200820883 龙、發明說明： 【發明所屬之技術領域】 本發明係涉及一種散熱模組’尤係涉及一種用於#熱 電子元件散熱之散熱模組。 ^ 【先前技術】200820883 Long, invention description: [Technical field of the invention] The present invention relates to a heat dissipation module ’ particularly relates to a heat dissipation module for heat dissipation of #热电子元件. ^ [Prior Art]
隨著中央處理器（CPU)等發熱電子元件功率之不斷 提高，散熱問題越來越受到人們之重視，在電腦中尤為如 此，為了在有限之空間内高效地帶走系統產生之熱量，目 前業界主要採用由吸熱塊、散熱片、熱管及風扇組成之散 熱模組，將其安裝於CPU上，使吸熱塊與CPU良好接觸 以吸收CPU所產生之熱量。該方式之熱傳遞路徑為：CPU 產生之熱量經熱管傳到散熱片’再由風扇產生之氣流將傳 至散熱片之熱量帶走。 為了提高熱量從CPU到熱管間之傳導效率，在cpu 與熱管之間還設有一用熱傳導率比較高之材料製成之吸熱 塊。該吸熱塊呈水平板狀設計，具有一平面底面，與cPU 之外表面熱連接。CPU裝設於一電路板上，藉由一扣具將 該電路板與該吸熱塊鎖合在一起。該扣具與該吸熱塊之兩 對邊或者四個角相靠接。如此一來扣具施加在與吸熱塊相 接觸之部分之壓力要比其他部分大，亦即扣具施加在吸熱 塊上之壓力不均衡，其在中央部分之壓力要比兩邊或者四 個角上之壓力要小。吸熱塊周緣產生向下之輕微之彎曲變 形’而中央部分則輕微向上突起，從而與CPU之間形成微 小之間隙，使得吸熱塊之中央部分與CPU之間由於接觸不 200820883 夠緊密產生了相對較大之熱阻。然而—般情況下吸熱塊之 中央部分正對CPU之發_心，尤其對雙敎咖來戈， 其中心部分有兩個熱源點1於在其中央部位形成熱區。 在以上之熱傳導路徑中，CPU與吸熱塊之間之哉阻， 往往在散減組巾比重，CPU與吸減在傳執過 程中接觸是否緊密’對整體熱阻之大小有很大之影響With the continuous improvement of the power of heat-generating electronic components such as central processing units (CPUs), the problem of heat dissipation has received more and more attention. This is especially true in computers, in order to efficiently remove the heat generated by the system in a limited space. The heat dissipation module consisting of a heat absorbing block, a heat sink, a heat pipe and a fan is mainly installed on the CPU, so that the heat absorbing block is in good contact with the CPU to absorb the heat generated by the CPU. The heat transfer path of this mode is that the heat generated by the CPU is transmitted to the heat sink through the heat pipe, and the air generated by the fan carries away the heat transferred to the heat sink. In order to improve the conduction efficiency of heat from the CPU to the heat pipe, a heat absorbing block made of a material having a relatively high thermal conductivity is provided between the cpu and the heat pipe. The heat absorbing block has a horizontal plate shape with a flat bottom surface and is thermally connected to the outer surface of the cPU. The CPU is mounted on a circuit board, and the circuit board is locked with the heat absorbing block by a buckle. The buckle is abutted against two or four corners of the heat absorbing block. In this way, the pressure applied by the buckle to the portion in contact with the heat absorbing block is greater than that of the other portions, that is, the pressure exerted by the buckle on the heat absorbing block is unbalanced, and the pressure in the central portion is higher than the two sides or the four corners. The pressure is small. The periphery of the heat absorbing block produces a slight downward bending deformation, and the central portion slightly protrudes upward, thereby forming a slight gap with the CPU, so that the central portion of the heat absorbing block and the CPU are relatively close to each other due to the contact not being 200820883. Great heat resistance. However, in general, the central part of the heat absorbing block is facing the heart of the CPU, especially for the double 敎 来 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , In the above heat conduction path, the resistance between the CPU and the heat absorbing block tends to reduce the proportion of the tissue, and whether the CPU and the suction are in close contact during the transfer process have a great influence on the overall thermal resistance.
若能有效減小其接職a，絲大大提高散賊組之散執 效率。 “、、 【發明内容】 有鑒於此，有必要提供一種能與電子元件緊密接觸之 散熱模組。 一種散熱模組，包括用於與發熱元件熱連接之一吸熱 塊、與該吸熱塊熱連接之一熱管以及與該熱管熱連接之一 鰭片組，該吸熱塊與發熱元件連接之表面上設有向外之至 少一凸起，該凸起對應於發熱元件之熱源點位置，該熱管 包括與該吸熱塊熱連接之一蒸發端以及與該鰭片組熱連接 之一冷凝端。 一種散熱模組，用於對發熱電子元件散熱，包括吸熱 塊及將該吸熱塊固定至該發熱電子元件上之至少一固定 件，該吸熱塊之中央部位向下突出形成與發熱電子元件對 應之一凸起，同時該固定件向下施力使該吸熱塊之邊緣受 力，使該凸起彌補吸熱塊由於受力而產生之形變，讓發熱 電子元件之每一部分皆與吸熱塊緊密貼實。 與習知技術相比，該散熱模組之吸熱塊與電子元件接 7 200820883 龜 觸之表面形成向外之凸起，可以彌補吸熱塊中央與電子元 •件之間由於固定時之變形所產生之間隙，使吸熱塊與電子 元件充分接觸，提高散熱模組之散熱效率。 【實施方式】 如圖1至圖3所示為本發明散熱模組之一個較佳實施 例，該散熱模組包括一風扇10、一鰭片組20、一熱管3〇、 一吸熱塊40，及一對將該散熱模組鎖合在電路板9〇上之 彈片50。 • 風扇10包括一殼體101，殼體101内設有一扇輪60， 殼體101之一侧形成出風口 70，供風扇10產生之氣流通 過。殼體101之另一侧向外延伸形成一底座102,底座1〇2 之中央形成一孔洞103,孔洞103兩侧分別形成一板體 104，每一板體104上設有三個大小相同、等距排列之銷釘 105，用於固定彈片50。孔洞1〇3呈方形，其大小與熱管 30之外殼之大小相當，且對應該孔洞103在底座1〇2下方 鲁 設有一用於收容吸熱塊40之凹槽1〇6 (圖3)，該凹槽106 之大小與吸熱塊40相當。底座102之上侧形成一容置槽 107 ’該容置槽107用於定位熱管30且與孔洞103相連通。 該風扇10之殼體101與底座102通常由壓鑄之方式一體成 型製成。 鰭片組20設置在風扇10之出風口 70處，由複數平行 相間排列之鰭片21組成，相鄰之兩鰭片21之間形成供氣 流通過之流道22。熱管30呈扁平彎曲形，包括一蒸發端 301和一冷凝端302,蒸發端301放置在底座1〇2之容置槽 8 200820883 107中’熱管30之冷凝端302呈彎曲延伸與鰭片組20相 連接。 兩個彈片50結構形狀相同，均為平面彎曲型結構，每 一彈片50包括一結合部51和第一、第二鎖合部52、53， 結合部51呈縱長直線狀，於其中間部位沿縱向設有三個大 小相同、等距排列之固定孔5〇1，其大小與風扇1〇之底座 102上之銷釘1〇5大小相應，且各固定孔5〇1之間的間距 與各銷釘105之間的間距相同。第一鎖合部52和第二鎖合 部53分別從結合部51之兩端反向彎曲延伸形成，其形狀 貌似字母“L” ，且呈相向設置。在第一鎖合部52之末端 設有一個腰形裝配孔502,在第二鎖合部53之末端設有另 一個圓形裝配孔503。兩個裝配孔502、503呈不同型態， 主要係考慮到散熱模組與電路板90組裝時之配合公差問 題’在滿足公差之前提下，上述裝配孔5〇2、5〇3亦可為相 同之形狀如圓形。上述鎖合部52、53設置成彎曲形，可有 效地增加彈性臂之有效長度，以便於扣合固定時提供更加 穩定之扣合壓力’避免鎖合部52、53在豎直方向之輕微變 形即觸發扣合壓力之極劇變化。 請參考圖3與圖4,該吸熱塊40設置于底座1〇2下方 之凹槽106内，其大小與凹槽1〇6之形狀相對應，該吸熱 塊40之上表面透過底座102之孔洞103與熱管30之蒸發 端301相接觸，二者之間可直接藉由焊接固定，亦可籍由 熱介面材料，如導熱膏80相接觸，吸熱塊40之下表面設 置一圓形凸起41，該圓形凸起41從四周朝中心呈微弧之 9 200820883 突起之結構，該凸起41呈球面突出，且該凸起41之中心 與吸熱塊4G之中心大致重合，即該凸起41大致位於吸熱 鬼40之中央’該吸熱塊4〇之下表面用於與電路板上之 電子兀件，如CPU10G結合，從而將cpui〇〇產生之熱量 傳遞至熱官30並藉由鰭片組2〇散發至外界環境中，為提 升傳熱效果，該吸熱塊4〇較佳為用銅製成。 該散熱模組組裝時，鰭片組2〇設置在風扇1〇之出風 口 70處，熱管30之蒸發端301置於底座1〇2之容置槽1〇7 内，冷凝端302彎曲延伸與鰭片組2〇之上表面連接，吸熱 塊40設置于底座1〇2下方之凹槽1〇6内，藉由彈片上 之固定孔501與底座1〇2上之銷釘1〇5之結合來固定彈片 50至底座1〇2上’將四顆螺絲（圖未示）穿過兩個彈片％ 上之裝配孔502、503把散熱模組鎖合至電路板90上。其 中’該吸熱塊40之凸起對應與CPU100之中心最熱部分即 熱源點處接觸。由於底座1〇2以及吸熱塊4〇主要靠四周之 螺絲之作用力來固定在電路板90上，且螺絲之作用力施加 於彈片50上，彈片50抵置於板体104之邊緣，吸熱塊位 于兩板体104之間之部位，從而吸熱塊40之周緣受到之力 比其中間部分大，故周緣部分產生之形變相對較大。而吸 熱塊40中央形成向下突出之凸起41，使中央比周緣部分 之位置要低，故吸熱塊40之底面最終之形變結果為近似於 一個平面，使得吸熱塊40每一部分都與CPU100緊密接 觸。因而CPU100中心部分之熱量能及時之傳遞到吸熱塊 40，降低了 CPU100與吸熱塊40之間之接觸熱阻’進而避 200820883 •免了熱區之產生，能夠保證cpul〇〇安全正常之工作。該 凸起41之高度可根據彈片5〇施力之大小及吸熱塊4〇之變 形程度來確定，比如針對cpu散熱而言，該凸起41之高 度係控制在0.1mm左右或小於〇 lmm。 工作時’該吸熱塊40與CPU100熱接觸並快速吸收其 產生之熱量’並將熱量傳遞至與該吸熱塊4〇熱接觸之熱管 3〇之蒸發端301，再由熱管30將熱量傳到鰭片組2〇，最 後藉由風扇1〇產生之氣流與該鰭片組2〇發生熱交換，將 熱量最終散發到環境中去，以達到快速有效散熱之目的。、 本發明於吸熱塊40之下表面形成一個圓形凸起41， 用螺絲進行固定時，使其與CPU1〇〇各部分均保持良好均 勻之接觸以提升散熱性能。實際上由於加在cpm〇〇各個 部分之力與吸熱塊40之形狀相關，可以藉由改變吸熱塊 40之具體形狀來適應不同熱載荷之cpul〇〇，如上述凸起 41之週邊輪廓除圓形之外，還可為方形，三角形，或多邊 • 形結構。吸熱塊40之下表面還可以設置多個凸起，如兩 個、三個或四個等，以適合具有多個熱源點之雙核和多核 處理器之散熱，或者同時適合多個不同之發熱電子元件之 散熱。同時，該凸起41之外表面除了呈微弧之球面突出形 狀之外，還可設计成其他形狀，比如根據電子元件之表面 輪廓形狀設計減合其狀需求q起·。請參照圖5 與圖6,該實施例中吸熱塊40a之下表面設置兩個高度不 大於0.1mm之圓形凸起41，對於雙核之cpu來說，該吸 熱塊4〇a之兩個凸起41可分別對應於其中心部分之兩個熱 11 200820883 源點，將CPU之熱量快速地散發。如圖7與圖8所示為本 發明之又一實施例’該吸熱塊40b之下表面對應cpu形成 高度不大於0.05mm之方形凸起41b，該方形凸起41b具有 與cpu接觸之一平整底面411，當然該凸起41b亦可形成 為圓形等其他形狀。 下表中所示為本發明之散熱模組與習知之散熱模組實 驗測試資料，本發明之散熱模組分別採用具有兩個和三個 凸起之吸熱塊，CPU為多核心結構。If it can effectively reduce its succession, a greatly improve the efficiency of the thief group. In view of the above, it is necessary to provide a heat dissipation module that can be in close contact with an electronic component. A heat dissipation module includes a heat absorbing block for thermally connecting with a heat generating component, and is thermally connected to the heat absorbing block. a heat pipe and a fin group thermally connected to the heat pipe; the surface of the heat absorbing block connected to the heat generating component is provided with at least one outward protrusion corresponding to a heat source point position of the heat generating component, the heat pipe comprising An evaporation end connected to the heat absorbing block and a condensation end connected to the fin group. A heat dissipation module for dissipating heat to the heat generating electronic component, including the heat absorbing block and fixing the heat absorbing block to the heat generating electronic component At least one fixing member, the central portion of the heat absorbing block protrudes downward to form a protrusion corresponding to the heat-generating electronic component, and the fixing member applies a downward force to force the edge of the heat absorbing block to make the protrusion absorb the heat absorption The deformation of the block due to the force, so that each part of the heat-generating electronic component is closely adhered to the heat-absorbing block. Compared with the conventional technology, the heat-absorbing block and the electron element of the heat-dissipating module Part 7 7 200820883 The surface of the turtle touches outwards to compensate for the gap between the center of the heat absorbing block and the electronic component due to deformation during the fixing, so that the heat absorbing block is in full contact with the electronic components, and the heat dissipation module is improved. The heat dissipation efficiency of the present invention is as shown in FIG. 1 to FIG. 3 . The heat dissipation module includes a fan 10 , a fin assembly 20 , a heat pipe 3 , and a heat dissipation module . The heat absorbing block 40 and a pair of elastic pieces 50 for locking the heat dissipation module on the circuit board 9 。. The fan 10 includes a casing 101. The casing 101 is provided with a fan wheel 60, and one side of the casing 101 is formed. The air outlet 70 passes through the airflow generated by the fan 10. The other side of the casing 101 extends outward to form a base 102. A hole 103 is formed in the center of the base 110, and a plate body 104 is formed on each side of the hole 103. A plate body 104 is provided with three pins 105 of the same size and equidistant arrangement for fixing the elastic piece 50. The hole 1〇3 is square, the size of which is equivalent to the size of the outer casing of the heat pipe 30, and the corresponding hole 103 is at the base 1 〇2 below is provided with a heat sink for housing The groove 106 is the same as the heat absorbing block 40. The upper side of the base 102 forms a receiving groove 107. The receiving groove 107 is used for positioning the heat pipe 30 and the hole 103. The housing 101 and the base 102 of the fan 10 are generally integrally formed by die casting. The fin group 20 is disposed at the air outlet 70 of the fan 10, and is composed of a plurality of fins 21 arranged in parallel and adjacent to each other. A flow passage 22 for airflow is formed between the two fins 21. The heat pipe 30 has a flat curved shape and includes an evaporation end 301 and a condensation end 302, and the evaporation end 301 is placed in the receiving groove 8 of the base 1〇2008 200820883 107 The condensation end 302 of the 'heat pipe 30' is connected to the fin group 20 in a curved extension. The two elastic pieces 50 have the same structural shape and are flat curved structures. Each elastic piece 50 includes a joint portion 51 and first and second locking portions 52 and 53. The joint portion 51 has a longitudinally long straight line shape at the middle portion thereof. There are three fixing holes 5〇1 of the same size and equidistant arrangement in the longitudinal direction, the size of which corresponds to the size of the pins 1〇5 on the base 102 of the fan 1,, and the spacing between the fixing holes 5〇1 and the pins. The spacing between the 105 is the same. The first latching portion 52 and the second latching portion 53 are respectively formed by inversely bending and extending from both ends of the joint portion 51, and have a shape resembling the letter "L" and disposed in opposite directions. A waist-shaped fitting hole 502 is provided at the end of the first locking portion 52, and another circular fitting hole 503 is provided at the end of the second locking portion 53. The two mounting holes 502, 503 are in different types, mainly considering the tolerance problem of the assembly of the heat dissipation module and the circuit board 90. Before the tolerance is satisfied, the assembly holes 5〇2, 5〇3 may also be The same shape is like a circle. The locking portions 52, 53 are arranged in a curved shape, which can effectively increase the effective length of the elastic arms, so as to provide a more stable fastening pressure when the fastening is engaged, and to avoid slight deformation of the locking portions 52, 53 in the vertical direction. That is, it triggers a dramatic change in the fastening pressure. Referring to FIG. 3 and FIG. 4 , the heat absorbing block 40 is disposed in the recess 106 below the base 1 〇 2 and has a size corresponding to the shape of the recess 1 〇 6 . The upper surface of the heat absorbing block 40 passes through the hole of the base 102 . 103 is in contact with the evaporation end 301 of the heat pipe 30, and may be directly fixed by welding, or may be contacted by a thermal interface material such as the thermal paste 80, and a circular protrusion 41 is disposed on the lower surface of the heat absorption block 40. The circular protrusion 41 has a structure of a micro-arc 9 200820883 protrusion from the periphery toward the center, the protrusion 41 is spherically protruded, and the center of the protrusion 41 substantially coincides with the center of the heat absorption block 4G, that is, the protrusion 41 Located substantially in the center of the heat absorbing ghost 40' the lower surface of the heat absorbing block 4 用于 is used to combine with the electronic components on the circuit board, such as the CPU 10G, thereby transferring the heat generated by the cpui 至 to the heat officer 30 and by the fin group 2〇 is emitted to the external environment, and in order to improve the heat transfer effect, the heat absorbing block 4 is preferably made of copper. When the heat dissipation module is assembled, the fin group 2 is disposed at the air outlet 70 of the fan 1 , and the evaporation end 301 of the heat pipe 30 is disposed in the receiving groove 1〇7 of the base 1〇2, and the condensation end 302 is bent and extended. The upper surface of the fin group 2 is connected, and the heat absorbing block 40 is disposed in the groove 1〇6 below the base 1〇2, by the combination of the fixing hole 501 on the elastic piece and the pin 1〇5 on the base 1〇2. Fixing the elastic piece 50 to the base 1〇2, and inserting four screws (not shown) through the mounting holes 502 and 503 on the two elastic pieces to lock the heat dissipation module to the circuit board 90. The protrusion of the heat absorbing block 40 corresponds to the hottest portion of the center of the CPU 100, that is, the heat source point. Since the base 1〇2 and the heat absorbing block 4〇 are mainly fixed on the circuit board 90 by the force of the surrounding screws, and the force of the screw is applied to the elastic piece 50, the elastic piece 50 is placed on the edge of the plate body 104, and the heat absorbing block is applied. The portion between the two plates 104 is located such that the peripheral edge of the heat absorbing block 40 is subjected to a greater force than the middle portion thereof, so that the deformation of the peripheral portion is relatively large. The central portion of the heat absorbing block 40 forms a downwardly projecting protrusion 41 so that the center is lower than the position of the peripheral portion, so that the bottom surface of the heat absorbing block 40 is finally deformed to be approximately one plane, so that each portion of the heat absorbing block 40 is closely related to the CPU 100. contact. Therefore, the heat of the central portion of the CPU 100 can be transferred to the heat absorbing block 40 in time, and the contact thermal resistance between the CPU 100 and the heat absorbing block 40 is lowered, thereby avoiding the 200820883. • The hot zone is avoided, and the cpul can be safely and normally operated. The height of the protrusion 41 can be determined according to the magnitude of the force applied by the elastic piece 5 及 and the degree of deformation of the heat absorbing block 4 ,. For example, for the heat dissipation of the cpu, the height of the protrusion 41 is controlled to be about 0.1 mm or less than 〇 lmm. During operation, the heat absorbing block 40 is in thermal contact with the CPU 100 and rapidly absorbs the heat generated by it, and transfers heat to the evaporation end 301 of the heat pipe 3〇 in thermal contact with the heat absorbing block 4, and heat is transferred to the fin by the heat pipe 30. After the chip group 2〇, the airflow generated by the fan 1〇 is heat exchanged with the fin group 2〇, and the heat is finally released into the environment for the purpose of fast and effective heat dissipation. The invention forms a circular protrusion 41 on the lower surface of the heat absorbing block 40, and when fixed by screws, it maintains good and uniform contact with each part of the CPU1 to improve heat dissipation performance. In fact, since the force applied to each part of the cpm is related to the shape of the heat absorbing block 40, the cpul 不同 of different thermal loads can be adapted by changing the specific shape of the heat absorbing block 40, such as the peripheral contour of the above-mentioned protrusion 41. In addition to the shape, it can also be square, triangular, or polygonal. The lower surface of the heat absorbing block 40 may also be provided with a plurality of protrusions, such as two, three or four, for the heat dissipation of the dual-core and multi-core processors having multiple heat source points, or at the same time, for a plurality of different heating electrons. Heat dissipation of components. At the same time, the outer surface of the protrusion 41 may be designed in other shapes in addition to the spherical protrusion shape of the micro-arc, for example, according to the surface contour shape of the electronic component, the design is required to reduce the shape. Referring to FIG. 5 and FIG. 6, in the embodiment, two circular protrusions 41 having a height of not more than 0.1 mm are disposed on the lower surface of the heat absorption block 40a. For the dual-core cpu, the two heat absorption blocks 4a are convex. The 41 can correspond to the two hot 11 200820883 source points in the central portion thereof, and the heat of the CPU is quickly dissipated. 7 and FIG. 8 show another embodiment of the present invention. The lower surface of the heat absorbing block 40b corresponds to a cpu forming a square protrusion 41b having a height of not more than 0.05 mm, and the square protrusion 41b has a flat contact with the cpu. The bottom surface 411, of course, the protrusion 41b may be formed in other shapes such as a circle. The following table shows the experimental data of the heat dissipation module of the present invention and the conventional heat dissipation module. The heat dissipation module of the present invention respectively adopts a heat absorption block having two and three protrusions, and the CPU has a multi-core structure.
表 1 部位 習知技術（未設 凸起之平板狀 吸熱塊） 本發明實施例 一（具兩個凸起 之吸熱塊） 本發明實施例 二（具三個凸起 之吸熱塊） 熱管 73.4。。 70.8〇C 71 °C CPU表面 92 °C 88〇C 89 °C CPU其中一核 心 89 °〇 86 °C 86〇C CPU其中另一 _i亥心 --------- 89 °C 87 °C 86 °C 與熱管之 溫差 -----. ~ ^- 18.6〇C ------- 17.2〇C 18°C 由表1可知’運用本發明中有兩個或三個凸起之吸熱 鬼之政熱模組’各部件之溫度均比習知技術巾應用平板狀 吸熱塊之散熱模組低，而且CPU與熱管之溫差亦有所下 12 200820883 •降，政熱政果明顯提高。 ^表=所不為本發明運用如圖7_8所示之吸熱塊之散熱 模且/、驾知之散熱模組實驗測試資料，散熱模組採用具有 平整底面之㈣凸起之吸熱塊。CPU為雙核結構。Table 1 Position Conventional technique (flat-shaped heat-absorbing block without protrusion) Inventive Example 1 (heat-absorbing block with two protrusions) Embodiment 2 of the present invention (heat-absorbing block with three protrusions) Heat pipe 73.4. . 70.8〇C 71 °C CPU surface 92 °C 88〇C 89 °C CPU one core 89 °〇86 °C 86〇C CPU one of the other _i Haixin--------- 89 °C 87 °C 86 °C and the temperature difference between the heat pipe -----. ~ ^- 18.6〇C ------- 17.2〇C 18 °C It can be seen from Table 1 that there are two or three in the application of the present invention. The temperature of each component of the raised heat-absorbing ghost's political heat module is lower than that of the conventional technology towel using the flat heat-absorbing block, and the temperature difference between the CPU and the heat pipe is also lower. 12 200820883 • The effect is obviously improved. ^Table=Do not use the heat-dissipating module of the heat-absorbing block shown in Fig. 7_8 and the heat-test module experimental test data shown in Fig. 7-8, and the heat-dissipating module adopts the heat-absorbing block with the flat bottom surface (4). The CPU is a dual core structure.
從上可知，運用本發明中具有平整底面之方形凸起之 吸熱塊之賴触，各部件之溫度均比f知技射未設凸 起之吸熱塊之散減組低，CPU與熱管表面上之溫差亦大 大下降，導熱性能大幅度提高。 綜上所述，在吸熱塊上形成凸起，使其能與充分 接觸，提升散熱模組之性能，並且，該發明係—種可以廣 泛應用之散触構，在提升性能之㈣，成林會增加， 通用性強’適用各種散熱產品。 在以上實施射，係採㈣片5G作為岐件來固定散 熱模組。當然，除了使賴料，射制技術人士所熟 知之其他形式之固定件，比如彈簧螺絲、金屬絲線性扣具 13 200820883 或其他卡扣結構等。 综上所述’本發明符合發明專利要件，爰依法提出專 利申明。♦’ w上所述者僅為本發明之較佳實施例，舉凡 熟=本案技藝之人士，在爰依本發明精神所作之等效 威=匕:皆應涵蓋於以下之申請專 ^ 【圖式間單說明】It can be seen from the above that the temperature of each component is lower than that of the heat-absorbing block with no convex protrusions on the surface of the CPU and the heat pipe by using the heat-absorbing block with the square protrusion of the flat bottom surface. The temperature difference is also greatly reduced, and the thermal conductivity is greatly improved. In summary, the protrusion is formed on the heat absorbing block to make it fully contact with each other to improve the performance of the heat dissipation module, and the invention is a widely applicable scattering structure, which improves the performance (4), Chenglin Will increase, versatile 'applicable to a variety of cooling products. In the above implementation, the (4) piece 5G is used as a piece to fix the heat dissipation module. Of course, in addition to the other types of fasteners known to those skilled in the art, such as spring screws, wire linear fasteners 13 200820883 or other snap structures. In summary, the invention conforms to the patent requirements of the invention, and the patent declaration is filed according to law. The above description is only a preferred embodiment of the present invention, and the equivalent of the skill of the present invention in the spirit of the present invention should be covered in the following application. Single statement
1係本發明散熱模組第 2係圖1之立體組裝圖 實施例之立體分解圖1 is a three-dimensional assembly diagram of the heat dissipation module of the present invention. FIG. 1 is an exploded perspective view of the embodiment.
圖8係圖7沿VIII-VIII線之剖示圖 【主要元件符號說明】 風扇 10 CPU 殻體 101 底座 孔洞 103 板體 銷釘 105 凹槽 容置槽 107 鰭片組 鰭片 21 流道 熱管 30 蒸發端 冷凝端 302 吸熱塊40 凸起 41 、 41b 底面 彈片 50 結合部 鎖合部 52、53 固定孑L 裝配孔 502、503 扇輪 出風口 70 導熱膏 圖3係該散熱模組另一角度立體組裝圖。 圖4係圖3中吸熱塊沿IV-IV線剖示圖。 圖5係吸熱塊第二實施例立體示意圖。 圖6係圖5沿Vl·VI線之剖示圖。 圖7係吸熱塊第三實施例立體示意圖。 100 102 104 106 20 22 301 40a、40b 411 51 501 60 80 14 90 200820883 β電路板Figure 8 is a cross-sectional view taken along line VIII-VIII of Figure 7 [Description of main component symbols] Fan 10 CPU housing 101 Base hole 103 Plate pin 105 Groove receiving groove 107 Fin group fin 21 Flow path heat pipe 30 Evaporation End condensation end 302 Heat absorbing block 40 Raised 41, 41b Bottom elastic piece 50 Jointing part 52, 53 Fixing L Mounting hole 502, 503 Fan wheel air outlet 70 Thermal paste Figure 3 is another angular assembly of the heat sink module Figure. Figure 4 is a cross-sectional view of the heat absorbing block of Figure 3 taken along line IV-IV. Fig. 5 is a perspective view showing a second embodiment of the heat absorbing block. Figure 6 is a cross-sectional view taken along line Vl·VI of Figure 5. Figure 7 is a perspective view of a third embodiment of the heat absorbing block. 100 102 104 106 20 22 301 40a, 40b 411 51 501 60 80 14 90 200820883 β circuit board
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