US20060185831A1 - Heat exchanger assembly - Google Patents
Heat exchanger assembly Download PDFInfo
- Publication number
- US20060185831A1 US20060185831A1 US11/065,326 US6532605A US2006185831A1 US 20060185831 A1 US20060185831 A1 US 20060185831A1 US 6532605 A US6532605 A US 6532605A US 2006185831 A1 US2006185831 A1 US 2006185831A1
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- United States
- Prior art keywords
- heat
- dissipation fins
- exchanger assembly
- heat transfer
- transfer section
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
- F28F1/105—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being corrugated elements extending around the tubular elements
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
- F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
- F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
- F28D2021/0031—Radiators for recooling a coolant of cooling systems
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the electronic systems and/or components become faster, smaller, more densely packed and/or more powerful, the amount or density of heat generated by the various components becomes greater.
- the difficulty encountered in dissipating the heat from these components within the confines of the systems becomes greater. Consequently, electronic systems makers continue to pursue heat transfer technology or devices capable of satisfying the increased heat transfer requirements of new components and/or new systems.
- FIG. 1 is a top, front, left side perspective view of a computer system incorporating various embodiments of the present invention.
- FIG. 2 is a top, front, left side perspective view of a heat exchanger assembly for use in a system, such as the computer system shown in FIG. 1 , and incorporating an embodiment of the present invention.
- FIG. 3 is a front view of folded metal heat dissipation fins for use in various embodiments of the present invention, such as the embodiments incorporated in the computer system shown in FIG. 1 .
- FIG. 4 is a front view of a portion of a heat exchanger assembly for use in a system, such as the computer system shown in FIG. 1 , and incorporating an embodiment of the present invention.
- FIG. 5 is a side view of a portion of a heat exchanger assembly for use in a system, such as the computer system shown in FIG. 1 , and incorporating an embodiment of the present invention.
- FIG. 6 is a top, front, left side perspective view of another heat exchanger assembly for use in a system, such as the computer system shown in FIG. 1 , and incorporating another embodiment of the present invention.
- FIG. 7 is a top, front, left side perspective view of a portion of the heat exchanger assembly shown in FIG. 6 and incorporating an embodiment of the present invention.
- FIG. 8 is a top, front, left side perspective view of another portion of the heat exchanger assembly shown in FIG. 6 and incorporating an embodiment of the present invention.
- FIG. 9 is a top, front, left side perspective view of an alternative structure of a portion of the heat exchanger assembly shown in FIG. 6 and incorporating an alternative embodiment of the present invention.
- FIG. 1 A computer system 100 incorporating various embodiments of the present invention is shown in FIG. 1 having elements such as a housing 102 , a keyboard 104 and a display 106 .
- a first heat exchanger assembly 108 incorporating a first embodiment, for transferring heat away from various components 110 of the computer system 100 , is disposed at an appropriate location within the housing 102 .
- a second heat exchanger assembly 112 incorporating a second embodiment, for transferring heat away from another component 114 of the computer system 100 , is disposed at another appropriate location within the housing 102 .
- the components 110 and 114 may be various appropriate heat sources, such as a processor, an IC (Integrated Circuit), an ASIC (Application Specific IC), a power supply, a hard drive, etc.
- the components 110 and 114 are typically mounted on a printed circuit board 116 within the housing 102 .
- a vent 117 in the front of the housing 102 may permit air to flow into the housing 102 to cool the heat exchanger assemblies 108 and 112 .
- the present invention is described with respect to its use in the computer system 100 and the heat exchanger assemblies 108 and 112 , it is understood that the invention is not so limited, but may be used in any appropriate electronic system or assembly that includes a heat source with appropriate heat dissipation requirements and regardless of any other elements or components included in the electronic system.
- the first heat exchanger assembly 108 generally includes heat transfer sections 118 and a central heat dissipation section 120 .
- the heat transfer sections 118 each include a first portion 122 that attaches to the components 110 and a second portion 124 that extends away from the first portion 122 . Only one of the first portions 122 , and thus only one complete heat transfer section 118 , is shown in FIG. 2 for simplicity.
- the heat transfer sections 118 may be an evaporative-cycle closed-loop type of heat transfer device, such as a heat pipe, a vapor chamber, a radiator-type exchanger, a thermo-siphon, etc.
- heat transfer through the heat transfer sections 118 from the components 110 to the heat dissipation section 120 is enhanced, because the evaporative-cycle closed-loop type heat transfer devices have a low thermal resistance in order to efficiently transport heat. Furthermore, the heat is effectively concentrated in one place, i.e. at the heat dissipation section 120 , for more efficient cooling or dissipation.
- the size and lengths of the heat transfer sections 118 and the heat dissipation section 120 may depend on the amount of power or heat to be dissipated and the geometry of the specific situation.
- the heat dissipation section 120 generally includes a number of sets of thermally conductive heat dissipation fins 126 with each set of heat dissipation fins 126 surrounded by an optional sleeve 128 .
- the illustrated embodiment shows four sets of the heat dissipation fins 126 , but it is understood that the invention is not so limited. Instead, any appropriate number of sets of heat dissipation fins 126 may be used.
- the sleeves 128 duct airflow passed the heat dissipation fins 126 .
- one or more optional fans 130 may be positioned adjacent one end of the heat dissipation section 120 to flow the air through the sleeves 128 and passed the heat dissipation fins 126 .
- each set of heat dissipation fins 126 is attached to a part of the second portion 124 of one of the heat transfer sections 118 . In this manner, heat generated by the components 110 is transferred through the first portion 122 of the heat transfer sections 118 , through the second portion 124 to the heat dissipation fins 126 , where the heat is dissipated to the air flowing through the sleeves 128 .
- the sleeves 128 Without the sleeves 128 , much of the air still flows passed the heat dissipation fins 126 , but is not specifically channeled to pass with maximum airflow next to the heat dissipation fins 126 . With the sleeves 128 , the airflow through the housing 102 or the number of fans used in the housing 102 may be reduced, thereby reducing fan noise and electrical power usage.
- first heat exchanger assembly 108 may be removed and replaced for ease of manufacturing and/or servicing the first heat exchanger assembly 108 and/or the components 110 .
- each set of heat dissipation fins 126 with or without the sleeves 128 , may be individually removed and replaced.
- An exemplary way to form a set of the heat dissipation fins 126 uses a folded metal fin structure 132 , as shown in FIG. 3 . (Other types of fin structures may also be used.) Each heat dissipation fin 126 is thus joined at the top and/or bottom with the next and/or previous heat dissipation fins 126 via top and bottom fin connections 134 and 136 between the heat dissipation fins 126 .
- the folded metal fin structure 132 is wrapped around part of the second portion 124 of the heat transfer section 118 , as shown in FIGS. 4 and 5 .
- the bottom fin connections 136 are attached to the second portion 124 , e.g.
- the heat dissipation fins 126 therefore, extend radially from the second portion 124 .
- the bottom fin connections 136 must be of an appropriate size to fit all of the heat dissipation fins 126 onto the diameter of the second portion 124 .
- the top fin connections 134 are shown as being approximately the same size as the bottom fin connections 136 , the top fin connections 134 may be any appropriate length to permit airflow between each of the heat dissipation fins 126 . Additionally, the fin configuration may have any appropriate longitudinal and radial dimensions.
- the heat dissipation fins 126 are attached along the longitudinal dimension, rather than around the circumference of the second portion 124 . In this manner, the heat dissipation fins 126 are parallel to the axis of the cylindrical second portion 124 , rather than perpendicular to the axis. This configuration maximizes the contact between the heat dissipation fins 126 and the second portion 124 of the heat transfer section 118 . In this manner, the transfer of heat from the second portion 124 through the heat dissipation fins 126 is also maximized.
- the components 110 can be laid out on the printed circuit board 116 without regard to the size of the heat dissipation fins 126 or other mechanical constraints related thereto. In this manner, components can be placed close together to maximize the use of the surface area of the printed circuit board 116 and/or to reduce electrical line length and propagation delay problems.
- having the heat dissipation fins 126 located away from the components 110 enables the dissipation fins 126 to be placed adjacent an outer wall of the housing 102 , where the air heated by the first heat exchanger assembly 108 can be dispelled directly out of the housing 102 . Therefore, an almost direct thermal path is provided from the components 110 to the outside environment. Furthermore, having the heat dissipation fins 126 located away from the components 110 also minimizes restriction of airflow to other components within the housing 102 and enables removal of heat from the components 110 without heating the air used to cool the other components.
- the second heat exchanger assembly 112 generally includes an inverted T-shaped heat transfer section 138 and heat dissipation fins 140 , as shown in FIG. 6 .
- the heat exchanger assembly 112 may also include an optional cover 142 surrounding the heat dissipation fins 140 .
- the heat transfer section 138 and the heat dissipation fins 140 (and optionally the cover 142 ) may be made of any appropriate thermally conductive material.
- the cover 142 ducts the flow of air between the heat dissipation fins 140 . In this manner, the airflow enters the second heat exchanger assembly 112 at one open end, e.g. the front 144 , and exits at the other open end, e.g. the back 146 .
- the heat transfer section 138 generally includes a horizontal base 148 and a vertical section 150 , both of which are substantially rectangular in shape.
- the horizontal base 148 may have optional small vertical fins 152 protruding therefrom.
- the heat dissipation fins 140 and the vertical section 150 have a longitudinal dimension in the direction of arrow A, as shown in FIG. 7 .
- the heat dissipation fins 140 are attached (e.g. by soldering, thermally conductive epoxy, etc.) to the vertical section 150 along the longitudinal dimension.
- the heat dissipation fins 140 extend horizontally from the vertical section 150 , so the air flows horizontally across the heat dissipation fins 140 .
- the folded metal fin structure 132 ( FIG. 3 ) is an exemplary type of fin structure that may be used for the heat dissipation fins 140 . (Other types of fin structures may also be used.)
- the heat transfer section 138 generally includes a vapor chamber 154 , as shown in FIG. 8 .
- the vapor chamber 154 generally includes a portion 156 within the horizontal base 148 and a portion 158 within the vertical section 150 .
- the vapor chamber 154 enhances heat transfer from the component 114 ( FIG. 1 ) through the horizontal base 148 and into the vertical section 150 , so the heat can be transferred to the heat dissipation fins 140 with minimal losses.
- the heat transfer section 138 generally includes one or more embedded heat pipes 160 , 162 and 164 , as shown in FIG. 9 .
- the embedded heat pipes 160 are vertical within the vertical section 150 .
- the embedded heat pipe 162 is horizontal within the junction between the vertical section 150 and the horizontal base 148 .
- the embedded heat pipes 164 are horizontal within the horizontal base 148 .
- the embodiment in FIG. 8 shows the embedded heat pipes 164 in only one half of the horizontal base 148 , but it is understood that additional such embedded heat pipes may be in the other half of the horizontal base 148 .
- the heat pipes 160 , 162 and 164 enhance heat transfer from the component 114 ( FIG. 1 ) through the horizontal base 148 and into the vertical section 150 .
- FIGS. 8 and 9 Other embodiments having evaporative-cycle closed-loop type heat transfer means, in addition to those illustrated in FIGS. 8 and 9 , may be incorporated in the heat transfer section 138 . Additionally, variations on the embodiments shown in FIGS. 8 and 9 may have various different geometrical configurations or combinations of vapor chambers and/or embedded heat pipes, whether or not various parts of the vapor chambers and heat pipes are connected together as shown in FIGS. 8 and 9 . Furthermore, some parts of the heat transfer section 138 may include a vapor chamber and/or an embedded heat pipe, while other parts of the heat transfer section 138 do not. Also, an alternative-embodiment heat transfer section 138 may have more than one vertical section 150 .
- FIGS. 8 and 9 rapidly transfer heat from the component 114 ( FIG. 1 ) through the horizontal base 148 and into the vertical section 150 of the heat transfer section 138 .
- the heat is quickly transferred to a surface area, i.e. the surfaces of the vertical section 150 , where the heat can then be transferred to the heat dissipation fins 140 ( FIGS. 6 and 7 ) for rapid dissipation to the air.
- the vertical section 150 therefore, enables a more efficient use of the space above the component 114 for heat dissipation than does (for example) a horizontal base section alone with vertical heat dissipation fins.
- the efficiency gain occurs because the usable surfaces of the vertical section 150 have a much larger area than the top surface of the horizontal base 148 , so the distance between the hottest and coolest points on the heat dissipation fins 140 (i.e. the size of the heat dissipation fins 140 ) can be minimized and the contact area between the heat dissipation fins 140 and the surface of the vertical section 150 can be maximized. Additionally, due to the low heat loss characteristics of the evaporative-cycle closed-loop type heat transfer means and the presence of the vertical section 150 , the second heat exchanger assembly 112 ( FIG. 6 ) can be made taller with improved fin efficiency over prior solutions that may rely on a larger horizontal base for heat transfer.
- Having a smaller horizontal base 148 along with the vertical section 150 enables the components 114 to be laid out on the printed circuit board 116 ( FIG. 1 ) with less regard to the size of the heat exchanger assembly 112 or other mechanical constraints related thereto. In this manner, the components 114 can be placed close to other components to maximize the use of the surface area of the printed circuit board 116 and/or to reduce electrical line length and propagation delay problems.
- the horizontal base 148 and the vertical section 150 provide structural strength in x-y-z directions for the second heat exchanger assembly 112 .
- the second heat exchanger assembly 112 has a robust structure that prevents shock and vibration problems and allows for strong retention methods to hold the second heat exchanger assembly 112 onto the component 114 ( FIG. 1 ).
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Abstract
A heat exchanger assembly for use in an electronic assembly having a heat source comprises a heat transfer section and heat dissipation fins. The heat transfer section includes a first portion attachable to the heat source and a second portion extending away from the first portion. The heat dissipation fins have a longitudinal dimension and are attached to at least part of the second portion of the heat transfer section along the longitudinal dimension.
Description
- Heat generated by components within electronic devices/systems, such as computer systems, etc., must be transferred away from the components in order to ensure proper and efficient operation of these components. As the electronic systems and/or components become faster, smaller, more densely packed and/or more powerful, the amount or density of heat generated by the various components becomes greater. Likewise, the difficulty encountered in dissipating the heat from these components within the confines of the systems becomes greater. Consequently, electronic systems makers continue to pursue heat transfer technology or devices capable of satisfying the increased heat transfer requirements of new components and/or new systems.
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FIG. 1 is a top, front, left side perspective view of a computer system incorporating various embodiments of the present invention. -
FIG. 2 is a top, front, left side perspective view of a heat exchanger assembly for use in a system, such as the computer system shown inFIG. 1 , and incorporating an embodiment of the present invention. -
FIG. 3 is a front view of folded metal heat dissipation fins for use in various embodiments of the present invention, such as the embodiments incorporated in the computer system shown inFIG. 1 . -
FIG. 4 is a front view of a portion of a heat exchanger assembly for use in a system, such as the computer system shown inFIG. 1 , and incorporating an embodiment of the present invention. -
FIG. 5 is a side view of a portion of a heat exchanger assembly for use in a system, such as the computer system shown inFIG. 1 , and incorporating an embodiment of the present invention. -
FIG. 6 is a top, front, left side perspective view of another heat exchanger assembly for use in a system, such as the computer system shown inFIG. 1 , and incorporating another embodiment of the present invention. -
FIG. 7 is a top, front, left side perspective view of a portion of the heat exchanger assembly shown inFIG. 6 and incorporating an embodiment of the present invention. -
FIG. 8 is a top, front, left side perspective view of another portion of the heat exchanger assembly shown inFIG. 6 and incorporating an embodiment of the present invention. -
FIG. 9 is a top, front, left side perspective view of an alternative structure of a portion of the heat exchanger assembly shown inFIG. 6 and incorporating an alternative embodiment of the present invention. - A
computer system 100 incorporating various embodiments of the present invention is shown inFIG. 1 having elements such as ahousing 102, akeyboard 104 and adisplay 106. A firstheat exchanger assembly 108, incorporating a first embodiment, for transferring heat away fromvarious components 110 of thecomputer system 100, is disposed at an appropriate location within thehousing 102. A secondheat exchanger assembly 112, incorporating a second embodiment, for transferring heat away from anothercomponent 114 of thecomputer system 100, is disposed at another appropriate location within thehousing 102. Thecomponents components circuit board 116 within thehousing 102. Avent 117 in the front of thehousing 102 may permit air to flow into thehousing 102 to cool theheat exchanger assemblies computer system 100 and the heat exchanger assemblies 108 and 112, it is understood that the invention is not so limited, but may be used in any appropriate electronic system or assembly that includes a heat source with appropriate heat dissipation requirements and regardless of any other elements or components included in the electronic system. - The first
heat exchanger assembly 108, according to the embodiment shown, generally includesheat transfer sections 118 and a centralheat dissipation section 120. (See alsoFIG. 2 .) Theheat transfer sections 118 each include afirst portion 122 that attaches to thecomponents 110 and asecond portion 124 that extends away from thefirst portion 122. Only one of thefirst portions 122, and thus only one completeheat transfer section 118, is shown inFIG. 2 for simplicity. Theheat transfer sections 118 may be an evaporative-cycle closed-loop type of heat transfer device, such as a heat pipe, a vapor chamber, a radiator-type exchanger, a thermo-siphon, etc. In this manner, heat transfer through theheat transfer sections 118 from thecomponents 110 to theheat dissipation section 120 is enhanced, because the evaporative-cycle closed-loop type heat transfer devices have a low thermal resistance in order to efficiently transport heat. Furthermore, the heat is effectively concentrated in one place, i.e. at theheat dissipation section 120, for more efficient cooling or dissipation. The size and lengths of theheat transfer sections 118 and theheat dissipation section 120 may depend on the amount of power or heat to be dissipated and the geometry of the specific situation. - The
heat dissipation section 120, according to the embodiment shown, generally includes a number of sets of thermally conductive heat dissipation fins 126 with each set of heat dissipation fins 126 surrounded by anoptional sleeve 128. The illustrated embodiment shows four sets of theheat dissipation fins 126, but it is understood that the invention is not so limited. Instead, any appropriate number of sets of heat dissipation fins 126 may be used. - The
sleeves 128 duct airflow passed the heat dissipation fins 126. Additionally, one or moreoptional fans 130 may be positioned adjacent one end of theheat dissipation section 120 to flow the air through thesleeves 128 and passed the heat dissipation fins 126. Furthermore, each set ofheat dissipation fins 126 is attached to a part of thesecond portion 124 of one of theheat transfer sections 118. In this manner, heat generated by thecomponents 110 is transferred through thefirst portion 122 of theheat transfer sections 118, through thesecond portion 124 to the heat dissipation fins 126, where the heat is dissipated to the air flowing through thesleeves 128. Without thesleeves 128, much of the air still flows passed the heat dissipation fins 126, but is not specifically channeled to pass with maximum airflow next to the heat dissipation fins 126. With thesleeves 128, the airflow through thehousing 102 or the number of fans used in thehousing 102 may be reduced, thereby reducing fan noise and electrical power usage. - Additionally, the first
heat exchanger assembly 108 may be removed and replaced for ease of manufacturing and/or servicing the firstheat exchanger assembly 108 and/or thecomponents 110. Alternatively, each set of heat dissipation fins 126, with or without thesleeves 128, may be individually removed and replaced. - An exemplary way to form a set of the
heat dissipation fins 126 uses a foldedmetal fin structure 132, as shown inFIG. 3 . (Other types of fin structures may also be used.) Eachheat dissipation fin 126 is thus joined at the top and/or bottom with the next and/or previous heat dissipation fins 126 via top and bottomfin connections metal fin structure 132 is wrapped around part of thesecond portion 124 of theheat transfer section 118, as shown inFIGS. 4 and 5 . Thebottom fin connections 136 are attached to thesecond portion 124, e.g. by soldering or other appropriate means, along a longitudinal dimension of both the heat dissipation fins 126 and thesecond portion 124. The heat dissipation fins 126, therefore, extend radially from thesecond portion 124. Thebottom fin connections 136 must be of an appropriate size to fit all of the heat dissipation fins 126 onto the diameter of thesecond portion 124. Although thetop fin connections 134 are shown as being approximately the same size as thebottom fin connections 136, thetop fin connections 134 may be any appropriate length to permit airflow between each of the heat dissipation fins 126. Additionally, the fin configuration may have any appropriate longitudinal and radial dimensions. - The
heat dissipation fins 126 are attached along the longitudinal dimension, rather than around the circumference of thesecond portion 124. In this manner, theheat dissipation fins 126 are parallel to the axis of the cylindricalsecond portion 124, rather than perpendicular to the axis. This configuration maximizes the contact between theheat dissipation fins 126 and thesecond portion 124 of theheat transfer section 118. In this manner, the transfer of heat from thesecond portion 124 through theheat dissipation fins 126 is also maximized. - Having the heat dissipation fins 126 attached to only part of the
second portion 124 enables the heat dissipation fins 126 to be located away from thecomponents 110. Thus, thecomponents 110 can be laid out on the printedcircuit board 116 without regard to the size of the heat dissipation fins 126 or other mechanical constraints related thereto. In this manner, components can be placed close together to maximize the use of the surface area of the printedcircuit board 116 and/or to reduce electrical line length and propagation delay problems. Additionally, having theheat dissipation fins 126 located away from thecomponents 110 enables thedissipation fins 126 to be placed adjacent an outer wall of thehousing 102, where the air heated by the firstheat exchanger assembly 108 can be dispelled directly out of thehousing 102. Therefore, an almost direct thermal path is provided from thecomponents 110 to the outside environment. Furthermore, having theheat dissipation fins 126 located away from thecomponents 110 also minimizes restriction of airflow to other components within thehousing 102 and enables removal of heat from thecomponents 110 without heating the air used to cool the other components. - The second
heat exchanger assembly 112, according to the embodiment shown, generally includes an inverted T-shapedheat transfer section 138 and heat dissipation fins 140, as shown inFIG. 6 . Theheat exchanger assembly 112 may also include anoptional cover 142 surrounding the heat dissipation fins 140. Theheat transfer section 138 and the heat dissipation fins 140 (and optionally the cover 142) may be made of any appropriate thermally conductive material. Thecover 142 ducts the flow of air between the heat dissipation fins 140. In this manner, the airflow enters the secondheat exchanger assembly 112 at one open end, e.g. the front 144, and exits at the other open end, e.g. theback 146. - The
heat transfer section 138 generally includes ahorizontal base 148 and avertical section 150, both of which are substantially rectangular in shape. Thehorizontal base 148 may have optional smallvertical fins 152 protruding therefrom. - The
heat dissipation fins 140 and thevertical section 150 have a longitudinal dimension in the direction of arrow A, as shown inFIG. 7 . Theheat dissipation fins 140 are attached (e.g. by soldering, thermally conductive epoxy, etc.) to thevertical section 150 along the longitudinal dimension. Thus, theheat dissipation fins 140 extend horizontally from thevertical section 150, so the air flows horizontally across theheat dissipation fins 140. The folded metal fin structure 132 (FIG. 3 ) is an exemplary type of fin structure that may be used for theheat dissipation fins 140. (Other types of fin structures may also be used.) - According to a particular embodiment, the
heat transfer section 138 generally includes avapor chamber 154, as shown inFIG. 8 . Thevapor chamber 154 generally includes aportion 156 within thehorizontal base 148 and aportion 158 within thevertical section 150. Thevapor chamber 154 enhances heat transfer from the component 114 (FIG. 1 ) through thehorizontal base 148 and into thevertical section 150, so the heat can be transferred to theheat dissipation fins 140 with minimal losses. - According to another particular embodiment, the
heat transfer section 138 generally includes one or more embeddedheat pipes FIG. 9 . The embeddedheat pipes 160 are vertical within thevertical section 150. The embeddedheat pipe 162 is horizontal within the junction between thevertical section 150 and thehorizontal base 148. The embeddedheat pipes 164 are horizontal within thehorizontal base 148. For simplicity, the embodiment inFIG. 8 shows the embeddedheat pipes 164 in only one half of thehorizontal base 148, but it is understood that additional such embedded heat pipes may be in the other half of thehorizontal base 148. In much the same way that thevapor chamber 154 enhances heat transfer for the embodiment shown inFIG. 8 , though perhaps not as efficiently, theheat pipes FIG. 1 ) through thehorizontal base 148 and into thevertical section 150. - Other embodiments having evaporative-cycle closed-loop type heat transfer means, in addition to those illustrated in
FIGS. 8 and 9 , may be incorporated in theheat transfer section 138. Additionally, variations on the embodiments shown inFIGS. 8 and 9 may have various different geometrical configurations or combinations of vapor chambers and/or embedded heat pipes, whether or not various parts of the vapor chambers and heat pipes are connected together as shown inFIGS. 8 and 9 . Furthermore, some parts of theheat transfer section 138 may include a vapor chamber and/or an embedded heat pipe, while other parts of theheat transfer section 138 do not. Also, an alternative-embodimentheat transfer section 138 may have more than onevertical section 150. - The embodiments shown in
FIGS. 8 and 9 , and variations thereof, rapidly transfer heat from the component 114 (FIG. 1 ) through thehorizontal base 148 and into thevertical section 150 of theheat transfer section 138. In this manner, the heat is quickly transferred to a surface area, i.e. the surfaces of thevertical section 150, where the heat can then be transferred to the heat dissipation fins 140 (FIGS. 6 and 7 ) for rapid dissipation to the air. Thevertical section 150, therefore, enables a more efficient use of the space above thecomponent 114 for heat dissipation than does (for example) a horizontal base section alone with vertical heat dissipation fins. The efficiency gain occurs because the usable surfaces of thevertical section 150 have a much larger area than the top surface of thehorizontal base 148, so the distance between the hottest and coolest points on the heat dissipation fins 140 (i.e. the size of the heat dissipation fins 140) can be minimized and the contact area between theheat dissipation fins 140 and the surface of thevertical section 150 can be maximized. Additionally, due to the low heat loss characteristics of the evaporative-cycle closed-loop type heat transfer means and the presence of thevertical section 150, the second heat exchanger assembly 112 (FIG. 6 ) can be made taller with improved fin efficiency over prior solutions that may rely on a larger horizontal base for heat transfer. Having a smallerhorizontal base 148 along with thevertical section 150, on the other hand, enables thecomponents 114 to be laid out on the printed circuit board 116 (FIG. 1 ) with less regard to the size of theheat exchanger assembly 112 or other mechanical constraints related thereto. In this manner, thecomponents 114 can be placed close to other components to maximize the use of the surface area of the printedcircuit board 116 and/or to reduce electrical line length and propagation delay problems. - Furthermore, the
horizontal base 148 and thevertical section 150 provide structural strength in x-y-z directions for the secondheat exchanger assembly 112. Thus, the secondheat exchanger assembly 112 has a robust structure that prevents shock and vibration problems and allows for strong retention methods to hold the secondheat exchanger assembly 112 onto the component 114 (FIG. 1 ).
Claims (21)
1. A heat exchanger assembly for use in an electronic assembly having a heat source comprising:
a heat transfer section including a first portion attachable to the heat source and a second portion extending away from the first portion; and
a set of heat dissipation fins, each heat dissipation fin having a longitudinal dimension and attached to at least part of the second portion of the heat transfer section along the longitudinal dimension.
2. A heat exchanger assembly as defined in claim 1 wherein:
the electronic assembly is a computer system.
3. A heat exchanger assembly as defined in claim 1 wherein:
the heat transfer section comprises an evaporative-type heat transfer device.
4. A heat exchanger assembly as defined in claim 3 wherein:
the second portion of the heat transfer section has a cylindrical shape; and
the heat dissipation fins extend radially away from the second portion.
5. A heat exchanger assembly as defined in claim 4 further comprising:
a cylindrical sleeve surrounding the heat dissipation fins to duct airflow passed the heat dissipation fins within the cylindrical sleeve.
6. A heat exchanger assembly as defined in claim 3 further comprising:
a fan positioned adjacent the heat dissipation fins to flow air passed the heat dissipation fins.
7. A heat exchanger assembly as defined in claim 3 , wherein the electronic assembly has a plurality of the heat sources, further comprising:
a plurality of the heat transfer sections attached together, each including the first portion attachable to one of the heat sources and the second portion extending away from the first portion; and
a plurality of the sets of heat dissipation fins, each set of heat dissipation fins attached to at least part of the second portion of one of the heat transfer sections along the longitudinal dimension of the heat dissipation fins.
8. A heat exchanger assembly as defined in claim 3 wherein:
the first portion of the heat transfer section has a horizontal rectangular shape;
the second portion of the heat transfer section has a vertical rectangular shape; and
the heat dissipation fins extend horizontally from the second portion.
9. A heat exchanger assembly as defined in claim 8 wherein:
the first and second portions of the heat transfer section form an inverted T shape.
10. A heat exchanger assembly as defined in claim 8 further comprising:
a vapor chamber within the heat transfer section.
11. A heat exchanger assembly as defined in claim 8 further comprising:
at least one heat pipe embedded within the heat transfer section.
12. A heat exchanger assembly for use in a computer system having a heat source comprising:
a means for attaching to and receiving heat from the heat source;
a means for transferring the received heat to a location within the computer system remote from the heat source; and
a plurality of means for dissipating the transferred heat from the transferring means, the dissipating means each having a longitudinal dimension and being attached to the transferring means along the longitudinal dimension.
13. A computer system comprising:
a heat source; and
a heat exchanger assembly comprising:
a heat transfer section including a first portion attached to the heat source and a second portion extending away from the first portion and the heat source; and
heat dissipation fins having a longitudinal dimension and attached to at least part of the second portion of the heat transfer section along the longitudinal dimension.
14. A computer system as defined in claim 13 wherein:
the heat transfer section of the heat exchanger assembly comprises an evaporative-type heat transfer device.
15. A computer system as defined in claim 14 wherein:
the second portion of the heat transfer section comprises a cylindrical heat pipe; and
the heat dissipation fins extend radially out from the heat pipe.
16. A computer system as defined in claim 15 wherein:
the heat exchanger assembly further comprises:
a plurality of the heat transfer sections attached together.
17. A computer system as defined in claim 15 wherein:
the heat exchanger assembly further comprises:
a sleeve surrounding the heat dissipation fins to duct airflow passed the heat dissipation fins.
18. A computer system as defined in claim 15 wherein:
the heat exchanger assembly further comprises:
a fan adjacent the heat dissipation fins to flow air passed the heat dissipation fins.
19. A computer system as defined in claim 14 wherein:
the first portion of the heat transfer section has a horizontal rectangular shape;
the second portion of the heat transfer section has a vertical rectangular shape; and
the heat dissipation fins extend horizontally from the second portion.
20. A computer system as defined in claim 19 wherein:
the second portion of the heat transfer section comprises a vapor chamber.
21. A computer system as defined in claim 19 wherein:
the heat transfer section comprises at least one embedded heat pipe.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/065,326 US20060185831A1 (en) | 2005-02-24 | 2005-02-24 | Heat exchanger assembly |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/065,326 US20060185831A1 (en) | 2005-02-24 | 2005-02-24 | Heat exchanger assembly |
Publications (1)
Publication Number | Publication Date |
---|---|
US20060185831A1 true US20060185831A1 (en) | 2006-08-24 |
Family
ID=36911418
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/065,326 Abandoned US20060185831A1 (en) | 2005-02-24 | 2005-02-24 | Heat exchanger assembly |
Country Status (1)
Country | Link |
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US (1) | US20060185831A1 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070151712A1 (en) * | 2006-01-05 | 2007-07-05 | Foster Jimmy G Sr | Heat sink for distributing a thermal load |
US20110192577A1 (en) * | 2006-01-05 | 2011-08-11 | International Business Machines Corporation | Heat Sink For Dissipating A Thermal Load |
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US6418018B1 (en) * | 2000-12-21 | 2002-07-09 | Foxconn Precision Components Co., Ltd. | Heat removal system |
US6661660B2 (en) * | 2000-12-22 | 2003-12-09 | Intel Corporation | Integrated vapor chamber heat sink and spreader and an embedded direct heat pipe attachment |
US6717813B1 (en) * | 2003-04-14 | 2004-04-06 | Thermal Corp. | Heat dissipation unit with direct contact heat pipe |
US6745824B2 (en) * | 2002-06-13 | 2004-06-08 | Hon Hai Precision Ind. Co., Ltd. | Heat dissipation device |
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2005
- 2005-02-24 US US11/065,326 patent/US20060185831A1/en not_active Abandoned
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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US6418018B1 (en) * | 2000-12-21 | 2002-07-09 | Foxconn Precision Components Co., Ltd. | Heat removal system |
US6661660B2 (en) * | 2000-12-22 | 2003-12-09 | Intel Corporation | Integrated vapor chamber heat sink and spreader and an embedded direct heat pipe attachment |
US6745824B2 (en) * | 2002-06-13 | 2004-06-08 | Hon Hai Precision Ind. Co., Ltd. | Heat dissipation device |
US6717813B1 (en) * | 2003-04-14 | 2004-04-06 | Thermal Corp. | Heat dissipation unit with direct contact heat pipe |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
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US20070151712A1 (en) * | 2006-01-05 | 2007-07-05 | Foster Jimmy G Sr | Heat sink for distributing a thermal load |
US20110192577A1 (en) * | 2006-01-05 | 2011-08-11 | International Business Machines Corporation | Heat Sink For Dissipating A Thermal Load |
US9230881B2 (en) | 2006-01-05 | 2016-01-05 | International Business Machines Corporation | Heat sink for dissipating a thermal load |
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Legal Events
Date | Code | Title | Description |
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AS | Assignment |
Owner name: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P., TEXAS Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:MOORE, DAVID ALLEN;FRANZ, JOHN P.;REEL/FRAME:016331/0864 Effective date: 20050222 |
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STCB | Information on status: application discontinuation |
Free format text: EXPRESSLY ABANDONED -- DURING EXAMINATION |