TW201224388A - Heat sink - Google Patents

Heat sink Download PDF

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Publication number
TW201224388A
TW201224388A TW099142284A TW99142284A TW201224388A TW 201224388 A TW201224388 A TW 201224388A TW 099142284 A TW099142284 A TW 099142284A TW 99142284 A TW99142284 A TW 99142284A TW 201224388 A TW201224388 A TW 201224388A
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TW
Taiwan
Prior art keywords
heat
fin
heat sink
base
cover
Prior art date
Application number
TW099142284A
Other languages
Chinese (zh)
Inventor
Meng-Hsien Lin
Original Assignee
Hon Hai Prec Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hon Hai Prec Ind Co Ltd filed Critical Hon Hai Prec Ind Co Ltd
Priority to TW099142284A priority Critical patent/TW201224388A/en
Priority to US12/979,359 priority patent/US20120138273A1/en
Publication of TW201224388A publication Critical patent/TW201224388A/en

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Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367Cooling facilitated by shape of device
    • H01L23/3672Foil-like cooling fins or heat sinks
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427Cooling by change of state, e.g. use of heat pipes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Sustainable Development (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The present invention relates to a heat sink. The heat sink includes a base, a heat pipe connected to the base, a fin assembly and a cover. The fin assembly is mounted to the heat pipe and includes a number of fins parallel to each other. Each fin defines two through holes allowing the heat pipe to pass through. The heat pipe includes a body and a couple end connected to the body. Diameter of the couple end is smaller than that of the body. The body is in thermal contact with the fin assembly. The cover extends through partial through holes and covers the couple end and is in thermal contact with the fin. The couple end is in thermal contact with the cover.

Description

201224388 六、發明說明: 【發明所屬之技術領域】 [0001] 本發明涉及一種散熱器。 【先前技術】 [0002] 隨著電腦的中央處理器功率的不斷提高,中央處理器的 散熱需求也越來越高,熱管作為中央處理器的傳熱裝置 被廣泛地使用。熱管成片的長度一般在100mm〜300mm, 而電腦散熱器中可能無法用到這麼長的熱管,這時候就 _ 需要將其切斷,再將切頭封住以讓熱管重新發揮效能。 〇 切斷的位置就叫做縮尾,由於縮尾端無法利用熱管的原 理來導熱,因此也叫做無效端。使用時,熱管的管體穿 設於散熱鰭片而構成散熱器,而熱管的無效端一般會外 露於散熱鰭片外。惟,該無效端的材料為熱管的管體材 料,即一般為銅,該無效端也能通過自身作為傳熱的介 質。因此,熱管的無效端無法得到有效的利用,使熱管 的散熱效率及利用率較低。 Q 【發明内容】 [0003] 有鑒於此,有必要提供一種可提高熱管的散熱效率及利 用率的散熱器。 [0004] 一種散熱器,其包括基座、連接於該基座的熱管、鰭片 組及散熱蓋套。該鰭片組裝設於該熱管且包括複數相互 平行的鰭片,該鰭片開設有供該熱管穿設的通孔,該熱 管包括管體及與該管體連接的無效端,該無效端的直徑 比該管體的直徑小,該管體與該鰭片組接觸,該散熱蓋 套穿設該鰭片的部分通孔以蓋設於該無效端並與該鰭片 099142284 表單編號A0101 第3頁/共13頁 0992073442-0 201224388 接觸,該無效端與該散熱蓋套接觸。 [0005] |發明提供的散熱器,通過在熱管的無效端加裝散熱蓋 套並使該散熱蓋套與鰭片接觸,使該無效端也可通過該 鰭片散熱,加大了散熱速度及散熱量,進而提高了熱管 的散熱效率及利用率。 【實施方式】 [0006] 下面將結合圖式對本發明作進一步詳細說明。 [00〇7]請參閱圖1至圖3,本發明第一實施方式提供的一種散熱 器100包括基座10、熱管2〇 '鰭片組3〇、散熱蓋套4〇及 固定件50。基座10、該鰭片组30及該散熱蓋套4〇的材料 可選用散熱性能較佳的金屬銅或鋁。 [0008] 该基座10大致呈長方體形,其於4個角落分別開設有4個 有固定用通孔101。該基座1〇包括第一表面1〇2及與該第 一表面102相背的第二表面1〇3。該第一表面1〇2與熱源 (圖未示)’如中央處理器_觸以將該熱源的熱量通過 該第一表面102傳導至該基雇1〇,再通過該基座丨〇將熱量 傳導至熱管20及散熱器1〇〇的其它散熱元件。該第二表面 103開設有凹槽104。本實施方式中,凹槽1〇4的數量為2 個’且該2個凹槽1 0 4相互平行。可以理解,在其它實施 方式中’凹槽104的數量可為其它數量,凹槽1〇4的數量 與該散熱器100的所裝配的熱管20數量相匹配。 [0009] 本實施方式中’該熱管20的數量為2個,且均呈!]型。該 熱管20連接於該基座10。該熱管20包括管體2〇1及與該 管體201連接的無效端202。該管體201與該鰭片組3〇接 099142284 表單編號A0101 第4頁/共13頁 0992073442-0 201224388 [0010] ο [0011]201224388 VI. Description of the Invention: [Technical Field to Which the Invention Is Ascribed] [0001] The present invention relates to a heat sink. [Prior Art] [0002] As the power of the central processing unit of the computer continues to increase, the heat dissipation requirement of the central processing unit is also increasing, and the heat pipe is widely used as a heat transfer device of the central processing unit. The length of the heat pipe is generally from 100mm to 300mm, and such a long heat pipe may not be used in the computer radiator. At this time, it needs to be cut off, and then the cutting head is sealed to make the heat pipe work again. 〇 The cut position is called the tail end. Because the tail end cannot use the heat pipe to heat the heat, it is also called the invalid end. In use, the tube of the heat pipe is disposed on the heat sink fin to form a heat sink, and the ineffective end of the heat pipe is generally exposed outside the heat sink fin. However, the material of the inactive end is the tube material of the heat pipe, that is, generally copper, and the ineffective end can also pass through itself as a heat transfer medium. Therefore, the ineffective end of the heat pipe cannot be effectively utilized, so that the heat dissipation efficiency and utilization rate of the heat pipe are low. Q [ SUMMARY OF THE INVENTION] [0003] In view of the above, it is necessary to provide a heat sink that can improve the heat dissipation efficiency and utilization rate of the heat pipe. A heat sink includes a base, a heat pipe connected to the base, a fin set, and a heat dissipation cover. The fin assembly is disposed on the heat pipe and includes a plurality of fins parallel to each other, the fin is provided with a through hole for the heat pipe to pass through, the heat pipe includes a pipe body and an invalid end connected to the pipe body, and the diameter of the invalid end The tube body is in contact with the fin set, and the heat dissipation cover sleeve passes through a portion of the through hole of the fin to cover the invalid end and the fin is 099142284. Form No. A0101 Page 3 / A total of 13 pages 0992073442-0 201224388 contact, the invalid end is in contact with the heat sink cover. [0005] The heat sink provided by the invention has a heat dissipation cover sleeve attached to the inactive end of the heat pipe and the heat dissipation cover sleeve is in contact with the fin, so that the invalid end can also dissipate heat through the fin, thereby increasing the heat dissipation speed and The amount of heat dissipation further improves the heat dissipation efficiency and utilization rate of the heat pipe. [Embodiment] The present invention will be further described in detail below with reference to the drawings. Referring to FIG. 1 to FIG. 3, a heat dissipator 100 according to a first embodiment of the present invention includes a susceptor 10, a heat pipe 2'' fin set 3'', a heat dissipation cover 4'', and a fixing member 50. The material of the susceptor 10, the fin set 30 and the heat dissipating cover 4 can be selected from metal copper or aluminum with better heat dissipation performance. The base 10 has a substantially rectangular parallelepiped shape, and four fixed through holes 101 are respectively opened in four corners. The base 1 includes a first surface 1〇2 and a second surface 1〇3 opposite the first surface 102. The first surface 1〇2 and a heat source (not shown), such as a central processing unit, are in contact with the heat of the heat source through the first surface 102 to the base, and then the heat is transferred through the base Other heat dissipating components that are conducted to the heat pipe 20 and the heat sink 1〇〇. The second surface 103 is provided with a recess 104. In the present embodiment, the number of the grooves 1〇4 is 2' and the 2 grooves 1 0 4 are parallel to each other. It will be appreciated that in other embodiments the number of grooves 104 may be other numbers, and the number of grooves 1〇4 matches the number of assembled heat pipes 20 of the heat sink 100. [0009] In the present embodiment, the number of the heat pipes 20 is two, and both of them are of the type of !]. The heat pipe 20 is coupled to the base 10. The heat pipe 20 includes a tubular body 2〇1 and an ineffective end 202 connected to the tubular body 201. The tube body 201 is connected to the fin group 3 099142284 Form No. A0101 Page 4 / Total 13 pages 0992073442-0 201224388 [0010] ο [0011]

[0012] [0013] 觸’管體2 01利用熱管的工作原理進行散熱。該無效端 202的直徑比管體2〇丨的直徑小。管體2〇ι的外殼材料及 無效端202也可選用散熱性能較佳的金屬銅或鋁。 本實施方式中,該管體2〇1呈1|型。管體201遠離無效端 202的一個末端與無效端2〇2為熱管2〇的兩個末端。該^ 型管體201的水平管體部分收容於該凹槽1〇4内,因此, 比起將管體201的水平管體部分直接置於不開設凹槽1〇4 的基座10上’收容於該凹槽1〇4内的管體2〇1增加了與基 座10的接觸面積,從而加大了熱的傳導速度。該U型管體 201的兩垂直管體部分自該基座丨〇向上延伸。 該鰭片組3 0裝設於該熱管2 〇且包括複數相互平行的鰭片 3〇1。本實施方式中,鰭片3〇1通過支撐柱60結合於一起 並支撐在基座10上,同時,支撐柱60也由散熱性能較佳 的金屬銅或鋁製成’基座1〇的熱量一部分可經由支撐柱 60向韓片301傳導’增加了熱的傳導路徑;支樓柱6〇本身 為散熱體’也增加了散熱的面積β 扮. W ... · 該韓片301開設有供該熱管2〇穿設的通孔3〇2。本實施方 式中,最遠離基座10的2個鰭片301開設的供熱管20的無 效端202穿過的通孔303 (下稱蓋套通孔303 )的孔徑比 其匕韓片301上開設的通孔302的孔徑大。可以理解,開 β又有蓋套通孔303的韓片301的數量可視散熱蓋套的長 度及相鄰兩韓片301之間的距離決定,只需保證,散熱蓋 套40及熱管20均與鰭片301接觸。 該無效端202的直徑比通孔302 (包括蓋套通孔3〇3)的 099142284 表單編號Α0101 第5頁/共13頁 0992073442-0 201224388 孔徑小。 [0014] 該散熱蓋套40穿設該鰭片301的蓋套通孔303以蓋設於該 無效端202並與該鰭片301接觸。本實施方式中,該無效 端202的端面與該散熱蓋套40接觸。因此,該無效端202 的熱量可經散熱蓋套40傳導至鰭片301。 [0015] 該固定件50穿設該基座10以將該基座10固定在該熱源上 。具體地,本實施方式中,該固定件50包括螺釘501及彈 簧502。該彈簧502套設於該螺釘501。該螺釘501穿設該 基座10的固定用通孔101以使該彈簧502抵觸於該基座10 及該螺釘501的螺帽之間。彈簧502提供的彈力可調整散 熱器10相對於該熱源的垂直度以使散熱器100更好地與該 熱源接觸。 [0016] 本發明提供的散熱器100,通過在熱管20的無效端202加 裝散熱蓋套40並使該散熱蓋套40與鰭片301接觸,使該無 效端202也可通過該鰭片301散熱,加大了散熱速度及散 熱量,進而提高了熱管20的散熱效率及利用率。 [0017] 另外,因成批的散熱蓋套40具有統一的直徑,則最遠離 基座10的若干鰭片301就可以開固定直徑的蓋套通孔303 ,不需要因熱管20的無效端202直徑的變化來設定不同的 通孔大小,降低了散熱器100的製造難度,並藉此散熱蓋 套40與鰭片301有良好的緊密接觸度以達到導熱的效果, 同時利用金屬銅的良好導熱性可以將熱管20導熱的效應 放大,因此,鰭片組30的每個鰭片301均能利用散熱,加 大了散熱效率。 099142284 表單編號A0101 第6頁/共13頁 0992073442-0 201224388 [〇〇18]請參閱圖4,本發明第二實施方式提供的一種散熱器2〇〇 。散熱器200與第—實施方式的散熱器100不同之處在於 ,在散熱器200中,熱管600的無效端602的外側面與端 面均與散熱蓋套80接觸。因此,無效端6〇2與散熱蓋套8〇 的接觸面積增大了,進而加快了散熱速度。 [0019]綜上所述,本發明確已符合發明專利之要件,遂依法提 出專利申請。惟,以上所述者僅為本發明之較佳實施方 式,自不能以此限制本案之申請專利範圍。舉凡熟悉本 Ο 案技藝之人士援依本發明之精神所作之等效修飾或變化 ’皆應涵蓋於以下申讀專利範圍内。 【圖式簡單說明】Λ 剛¢1為本發明第-實施方式提㈣—種散熱器的立體示意 圖。 ί0021]圖2為圖1的散熱器的部分分解示意圖。 [0022]圖3為圖1的散熱器沿ΙΠ-1ΙΙ線的戴面示意圖。 〇 剛®4為本發明第二實施方式提供的—種散熱㈣戴面示意 圖。 【主要元件符號說明】 [0024]散熱器:100,200 [_ 基座:1〇 [_]熱管:20,600 剛鰭片組:30 [_]散熱蓋套:40,80 099142284 表單蝙珑Α0101 第7頁/共13頁 0992073442-0 201224388 [0029] 固定件:50 [0030] 固定用通孔:101 [0031] 第一表面:1 0 2 [0032] 第二表面:1 0 3 [0033] 凹槽:104 [0034] 管體:201 [0035] 無效端:202,602 [0036] 鰭片:301 [0037] 支撐柱:60 [0038] 通孔:3 02 [0039] 蓋套通孔:303 [0040] 彈簧:502 [0041] 螺釘:501 099142284 表單編號A0101 第8頁/共13頁 0992073442-0[0013] The contact 'tube body 201' uses the operating principle of the heat pipe to dissipate heat. The diameter of the inactive end 202 is smaller than the diameter of the tubular body 2〇丨. The outer casing material of the tubular body 2 and the ineffective end 202 may also be selected from metallic copper or aluminum having better heat dissipation properties. In the present embodiment, the tubular body 2〇1 has a 1| shape. The end of the tubular body 201 away from the ineffective end 202 and the inactive end 2〇2 are the two ends of the heat pipe 2〇. The horizontal body portion of the tubular body 201 is received in the recess 1〇4, and therefore, the horizontal tubular body portion of the tubular body 201 is directly placed on the base 10 where the recess 1〇4 is not opened. The tube body 2〇1 accommodated in the groove 1〇4 increases the contact area with the susceptor 10, thereby increasing the heat conduction speed. The two vertical tubular portions of the U-shaped tubular body 201 extend upward from the base bore. The fin set 30 is mounted on the heat pipe 2 and includes a plurality of fins 3〇1 that are parallel to each other. In the embodiment, the fins 3〇1 are bonded together by the support post 60 and supported on the base 10. At the same time, the support post 60 is also made of metal copper or aluminum with better heat dissipation performance. A part can be transmitted to the Korean piece 301 via the support column 60 to increase the heat conduction path; the branch column 6〇 itself is a heat sink body also increases the area of heat dissipation β. W... The Korean piece 301 is provided for The heat pipe 2 is bored through the through hole 3〇2. In the present embodiment, the through hole 303 (hereinafter referred to as the cover through hole 303) through which the ineffective end 202 of the heat supply tube 20 which is located far away from the two fins 301 of the susceptor 10 passes has an aperture smaller than that of the Korean 301. The through hole 302 has a large aperture. It can be understood that the number of the Korean 301 that opens the β and has the cover through hole 303 can be determined by the length of the heat dissipation cover and the distance between the adjacent two Korean pieces 301, and only needs to ensure that the heat dissipation cover 40 and the heat pipe 20 are both connected with the fins. Sheet 301 is in contact. The diameter of the invalid end 202 is 099142284 than that of the through hole 302 (including the cover through hole 3〇3). Form number Α0101 Page 5 of 13 0992073442-0 201224388 The aperture is small. The heat dissipation cover 40 penetrates the cover through hole 303 of the fin 301 to cover the invalid end 202 and contact the fin 301. In this embodiment, the end surface of the ineffective end 202 is in contact with the heat dissipation cover 40. Therefore, the heat of the inactive end 202 can be conducted to the fins 301 via the heat dissipation cover 40. [0015] The fixing member 50 is passed through the base 10 to fix the base 10 to the heat source. Specifically, in the present embodiment, the fixing member 50 includes a screw 501 and a spring 502. The spring 502 is sleeved on the screw 501. The screw 501 is inserted through the fixing through hole 101 of the base 10 such that the spring 502 is in contact with the base 10 and the nut of the screw 501. The spring force provided by the spring 502 adjusts the verticality of the heat sink 10 relative to the heat source to better contact the heat sink 100 with the heat source. The heat sink 100 of the present invention can pass the heat sink cover 40 at the inactive end 202 of the heat pipe 20 and bring the heat dissipation cover 40 into contact with the fin 301, so that the invalid end 202 can also pass through the fin 301. The heat dissipation increases the heat dissipation speed and the heat dissipation amount, thereby improving the heat dissipation efficiency and utilization rate of the heat pipe 20. [0017] In addition, since the batch of heat dissipation cover 40 has a uniform diameter, the plurality of fins 301 farthest from the base 10 can open the cover through hole 303 of the fixed diameter without the invalid end 202 of the heat pipe 20. The change of the diameter to set different through-hole sizes reduces the manufacturing difficulty of the heat sink 100, and the heat-dissipating cover 40 has good close contact with the fins 301 to achieve the heat conduction effect, and at the same time utilizes the good heat conduction of the metal copper. The effect of the heat conduction of the heat pipe 20 can be amplified. Therefore, each of the fins 301 of the fin set 30 can utilize heat dissipation, thereby increasing heat dissipation efficiency. 099142284 Form No. A0101 Page 6 of 13 0992073442-0 201224388 [〇〇18] Please refer to FIG. 4, a heat sink 2〇〇 according to a second embodiment of the present invention. The heat sink 200 is different from the heat sink 100 of the first embodiment in that, in the heat sink 200, the outer side surface and the end surface of the ineffective end 602 of the heat pipe 600 are in contact with the heat dissipation cover 80. Therefore, the contact area between the ineffective end 6〇2 and the heat dissipation cover 8〇 is increased, thereby accelerating the heat dissipation speed. [0019] In summary, the present invention has indeed met the requirements of the invention patent, and the patent application is filed according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by those skilled in the art of the present invention in light of the spirit of the invention are intended to be included within the scope of the following claims. BRIEF DESCRIPTION OF THE DRAWINGS Λ ¢ ¢ 1 is a perspective view of a heat sink according to a fourth embodiment of the present invention. 2 is a partially exploded perspective view of the heat sink of FIG. 1. 3 is a schematic view of the wearer of the heat sink of FIG. 1 along a ΙΠ-1ΙΙ line. The ®Gang® 4 is a schematic diagram of a heat-dissipating (four) wearing surface provided by the second embodiment of the present invention. [Main component symbol description] [0024] Radiator: 100,200 [_ Base: 1〇[_] Heat pipe: 20,600 Fin fin set: 30 [_] Cooling cover: 40, 80 099142284 Form bat Α0101 Page 7 of 13 0992073442-0 201224388 [0029] Fixing member: 50 [0030] Fixing through hole: 101 [0031] First surface: 1 0 2 [0032] Second surface: 1 0 3 [0033 Groove: 104 [0034] Body: 201 [0035] Invalid end: 202, 602 [0036] Fin: 301 [0037] Support column: 60 [0038] Through hole: 3 02 [0039] Cover through hole :303 [0040] Spring: 502 [0041] Screw: 501 099142284 Form No. A0101 Page 8 / Total 13 Page 0992073442-0

Claims (1)

201224388 七、申請專利範圍: 1 . 一種散熱器,其包括基座、連接於該基座的熱管、鰭片組 及散熱蓋套,該鰭片組裝設於該熱管且包括複數相互平行 的鰭片,該鰭片開設有供該熱管穿設的通孔,該熱管包括 管體及與該管體連接的無效端,該無效端的直徑比該管體 的直徑小,該管體與該鰭片組接觸,該散熱蓋套穿設該鰭 片的部分通孔以蓋設於該無效端並與該鰭片接觸,該無效 端與該散熱蓋套接觸。 2 .如申請專利範圍第1項所述的散熱器,其中,該基座、該 (〇 鰭片組及該散熱蓋套的材料為銅或鋁。 3 .如申請專利範圍第1項所述的散熱器,其中,該熱管呈U型 4. 如申請專利範圍第3項所述的散熱器,其中,該基座包括 第一表面及與該第一表面相背的第二表面,該第一表面與 熱源接觸,該第二表面開設有容槽該管體的凹槽。 5. 如申請專利範圍第1項所述的散熱器,其中,該散熱器還 Q 包括固定件,該固定件穿設該基座以將該基座固定。 6 .如申請專利範圍第5項所述的散熱器,其中,該固定件包 括螺釘及彈簧,該彈簧套設於該螺釘,該螺釘穿設該基座 以使該彈簧抵觸於該基座及該螺釘的螺帽之間。 099142284 表單編號A0101 第9頁/共13頁 0992073442-0201224388 VII. Patent application scope: 1. A heat sink comprising a base, a heat pipe connected to the base, a fin set and a heat dissipation cover, the fin being assembled on the heat pipe and comprising a plurality of fins parallel to each other The fin is provided with a through hole for the heat pipe, and the heat pipe includes a pipe body and an invalid end connected to the pipe body, the diameter of the invalid end is smaller than a diameter of the pipe body, and the pipe body and the fin group In contact, the heat dissipation cover sleeve passes through a portion of the through hole of the fin to cover the inactive end and is in contact with the fin, and the inactive end is in contact with the heat dissipation cover. 2. The heat sink according to claim 1, wherein the base, the (the fin fin set and the heat sink cover are made of copper or aluminum. 3. As described in claim 1 The heat sink according to claim 3, wherein the base includes a first surface and a second surface opposite the first surface, the first surface A surface is in contact with a heat source, and the second surface is provided with a groove for receiving the tube body. 5. The heat sink according to claim 1, wherein the heat sink further comprises a fixing member, the fixing member The heat sink according to claim 5, wherein the fixing member comprises a screw and a spring, the spring is sleeved on the screw, and the screw is disposed through the screw The base is such that the spring is in contact with the base and the nut of the screw. 099142284 Form No. A0101 Page 9 of 13 0992073442-0
TW099142284A 2010-12-06 2010-12-06 Heat sink TW201224388A (en)

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WO2013102301A1 (en) * 2012-01-05 2013-07-11 Sapa Ab Heat sink and method for manufacturing
CN113747735A (en) * 2020-05-27 2021-12-03 中科寒武纪科技股份有限公司 Heat dissipation device and board card

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US7537046B2 (en) * 2007-04-02 2009-05-26 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device with heat pipe
US20100181047A1 (en) * 2009-01-20 2010-07-22 Kuo-Len Lin Fins-type heat sink and method for assembling the same

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