M346053 八、新型說明： 【新型所屬之技術領域】 本創作係有關於-種散熱裝置，尤指—種具有f折狀 均溫板之散熱裝置。 【先前技術】 直所之中央處理器咖的運算速度不斷提昇， 其所產生的發熱量亦掠;^ > 所組成的散熱裝置，已不能：足=由：熱-片組及風扇 :求於疋有業者陸續開發出具有更高導熱效能的均溫板 (v—r chamber) ’並將其與散 解決現階段的散埶問顳.苴Λ 作，口以有效地 子元件作大Ί又以均溫板具有與發熱電 入此均溫板的研^附接觸，而吸引更多的相關業者投 片植以熱裝置，其主要包括-均溫板、-熱散鰭 元件==:::板係呈平面狀，並貼設於一發熱 風扇係扣接於該^ 溫板進行散熱，藉此二"二，_組及_ 麸而，羽， 从f走该發熱疋件所產生的熱能。 的缺二“二置’在實際使用上仍存在有以下 過程中，並益法散續片組及該均溫板進行散熱的 進而影塑1料中風力，俾造成其散熱之不完全， 而其。積效能’此外，因該均溫板係呈平面狀， 、凡王，、4發熱元件貼附，且其導熱面積僅侷限 M346053 於該發熱元狀表面積大彳、，故無法進—步有效提昇其導 熱之效能，另外，若增加該均溫板製作之寬度，以增加其 表面積，則其有可能會與安裝在電路板上之其他的電子^ 件發生碰撞造成此散熱裝置無法安裝與使關情況。 有鑑於此，本創作人係為改善並解決上述之缺失，乃 特潛心研究並配合學理之料，終於提出—種設計合理且 有效改善上述缺失之本創作。 【新型内容】 丑本創作之-目的係提供—種散熱裝置，藉由罩體單合 散熱鰭片組及風扇，以使風扇運轉時所產生的風 : 並對散熱,ϋ片組及均溫板直接進行散熱， 之散熱效能者。 攸升登體 ’藉由彎折狀 進而提昇其導 本創作之另—目的係提#一種散熱裝置M346053 VIII. New description: [New technical field] This creation department has a kind of heat-dissipating device, especially a heat-dissipating device with f-shaped uniform temperature plate. [Prior Art] The computing speed of the central processor coffee of the Zhisho is constantly increasing, and the heat generated by it is also swept; ^ > The heat sink composed of the heat sink can not: foot = by: heat - film set and fan: seeking Yu Yu has developed a uniform temperature plate (v-r chamber) with higher thermal conductivity, and solves the problem with the current stage of dispersing. In addition, the uniform temperature plate has contact with the heat-generating electricity into the temperature-sensing plate, and attracts more relevant industry to cast the film to the thermal device, which mainly includes - the temperature equalizing plate, the heat-dissipating fin element ==: :: The board is flat and attached to a heating fan to be fastened to the heat board for heat dissipation, thereby using the two "two, _ group and _ bran, feather, from f to the hot element The heat generated. The lack of two "two sets" in the actual use still exists in the following process, and the Yifa scattered film group and the temperature plate to dissipate heat and then shape the wind in the material, causing its heat dissipation is incomplete, and In addition, the uniform temperature plate is flat, and the Wang, and 4 heating elements are attached, and the heat transfer area is limited to M346053. Effectively improve the thermal conductivity. In addition, if the width of the temperature equalizing plate is increased to increase the surface area, it may collide with other electronic components mounted on the circuit board, and the heat sink cannot be installed. In view of this, the creator is trying to improve and solve the above-mentioned shortcomings, and he has devoted himself to researching and cooperating with academic materials, and finally proposed a design that is reasonable in design and effective in improving the above-mentioned defects. [New content] Ugly The purpose of this creation is to provide a kind of heat dissipating device, which uses a single heat sink fin set and a fan to make the wind generated when the fan is running: and directly dissipates heat, the breeze group and the temperature equalizing plate. Heat, thermal performance of the board body by Yau L 'by the bent further and thus enhance the conduction of this design - object-based A heat dissipation device lifting #
之均溫板設計，俾增加均溫板之導熱面積， 熱效能者。 之兩:1:::之::係提供一種散熱裝置，藉由均溫板 細 计，可避免與主機板上之其他電子元 件务生碰撞，俾具有較佳之安裝彈性。 因此，本創作係提供一種散熱裝置， 組、一軍體以及一風扇所構成，·： ::狀’·該熱散轉片組貼設於該均溫板之 豆連接该均溫板，且於彼此之間圍設 ： 散埶鰭Η知及V Λ百一流道，該 …、、’糸位於該流道内’該罩體開設有連通該流道的 6 M346053 一開孔；該風扇對應於該開孔以及該均溫板之另一部分表 面設置。 【實施方式】 以下之實施例係進一步詳細說明本創作之觀點，但非 以任何觀點限制本創作之範疇。 請參閱第一圖及第四圖，本創作散熱裝置，係由一均 _ mL板10 政熱鰭片組20、一罩體30以及一風扇40所構 成。 該均溫板10係為一狹長形且呈彎折狀之均溫板，該均 /m板ίο具有一吸熱段u及從該吸熱段η二侧分別彎折並延 伸出的放熱丰又12，且該吸熱段u係凸伸出該二放熱段12 之表面孩及熱段Π係抵接於一發熱元件β2之表面（如第 五圖所不），而該放熱段12則與該吸熱段11形成有較大之 導熱面積’所述該發熱元件62可為一CPU、半導體封裝 件θθ片或其他具有產生高熱而需散熱之電子元件。 該散熱轉片組2〇貼設於該均溫板10之一部分表面，較 佳地，该散熱籍片組2〇係貼接於該放熱段12表面，且該散 •熱鰭片組20係由等間距排列之複數散熱鰭片21所構成，而 該等散熱籍片21分別可為紹擠型之散熱韓片。 、/亥罩體30連接該均溫板1〇，且於彼此之間圍設形成有 /爪道32 ’ 4散熱鰭片組2〇係位於該流道％内，該罩體洲 開設有連通該流道32的一開孔抑以及内部形成有連通該開 孔33的&置空間31，該熱散鰭片組20係位在該流道32内 7 M346053 部’並在該罩體30表面開設有連通該容置空間31之複數穿 孔34 ’該等穿孔34分別鄰近該開孔33設置，另在該罩體30 之兩側分別成型有一扣鉤35，該等扣鉤35分別扣接於該均 溫板10之該放熱段12的兩側。 4風扇40容設於該容置空間31内部，並對應於該開孔 33以及該均溫板1〇之另一部分表面設置，該風扇4〇包含一 —支架41，並在該支架41上開設有對應於該等穿孔34之複數 籲螺孔42，其分別可以一螺絲5〇穿設鎖固，所述該風扇仙可 為軸流式風扇或離心式風扇等。 組裝本創作時，復參閱第一圖及第二圖，首先將該散 熱鰭片組20貼設於該均溫板1〇之該放熱段12表面，並可以 例如焊接加工方式將該散熱鰭片組2〇焊固於該放熱段12 上，再將该風扇40以該支架41之該等螺孔42對應該罩體3〇 之該等穿孔34，並以該等螺絲5〇分別穿設鎖固，而將該風 扇40固定於該罩體30之容置空間31内部，最後，再將該罩 鲁體30以該等扣鉤35扣接於該均溫板1〇之該放熱段12的兩 側，並可以例如焊接加工方式將該罩體3〇與該均溫板1〇予 以焊接固定，以完成本創作之組裝作業。 使用本創作時，請參閱第五圖，本創作係應用於一電 子產αα 60上，該電子產品6〇包含一主機板61以及電連接在 5亥主機板61上的該發熱元件62與複數電子元件63，首先將 本創作之該吸熱段η抵接在該發熱元件62之表面後，該發 熱/〇件62所產生之熱能則經由該均溫板1〇傳導至該散熱鰭 片組20，以逸除該發熱元件62所產生之熱能，並藉由啟動 8 M346053 該風扇40運轉，以使風力集中，並對該散熱鰭片組2〇及該 均溫板10直接進行散熱，以迅速將熱能經由該流道犯帶μ 出’俾有效提昇整體之散熱效能者。 此外，本創作係藉由從該吸熱段u之二側所分別延伸 出的該放熱段12的設計，以增加該均溫板1〇之導 進而提昇其導熱效能者。 …The average temperature plate design increases the heat transfer area of the uniform temperature plate and the thermal efficiency. Two: 1::::: Provides a heat sink. By means of a uniform temperature plate, it can avoid collision with other electronic components on the motherboard, and has better installation flexibility. Therefore, the present invention provides a heat dissipating device, which is composed of a group, a military body and a fan, and is::::: The heat-dissipating film group is attached to the temperature-equalizing plate to connect the temperature-equalizing plate, and Encircling each other: a scorpion fin Η 及 及 及 及 及 及 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , The opening and the other surface of the temperature equalizing plate are disposed. [Embodiment] The following examples are intended to further explain the scope of the present invention, but do not limit the scope of the present invention in any way. Referring to the first and fourth figures, the heat sink of the present invention is composed of a uniform _ mL board 10 thermal fin set 20, a cover 30 and a fan 40. The temperature equalizing plate 10 is an elongated and curved uniform temperature plate, and the average/m plate has an endothermic section u and a heat release 12 which is bent and extended from the two sides of the heat absorption section η, respectively. And the heat absorbing section u protrudes from the surface of the two heat releasing sections 12 to contact the surface of a heat generating component β2 (as shown in FIG. 5), and the heat releasing section 12 and the heat absorbing section The segment 11 is formed with a large heat-conducting area. The heat-generating component 62 can be a CPU, a semiconductor package θ θ plate, or other electronic component that has a high heat and requires heat dissipation. The heat-dissipating fin group 2 is attached to a surface of a portion of the temperature-regulating plate 10. Preferably, the heat-dissipating film group 2 is attached to the surface of the heat-dissipating portion 12, and the heat-dissipating fin group 20 is attached. The heat dissipating fins 21 are formed by a plurality of heat dissipating fins 21 arranged at equal intervals, and the heat dissipating fins 21 may each be a squeeze-type heat dissipating Korean film. The / hood body 30 is connected to the temperature equalizing plate 1 〇, and is formed with a / claw channel 32 ′ between each other. 4 The heat dissipation fin group 2 is located in the flow channel %, and the cover body is open and connected. An opening of the flow path 32 and a & space 31 communicating with the opening 33 are formed therein, and the heat dissipation fin set 20 is located in the flow path 32 and is in the portion M M M M M M M A plurality of through holes 34 are formed in the surface of the accommodating space 31. The through holes 34 are respectively disposed adjacent to the opening 33, and a hook 35 is formed on each side of the cover 30, and the hooks 35 are respectively fastened. On both sides of the heat release section 12 of the temperature equalization plate 10. The fan 40 is disposed inside the accommodating space 31 and corresponding to the opening 33 and another surface of the temperature equalizing plate 1 , the fan 4 〇 includes a bracket 41 and is opened on the bracket 41 . There are a plurality of screw holes 42 corresponding to the through holes 34, which can be respectively locked by a screw 5, which can be an axial fan or a centrifugal fan or the like. When assembling the present invention, referring to the first figure and the second figure, the heat dissipation fin group 20 is first attached to the surface of the heat release section 12 of the temperature equalization plate 1 , and the heat dissipation fins can be soldered, for example. The group 2 is welded to the heat releasing section 12, and the fan 40 is corresponding to the through holes 34 of the cover 3 by the screw holes 42 of the bracket 41, and the locks are respectively inserted by the screws 5〇. The fan 40 is fixed to the inside of the accommodating space 31 of the cover 30. Finally, the cover 30 is fastened to the heat releasing section 12 of the temperature equalizing plate 1 by the hooks 35. The cover body 3〇 and the temperature equalization plate 1〇 can be welded and fixed on both sides, for example, by welding, to complete the assembly work of the present invention. When using this creation, please refer to the fifth figure. The creation is applied to an electronic product αα 60. The electronic product 6〇 includes a motherboard 61 and the heating element 62 electrically connected to the 5H motherboard 61 and a plurality of After the heat-absorbing portion η of the present invention is abutted on the surface of the heat-generating element 62, the heat generated by the heat-generating element 62 is transmitted to the heat-dissipating fin group 20 via the temperature-regulating plate 1 The heat generated by the heating element 62 is removed, and the fan 40 is operated by starting 8 M346053 to concentrate the wind, and the heat dissipation fin set 2 and the temperature equalizing plate 10 are directly dissipated to quickly By passing the heat energy through the flow path, the heat dissipation efficiency of the whole is improved. In addition, the creation is based on the design of the heat release section 12 extending from the two sides of the heat absorption section u to increase the conduction of the temperature equalization plate and thereby improve the heat conduction performance. ...
另外’因本創作之該放熱段12係高於該吸熱段^，其 除了可增加該均溫板1G之導熱面積外，亦可避免與該主機 板61上之該等電子元件63發生碰撞，故可將本創作貼設於 该主機板61上的任-該發熱元件62上，不因該發埶元件62 週遭之該等電子元件63因位置配置的不同，而造成本創作 無法安襞的情況，&本創作俾具有較佳之安裝彈性。 口惟值得注意的是，本創作可應用在厚度較薄之該電子 產品60上，例如筆記型電腦或個人數位助理器⑽）等 等，但並不以此等為限。 综上所述’應用本|彳作可達成提昇㈣之導、散熱效 能並增加安裝上之彈性的效果，以解決習知技術之種種缺 失，實已具備高度產業利用價值。 【圖式簡單說明】 第一圖為本創作之立體分解示意圖。 第二圖為本創作之立體組合示意圖。 第三圖為第二圖之3_3剖面的示意圖。 第四圖為第三圖之4_4剖面的示意圖。 9 M346053 第五圖為本創作之使用狀態圖。In addition, because the heat release section 12 of the present invention is higher than the heat absorption section, in addition to increasing the heat transfer area of the temperature equalization plate 1G, collision with the electronic components 63 on the motherboard 61 can be avoided. Therefore, the present invention can be attached to any of the heating elements 62 on the motherboard 61, and the electronic components 63 surrounding the hairpin 62 cannot be installed because of the difference in positional configuration. In this case, & this creation has better installation flexibility. It is worth noting that the creation can be applied to the electronic product 60 having a relatively small thickness, such as a notebook computer or a personal digital assistant (10), etc., but is not limited thereto. In summary, the application of this application can achieve the improvement of (4) guidance, heat dissipation and increase the flexibility of installation to solve the various defects of the prior art, which has already achieved high industrial utilization value. [Simple description of the diagram] The first diagram is a three-dimensional decomposition diagram of the creation. The second picture is a three-dimensional combination diagram of the creation. The third figure is a schematic view of the 3_3 section of the second figure. The fourth figure is a schematic view of the 4_4 section of the third figure. 9 M346053 The fifth picture is the usage status diagram of this creation.
【主要元件符號說明】 10 · • · · ·均溫板 11 · • · · ·吸熱段 12 · · •··放熱段 20 · • · · ·散熱鰭片組 21 · .· · ·散熱鰭片 30 · • · · ·罩體 31 · • · · ·容置空間 32 · · • · ·流道 33 · • · · ·開孔 34 · · • · ·穿孔 35 · • · · ·扣鉤 40 · • · · ·風扇 41 · • · · ·支架 42 · · • · ·螺孔 50 · • · ••螺絲 60 · • · · ·電子產品 61 · • · · ·主機板 62 · · •··發熱元件 63 · •···電子元件[Main component symbol description] 10 · • · · ·Homothermal plate 11 · • · · · Heat absorption section 12 · · ··· Heat release section 20 · • · · · Heat sink fin set 21 · ·· · · Heat sink fin 30 · • · · · Cover 31 · · · · · accommodating space 32 · · · · · Flow path 33 · · · · · Opening 34 · · · · · Perforation 35 · • · · · · • · · · Fan 41 · • · · · Bracket 42 · · · · · Screw hole 50 · • · •• Screw 60 · • · · · Electronics 61 · • · · · Motherboard 62 · · •·· Component 63 · •··· Electronic components