1294763 九、發明說明： 【發明所屬之技術領域】 本發明涉及一種散熱裝置，尤係指一種冷卻電子元件之执管散軌 裝置。 ........ 【先前技術】1294763 IX. Description of the Invention: [Technical Field] The present invention relates to a heat dissipating device, and more particularly to a dispersing rail device for cooling electronic components. ........ [Prior Art]
隨著電子產業之迅速發展，如電腦中電子元件之運算速度大幅度 提高，其產生的熱量也隨之劇增，如何將電子元件之熱量散發出去， 以保證其正常運行，一直是業者必需解決的問題。眾所周知，安裝在 主機板上之中央處理器是電腦系統之核心，當電腦運行時，中央處理 器產生熱量。過多的熱量會導致中央處理器無法正常運行。為有效散 發中央處理器在運行過程中產生之熱量，通常在其上加裝一執 以便將其產生之熱量散發出去。 第-圖及第二圖揭露-傳統之散熱裝置，該散熱裝置包括一散熱 器100及一對與散熱器100熱連接之熱管2〇〇，散熱器1〇〇由導熱性 良好之金屬製成，其包括二相隔設置之扁平基座1(>2，每一基座皿 設有二孔(圖未標），複數散熱縛片綱夾置於二基座102之間，其中 -基座102置於中央處理 3〇〇上，熱管2〇〇呈u形設置，数管2〇〇 之兩齡別連接二基座搬上相應的孔。該散熱裝置使用時，置於中 央處理器300上之基座搬吸收中央處理器·產生之 隹 基座1犯上之熱量一部分傳遞至散熱鰭片綱之底部；另一部分=量 通過熱管200傳遞至另一相對基座搬上，接著傳遞至散顏片綱 頁U而此種政熱裝置之基座1〇2不能將從中央處理器3⑻上吸收 均勻的分佈至整健座皿，從而導致熱量不能被迅速而 至散熱鰭片腦，由此可見，該散熱裝置的傳熱效率較低。 【發明内容】 有鑒於此，有必要提供一種熱管散熱裝置。 上之：=，包括一可與發熱電子元件接觸之基座及設於基座 上之複數政熱鰭片，—第―熱管—端連接該 接觸，該散熱裝置還包括嵌設於基座上之第二$ t政熱‘·"曰片 6 这相較於現有技術，該散熱裝置包括第—及第二熱管，其中第一熱 :可將熱量傳遞至散熱則頂部，第二熱管嵌設於基座上可使執量快 迷=布於整個基座，從而促進基座到散熱則之熱傳遞，此兩種熱管 t佈方式結合使用將熱讀速分佈於整個散熱裝置，從而使整個散 熱袭置之散熱性能提升。 【實施方式】 請參閱第三圖及第四圖，本發明之散熱裝置用以對一置於電路板 40上之發熱電子元件42進行散熱，該散熱裝置包括一置於發熱電子 元件42上之基座12、一與基座平行且相隔設置之頂板14及夾置 於基座12與頂板Μ之間的複數散熱籍# 16、一對第一熱管2〇連接 該基座12及散熱鰭丨16及-對敌設於基座12且彎折延伸之第二熱管 3〇，其中每一散熱鰭片16相對兩邊緣焊接連接基座12與頂板14。 基座12由導熱性良好之金屬，例如銅或鋁製成，該基座12具有 底面及與底面相對設置之-頂面，其中該底面用以與電子元件42 接觸:基座12 +央設置有一對平直且相互平行之第一溝槽122，一對 u形第二溝槽124對稱地置於第一溝槽122兩側，每一第二溝槽 包括-臨近且平行於第—溝槽122之—第—豎直段，該第—豎直段末 端彎折設置-與第紐大致垂直之水平段，該水平段末端彎折設 置-與第-g直段平行之第二賢直段，該第二豎直段遠離第一溝槽 122。頂板14朝向散熱鰭片16之一面設有一對凹槽142。散熱鰭片16 具有一頂面164及一底面162,其中頂面164設有一對與頂板14之凹 槽142相對應之凹槽166。 々第一及第二熱管20、30均呈ϋ形設置，其内分別具有毛細結構， 第-及第二熱管2G、3G内充滿工作流體，第-及第二熱管2〇、3〇分 別形成有一吸熱段22、32及平行於吸熱段22、32之放熱段24'34， 其中第一熱管20之吸熱段22收容於基座12之第一溝槽122中，第一 熱管20之放熱段24收容於頂板14之凹槽142及散熱鰭片16之凹槽 166共同構成之孔洞内，二第一熱管2〇放熱段24之間的距離大於二 吸熱段22之間的距離。第二熱管3〇之吸熱段32與放熱段弘收容於 1294763 底座12上相應之第二溝槽124中，其中吸熱段％靠近第一溝槽i22， 放熱段34遠離第一溝槽122。 請同時參閱第五圖，散熱鰭片16置於基座12上，散熱鰭片16 ^頂面164與頂板14及第一熱管2〇之放熱段24接觸；如此，第一熱 官f之吸熱段22夾置於基座12與散熱鰭片16底面162之間，第一 熱官20之放熱段24夾置於散熱鰭片16之頂面164及頂板14之間， 整個第二熱管30夾置於基座12與散熱鰭片16底面162之間。 在本發明中，第一熱管20與基座12、第二熱管3〇與基座12、第 • 一熱管20與頂板14、第一熱管20與散熱鰭片16及第二熱管30與散 φ 熱鰭片16之間的連接均採用焊接方式。 / 、本發明之散熱裝置使用時，發熱電子元件42產生之熱量一部分通 -過第二熱管30迅速均勻傳遞至整個基座12及散熱鰭片16底部，通 ，散熱·，片I6進而將熱量散發到周圍的空氣巾；另—部分熱量則通過 第—熱官20傳遞至頂板14及散熱鰭片16頂部，通過散熱縛片仏進 =將熱量散發到顺的空氣中。本發明第_及，二熱㈣、3。兩種分 、 財式之結合顧，組將發熱電子元件42產生之熱量均勻分佈於整 裝置上’並通過散熱鰭片16將熱量散發，翻高效散熱性能。 ，、疋本發明之第二熱管3Q在使㈣，可使基座以上之熱量快速均 自的分佈，從而使熱量快速從基座12傳遞到散熱鰭片16。 90以理解地，本發明之施14切可嵌設熱管，從而使第一熱管 、至頂板14之熱量快速均勻的分佈於該頂板14上，以加強向散 熱鰭片16之熱傳導。 【圖式簡單說明】 · 第一圖係傳統散熱裝置之組合示意圖。 、 第二圖係沿第一圖中線V-V之截面圖。 第三圖係本發明散熱裝置之立體分解圖。 第四圖係第三圖中基座及第二熱管之組合圖。 第五圖係第三圖之組合圖。 【主要元件符號說明】 8 1294763 基座 12 第一溝槽 122 第二溝槽 124 頂板 14 凹槽 142 、 166 散熱鰭片 16 底面 162 頂面 164 第一熱管 20 吸熱段 22 放熱段 24 第二熱管 30 吸熱段 32 放熱段 34 電路板 40 電子元件 42With the rapid development of the electronics industry, such as the speed of computing electronic components in computers has increased dramatically, the heat generated by them has also increased dramatically. How to dissipate the heat of electronic components to ensure their normal operation has always been solved by the industry. The problem. It is well known that the central processor installed on the motherboard is the core of the computer system, and the central processor generates heat when the computer is running. Excessive heat can cause the central processor to not function properly. In order to effectively dissipate the heat generated by the central processing unit during operation, a heat is usually added to it to dissipate the heat it generates. The first and second figures disclose a conventional heat sink comprising a heat sink 100 and a pair of heat pipes 2 热 thermally connected to the heat sink 100. The heat sink 1 is made of a metal having good thermal conductivity. The utility model comprises a flat base 1 (>2, which is provided with two holes, each of which is provided with two holes (not shown), and a plurality of heat-dissipating clips are placed between the two bases 102, wherein the base 102 is placed on the central processing 3〇〇, the heat pipe 2〇〇 is arranged in a u shape, and the two tubes of the two tubes are connected to the two bases to carry corresponding holes. When the heat sink is used, it is placed in the central processing unit 300. The base is moved to absorb the central processing unit. The generated heat of the base 1 is partially transmitted to the bottom of the heat sink fin; the other part is transferred to the opposite base through the heat pipe 200, and then transferred to the ground. The slab of the slab page U and the pedestal 1 〇 2 of the tempering device cannot be uniformly distributed from the central processing unit 3 (8) to the sturdy dish, so that the heat cannot be quickly dissipated to the fin surface. It can be seen that the heat transfer efficiency of the heat sink is low. It is necessary to provide a heat pipe heat sink. The above: =, includes a base that can be in contact with the heat-generating electronic component, and a plurality of political fins disposed on the base, the first heat pipe-end connects the contact, the heat dissipation The device further includes a second $t political heat embedded on the pedestal. The heat sink comprises a first heat pipe and a second heat pipe, wherein the first heat: heat transfer To the top of the heat dissipation, the second heat pipe is embedded on the pedestal to make the singularly fast = the whole pedestal, so as to promote the heat transfer from the pedestal to the heat dissipation. The two heat pipes are combined with the heat to read the heat. The heat dissipation device is disposed on the entire heat dissipating device, so that the heat dissipation performance of the entire heat dissipating device is improved. [Embodiment] Referring to the third and fourth figures, the heat dissipating device of the present invention is used for a heat generating electron placed on the circuit board 40. The heat dissipating device includes a susceptor 12 disposed on the heat generating electronic component 42 , a top plate 14 disposed parallel to the pedestal and spaced apart from each other, and a plurality of heat sinks sandwiched between the pedestal 12 and the top plate # 16, a pair of first heat pipe 2 〇 connection The pedestal 12 and the heat dissipating fins 16 and the second heat pipe 3 敌 extending to the base 12 and extending and extending, wherein each of the heat dissipating fins 16 is welded to the base 12 and the top plate 14 opposite to the two edges. The base 12 has a bottom surface and a top surface opposite to the bottom surface, wherein the bottom surface is in contact with the electronic component 42: the base 12 + central portion is provided with a pair of flat Straight and mutually parallel first trenches 122, a pair of u-shaped second trenches 124 are symmetrically disposed on opposite sides of the first trench 122, each second trench including - adjacent to and parallel to the first trench 122 a first-vertical segment, the end of the first vertical segment is bent to be disposed - a horizontal segment substantially perpendicular to the first button, and the end of the horizontal segment is bent and disposed - a second straight segment parallel to the straight portion of the -g, the first segment The two vertical segments are away from the first trench 122. The top plate 14 is provided with a pair of grooves 142 facing one side of the heat dissipation fins 16. The heat sink fin 16 has a top surface 164 and a bottom surface 162, wherein the top surface 164 is provided with a pair of recesses 166 corresponding to the recesses 142 of the top plate 14. The first and second heat pipes 20 and 30 are arranged in a meandering shape, respectively having a capillary structure therein, the first and second heat pipes 2G, 3G are filled with a working fluid, and the first and second heat pipes 2, 3, respectively are formed. There is a heat absorption section 22, 32 and a heat release section 24'34 parallel to the heat absorption sections 22, 32, wherein the heat absorption section 22 of the first heat pipe 20 is received in the first groove 122 of the base 12, and the heat release section of the first heat pipe 20 24 is received in the hole 142 of the top plate 14 and the groove 166 of the heat dissipation fin 16 together, and the distance between the heat dissipation sections 24 of the first heat pipe 2 is greater than the distance between the heat absorption sections 22. The heat absorption section 32 and the heat release section of the second heat pipe 3 are received in the corresponding second groove 124 of the base 12 of the 1294763, wherein the heat absorption section % is close to the first groove i22, and the heat release section 34 is away from the first groove 122. Please also refer to the fifth figure, the heat dissipation fins 16 are placed on the base 12, and the heat dissipation fins 16 ^ top surface 164 are in contact with the top plate 14 and the heat release section 24 of the first heat pipe 2; thus, the heat absorption of the first heat officer f The segment 22 is sandwiched between the pedestal 12 and the bottom surface 162 of the heat dissipation fin 16, and the heat release portion 24 of the first heat member 20 is sandwiched between the top surface 164 of the heat dissipation fin 16 and the top plate 14, and the entire second heat pipe 30 is clamped. Placed between the susceptor 12 and the bottom surface 162 of the heat dissipation fins 16. In the present invention, the first heat pipe 20 and the susceptor 12, the second heat pipe 3 〇 and the susceptor 12, the first heat pipe 20 and the top plate 14, the first heat pipe 20 and the heat dissipation fins 16 and the second heat pipe 30 and φ The connections between the hot fins 16 are all welded. When the heat sink of the present invention is used, a part of the heat generated by the heat-generating electronic component 42 passes through the second heat pipe 30 and is evenly and evenly transmitted to the bottom of the entire susceptor 12 and the heat-dissipating fins 16, and the heat is dissipated. The air towel is radiated to the surrounding air; another part of the heat is transmitted to the top of the top plate 14 and the heat dissipating fins 16 through the first heat member 20, and is dissipated through the heat dissipating fins to dissipate heat into the smooth air. The invention has the first and second heats (four) and three. The combination of the two types of financial and financial methods, the heat generated by the heat-generating electronic component 42 is evenly distributed on the whole device', and the heat is radiated through the heat-dissipating fins 16, and the heat-dissipating performance is turned. The second heat pipe 3Q of the present invention enables (4) to quickly and evenly distribute the heat above the susceptor so that heat is quickly transferred from the susceptor 12 to the heat sink fins 16. 90. In an understanding, the heat pipe of the first heat pipe and the top plate 14 can be quickly and evenly distributed on the top plate 14 to enhance the heat conduction to the heat radiating fins 16. [Simple description of the diagram] · The first diagram is a combination diagram of the traditional heat sink. The second figure is a cross-sectional view taken along line V-V in the first figure. The third figure is an exploded perspective view of the heat sink of the present invention. The fourth figure is a combination diagram of the pedestal and the second heat pipe in the third figure. The fifth figure is a combination of the third figure. [Main component symbol description] 8 1294763 Base 12 First groove 122 Second groove 124 Top plate 14 Groove 142, 166 Heat sink fin 16 Bottom surface 162 Top surface 164 First heat pipe 20 Heat absorption section 22 Heat release section 24 Second heat pipe 30 Endothermic section 32 Exothermic section 34 Circuit board 40 Electronic components 42
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