TWI308954B - Heat dissipation device - Google Patents

Heat dissipation device Download PDF

Info

Publication number
TWI308954B
TWI308954B TW095138816A TW95138816A TWI308954B TW I308954 B TWI308954 B TW I308954B TW 095138816 A TW095138816 A TW 095138816A TW 95138816 A TW95138816 A TW 95138816A TW I308954 B TWI308954 B TW I308954B
Authority
TW
Taiwan
Prior art keywords
heat
fin
dissipating
heat dissipating
conducting column
Prior art date
Application number
TW095138816A
Other languages
Chinese (zh)
Other versions
TW200819700A (en
Inventor
Cheng Tien Lai
Wei-Le Wu
Cui-Jun Lu
Original Assignee
Foxconn Tech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Foxconn Tech Co Ltd filed Critical Foxconn Tech Co Ltd
Priority to TW095138816A priority Critical patent/TWI308954B/en
Publication of TW200819700A publication Critical patent/TW200819700A/en
Application granted granted Critical
Publication of TWI308954B publication Critical patent/TWI308954B/en

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/14—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending longitudinally
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H01L21/4882—Assembly of heatsink parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2215/00—Fins
    • F28F2215/10—Secondary fins, e.g. projections or recesses on main fins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Geometry (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Description

1308954 九、發明說明： _【發明所屬之技術領域】 •本發明涉及-種散熱Μ，尤其涉及—㈣ 件之散熱裝置。 -【先前技術】 電子元件如中央處理器等在運行過程中產生大量之 ，二元件之正常運行，其產生之熱需及時地散 發出去H該f子元件上加裝—散熱裳置。 ㊉用之散熱裝置包括-金屬底板及從該底板向上延伸 ^出之複數散減；1。料W之頂端還加裝 該籍片提供強對錢流。使料，該底㈣置於發熱電2 兀件而吸收其產生之熱量，進而將熱量傳遞至 散發到周討間。隨著電子產業之發展，電子元件:= 頻率和功能曰益提升’其發熱量亦隨之增加。上述散孰裝 置需要較大之散熱面積以滿足電子元件之散熱需求。然而 在電子系統日益集成化和小型化之趨勢下，上述散熱裝置 之面積增加有限。因此，另外一種散熱裝置應用電=件 之散熱’請參閱圖1，該散熱裝置包括一中心柱體丄、圍繞 該柱體1結合之散熱體3。該散熱體3之外周面輻射延伸= 數韓片4’相鄰鰭片4間形成複數氣流通道。一風^通過— 風扇固定件7固定至該等鯖片4之頂端。其中，該等複 片4沿順時針方向彎曲，該風扇6可沿逆時針方向旋轉. 作時，該散熱裝置通過一扣件5將柱體丨之底部貼合至電= 6 1308954 元件上，電子元件產生之熱通過柱體1吸收進而到達該等鰭 .片4’該風扇6向該等鰭片4提供強對流氣流而加速該等鰭片曰 、4上之熱量散發至周圍空間。然而，在該散熱裝置散熱體3 之下部，由於氣流流速降低，加之，氣流之紊流度降低， 則其與該等鰭片4之熱交換率下降，其散熱性能有待進 提升。 【發明内容】 本發明旨在提供一種散熱性能好之散熱裝置。 一種散熱裝置用於電子元件散熱，其包括一導熱柱及 圍繞該導熱柱設置之複數散賊丨，所述該等㈣包括分 另J圍、該V熱柱周圍呈放射狀延伸之複數第一散埶鳍片及 複數第二散熱鰭片’該等第一散熱轉片和該等第：散熱鰭 片之彎曲方向相反。 黯月對應彎曲設置 與習知技術相比，上述第一、 從而使工作中通過該第一、二散熱轉片之氣流在其間產生 強资机而與該第-、—散熱_片進行充分熱交換，從而第 -、二鰭片上之熱量充分之散發出去，該散熱裝置之散熱 性能得以提升。 【實施方式】 請參閱圖2,本發明散熱裝置包括一散熱器（未標示）、 與該散熱器結合以將該散熱裝置固定至發埶電子元 扣㈣、-風扇60通過—固定架则定至散熱器之頂部。 上述散熱器包括一導熱導熱柱11及圍繞該導熱柱打之 7 1308954 氣流流通之第二通道（未標示）。該第二鰭片153和第一鰭 -片133之彎曲弧度相同。 ' ' 上述扣具30包括一大致呈四邊形之扣板31及從該扣板 31四角向外延伸之四扣腳33。該扣板31之中心設有一開口 311，以收容上述導熱柱1：[之傳熱部113。該開口 311之直徑 小於上述導熱柱11吸熱部Hi之直徑，但略大於或相當於該 傳熱部113之直徑。每一扣腳33之近末端處設有一螺孔331 鲁以谷置一固疋件如螺釘（圖未示）等，而將該散熱裝置固 疋至電子元件所在之電路板（圖未示）上。該固定腳33之 底部對應該螺孔331向下延伸一襯套333以導引固定件之鎖 固。 • 請參閱圖3和圖4 ,上述導熱柱11之傳熱部113依次穿過 扣具30之開口 3U、第一、二套筒131、151之第一、第二穿 孔1311、1511，從而該傳熱部113通過過盈配合與該第一、 一套筒131、151結合。該導熱柱η之吸熱部ln從該扣板31 開口 311凸出，該扣板31夹置於該第一鰭片組13和導熱柱u -之吸熱部ill之間。該第二鰭片組15位於該第一鰭片組 上，其中該第一鰭片組13之第一鰭片133沿逆時針方向延 伸，第二鰭片組15之第二鰭片153沿順時針方向延伸。該第 一、二鰭片組13、15之第一、二通道相通。該扣具3〇之四 扣腳33伸出於第一、二鰭片組13、15端緣之外。 請參閱圖2-5，上述風扇60呈圓形，其通過上述固定架 70固定至上述第二鰭片組15上。該固定架7〇包括一環形部 710及從該環形部710外周面之上周緣向外延伸之複數固定 9 1308954 部730。該複數固定部730均勻分佈於該環形部7i〇之上周 ..緣。該環形部710環繞固定至該第二韓片組15之上部外周 •.緣，該風扇60固定至該複數固定部73〇上，從而該風扇6〇對 應於該第-、二韓片組13、15之第一、二通道而固定至該 第二鰭片組15之上部。 使用時，上述該散熱裝置通過扣具30固定至電路板 上，散熱器導熱柱11之吸熱部ηι貼合至該電子元件而吸收 籲電子元件產生之熱罝，該熱量通過該導熱柱。之傳熱部m 傳遞至第一、二鰭片組13、15。風扇6〇向該第一、二鰭片 組13、15提供強對流氣流，該氣流通過第一、二鰭片組、 15之第一、二通道而將第一、二鰭片133、153上之熱量散 發至周圍空間。該實施例中，風扇60沿逆時針方向運轉， 其與第二韓片組15之第二韓片153之順時針彎曲方向相反。 與習知技術相比，上述散熱裝置之第一、二鰭片組13、 • 15^第一、二鰭片133、153反向彎曲，從而其間形成大致 ^，，S之氣流通道。上述風扇60提供之強對流氣流在該 S之氣流通道内產生強紊流，而與該第一、二鰭片組 13 15之鰭片133、153進行充分熱交換，從而及時帶走第 、日一鰭片133、153上之熱量，該散熱裝置之散熱性能得 以提升。請參閱表i，其為本發明散熱裝置與習知技術圖工 中散熱裝置之對比實驗資料，其中Ta表該測試時之環境溫 度Tc表被測試電子元件在加裝散熱裝置時之測試溫度，p 表被，試電子元件功率，字母A表圖1中習知技術之散熱裝 置，子母B表本發明散熱裝置，字母M、別表本發明散 1308954 ^ ^盆 旦鰭片組13、第二鰭片組15。Θ表散熱裝置之熱 θ__八衡星散熱裝置散熱性能之指標，AT=Tc - Ta， …AT/P由此可知’當P、Ta均恒定時，Θ值越小，ΔΤ值小， 谠明電子元件運行時之仇值越小，電子元件產生之熱被散 熱裝置及時地散發出去’則可知電子元件所用散熱裝置之 散熱性能較好，反之，電子元件所用散熱裝置之散熱性能 欠佳。 表1 試樣 — —------ 所用風扇 P 尚度 (mm) 0(°C /watt) 轉速 (rpm) (watt) Μ Ν Ta(t) Tc(°C) ΔΤ (°〇 34.3 61.6 27.3 0.2707 A 40 32,5 60.2 27.7 0.2746 34.8 62,6 27.8 0.2756 32.3 60.1 27.8 0.2756 32.8 58.9 26.1 0.2588 20 20 32.7 59.0 26.3 0.2608 33.4 59.9 26.5 0.2627 4000 100.86 32.1 58.1 26.0 0.2578 32.8 59.4 26.6 0.2637 B 15 25 32.4 58.2 25.8 0.2558 33.3 59.4 26.1 0.2588 -. 32.7 58.7 26.0 0.2578 32.1 58.9 26.8 0.2657 25 15 32.1 58.2 26.1 0.2588 30.3 57 26.7 0.2647 - 1 32.4 59.2 26.8 0.26571308954 IX. Description of the invention: _ [Technical field to which the invention pertains] The present invention relates to a heat dissipating device, and more particularly to a heat dissipating device of the (4) piece. - [Prior Art] Electronic components such as the central processing unit generate a large number of them during operation, and the normal operation of the two components, the heat generated by them needs to be dissipated in time to be added to the sub-components. The heat dissipating device for the tenth includes a metal bottom plate and a plurality of thinnings extending upward from the bottom plate; The top of the material W is also installed to provide a strong flow of money. The material is placed in the heating element 2 to absorb the heat generated by the bottom (4), and then the heat is transferred to the chamber. With the development of the electronics industry, electronic components: = increased frequency and functional benefits, and their heat generation has also increased. The above-mentioned diverging device requires a large heat dissipation area to meet the heat dissipation requirements of electronic components. However, with the increasing integration and miniaturization of electronic systems, the area of the above heat sinks has been limited. Therefore, another type of heat dissipating device applies heat dissipation of the electric component. Referring to Fig. 1, the heat dissipating device includes a center cylinder 丄, and a heat dissipating body 3 coupled around the cylinder 1. The outer peripheral surface of the heat radiating body 3 is radiated and extended to form a plurality of airflow passages between the adjacent fins 4 of the 4's. A wind passes through - a fan holder 7 is fixed to the top end of the jaws 4. Wherein, the plurality of sheets 4 are bent in a clockwise direction, and the fan 6 is rotatable in a counterclockwise direction. In this case, the heat dissipating device attaches the bottom of the cylinder to the electric component by means of a fastener 5, The heat generated by the electronic components is absorbed by the cylinder 1 to reach the fins. The sheet 4' provides a strong convective airflow to the fins 4 to accelerate the dissipation of heat from the fins 4 to the surrounding space. However, in the lower portion of the heat sink 3, since the flow velocity is lowered, and the turbulence of the airflow is lowered, the heat exchange rate with the fins 4 is lowered, and the heat dissipation performance is to be improved. SUMMARY OF THE INVENTION The present invention is directed to a heat sink having good heat dissipation performance. A heat dissipating device is used for dissipating heat of an electronic component, comprising a heat conducting column and a plurality of thieves disposed around the heat conducting column, wherein the (4) includes a plurality of first and a plurality of first extending around the V hot column. The diverging fins and the plurality of second heat dissipating fins have opposite bending directions of the first heat dissipating fins and the first heat dissipating fins. The first month corresponding to the bending arrangement is compared with the prior art, so that the airflow passing through the first and second heat dissipating fins during operation generates a strong power machine therebetween and is sufficiently heated with the first and second heat dissipating sheets. Exchanging, so that the heat on the first and second fins is sufficiently radiated, and the heat dissipation performance of the heat sink is improved. [Embodiment] Please refer to FIG. 2, the heat dissipating device of the present invention comprises a heat sink (not shown), combined with the heat sink to fix the heat sink to the hairpin electronic button (4), and the fan 60 passes through the fixing frame. To the top of the radiator. The heat sink comprises a heat conducting and heat conducting column 11 and a second channel (not labeled) through which the air flow of the 1 1308954 is circulated. The second fin 153 and the first fin-sheet 133 have the same curvature. The fastener 30 includes a substantially quadrangular gusset 31 and four fastening legs 33 extending outwardly from the four corners of the gusset 31. An opening 311 is defined in the center of the gusset 31 to receive the heat transfer portion 113 of the heat conducting column 1. The diameter of the opening 311 is smaller than the diameter of the heat absorbing portion Hi of the heat conducting column 11, but is slightly larger than or equal to the diameter of the heat transfer portion 113. A screw hole 331 is disposed at a proximal end of each of the buckle legs 33. The heat sink is fixed to the circuit board where the electronic component is located (not shown). on. The bottom of the fixing leg 33 has a bushing 333 extending downwardly corresponding to the screw hole 331 to guide the fixing of the fixing member. Referring to FIG. 3 and FIG. 4, the heat transfer portion 113 of the heat conducting column 11 sequentially passes through the opening 3U of the clip 30, the first and second through holes 1311, 1511 of the first and second sleeves 131, 151, so that The heat transfer portion 113 is coupled to the first and first sleeves 131, 151 by an interference fit. The heat absorbing portion ln of the heat conducting column η protrudes from the opening 311 of the gusset plate 31, and the gusset plate 31 is interposed between the first fin group 13 and the heat absorbing portion ill of the heat conducting column u-. The second fin set 15 is located on the first fin set, wherein the first fin 133 of the first fin set 13 extends in a counterclockwise direction, and the second fin 153 of the second fin set 15 follows the same The hour hand extends. The first and second channels of the first and second fin sets 13, 15 are in communication. The buckles 3 of the buckles extend beyond the end edges of the first and second fin sets 13, 15. Referring to Figures 2-5, the fan 60 has a circular shape and is fixed to the second fin set 15 by the fixing bracket 70. The mounting bracket 7 includes an annular portion 710 and a plurality of fixed 9 1308954 portions 730 extending outwardly from a peripheral edge of the outer peripheral surface of the annular portion 710. The plurality of fixing portions 730 are evenly distributed on the circumference of the annular portion 7i. The annular portion 710 is circumferentially fixed to the outer periphery of the second Korean group 15 , and the fan 60 is fixed to the plurality of fixing portions 73 , so that the fan 6 〇 corresponds to the first and second Korean groups 13 . The first and second channels of 15 are fixed to the upper portion of the second fin set 15. In use, the heat dissipating device is fixed to the circuit board by the clip 30, and the heat absorbing portion ηι of the heat dissipating post 11 of the heat sink is attached to the electronic component to absorb the heat generated by the electronic component, and the heat passes through the heat conducting column. The heat transfer portion m is transmitted to the first and second fin groups 13, 15. The fan 6 提供 provides a strong convective airflow to the first and second fin sets 13 and 15, and the airflow passes through the first and second fin sets, the first and second channels of the first and second fins 133 and 153. The heat is dissipated to the surrounding space. In this embodiment, the fan 60 is operated in a counterclockwise direction opposite to the clockwise direction of the second Korean piece 153 of the second Korean group 15. Compared with the prior art, the first and second fin sets 13, 15^, and the second fins 133 and 153 of the heat dissipating device are reversely bent to form a gas flow passage of substantially ^, S therebetween. The strong convection current provided by the fan 60 generates strong turbulence in the air flow channel of the S, and is fully exchanged with the fins 133 and 153 of the first and second fin sets 13 15 to take away the first day and the day. The heat dissipation on the fins 133, 153 improves the heat dissipation performance of the heat sink. Please refer to Table i, which is a comparative experimental data of the heat dissipating device of the present invention and the heat dissipating device in the prior art, wherein the ambient temperature Tc of the test table is the test temperature of the tested electronic component when the heat dissipating device is installed. p table, test electronic component power, letter A, heat dissipation device of the prior art in FIG. 1, sub-B, table, heat sink of the present invention, letter M, other table, invention, dispersal 1308954 ^ ^ potted fin group 13, second Fin set 15. Θ 散热 散热 散热 散热 散热 θ 衡 衡 衡 衡 衡 衡 衡 衡 衡 衡 衡 衡 衡 衡 衡 衡 衡 衡 衡 衡 衡 衡 衡 衡 衡 衡 衡 衡 衡 衡 衡 衡 衡 衡 衡 衡 衡 衡 衡 衡 衡 衡 衡 衡 衡 衡 衡 衡The smaller the value of the electronic components during operation, the heat generated by the electronic components is dissipated by the heat dissipating device in time. It is known that the heat dissipating device used in the electronic components has better heat dissipation performance. Conversely, the heat dissipating performance of the heat dissipating device used in the electronic components is not good. Table 1 Sample ------------- Fan used P (degrees) 0 (°C / watt) Speed (rpm) (watt) Μ Ν Ta(t) Tc(°C) ΔΤ (°〇34.3 61.6 27.3 0.2707 A 40 32,5 60.2 27.7 0.2746 34.8 62,6 27.8 0.2756 32.3 60.1 27.8 0.2756 32.8 58.9 26.1 0.2588 20 20 32.7 59.0 26.3 0.2608 33.4 59.9 26.5 0.2627 4000 100.86 32.1 58.1 26.0 0.2578 32.8 59.4 26.6 0.2637 B 15 25 32.4 58.2 25.8 0.2558 33.3 59.4 26.1 0.2588 -. 32.7 58.7 26.0 0.2578 32.1 58.9 26.8 0.2657 25 15 32.1 58.2 26.1 0.2588 30.3 57 26.7 0.2647 - 1 32.4 59.2 26.8 0.2657

由上述實驗資料可知，本發明散熱裝置之熱阻Θ明顯小 11 •1308954 於習知技術中散熱裝置之熱阻， 性能優於習知技術中散熱裝置/本發明散熱裝置之散熱 利申=述:本發明符合發明專利要件，爱依法提出專 来本：枯蓺W上該者僅為本發明之較佳實施例，舉凡熟 j 士，在爰依本發明精神所作之等效修倚或 邊化，^應涵蓋於以下之巾請專利範圍内。 一 【圖式簡單說明】 圖1係習知技術中-散熱裝置之立體圖。 圖2係本發明散熱裝置之立體分解圖。 圖3係本發明散熱裝置部分元件之組裝圖 圖4係圖 3之俯視圖 0 圖5係本發明散熱裝 置之組裝圖。 主要元件符 號說明】 導熱柱 11 吸熱部 111 傳熱部 113 第一鑛片組 13 第一套筒 131 第一穿孔 1311 第一鰭片 133 主體部 1331 ' 1531 分叉部 1333、 1533第二鰭片組 15 第二穿孔 1511 第二鰭片 153 扣具 30 扣板 31 開口 311 扣腳 33 螺孔 331 襯套 333 風扇 60 固定架 70 12 .1308954 730 環形部 710 固定部It can be seen from the above experimental data that the thermal resistance of the heat dissipating device of the present invention is significantly smaller. 11 • 1308954 The thermal resistance of the heat dissipating device in the prior art is better than that of the heat dissipating device/heat dissipating device of the present invention. The present invention complies with the requirements of the invention patent, and the love is presented in accordance with the law: the latter is only a preferred embodiment of the present invention, and the equivalent of the invention is based on the equivalent of the invention. , ^ should be covered in the scope of the following patents. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view of a heat dissipating device in a conventional technique. 2 is an exploded perspective view of the heat sink of the present invention. Figure 3 is an assembled view of some components of the heat sink of the present invention. Figure 4 is a plan view of Figure 3. Figure 5 is an assembled view of the heat sink of the present invention. Main component symbol description] Thermal column 11 Heat absorbing portion 111 Heat transfer portion 113 First slab group 13 First sleeve 131 First through hole 1311 First fin 133 Main body portion 1331 ' 1531 Fork portion 1333, 1533 Second fin Group 15 second perforation 1511 second fin 153 buckle 30 gusset 31 opening 311 buckle leg 33 screw hole 331 bushing 333 fan 60 fixing bracket 70 121308954 730 ring portion 710 fixing portion

1313

Claims (1)

Ϊ308954 十申睛專利範圍： 種政熱裝置’包括一導熱枉及圍繞該導熱柱設置之複 數散熱鰭片，其改良在於：該散熱鰭片包括分別圍繞該 導熱柱周圍呈放射狀延伸之複數第一散熱鰭片及複數 第二散熱鰭片，該第一散熱鰭片和第二散熱鰭片之彎曲 方向相反。 2_如申請專利範圍第i項所述之散熱裝置，其中該第一散 熱鰭片、第二散熱鰭片沿該導熱柱之長度方向排佈。 3.如申請專利範圍第2項所述之散熱裝置，其中該第一散 鍵…㈢片石該導熱柱周向呈逆時針方向彎曲，該第二散熱 轉片沿該導熱柱周向呈順時針方向彎曲。 … 4.如申請專利範圍第3項所述之散熱裝置，其中該第一及 第二散熱鰭片之彎曲弧度相同。 5· 範圍第3項所述之散熱裝置，其中該散熱裏 L括套设在該導熱柱外周面之第—及第 置’其中該導熱柱 或第二散熱鰭片之 6.如申請專利範圍第5項所述之散熱農 —端具有圍徑增大且凸伸出該第一 吸熱部。 :申請專利範圍第5項所述之散熱裝置，1中 …鰭片包括從該第一套筒外周面延伸之主體 主體部末端進一步向外延伸之二分又部。 ^ 14 7.Ϊ 308954 The scope of the patent application: The tempering thermal device 'includes a heat-conducting enthalpy and a plurality of heat-dissipating fins disposed around the heat-conducting column, the improvement is that the heat-dissipating fins comprise a plurality of radially extending around the heat-conducting column respectively A heat dissipation fin and a plurality of second heat dissipation fins have opposite bending directions of the first heat dissipation fin and the second heat dissipation fin. The heat dissipating device of claim 1, wherein the first heat dissipating fin and the second heat dissipating fin are arranged along a length of the heat conducting column. 3. The heat dissipating device of claim 2, wherein the first scatter key (3) schist stone is curved in a counterclockwise direction in a circumferential direction, and the second heat dissipating fin is clockwise along a circumference of the heat conducting column The direction is curved. 4. The heat sink of claim 3, wherein the first and second heat sink fins have the same curvature. 5. The heat dissipating device of item 3, wherein the heat dissipating portion L is disposed on the outer circumference of the heat conducting column and the first portion of the heat conducting column or the second heat dissipating fin. 6. The heat-dissipating agricultural end of the fifth item has an enlarged diameter and protrudes from the first heat absorbing portion. The heat dissipating device of claim 5, wherein the fin comprises a two-part portion extending further outward from a distal end of the main body portion extending from an outer peripheral surface of the first sleeve. ^ 14 7.
TW095138816A 2006-10-20 2006-10-20 Heat dissipation device TWI308954B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW095138816A TWI308954B (en) 2006-10-20 2006-10-20 Heat dissipation device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW095138816A TWI308954B (en) 2006-10-20 2006-10-20 Heat dissipation device

Publications (2)

Publication Number Publication Date
TW200819700A TW200819700A (en) 2008-05-01
TWI308954B true TWI308954B (en) 2009-04-21

Family

ID=44769897

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095138816A TWI308954B (en) 2006-10-20 2006-10-20 Heat dissipation device

Country Status (1)

Country Link
TW (1) TWI308954B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102166190B1 (en) * 2010-05-04 2020-10-15 알렉산더 폴토락 Fractal heat transfer device
CN106659059B (en) * 2016-09-11 2023-04-07 奇鋐科技股份有限公司 Fin structure of heat sink
CN107634038B (en) * 2017-10-25 2024-05-24 东莞永腾电子制品有限公司 Cross high wind-guiding fin group radiator

Also Published As

Publication number Publication date
TW200819700A (en) 2008-05-01

Similar Documents

Publication Publication Date Title
TWM244719U (en) Heat sink
TW201024982A (en) Heat dissipation device
TW200421073A (en) System and method for cooling an electronic device
TWM304705U (en) Display card heat sink
TW201329679A (en) Electronic device having a passive heat exchange device
JP2004228484A (en) Cooling device and electronic device
TWI309001B (en)
TW200903236A (en) Heat dissipation module
TWI308954B (en) Heat dissipation device
TW201227244A (en) Heat dissipation device
TW201206325A (en) Heat dissipation device
TW200930275A (en) Heat dissipation device
TWM281394U (en) Heat dissipation device
TWI300328B (en) Heat dissipating device with fan duct
CN109974331A (en) A kind of semiconductor cooling device
TWI310895B (en) Heat dissipation device
JPH104164A (en) Air cooling heat sink
TWI313407B (en) Heat dissipation device
TW201216827A (en) Disk drive bracket and disk drive assembly
TW201224388A (en) Heat sink
JP2004235171A (en) Cooling device with heat sink
TW201014981A (en) Control module structure of heat-dissipation fan
TW201144993A (en) Memory heat-dissipating device
TWI236335B (en) Fixing device of heat sink
TWI315176B (en) Heat dissipation device

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees