CN101196772A - Radiator rear panel module and circuit board and electronic device using the same - Google Patents
Radiator rear panel module and circuit board and electronic device using the same Download PDFInfo
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- CN101196772A CN101196772A CNA2006101622040A CN200610162204A CN101196772A CN 101196772 A CN101196772 A CN 101196772A CN A2006101622040 A CNA2006101622040 A CN A2006101622040A CN 200610162204 A CN200610162204 A CN 200610162204A CN 101196772 A CN101196772 A CN 101196772A
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- circuit board
- rear panel
- panel module
- radiator
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Abstract
The invention relates to an electronic device, which comprises a shell, a circuit board positioned on the shell, a radiator backboard module and a radiator. The radiator is provided on a heating source of the circuit board, the radiator backboard module is provided on a surface opposite to the heating source of the circuit board. In addition, the radiator backboard module comprises a main body with a plurality of clamping holes, at least one heat pipe, a fin group matching at end part of the heat pipe and a heat conduction strip. The radiator can be matched with a plurality of fixing components for fixing to the clamping holes, so as to make sure that the radiator can be steadily positioned on the heating source. Moreover, the heat conduction strip is provided on the main body at one surface adjacent to the circuit board, the heat pipe passes through the main body and conducts heat of the circuit board bottom to the fin group, so as to carry through thermal convection function and further lower the temperature of the circuit board bottom.
Description
Technical field
The present invention relates to a kind of rear panel module (Backing Plate Module), and particularly relate to a kind of rear panel module for heat radiator (Heat-Sink Backing Plate Module) and use the circuit board and the electronic installation of this module.
Background technology
Along with developing rapidly of electronic industry, also more and more be much accounted of at the radiating treatment of electronic package, for example: central processing unit (Central Processing Unit, arithmetic speed CPU) is high more, and the heat that it produced is big more.Therefore, industry is everlasting the central processing unit on the motherboard (Mother Board) is set a heating radiator (Heat Sink), to reduce the working temperature of central processing unit.In order to satisfy the radiating requirements of central processing unit, be equipped on the heating radiator on the central processing unit, its size and weight have the trend that increases gradually.
Under the long-time condition of high temperature,, and then motherboard is ruptured easily for fear of motherboard because of unpredictable external force such as vibrations because of the downward pulling force that heatsink weight produced causes the motherboard distortion.Industry is often assembled a radiator rear panel in the motherboard back side at present, with the structural strength of lifting motherboard, and makes that the heating radiator bottom can be more tight with the CPU surface engagement.
What deserves to be mentioned is, the heat that CPU produced dissipates in the external environment via heating radiator except meeting, also can conduct to the motherboard bottom, cause the motherboard bottom temp too high, and then make that the portions of electronics assembly on the motherboard can't operate as normal because of the motherboard over-heat at the bottom.
Summary of the invention
The purpose of this invention is to provide a kind of rear panel module for heat radiator, have the too high problem of its bottom temp of circuit board of pyrotoxin with solution.
Another object of the present invention provides a kind of circuit board, and its group is provided with described rear panel module for heat radiator, and then can reduce the bottom temp of circuit board effectively.
Another purpose of the present invention provides a kind of electronic installation, and its inner circuit board group is provided with described rear panel module for heat radiator, and then promotes whole radiating efficiency.
For reaching above-mentioned or other purpose, the present invention proposes a kind of rear panel module for heat radiator, and it is suitable for a heating radiator is fixed on the pyrotoxin of a circuit board, and pyrotoxin is the one side that is positioned at circuit board, and rear panel module for heat radiator is the another side that is positioned at circuit board.This rear panel module for heat radiator comprises a body, at least one heat pipe, a fins group and one first conducting strip.Body has a plurality of connecting holes, and these connecting holes are a plurality of perforates around the corresponding pyrotoxin, and wherein heating radiator utilizes a plurality of fixation kits of perforate that pass to be fixed in connecting hole.In addition, heat pipe is an end that is arranged in body, and fins group is the other end that is equipped on heat pipe.In addition, first conducting strip then is the one side that is disposed at body, and first conducting strip is suitable for fitting with circuit board.
In one embodiment of this invention, above-mentioned rear panel module for heat radiator more comprises one second conducting strip, and second conducting strip is disposed at the another side of body, and circuit board group is located in the casing, and second conducting strip then is suitable for fitting with casing.
In one embodiment of this invention, above-mentioned rear panel module for heat radiator more comprises at least one plate, and plate is embedded at the another side of body, and plate is provided with a plurality of internal screw threads, wherein these internal screw threads are arranged in connecting hole, and the fixation kit of heating radiator is locked in the internal screw thread
The present invention reintroduces a kind of circuit board, and it has the pyrotoxin that a plate body and has a plurality of perforates, and pyrotoxin is to be positioned at first of plate body, and above-mentioned rear panel module for heat radiator is suitable for being mounted on second of plate body.Wherein, first of plate body corresponds to each other with second face, and perforate is to be positioned at around the pyrotoxin.In addition, a plurality of connecting holes of rear panel module for heat radiator are a plurality of perforates of corresponding plate body, and the conducting strip that is disposed at a surface of body is to fit in plate body.
The present invention reintroduces a kind of electronic installation, and it comprises a casing, a heating radiator, above-mentioned circuit board and above-mentioned rear panel module for heat radiator.In the present invention, circuit board is to be disposed at rear panel module for heat radiator in the casing to be equipped on the circuit board surface of pyrotoxin relatively, and heating radiator is to be disposed on the pyrotoxin, so that pyrotoxin is dispelled the heat.Wherein, heating radiator has a plurality of fixation kits, and these fixation kits are fixed in the connecting hole of rear panel module for heat radiator.
In one embodiment of this invention, above-mentioned rear panel module for heat radiator more comprises one second conducting strip, and second conducting strip is disposed at the another side of body, and is suitable for fitting with casing.
In one embodiment of this invention, above-mentioned fixation kit is the elasticity clasp nail.
In one embodiment of this invention, above-mentioned rear panel module for heat radiator more comprises at least one plate, and plate is embedded at the another side of body, and plate is provided with a plurality of internal screw threads, wherein these internal screw threads are to be arranged in connecting hole, and fixation kit then is to be locked in these internal screw threads.
In one embodiment of this invention, above-mentioned fixation kit is a Spring screws.
In one embodiment of this invention, electronic installation more comprises a fan, and fan arrangement and is suitable for producing an active flow so that heating radiator is dispelled the heat on heating radiator, and fins group is contiguous heating radiator, and active flow then is suitable for the fins group of flowing through.
By technique scheme, the present invention has following advantage at least:
In electronic installation of the present invention, because its body of rear panel module for heat radiator surface adjacent with circuit board is provided with a conducting strip, therefore work as electronic installation in working order down, the heat that pyrotoxin produced is after conducting to the circuit board bottom, heat can conduct to body via conducting strip, conducts to fins group via the heat pipe that is arranged in body again.Wherein, conduct to fins group heat can by natural convection or the forced convertion that fan produced dissipates in the external environment, and then reduce the temperature of circuit board bottom effectively.In addition, the surface that body and casing are adjacent also can be provided with another conducting strip, and the heat that conducts to body can conduct to casing through conducting strip thus, and heat can dissipate in the external environment via the convection current of casing and air.
For above and other objects of the present invention, feature and advantage can be become apparent, preferred embodiment cited below particularly, and cooperate appended graphicly, be described in detail below.
Description of drawings
Figure 1A illustrates the part exploded view of a kind of electronic installation of preferred embodiment of the present invention.
Figure 1B illustrates the exploded view in the electronic installation of Figure 1A.
Fig. 1 C illustrates the circuit board of Figure 1A and the rear panel module for heat radiator constitutional diagram at another visual angle.
Fig. 2 illustrates the casing of Figure 1B and the part exploded view of rear panel module for heat radiator.
Fig. 3 A illustrates the constitutional diagram of the another kind of rear panel module for heat radiator of preferred embodiment of the present invention.
Fig. 3 B illustrates the part exploded view of the rear panel module for heat radiator of Fig. 3 A.
Fig. 4 illustrates another rear panel module for heat radiator of preferred embodiment of the present invention and the exploded view of a circuit board.
Embodiment
Figure 1A illustrates the constitutional diagram of a kind of electronic installation of preferred embodiment of the present invention, and Figure 1B illustrates the exploded view in the electronic installation of Figure 1A, and Fig. 1 C illustrates the circuit board of Figure 1A and the rear panel module for heat radiator constitutional diagram at another visual angle.Please also refer to Figure 1A, Figure 1B, and Fig. 1 C, the electronic installation 100 of present embodiment for example is a main frame, and it mainly comprises casing 110, be disposed at circuit board 120 in the casing 110, rear panel module for heat radiator 130, and heating radiator 140.
In the present embodiment, circuit board 120 for example is a motherboard, it has plate body 122, pyrotoxin 124, reaches a plurality of pyrotoxin perforates 126 on every side that are positioned at, pyrotoxin 124 is positioned at the first surface 122a of plate body 122, and heating radiator 140 is disposed on the pyrotoxin 124, so that pyrotoxin 124 is dispelled the heat.In addition, rear panel module for heat radiator 130 is equipped on the second surface 122b of plate body 122, and a plurality of fixation kits 142 of heating radiator 140 are to pass perforate 126, and be fixed in rear panel module for heat radiator 130, promoting the structural strength of circuit board 120, and make that engaging of 122 of heating radiator 140 and pyrotoxins can be more tight.In the present embodiment, first surface 122a is the end face of plate body 122, and second surface 122b is the bottom surface of plate body 122.
Specifically, the rear panel module for heat radiator 130 of present embodiment is except the structural strength that can promote circuit board 120, and rear panel module for heat radiator 130 also can reduce the temperature of circuit board 120 bottoms.In detail, the heat that pyrotoxin 124 is produced is after conducting to the second surface 122b of plate body 122, the rear panel module for heat radiator 130 that preferred embodiment of the present invention provided can conduct the heat of the second surface 122b of plate body 122 effectively, makes these heats to loose by rear panel module for heat radiator 130 and selects to external environment.Thus, the bottom temp of circuit board 120 can significantly reduce, and the portions of electronics assembly (not illustrating) that is disposed at circuit board 120 and contiguous pyrotoxin 124 just can be in normal working temperature.Hereinafter, will to describe the main member and the rear panel module for heat radiator 130 of rear panel module for heat radiator 130 in detail are the bottom temps that how to reduce circuit board 120 to present embodiment.
Fig. 2 illustrates the casing of Figure 1B and the part exploded view of rear panel module for heat radiator.Please also refer to Figure 1B and Fig. 2, the rear panel module for heat radiator 130 of present embodiment mainly comprises body 132, at least one heat pipe 133 (Fig. 2 illustrates two), reaches fins group 134.Above-mentioned body 132 is provided with the connecting hole 132a of a plurality of corresponding perforates 126, and wherein heating radiator 140 is to utilize a plurality of fixation kits 142 of perforate 126 that pass to be fixed among the connecting hole 132a.In the present embodiment, fixation kit 142 for example is the elasticity clasp nail.Thus, heating radiator 140 can stably be equipped on the pyrotoxin 124 by the snap-fit relationship between fixation kit 142 and connecting hole 132a.
In addition, an end of heat pipe 133 for example is in the groove (not illustrating) that is arranged in body 132, and fins group 134 is the other end that are equipped on heat pipe 133.Therefore, the heat that is conducted to body 132 by circuit board 120 bottoms can conduct to fins group 134 via heat pipe 133 again, and the heat that conducts to fins group 134 can dissipate in the external environment by natural convection, makes the bottom temp of circuit board 120 to reduce effectively.In addition, a fan 150 also can be set on the heating radiator 140, fan 150 can produce an active flow and come heating radiator 140 is dispelled the heat.In a preferred embodiment, heat pipe 133 can be bent, so that fins group 134 is positioned at the air flow outlet of heating radiator 140, makes the active flow that flows out from the air stream outlet fins group 134 of can flowing through again, and then remove the heat that conducts to fins group 134 by the circuit board bottom.
From the above, for the heat that can make circuit board 120 bottoms can more effectively conduct to body 132, present embodiment is disposed at first conducting strip 135 with preferable heat conduction efficiency a surperficial 132c of body 132 proximate circuitry plates 120.Thus, when rear panel module for heat radiator 130 is mounted on the bottom of circuit board 120, the heat of circuit board 120 bottoms can conduct to body 132 via first conducting strip 135 with plate body 122 applyings effectively, relends by 134 pairs of fins group to flow in the external environment.In another preferred embodiment, also can set one second conducting strip 136 on the surperficial 132d of body 132 contiguous casings 110.Therefore, when rear panel module for heat radiator 130 contacted with casing 110, the heat that is conducted to body 132 by circuit board 120 bottoms can conduct to casing 110 via second conducting strip 136 with casing 110 applyings.Because casing 110 has bigger contact area with air, therefore conduct to the heat of casing 110 can be effectively to flowing in the external environment, and then reduce the bottom temp of circuit board 120.
Fig. 3 A illustrates the constitutional diagram of the another kind of rear panel module for heat radiator of preferred embodiment of the present invention, and Fig. 3 B illustrates the part exploded view of the rear panel module for heat radiator of Fig. 3 A.Please refer to Fig. 3 A and Fig. 3 B, the rear panel module for heat radiator 130 ' of present embodiment is similar with the rear panel module for heat radiator 130 of the foregoing description, the two main difference only is that the rear panel module for heat radiator 130 ' of present embodiment is suitable for for the fixation kit locking that for example is Spring screws, and the rear panel module for heat radiator 130 of the foregoing description then is suitable for for the fixation kit engaging that for example is the elasticity clasp nail.In detail, in the present embodiment, the one side 132d of body 132 is embedded at least one plate 137 (Fig. 3 B illustrates 2), and wherein each plate 137 is provided with a plurality of internal screw thread 137a, and these internal screw threads 137a be suitable for the group be located among the connecting hole 132a.Thus, when the heating radiator that will be equipped with Spring screws when user's desire was assembled to rear panel module for heat radiator 130 ', the user can successfully be locked in Spring screws among the internal screw thread 137a, and then heating radiator can firmly be equipped on the pyrotoxin.
In other embodiments, owing to may be provided with the higher pyrotoxin of a plurality of heating powers on the circuit board, so the present invention reintroduces a kind of rear panel module for heat radiator that can dispel the heat to a plurality of pyrotoxins on the circuit board simultaneously.Please refer to Fig. 4, it illustrates another rear panel module for heat radiator of preferred embodiment of the present invention and the exploded view of a circuit board.As shown in Figure 4, present embodiment can be set up one or more bodies 132 according to the equipping position of pyrotoxin 124 on plate body 122, and these bodies 132 can interconnect by heat pipe 133.Thus, the heat that these pyrotoxins 124 conduct to plate body 122 bottoms can conduct to fins group 134 by heat pipe 133 simultaneously, and dissipates in the external environment by the convection action between fins group 134 and air.
In sum, in the electronic installation that the embodiment of the invention provided, because the conducting strip that its body of rear panel module for heat radiator surface configuration one adjacent with circuit board has preferable heat conduction efficiency, therefore work as electronic installation in working order down, the heat that is conducted to the circuit board bottom by pyrotoxin can conduct to body via conducting strip effectively, and conducts to fins group by the heat pipe that is arranged in body.Wherein conduct to fins group heat can by natural convection or forced convertion dissipates in the external environment, and then the temperature of circuit board bottom can be reduced effectively.In addition, the surface that body and casing are adjacent also can be provided with another conducting strip, and the heat that conducts to body can conduct to casing through conducting strip thus, and heat can dissipate in the external environment via the convection current of casing and air.
Compared to existing known techniques, the rear panel module for heat radiator that present embodiment provided is except the structural strength that can promote circuit board, and rear panel module for heat radiator also can be used for reducing the temperature of circuit board bottom by preferable conduction of heat and thermal convection.
The above, it only is preferred embodiment of the present invention, be not that the present invention is done any pro forma restriction, though the present invention discloses as above with preferred embodiment, yet be not in order to limit the present invention, any those skilled in the art, in not breaking away from the technical solution of the present invention scope, when the technology contents that can utilize above-mentioned announcement is made a little change or is modified to the equivalent embodiment of equivalent variations, in every case be the content that does not break away from technical solution of the present invention, according to technical spirit of the present invention to any simple modification that above embodiment did, equivalent variations and modification all still belong in the scope of technical solution of the present invention.
Claims (9)
1. rear panel module for heat radiator, be suitable for a heating radiator is fixed on the pyrotoxin of a circuit board, above-mentioned pyrotoxin is positioned at the one side of above-mentioned circuit board, and above-mentioned rear panel module for heat radiator is positioned at the another side of above-mentioned circuit board, have a plurality of perforates around the wherein above-mentioned pyrotoxin, it is characterized in that: above-mentioned rear panel module for heat radiator comprises:
One body has a plurality of connecting holes, corresponding above-mentioned these perforates of above-mentioned these connecting holes, and wherein above-mentioned heating radiator utilizes a plurality of fixation kits that pass above-mentioned these perforates, to be fixed in above-mentioned these connecting holes;
At least one heat pipe, an end of above-mentioned heat pipe is arranged in above-mentioned body;
One fins group is equipped on the other end of above-mentioned heat pipe; And
One first conducting strip is disposed at the one side of above-mentioned body, and the first above-mentioned conducting strip is suitable for and above-mentioned circuit board is fitted.
2. rear panel module for heat radiator according to claim 1, it is characterized in that it more comprises one second conducting strip, described second conducting strip is disposed at the another side of described body, and described circuit board group is located in the casing, and described second conducting strip then is suitable for fitting with described casing.
3. rear panel module for heat radiator according to claim 1, it is characterized in that, it more comprises at least one plate, described plate is embedded at the another side of described body, and described plate is provided with a plurality of internal screw threads, wherein said these internal screw threads are arranged in described these connecting holes, and described these fixation kits are locked in described these internal screw threads.
4. circuit board, be suitable for group and establish a rear panel module for heat radiator, described rear panel module for heat radiator has a body, at least one heat pipe, a fins group, reaches a conducting strip, wherein said body has a plurality of connecting holes, described heat pipe is arranged in an end of described body, and described fins group is equipped on the other end of described heat pipe, and described conducting strip then is the one side that is disposed at described body, it is characterized in that described circuit board comprises:
One plate body, have many perforates, one first with relative described first one second, wherein said these connecting holes are corresponding described these perforates, and described rear panel module for heat radiator is to be equipped on described second, and described conducting strip fits in described plate body; And
One pyrotoxin be positioned at described first, and described these perforates is positioned at around the described pyrotoxin.
5. electronic installation is characterized in that it comprises:
One casing;
One circuit board is disposed in the described casing, and has a pyrotoxin and a plurality of perforate, and described pyrotoxin is positioned at the one side of described circuit board, and described these perforates are positioned at around the described pyrotoxin;
One rear panel module for heat radiator is equipped on the another side of described circuit board, and described rear panel module for heat radiator comprises:
One body has a plurality of connecting holes, corresponding described these perforates of described these connecting holes;
At least one heat pipe is arranged in an end of described body;
One fins group is equipped on the other end of described heat pipe;
One first conducting strip is disposed at the one side of described body, and described first conducting strip is suitable for and described circuit board is fitted; And
One heating radiator is disposed on the described pyrotoxin, wherein said heating radiator a plurality of fixation kits that are suitable for arranging in pairs or groups, and described these fixation kits are fixed in described these connecting holes.
6. electronic installation according to claim 5, it is characterized in that, wherein said rear panel module for heat radiator more comprises one second conducting strip, and described second conducting strip is disposed at the another side of described body, and described second conducting strip is suitable for fitting with described casing.
7. electronic installation according to claim 5 is characterized in that, wherein said these fixation kits are the elasticity clasp nail.
8. electronic installation according to claim 5, it is characterized in that, wherein said rear panel module for heat radiator more comprises at least one plate, described plate is embedded at the another side of described body, and described plate is provided with a plurality of internal screw threads, wherein said these internal screw threads are arranged in described these connecting holes, and described these fixation kits are locked in described these internal screw threads.
9. electronic installation according to claim 5, it is characterized in that it more comprises a fan, described fan arrangement is on described heating radiator, and be suitable for producing an active flow so that described heating radiator is dispelled the heat, and the contiguous described heating radiator of described fins group, the described active flow described fins group that is suitable for flowing through.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2006101622040A CN101196772A (en) | 2006-12-06 | 2006-12-06 | Radiator rear panel module and circuit board and electronic device using the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2006101622040A CN101196772A (en) | 2006-12-06 | 2006-12-06 | Radiator rear panel module and circuit board and electronic device using the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101196772A true CN101196772A (en) | 2008-06-11 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2006101622040A Pending CN101196772A (en) | 2006-12-06 | 2006-12-06 | Radiator rear panel module and circuit board and electronic device using the same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101196772A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102163910A (en) * | 2011-03-29 | 2011-08-24 | 华为技术有限公司 | Power module and electronic apparatus using power module |
| WO2014172887A1 (en) * | 2013-04-26 | 2014-10-30 | 技嘉科技股份有限公司 | Heat pipe type heat dissipation module |
| CN114911315A (en) * | 2021-02-07 | 2022-08-16 | 北京图森智途科技有限公司 | Computing device and installation method of computing device |
-
2006
- 2006-12-06 CN CNA2006101622040A patent/CN101196772A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102163910A (en) * | 2011-03-29 | 2011-08-24 | 华为技术有限公司 | Power module and electronic apparatus using power module |
| CN102163910B (en) * | 2011-03-29 | 2013-12-04 | 华为技术有限公司 | Power module and electronic apparatus using power module |
| WO2014172887A1 (en) * | 2013-04-26 | 2014-10-30 | 技嘉科技股份有限公司 | Heat pipe type heat dissipation module |
| CN114911315A (en) * | 2021-02-07 | 2022-08-16 | 北京图森智途科技有限公司 | Computing device and installation method of computing device |
| CN114911315B (en) * | 2021-02-07 | 2024-02-06 | 北京图森智途科技有限公司 | Computing device and method for installing computing device |
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Open date: 20080611 |