TWI563906B - Cooling device, a method for manufacturing same and a flexible circuit board - Google Patents
Cooling device, a method for manufacturing same and a flexible circuit boardInfo
- Publication number
- TWI563906B TWI563906B TW102139222A TW102139222A TWI563906B TW I563906 B TWI563906 B TW I563906B TW 102139222 A TW102139222 A TW 102139222A TW 102139222 A TW102139222 A TW 102139222A TW I563906 B TWI563906 B TW I563906B
- Authority
- TW
- Taiwan
- Prior art keywords
- circuit board
- cooling device
- flexible circuit
- manufacturing same
- manufacturing
- Prior art date
Links
- 238000001816 cooling Methods 0.000 title 1
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
- F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
- F28F21/081—Heat exchange elements made from metals or metal alloys
- F28F21/085—Heat exchange elements made from metals or metal alloys from copper or copper alloys
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
- H01L21/4882—Assembly of heatsink parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D53/00—Making other particular articles
- B21D53/02—Making other particular articles heat exchangers or parts thereof, e.g. radiators, condensers fins, headers
- B21D53/04—Making other particular articles heat exchangers or parts thereof, e.g. radiators, condensers fins, headers of sheet metal
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2275/00—Fastening; Joining
- F28F2275/02—Fastening; Joining by using bonding materials; by embedding elements in particular materials
- F28F2275/025—Fastening; Joining by using bonding materials; by embedding elements in particular materials by using adhesives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/4935—Heat exchanger or boiler making
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Thermal Sciences (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Sustainable Development (AREA)
- Life Sciences & Earth Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structure Of Printed Boards (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310474244.9A CN104582234A (en) | 2013-10-12 | 2013-10-12 | Heat radiating device, fabricating method and flexible circuit board with heat radiating device |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201524326A TW201524326A (en) | 2015-06-16 |
TWI563906B true TWI563906B (en) | 2016-12-21 |
Family
ID=52808659
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW102139222A TWI563906B (en) | 2013-10-12 | 2013-10-30 | Cooling device, a method for manufacturing same and a flexible circuit board |
Country Status (4)
Country | Link |
---|---|
US (1) | US20150101785A1 (en) |
JP (1) | JP2015076619A (en) |
CN (1) | CN104582234A (en) |
TW (1) | TWI563906B (en) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105451507B (en) * | 2014-09-02 | 2018-02-02 | 鹏鼎控股(深圳)股份有限公司 | The preparation method of radiator structure and the radiator structure |
CN107027264B (en) * | 2015-06-24 | 2019-04-16 | 碁鼎科技秦皇岛有限公司 | Cooling fin and preparation method thereof and electronic equipment |
CN106856645B (en) * | 2015-12-09 | 2019-04-26 | 宏启胜精密电子(秦皇岛)有限公司 | Radiator structure and preparation method thereof |
CN107360695B (en) * | 2016-05-09 | 2019-07-23 | 鹏鼎控股(深圳)股份有限公司 | Radiator structure and preparation method thereof |
CN107846810A (en) * | 2016-09-18 | 2018-03-27 | 鹏鼎控股(深圳)股份有限公司 | Radiator structure and preparation method thereof and electronic equipment |
CN109219306B (en) * | 2017-06-30 | 2020-07-14 | 鹏鼎控股(深圳)股份有限公司 | Heat sink and method for manufacturing the same |
CN109413929B (en) * | 2017-08-16 | 2020-11-24 | 鹏鼎控股(深圳)股份有限公司 | Heat sink and method for manufacturing the same |
CN109413930A (en) * | 2017-08-18 | 2019-03-01 | 鹏鼎控股(深圳)股份有限公司 | The electronic device of temperature-uniforming plate and the application temperature-uniforming plate |
TW202024553A (en) * | 2018-12-27 | 2020-07-01 | 圓剛科技股份有限公司 | Heat dissipation device |
CN110548947B (en) * | 2019-08-21 | 2021-05-25 | 湖北三江航天险峰电子信息有限公司 | Welding method of cold plate assembly |
US11979977B2 (en) * | 2019-08-31 | 2024-05-07 | Qing Ding Precision Electronics (Huaian) Co., Ltd | Circuit board with heat dissipation structure and method for manufacturing same |
CN110739284B (en) * | 2019-09-24 | 2020-12-08 | 杭州臻镭微波技术有限公司 | Flexible circuit board radio frequency module with heat dissipation function and manufacturing method thereof |
CN111343834A (en) * | 2020-01-17 | 2020-06-26 | 广东工业大学 | Electronic equipment heat dissipation micro-fluidic chip and preparation method thereof |
CN113574974B (en) * | 2020-01-31 | 2024-06-28 | 迅达科技公司 | Printed circuit board assembly with engineered thermal pathways and method of manufacture |
US10777483B1 (en) * | 2020-02-28 | 2020-09-15 | Arieca Inc. | Method, apparatus, and assembly for thermally connecting layers |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6830098B1 (en) * | 2002-06-14 | 2004-12-14 | Thermal Corp. | Heat pipe fin stack with extruded base |
TWI294763B (en) * | 2005-11-25 | 2008-03-11 | Foxconn Tech Co Ltd | Heat dissipation device |
TWM435646U (en) * | 2012-04-25 | 2012-08-11 | Chaun Choung Technology Corp | Heat dissipating device and heat transfer structure thereof |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5697428A (en) * | 1993-08-24 | 1997-12-16 | Actronics Kabushiki Kaisha | Tunnel-plate type heat pipe |
US6613123B2 (en) * | 2000-05-24 | 2003-09-02 | Stephen F. Corbin | Variable melting point solders and brazes |
US7002247B2 (en) * | 2004-06-18 | 2006-02-21 | International Business Machines Corporation | Thermal interposer for thermal management of semiconductor devices |
WO2007018288A1 (en) * | 2005-08-11 | 2007-02-15 | Senju Metal Industry Co., Ltd. | Lead free solder paste and application thereof |
US20130058042A1 (en) * | 2011-09-03 | 2013-03-07 | Todd Richard Salamon | Laminated heat sinks |
-
2013
- 2013-10-12 CN CN201310474244.9A patent/CN104582234A/en active Pending
- 2013-10-30 TW TW102139222A patent/TWI563906B/en active
-
2014
- 2014-10-09 JP JP2014207827A patent/JP2015076619A/en not_active Withdrawn
- 2014-10-13 US US14/512,546 patent/US20150101785A1/en not_active Abandoned
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6830098B1 (en) * | 2002-06-14 | 2004-12-14 | Thermal Corp. | Heat pipe fin stack with extruded base |
TWI294763B (en) * | 2005-11-25 | 2008-03-11 | Foxconn Tech Co Ltd | Heat dissipation device |
TWM435646U (en) * | 2012-04-25 | 2012-08-11 | Chaun Choung Technology Corp | Heat dissipating device and heat transfer structure thereof |
Also Published As
Publication number | Publication date |
---|---|
CN104582234A (en) | 2015-04-29 |
TW201524326A (en) | 2015-06-16 |
JP2015076619A (en) | 2015-04-20 |
US20150101785A1 (en) | 2015-04-16 |
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