1304531 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種可調整方向之散熱裝置，尤指一 適用於可三百六十度旋轉發熱方向以配合發熱源^ 5 調整方向之散熱裝置。 可 【先前技術】 10 15 20 對於一般電子產品而言，其内部所組設之電子元 會產生或多或少之熱量，若不有效將此熱量散熱出去，二 有可能造成電子產品因過熱而故障，甚至損壞。 以電腦而言，其主要熱量之來源(發熱源)即為電腦主 機板上所組設之中央處理器（CPU)，i般對於電腦 上之中央處理器皆會有-些散熱措施，例如，於中理 器上再組設有一散熱風扇、或者組設有-散熱鰭片、=者 散熱風扇與散熱轉片皆一起組設等，藉以進行中央處理哭 之散熱。 然而，一般散熱風扇與散熱鰭片組設於電腦主 7 ’皆會因電腦主機板之設計而固定其位置 扇與散熱w僅會依照當時電腦主機板上中 = 方Γ因此，傳統散熱風扇與_僅 槿 、有放熱之效果，而無可轉換散熱方向之結 構权计，如此對於使用上而言，並無具有太 若欲將零件共用日卑，介、，n ^ ^ 理想。 _亦必❹以考量種種因素，實非十分 5 » 1304531 月同時參閱圖2係本發明第一較佳實施例之分解圖、及 圖3係本發明第一較佳實施例之立體圖，其係將上述本發明 之基本結構加以應用，於圖式中顯示有一基板5，且此基板 5匕括有一固定件51、以及一發熱電子元件π。 於本κ施例中，基板5僅顯示前面之固定件5 1，另一固 疋件51係被擋住而不顯示，且固定件51係分別為一螺孔， 同時基板5係為一主機板，而發熱電子元件52則為一中央 _ 處理器（CPU)。 、 於上述基板5上係組設有一本發明之可調整方向之散 1〇熱裝置（如圖1所示之基本結構而加以應用），其係包括有一 ^熱器10、以及一導風罩3。其中，散熱器1〇包括有複數片 放熱鰭片2、以及一旋轉機構12其係位於散熱器1〇之外部， ^複數片散熱鰭片2係彼此平行排列、並分別沿軸向固設於 旋轉機構12上，並且複數片散熱鰭片2係彼此間隔一預定距 15離t ’同時，複數片散熱鰭片2並分別貫設有一中央貫孔2!， 而旋轉機構12則串套並固定於複數片散熱鰭片2之中央貫 孔21内。 於本實施例中，旋轉機構12係為轉軸，且其係為一銅 柱，同時，散熱器10之複數片散熱鰭片2係為複數片圓形散 20 熱鰭片。 此外，散熱器10於旋轉機構12之下方尚固設有一底座 1，此底座1包括有二固定元件n，其係分別對應於基板5之 二固定件51，且於本實施例中，二固定元件u係分別為一 8 1304531 通孔，並以二螺絲6分別穿經通孔而螺鎖於基板5固定件 之螺孔，因此可將散熱器1〇組設於基板5上。 料’導風罩3包括有-第二導風孔3卜_第—導風孔 32、以及-導風通道33,且導風通道％係連結於第二導風 .5㈣、與第-導風孔32之間，並且第一導風孔观面向散 熱器H)，同時，導風罩3並包括有一另—旋轉機構331、以 及-内部空間332 ’其中之另一旋轉機構331係對應搞接至 Μ器1G之旋轉機構12上並相對旋轉，且散熱器⑺之複數 • #散熱縛片2之其中-部份係容置於導風通道％之内部空 10 間332内。 於本實施例中’導風罩3之另—旋轉機構331係為極轉 部’且導風罩3之第二導風孔31上藉由螺絲61鎖附而組設有 一散熱風扇4,此散熱風扇4包括有一入風區41、以及一出 風區42，其中之出風區42係對應於導風罩3之第二導風孔 15 31。 因此，當散熱器10、導風罩3、與散熱風扇4彼此組設 • 後，導風罩3之第一導風孔32係對應面向於散熱器10之複數 片散熱鰭片2，且可使導風罩3以旋轉機構12與另一旋轉機 構331相對於散熱器10旋轉，調整散熱器1〇之散熱方向，並 20使散熱風扇4之入風區41對應於基板5之發熱電子元件52而 加以散熱。 請參閱圖4係本發明第二較佳實施例之立體圖’當基板 5之發熱電子元件53因設計關係而改變其位置時，同樣的， 1304531 可使導風罩3以旋轉機構12相對於散熱器i〇旋轉，並使散熱 風扇4之入風區41對應於基板5之發熱電子元件53。 因此’上述之導風罩3可依不同之使用需求而旋轉其角 度，亦即導風罩3可三百六十度旋轉以調整其角度，並藉由 5 散熱器1 〇散熱，故不論基板5之發熱電子元件52,53組設於何 位置，皆可達成散熱之目的。再者，因基板5之發熱電子元 件52,53可組設於任何位置，故散熱器1〇、導風罩3等結構可 達成於不同場合皆可共用之目的。 丨請參閱圖5係本發明第三較佳實施例之立體圖，其主要 10 結構皆與上述第一、第二較佳實施例相同，唯差別在於散 熱風扇72係組設於發熱電子元件71上，且散熱風扇72同樣 包括有一入風區721、以及一出風區722。 此外，導風罩73之第二導風孔731上組設有一延伸管 74，且此延伸管74之前端係導引至散熱風扇72處，因此， 15 於各元件組設、並旋轉調整導風罩73之角度後，散熱風扇 72之出風區722係對應於導風罩73之第二導風孔73]1，散熱 風扇72之入風區721係對應於發熱電子元件71。 上述之結構同樣具有三百六十度旋轉調整導風罩73角 度之功效，且即使散熱風扇72組設於發熱電子元件71上， 20亦同樣可達成散熱之目的，亦即本實施例同樣可達成上述 各實施例所述之各種功效。 請參閱圖6係本發明第四較佳實施例之分解圖，其主要 結構亦與上述各實施例相同，唯差別在於複數片散熱鰭片 %係分別為多邊形散熱鰭片，於本實施例中，係為六邊形， 1304531 當然，亦可為四邊、五邊、七邊等各種形狀，且此種設計 亦可達成散熱之目的。 此外，於本實施例中，於每—散熱縛片％上並開設有 彼此相對應之二個卡合孔761，且於散熱器乃底座乃2上向 5上凸設有二卡合柱75卜故每—散熱鰭片％可湘其卡合孔 761而分別組設於散熱器75底座752之卡合柱751上。 上述實施例僅係為了方便說明而舉例而已，本發明所 主張之權利範圍自應以申請專利範圍所述為準，而非僅限 於上述實施例。 10 【圖式簡單說明】 圖1係本發明基本架構之示意圖。 圖2係本發明第一較佳實施例之分解圖。 圖3係本發明第一較佳實施例之立體圖。 15圖4係本發明第二較佳實施例之立體圖。 圖5係本發明第三較佳實施例之立體圖。 圖6係本發明第四較佳實施例之分解圖。 號說明】 【主要元件符 20 底座1 旋轉機構12 導風罩3 導風通道33 散熱風扇4 散熱器10 散熱鰭片2 第二導風孔31 另一旋轉機構331 入風區41 固定元件11 中央貫孔21 第一導風孔32 内部空間332 出風區42 11 1304531 基板5 固定件51 螺絲6 散熱風扇72 導風罩73 散熱器75 散熱鰭片76 發熱電子元件53 發熱電子元件71 出風區722 延伸管74 底座752 發熱電子元件52 螺絲61 入風區721 第二導風孔731 卡合柱751 卡合孔7611304531 IX. Description of the invention: [Technical field of the invention] The present invention relates to a heat dissipating device capable of adjusting the direction, in particular to a heat dissipating device which can be used in a direction of rotation of a heat of three hundred and sixty degrees to match the direction of the heat source . [Prior Art] 10 15 20 For general electronic products, the electronic components assembled inside will generate more or less heat. If it is not effective to dissipate this heat, the second possibility may cause the electronic products to overheat. Fault or even damage. In the case of a computer, the source of the main heat (heat source) is the central processing unit (CPU) set up on the computer motherboard. As for the central processing unit on the computer, there are some heat dissipation measures, for example, A heat-dissipating fan is further arranged on the middle-lowering device, or a heat-dissipating fin, a heat-dissipating fan and a heat-dissipating fin are all set together, so as to perform central processing and crying heat dissipation. However, the general cooling fan and the heat-dissipating fin set in the computer main 7' will be fixed by the design of the computer motherboard. The position fan and the heat dissipation w will only be in accordance with the computer motherboard at the time = square, therefore, the traditional cooling fan and _ Only 槿, there is the effect of heat release, and there is no structural weight meter for the direction of heat transfer, so there is no such thing as the use of the parts, and the n ^ ^ ideal. _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The basic structure of the present invention described above is applied, and a substrate 5 is shown in the drawing, and the substrate 5 includes a fixing member 51 and a heat generating electronic component π. In the embodiment of the present invention, the substrate 5 only shows the front fixing member 5 1, the other fixing member 51 is blocked and not displayed, and the fixing member 51 is respectively a screw hole, and the substrate 5 is a motherboard. The heat generating electronic component 52 is a central _ processor (CPU). The substrate 5 is provided with an adjustable direction dispersing device (applied to the basic structure shown in FIG. 1), and includes a heat exchanger 10 and an air hood. 3. The heat sink 1 includes a plurality of heat releasing fins 2, and a rotating mechanism 12 is disposed outside the heat sink 1 , and the plurality of heat radiating fins 2 are arranged in parallel with each other and are respectively fixed in the axial direction. On the rotating mechanism 12, and a plurality of fins 2 are spaced apart from each other by a predetermined distance 15 from t', a plurality of fins 2 are respectively disposed with a central through hole 2!, and the rotating mechanism 12 is sleeved and fixed. In the central through hole 21 of the plurality of fins 2 . In this embodiment, the rotating mechanism 12 is a rotating shaft, and is a copper column. At the same time, the plurality of heat radiating fins 2 of the heat sink 10 are a plurality of circular heat sinks. In addition, the heat sink 10 is further provided with a base 1 below the rotating mechanism 12. The base 1 includes two fixing elements n corresponding to the two fixing members 51 of the substrate 5, and in the embodiment, two fixed The element u is an 8 1304531 through hole, and the two screws 6 are respectively threaded through the through holes to be screwed to the screw holes of the fixing member of the substrate 5. Therefore, the heat sink 1 can be assembled on the substrate 5. The air hood 3 includes a second air guiding hole 3, a first air guiding hole 32, and a wind guiding passage 33, and the air guiding passage is connected to the second air guiding body. 5 (four), and the first guide Between the air holes 32, and the first air guiding hole surface faces the heat sink H), at the same time, the air guiding hood 3 includes a further rotating mechanism 331, and the inner space 332 'the other rotating mechanism 331 corresponds to It is connected to the rotating mechanism 12 of the device 1G and relatively rotated, and the plurality of heat sinks (7) are partially disposed in the inner space 10 332 of the air guiding channel. In the present embodiment, the other rotating mechanism 331 of the air guiding hood 3 is a pole rotating portion ′, and the second air guiding hole 31 of the air guiding hood 3 is locked by a screw 61 to form a heat dissipating fan 4 . The cooling fan 4 includes an air inlet area 41 and an air outlet area 42, wherein the air outlet area 42 corresponds to the second air guiding hole 15 31 of the air duct 3. Therefore, after the heat sink 10, the air guiding hood 3, and the heat dissipating fan 4 are assembled with each other, the first air guiding hole 32 of the air guiding hood 3 corresponds to the plurality of heat dissipating fins 2 facing the heat sink 10, and The air hood 3 is rotated by the rotating mechanism 12 and the other rotating mechanism 331 with respect to the heat sink 10 to adjust the heat dissipation direction of the heat sink 1 , and 20 the air inlet area 41 of the heat radiating fan 4 corresponds to the heat generating electronic component of the substrate 5 . 52 and heat. 4 is a perspective view of a second preferred embodiment of the present invention. When the heat-generating electronic component 53 of the substrate 5 changes its position due to the design relationship, the 1304531 can make the air guiding cover 3 dissipate relative to the rotating mechanism 12 by the rotating mechanism 12. The device 〇 rotates, and the air inlet region 41 of the heat dissipation fan 4 corresponds to the heat-generating electronic component 53 of the substrate 5. Therefore, the above-mentioned air hood 3 can be rotated according to different use requirements, that is, the air hood 3 can be rotated by 360 degrees to adjust the angle thereof, and the heat is dissipated by the 5 heat sink 1 , regardless of the substrate. The location of the 5th heating electronic components 52, 53 is set to achieve the purpose of heat dissipation. Furthermore, since the heat generating electronic components 52, 53 of the substrate 5 can be assembled at any position, the structure of the heat sink 1 and the air guiding cover 3 can be achieved for sharing in different occasions. 5 is a perspective view of a third preferred embodiment of the present invention, the main structure of which is the same as that of the first and second preferred embodiments described above, except that the heat dissipating fan 72 is disposed on the heat-generating electronic component 71. The cooling fan 72 also includes an air inlet region 721 and an air outlet region 722. In addition, an extension tube 74 is disposed on the second air guiding hole 731 of the air guiding cover 73, and the front end of the extending tube 74 is guided to the cooling fan 72. Therefore, the components are assembled and rotated. After the angle of the windshield 73, the air outlet area 722 of the heat dissipation fan 72 corresponds to the second air guiding hole 73]1 of the air guiding cover 73, and the air inlet area 721 of the heat dissipation fan 72 corresponds to the heat generating electronic component 71. The above structure also has the effect of rotating and adjusting the angle of the air hood 73 by three hundred and sixty degrees, and even if the heat dissipating fan 72 is disposed on the heat-generating electronic component 71, the same can be achieved for the purpose of heat dissipation, that is, the same can be used in this embodiment. The various effects described in the above embodiments are achieved. FIG. 6 is an exploded view of the fourth preferred embodiment of the present invention. The main structure is the same as that of the above embodiments, except that the plurality of heat sink fins are respectively polygonal fins, which is in this embodiment. It is hexagonal, 1304531. Of course, it can also be four-sided, five-sided, seven-sided and other shapes, and this design can also achieve the purpose of heat dissipation. In addition, in the embodiment, two engaging holes 761 corresponding to each other are disposed on each of the heat dissipating tabs, and two engaging posts 75 are protruded from the base of the heat sink. Therefore, each of the heat-dissipating fins may be disposed on the engaging post 751 of the base 752 of the heat sink 75, respectively. The above-described embodiments are merely examples for the convenience of the description, and the scope of the claims is intended to be limited by the scope of the claims. 10 [Simple description of the drawings] Fig. 1 is a schematic diagram of the basic structure of the present invention. Figure 2 is an exploded view of a first preferred embodiment of the present invention. Figure 3 is a perspective view of a first preferred embodiment of the present invention. Figure 4 is a perspective view of a second preferred embodiment of the present invention. Figure 5 is a perspective view of a third preferred embodiment of the present invention. Figure 6 is an exploded view of a fourth preferred embodiment of the present invention. No. Description] [Main component 20 Base 1 Rotating mechanism 12 Air duct 3 Air duct 33 Cooling fan 4 Radiator 10 Cooling fin 2 Second air guiding hole 31 Another rotating mechanism 331 Inlet area 41 Fixing element 11 Central Through hole 21 First air guiding hole 32 Internal space 332 Air outlet area 42 11 1304531 Substrate 5 Fixing piece 51 Screw 6 Cooling fan 72 Air hood 73 Heat sink 75 Heat sink fin 76 Heated electronic component 53 Heated electronic component 71 Outlet area 722 extension tube 74 base 752 heating electronic component 52 screw 61 air inlet area 721 second air guiding hole 731 clamping column 751 locking hole 761
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