱連 塊及模組’用於對發熱電子元件散熱，包括吸 訪厂…、塊固定至該發熱電子元件上之至少一 應之=熱塊之中央部位向下突出形成與發熱電子元件 :，：該:起=該固定件向下施力使該吸熱塊之邊緣 電子元件之/趣熱塊由於受力而產生之形變，讓發 部分皆與吸熱塊緊密貼實。 與習知技術相比，該散熱模組之吸熱塊與電子元件 7 •1320302 觸之表面形成向外之凸起，可以彌補吸熱塊中央與電子元 •件之間由於圓定時之變形所產生之間隙，使吸熱塊與電子 元件充分接艄，提高散熱模組之散熱效率。 【實施方式3 如圖1矣圖3所示為本發明散熱模組之一個較佳實施 例，該散熱槔組包括一風扇10、—鰭片組20、一熱管3〇、 一吸熱塊，及一對將該散熱模組鎖合在電路板90上之 彈片50。 風扇10包括一殼體101 ’殼體101内設有一扇輪60， 殼體101之/側形成出風口 70，供風扇10產生之氣流通 過。殼體1〇1之另一側向外延伸形成一底座102，底座102 之中央形成/孔洞ι〇3,孔洞103兩側分別形成一板體 比4,每一板雜104上設有三個大小相同、等距排列之銷釘 105，用於固定彈片5〇。孔洞103呈方形，其大小與熱管 3〇之外殼之Λ小相當’且對應該孔洞1〇3在底座1〇2下方 設有一用於收容吸熱塊40之凹槽106 (圖3)，該凹槽106 之大小與吸鈐塊40相當。底座102之上側形成一容置槽 107,該容置槽1〇7用於定位熱管30且與孔洞1〇3相連通。 該風扇ίο之麩體101與底座1〇2通常由壓鑄之方式一體成 型製成。 妹片組設置在風扇10之出風口 70處’由複數平行 相間排列之銪片21組成’相鄰之兩韓片21之間形成供氣 流通過之 流道22。熱管30呈扁平彎曲形，包括一蒸發端 301和一冷凝端302,蒸發端301放置在底座102之容置糟 •1320302 107中’熱管30之冷凝端302呈彎曲延伸與鰭片組20相 連接。 兩個彈片50結構形狀相同，均為平面彎曲型結構，每 一彈片50包括一結合部51和第一、第二鎖合部52、53， 結合部51呈縱長直線狀，於其中間部位沿縱向設有三個大 小相同、等距排列之固定孔5〇1，其大小與風扇1〇之底座 102上之銷釘105大小相應，且各固定孔501之間的間距 與各銷釘1〇5之間的間距相同。第一鎖合部52和第二鎖合 部53分別從結合部51之兩端反向彎曲延伸形成，其形狀 貌似字母“L” ，且呈相向設置。在第一鎖合部52之末端 設有一個腰形裝配孔502’在第二鎖合部53之末端設有另 —個圓形裝配孔503。兩個裝配孔502、503呈不同型態， 主要係考慮到散熱模組與電路板90組裝時之配合公差問 題’在滿足公差之前提下，上述裝配孔502、503亦可為相 同之形狀如圓形。上述鎖合部52、53設置成彎曲形，可有 政地增加彈性臂之有效長度，以便於扣合固定時提供更加 穩定之扣合壓力，避免鎖合部52、53在豎直方向之輕微變 形即觸發扣合壓力之極劇變化。 請參考圖3與圖4’該吸熱塊4〇設置于底座1〇2下方 之凹槽106内，其大小與凹槽106之形狀相對應，該吸熱 塊40之上表面透過底座1〇2之孔洞1〇3與熱管3〇之蒸發 端301相接觸，二者之間可直接藉由焊接固定，亦可藉由 熱介面材料，如導熱膏80相接觸，吸熱塊4〇之下表面設 置—圓形凸起41，該圓形凸起41從四周朝中心呈微弧之 9 •1320302 突起之結構，該凸起41呈球面突出，且該凸起41之中心 與吸熱塊40之中心、大致重合，即該凸起41大致位於吸熱 塊40之中央，該吸熱塊4〇之下表面用於與電路板卯上之 電子元件，如CPU100結合，從而將CPU100產生之熱量 傳遞至熱官30並藉由籍片組2〇散發至外界環境中，為提 升傳熱效果，該吸熱塊40較佳為用銅製成。 該散熱模組組裝時，鰭片組20設置在風扇1〇之出風 口 7〇處’熱管30之蒸發端301置於底座102之容置槽1〇7 内，冷凝端302彎曲延伸與鰭片組2〇之上表面連接，吸熱 塊40設置于底座102下方之凹槽1〇6内，藉由彈片5〇上 之固疋孔501與底座1〇2上之銷釘1〇5之結合來固定彈片 5〇至底座102上，將四顆螺絲（圖未示）穿過兩個彈片5〇 上之裝配孔502、503把散熱模組鎖合至電路板9〇上。其 中，該吸熱塊40之凸起對應與CPU100之中心最熱部分即 熱源點處接觸。由於底座1〇2以及吸熱塊40主要靠四周之 螺絲之作用力來固定在電路板9〇上，且螺絲之作用力施加 於彈片50上，彈片50抵置於板体1〇4之邊緣，吸熱塊位 于兩板体104之間之部位，從而吸熱塊40之周緣受到之力 比其中間部分大，故周緣部分產生之形變相對較大。而吸 熱塊40中央形成向下突出之凸起41，使中央比周緣部分 之位置要低，故吸熱塊40之底面最終之形變結果為近似於 一個平面’使得吸熱塊40每一部分都與CPU100緊密接 觸。因而CPU100中心部分之熱量能及時之傳遞到吸熱塊 40 ’降低了 CPU100與吸熱塊40之間之接觸熱阻，進而避 •1320302 :免了熱區之產生，能約保證cpui()()安全正常之工作 凸起41之高度可根據彈片50施力之大小及吸熱塊4〇之^ 形程度來確定，比如針對CPU散熱而言，該凸起41之古 度係控制在0.1mm左右或小於〇 —。 间 工作時’該吸熱塊4G與CPU1GG熱接觸並快速吸收A 產生之H將熱量傳遞至與該吸熱塊扣熱接觸之熱管 3〇,蒸發端3G1，再由熱管％將熱量傳到鰭片組如、，、、 後錯由風扇10產生之氣流與該韓片組2Q發生熱交換 熱量最終散發到環境中去，以達到快速有效散熱之目的。、 本發明於吸熱塊40之下表面形成-個圓形凸起41， 用螺絲進行蚊時，使其與CPU1GG各部分均保持良好 勻之接觸以提升散熱性能。實際上由於加在cpm⑽各個 刀之力與吸熱塊40之形狀相關，可以藉由改變吸熱塊 40之具體形狀來適應不同熱載荷之cpui〇〇，如上述凸起 41之週邊輪廓除圓形之外，還可為方形，三角形，或多邊 形結構。吸熱塊40之下表面還可以設置多個凸起，如兩 個、二個或四個等’以適合具有多個熱源點之雙核和多核 ^理器之散熱，或者同時適合多個不同之發熱電子元件之 政熱。同時，該凸起41之外表面除了呈微弧之球面突出形 狀之外，還可設計成其他形狀，比如根據電子元件之表面 輪鄭形狀設計成符合其特定需求之凸起形狀。請參照圖5 與圖6，該實施例中吸熱塊40a之下表面設置兩個高度不 大於0.1mm之圓形凸起41 ’對於雙核之cpu來說，該吸 熱塊40a之兩個凸起4i可分別對應於其中心部分之兩個熱 11 •1320302 -源點，將CPU之熱量快速地散發。如圖7與圖8所示為本 ‘發明之又一實施例，該吸熱塊40b之下表面對應CPU形成 高度不大於0.05mm之方形凸起41b，該方形凸起41b具有 與CPU接觸之一平整底面411，當然該凸起41b亦可形成 為圓形等其他形狀。 下表中所示為本發明之散熱模組與習知之散熱模組實 驗測試資料，本發明之散熱模組分別採用具有兩個和三個 凸起之吸熱塊，CPU為多核心結構。> SUMMARY OF THE INVENTION It is necessary to provide a heat dissipation module that can be in close contact with electronic components. The ..., the group 'includes for the thermal connection with the heating element - the suction: the heat pipe connected to the ° and the heat block - the heat pipe and the heat pipe connected to the heat pipe ^ a bump on the surface of the heat sink connected to the heating element The outer two and the heat source point of the heating element are disposed, the heat condensation end of the heat is connected to the evaporation end and the heat block and the module of the rhyme group are used for dissipating heat to the heat-generating electronic component, including At least one of the blocks to be fixed to the heat-generating electronic component = the central portion of the heat block protrudes downwardly to form a heat-generating electronic component:::: the fixed member is biased downward to make the heat-absorbing block The edge of the electronic component / the hot block is deformed by the force, so that the hair part is closely adhered to the heat absorbing block. Compared with the prior art, the heat absorbing block of the heat dissipation module and the surface of the electronic component 7 • 1320302 form an outward protrusion, which can compensate for the deformation of the center of the heat absorbing block and the electronic component due to the round timing. The gap makes the heat absorbing block and the electronic component fully connected, thereby improving the heat dissipation efficiency of the heat dissipation module. [Embodiment 3] As shown in FIG. 1 and FIG. 3, a heat dissipation unit of the present invention includes a fan 10, a fin group 20, a heat pipe 3〇, a heat absorption block, and A pair of elastic pieces 50 that lock the heat dissipation module on the circuit board 90. The fan 10 includes a housing 101. A housing wheel 101 is provided with a fan wheel 60. The side of the housing 101 forms an air outlet 70 for the airflow generated by the fan 10 to pass. The other side of the housing 1〇1 extends outwardly to form a base 102. The center of the base 102 is formed/hole ι〇3, and a hole ratio 4 is formed on each side of the hole 103, and each board 104 is provided with three sizes. The same, equidistantly arranged pins 105 are used to secure the shrapnel 5〇. The hole 103 is square and has a size corresponding to the size of the outer casing of the heat pipe 3' and corresponding to the hole 1〇3 is provided below the base 1〇2 with a groove 106 for receiving the heat absorption block 40 (Fig. 3). The slot 106 is sized to be comparable to the suction block 40. An accommodating groove 107 is formed on the upper side of the base 102 for positioning the heat pipe 30 and communicating with the hole 1〇3. The brazed body 101 of the fan ίο and the base 1〇2 are usually integrally formed by die casting. The sister group is disposed at the air outlet 70 of the fan 10, which is composed of a plurality of parallel-arranged cymbals 21, and a flow path 22 through which a supply air flows is formed between the adjacent two Korean sheets 21. The heat pipe 30 has a flat curved shape, and includes an evaporation end 301 and a condensation end 302. The evaporation end 301 is placed in the accommodating case 1320302 107 of the base 102. The condensation end 302 of the heat pipe 30 is bent and extended to connect with the fin group 20. . The two elastic pieces 50 have the same structural shape and are flat curved structures. Each elastic piece 50 includes a joint portion 51 and first and second locking portions 52 and 53. The joint portion 51 has a longitudinally long straight line shape at the middle portion thereof. There are three fixing holes 5〇1 of the same size and equidistant arrangement in the longitudinal direction, the size of which corresponds to the size of the pins 105 on the base 102 of the fan 1 , and the spacing between the fixing holes 501 and the pins 1〇5 The spacing between the two is the same. The first latching portion 52 and the second latching portion 53 are respectively formed by inversely bending and extending from both ends of the joint portion 51, and have a shape resembling the letter "L" and disposed in opposite directions. A waist-shaped fitting hole 502' is provided at the end of the first locking portion 52, and another circular fitting hole 503 is provided at the end of the second locking portion 53. The two mounting holes 502, 503 are in different types, mainly considering the tolerance problem of the assembly of the heat dissipation module and the circuit board 90. Before the tolerance is satisfied, the assembly holes 502, 503 can also have the same shape. Round. The locking portions 52, 53 are arranged in a curved shape, and can effectively increase the effective length of the elastic arms, so as to provide a more stable fastening pressure when the fastening is fastened, and to prevent the locking portions 52, 53 from being slightly vertical. The deformation triggers a dramatic change in the fastening pressure. Referring to FIG. 3 and FIG. 4, the heat absorbing block 4 is disposed in the recess 106 below the base 1 〇 2, and the size thereof corresponds to the shape of the recess 106. The upper surface of the heat absorbing block 40 passes through the base 1 〇 2 The hole 1〇3 is in contact with the evaporation end 301 of the heat pipe 3〇, and the two can be directly fixed by welding, or can be contacted by a thermal interface material such as the thermal paste 80, and the surface of the heat absorption block 4〇 is disposed. a circular protrusion 41 having a 9:1320302 protrusion structure with a micro-arc from the periphery toward the center, the protrusion 41 is spherically protruded, and the center of the protrusion 41 and the center of the heat absorption block 40 are substantially The protrusion 41 is located substantially at the center of the heat absorbing block 40. The lower surface of the heat absorbing block 4 is used for combining with electronic components on the circuit board, such as the CPU 100, to transfer the heat generated by the CPU 100 to the heat officer 30. The heat absorbing block 40 is preferably made of copper in order to enhance the heat transfer effect by the film group 2 〇 being emitted to the external environment. When the heat dissipation module is assembled, the fin group 20 is disposed at the air outlet 7 of the fan 1 'the evaporation end 301 of the heat pipe 30 is placed in the receiving groove 1〇7 of the base 102, and the condensation end 302 is bent and extended with the fin The upper surface of the group 2 is connected, and the heat absorbing block 40 is disposed in the groove 1〇6 below the base 102, and is fixed by the combination of the fixing hole 501 on the elastic piece 5 and the pin 1〇5 on the base 1〇2. The elastic piece 5 is attached to the base plate 102, and four screws (not shown) are passed through the mounting holes 502 and 503 of the two elastic pieces 5 to lock the heat dissipation module to the circuit board 9 。. The protrusion of the heat absorbing block 40 corresponds to the hottest portion of the center of the CPU 100, that is, the heat source point. Since the base 1〇2 and the heat absorbing block 40 are mainly fixed on the circuit board 9 by the force of the screws around, and the force of the screw is applied to the elastic piece 50, the elastic piece 50 is placed on the edge of the plate body 1〇4. The heat absorbing block is located at a portion between the two plates 104, so that the peripheral edge of the heat absorbing block 40 is subjected to a greater force than the middle portion thereof, so that the deformation of the peripheral portion is relatively large. The central portion of the heat absorbing block 40 is formed with a downwardly projecting projection 41 so that the center is lower than the peripheral portion, so that the bottom surface of the heat absorbing block 40 is finally deformed to be approximately one plane so that each portion of the heat absorbing block 40 is closely related to the CPU 100. contact. Therefore, the heat of the central portion of the CPU 100 can be transferred to the heat absorbing block 40 in time. The contact thermal resistance between the CPU 100 and the heat absorbing block 40 is lowered, and the 1320302 is avoided. The hot zone is avoided, and the cpui()() can be secured. The height of the normal working protrusion 41 can be determined according to the magnitude of the force applied by the elastic piece 50 and the degree of the shape of the heat absorbing block 4, for example, for the heat dissipation of the CPU, the ancient degree of the protrusion 41 is controlled to be about 0.1 mm or less. 〇—. During operation, the heat absorbing block 4G is in thermal contact with the CPU 1GG and rapidly absorbs the heat generated by A. The heat is transferred to the heat pipe 3 热 which is in thermal contact with the heat absorbing block, the evaporation end 3G1, and the heat is transferred to the fin group by the heat pipe %. For example, the airflow generated by the fan 10 and the heat exchange heat of the Korean group 2Q are finally radiated to the environment to achieve rapid and effective heat dissipation. The invention forms a circular protrusion 41 on the lower surface of the heat absorbing block 40, and when the mosquito is screwed, it is kept in good contact with each part of the CPU 1GG to improve the heat dissipation performance. In fact, since the force of each knife applied to the cpm (10) is related to the shape of the heat absorbing block 40, the cpui 不同 of different thermal loads can be adapted by changing the specific shape of the heat absorbing block 40, such as the peripheral contour of the above-mentioned protrusion 41 except a circle. In addition, it can be a square, triangle, or polygonal structure. The lower surface of the heat absorbing block 40 may also be provided with a plurality of protrusions, such as two, two or four, etc., to suit the heat dissipation of the dual-core and multi-core processors having multiple heat source points, or at the same time, to suit a plurality of different heat generations. The political heat of electronic components. At the same time, the outer surface of the projection 41 may be designed in other shapes in addition to the spherical protrusion shape of the micro-arc, such as a convex shape designed to meet the specific requirements according to the surface shape of the electronic component. Referring to FIG. 5 and FIG. 6, in the embodiment, two circular protrusions 41 having a height of not more than 0.1 mm are disposed on the lower surface of the heat absorption block 40a. For the dual-core cpu, the two protrusions 4i of the heat absorption block 40a are provided. The heat of the CPU can be quickly dissipated by corresponding to the two hot 11 • 1320302 - source points in its central portion. As shown in FIG. 7 and FIG. 8 , in another embodiment of the present invention, the lower surface of the heat absorbing block 40b is formed by a square protrusion 41b having a height of not more than 0.05 mm corresponding to the CPU, and the square protrusion 41b has one of contact with the CPU. The bottom surface 411 is flattened. Of course, the protrusion 41b may be formed in other shapes such as a circle. The following table shows the experimental data of the heat dissipation module of the present invention and the conventional heat dissipation module. The heat dissipation module of the present invention respectively adopts a heat absorption block having two and three protrusions, and the CPU has a multi-core structure.
部位 習知技術（未設 凸起之平板狀 吸熱塊） 本發明實施例 一（具兩個凸起 之吸熱塊） 本發明實施例 二（具三個凸起 之吸熱塊） 执管 *、，Ν ο 73.4。。 70.8。。 71V CPU表面 92。。 88 °C 89 °C CPU其中一核 心 89。。 86。。 86。。 CPU其中另一 核心 89 V 87 V 86 °C CPU與熱管之 溫差 18.6〇C 17.2V 18°C 由表1可知，運用本發明中有兩個或三個凸起之吸熱 塊之散熱模組，各部件之溫度均比習知技術中應用平板狀 吸熱塊之散熱模組低，而且CPU與熱管之溫差亦有所下 12 1320302 .降，散熱效果明顯提高。 表2所示為本發明運用如圖7-8所示之吸熱塊之散熱 模組與習知之散熱模組實驗測試資料，散熱模組採用具有 平整底面之方形凸起之吸熱塊。CPU為雙核結構。 表2Part of the prior art (flat-shaped heat-absorbing block without protrusions) Embodiment 1 of the present invention (heat-absorbing block with two protrusions) Embodiment 2 of the present invention (heat-absorbing block with three protrusions) Ν ο 73.4. . 70.8. . 71V CPU surface 92. . 88 °C 89 °C One core of the CPU 89. . 86. . 86. . Another core of the CPU, 89 V 87 V 86 °C, the temperature difference between the CPU and the heat pipe is 18.6 〇C 17.2V 18 °C. As can be seen from Table 1, the heat dissipation module having two or three raised heat absorbing blocks in the present invention is used. The temperature of each component is lower than that of the heat-dissipating module using the flat-shaped heat-absorbing block in the prior art, and the temperature difference between the CPU and the heat pipe is also reduced by 12 1320302. The heat dissipation effect is obviously improved. Table 2 shows the experimental test data of the heat dissipating module of the heat absorbing block shown in Fig. 7-8 and the conventional heat dissipating module according to the present invention. The heat dissipating module adopts a heat absorbing block with a square convex surface with a flat bottom surface. The CPU is a dual core structure. Table 2
部位 習知技術（未設凸起 之平板狀吸熱塊） 本發明實例三（具方 形凸起之吸熱塊） 孰管 73.4。。 70.3〇C CPU表面 92 °C 86 °C CPU其中一核心 89 V 83 °C CPU另一核心 89 V 83。。 CPU與熱管之溫差 18.6V 15.7 V 從上可知，運用本發明中具有平整底面之方形凸起之 吸熱塊之散熱模組，各部件之溫度均比習知技術中未設凸 起之吸熱塊之散熱模組低，CPU與熱管表面上之溫差亦大 大下降，導熱性能大幅度提高。 綜上所述，在吸熱塊上形成凸起，使其能與CPU充分 接觸，提升散熱模組之性能，並且，該發明係一種可以廣 泛應用之散熱結構，在提升性能之同時，成本不會增加， 通用性強，適用各種散熱產品。 在以上實施例中，係採用彈片50作為固定件來固定散 熱模組。當然，除了使用彈片外，還可採用技術人士所熟 知之其他形式之固定件，比如彈簧螺絲、金屬絲線性扣具 13 1320302 •:或其他卡扣結構等。 綜上所述，本發明符合發明專利要件，爰依法提出專 利申請。惟，以上所述者僅為本發明之較佳實施例，舉凡 熟悉本案技藝之人士，在爰依本發明精神所作之等效修飾 ' 或變化，皆應涵蓋於以下之申請專利範圍内。 【圖式簡單說明】 圖1係本發明散熱模組第一實施例之立體分解圖。 圖2係圖1之立體組裝圖。 • 圖3係該散熱模組另一角度立體組裝圖。 圖4係圖3中吸熱塊沿IV-IV線剖示圖。 圖5係吸熱塊第二實施例立體示意圖。 圖6係圖5沿VI-VI線之剖示圖。 圖7係吸熱塊第三實施例立體示意圖。 圖8係圖7沿VIII-VIII線之剖示圖。 【主要元件符號說明】 風扇 10 CPU 100 殼體 101 底座 102 孔洞 103 板體 104 銷釘 105 凹槽 106 容置槽 107 鰭片組 20 鰭片 21 流道 22 孰管 30 蒸發端 301 冷凝端 302 吸熱塊 40 、 40a 、 40b 凸起 41 、 41b 底面 411 彈片 50 結合部 51 鎖合部 52 ' 53 固定孔 501 裝配孔 502、503 扇輪 60 出風口 70 導熱膏 80 14 1320302 電路板 90Position Conventional technique (flat heat-absorbing block without protrusion) Example 3 of the present invention (heat-absorbing block with square protrusions) tube 73.4. . 70.3〇C CPU surface 92 °C 86 °C CPU one core 89 V 83 °C CPU another core 89 V 83. . The temperature difference between the CPU and the heat pipe is 18.6 V. 15.7 V. From the above, the heat dissipation module of the heat absorbing block having the square protrusion of the flat bottom surface is used, and the temperature of each component is higher than that of the heat absorbing block which is not provided with protrusions in the prior art. The heat dissipation module is low, the temperature difference between the CPU and the heat pipe surface is also greatly reduced, and the thermal conductivity is greatly improved. In summary, the protrusion is formed on the heat absorbing block so that it can fully contact the CPU to improve the performance of the heat dissipation module, and the invention is a heat dissipation structure that can be widely applied, and the cost is not improved while improving performance. Increased, versatile, suitable for all kinds of heat dissipation products. In the above embodiment, the elastic piece 50 is used as a fixing member to fix the heat dissipation module. Of course, in addition to the use of shrapnel, other forms of fasteners known to the skilled person, such as spring screws, wire linear fasteners 13 1320302 • or other snap-on structures, may be used. In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. The above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art will be covered by the following claims. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is an exploded perspective view of a first embodiment of a heat dissipation module of the present invention. 2 is a perspective assembled view of FIG. 1. • Figure 3 is a perspective view of the heat dissipation module at another angle. Figure 4 is a cross-sectional view of the heat absorbing block of Figure 3 taken along line IV-IV. Fig. 5 is a perspective view showing a second embodiment of the heat absorbing block. Figure 6 is a cross-sectional view taken along line VI-VI of Figure 5. Figure 7 is a perspective view of a third embodiment of the heat absorbing block. Figure 8 is a cross-sectional view taken along line VIII-VIII of Figure 7. [Description of main component symbols] Fan 10 CPU 100 Housing 101 Base 102 Hole 103 Plate 104 Pin 105 Groove 106 Socket groove 107 Fin set 20 Fin 21 Flow path 22 Tube 30 Evaporation end 301 Condensation end 302 Heat absorbing block 40, 40a, 40b Projection 41, 41b Bottom surface 411 Shrapnel 50 Joint portion 51 Locking portion 52' 53 Fixing hole 501 Mounting hole 502, 503 Fan wheel 60 Air outlet 70 Thermal paste 80 14 1320302 Circuit board 90
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