JP2015076619A - Heat radiator, method of manufacturing the same, and flexible circuit board equipped with heat radiator - Google Patents
Heat radiator, method of manufacturing the same, and flexible circuit board equipped with heat radiator Download PDFInfo
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- JP2015076619A JP2015076619A JP2014207827A JP2014207827A JP2015076619A JP 2015076619 A JP2015076619 A JP 2015076619A JP 2014207827 A JP2014207827 A JP 2014207827A JP 2014207827 A JP2014207827 A JP 2014207827A JP 2015076619 A JP2015076619 A JP 2015076619A
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- copper foil
- adhesive layer
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- dissipation device
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 70
- 239000011889 copper foil Substances 0.000 claims abstract description 70
- 230000017525 heat dissipation Effects 0.000 claims abstract description 21
- 239000012530 fluid Substances 0.000 claims abstract description 15
- 239000012790 adhesive layer Substances 0.000 claims abstract description 13
- 239000010410 layer Substances 0.000 claims description 50
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 19
- 229910000679 solder Inorganic materials 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 4
- 238000002844 melting Methods 0.000 claims description 3
- 230000008018 melting Effects 0.000 claims description 3
- 239000000654 additive Substances 0.000 claims description 2
- 238000005219 brazing Methods 0.000 claims description 2
- 238000001816 cooling Methods 0.000 claims description 2
- 238000005530 etching Methods 0.000 claims description 2
- 238000003825 pressing Methods 0.000 claims description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims 1
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 229910052797 bismuth Inorganic materials 0.000 claims 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 125000000896 monocarboxylic acid group Chemical group 0.000 claims 1
- 230000005855 radiation Effects 0.000 description 6
- 229910000831 Steel Inorganic materials 0.000 description 5
- 239000010959 steel Substances 0.000 description 5
- 238000003860 storage Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000004308 accommodation Effects 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
- F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
- F28F21/081—Heat exchange elements made from metals or metal alloys
- F28F21/085—Heat exchange elements made from metals or metal alloys from copper or copper alloys
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
- H01L21/4882—Assembly of heatsink parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D53/00—Making other particular articles
- B21D53/02—Making other particular articles heat exchangers or parts thereof, e.g. radiators, condensers fins, headers
- B21D53/04—Making other particular articles heat exchangers or parts thereof, e.g. radiators, condensers fins, headers of sheet metal
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2275/00—Fastening; Joining
- F28F2275/02—Fastening; Joining by using bonding materials; by embedding elements in particular materials
- F28F2275/025—Fastening; Joining by using bonding materials; by embedding elements in particular materials by using adhesives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/4935—Heat exchanger or boiler making
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Sustainable Development (AREA)
- Life Sciences & Earth Sciences (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
本発明は、放熱装置及びその製造方法並びに放熱装置を備えたフレキシブル回路基板に関するものである。 The present invention relates to a heat dissipation device, a manufacturing method thereof, and a flexible circuit board including the heat dissipation device.
従来の技術において、携帯電話などの小型電子製品のフレキシブル回路基板には鋼片が貼られており、フレキシブル回路基板の熱を放熱する。しかし、鋼片の放熱効率は低いため、過度に熱くなったフレキシブル回路基板を十分に放熱できない。これにより、電子製品は動作が停止し、更には損傷する場合もある。 In the prior art, a steel piece is attached to a flexible circuit board of a small electronic product such as a mobile phone, and the heat of the flexible circuit board is dissipated. However, since the heat dissipation efficiency of the steel slab is low, the excessively heated flexible circuit board cannot sufficiently dissipate heat. As a result, the electronic product stops operating and may even be damaged.
本発明の目的は、前記問題を解決し、放熱効率を向上できる放熱装置とその製造方法及び放熱装置を備えたフレキシブル回路基板を提供することである。 The objective of this invention is providing the flexible circuit board provided with the thermal radiation apparatus which can solve the said problem, and can improve thermal radiation efficiency, its manufacturing method, and a thermal radiation apparatus.
上記目的を達成するために、本発明に係る放熱装置は、第一銅箔と、第二銅箔と、第一銅箔と第二銅箔との間に設置される粘着剤層と、作動流体と、を備え、第一銅箔は第一表面を備え、第一表面には複数の第一溝部が設けられ、第二銅箔は第二表面を備え、第二表面には第一溝部と対応して複数の第二溝部が設けられ、第二銅箔は粘着剤層を介して第一銅箔に粘着され、第二溝部は第一溝部にそれぞれ連通されて、複数の密封された収容空間を形成し、作動流体は収容空間に収容される。 In order to achieve the above object, a heat dissipation device according to the present invention includes a first copper foil, a second copper foil, an adhesive layer installed between the first copper foil and the second copper foil, and an operation. A first copper foil having a first surface, the first surface having a plurality of first grooves, the second copper foil having a second surface, and the second surface having a first groove. A plurality of second groove portions are provided correspondingly, and the second copper foil is adhered to the first copper foil through the adhesive layer, and the second groove portions are respectively communicated with the first groove portions and sealed in a plurality. A storage space is formed, and the working fluid is stored in the storage space.
本発明に係る放熱装置は、作動流体を放熱媒介として使用するので、固体金属層より早く熱量を伝導して放熱させることができる。 Since the heat radiating device according to the present invention uses the working fluid as a heat radiating medium, it can conduct heat and conduct heat faster than the solid metal layer.
図１〜図５は、本発明の実施形態に係るフレキシブル回路基板の放熱装置の製造方法である。該製造方法は以下のステップを備える。 1-5 is a manufacturing method of the thermal radiation apparatus of the flexible circuit board based on Embodiment of this invention. The manufacturing method includes the following steps.
ステップ１において、図１〜図３に示したように、第一銅箔１０が提供され、この第一表面１０１には複数の第一溝部１０２が設けられている。 In step 1, as shown in FIGS. 1 to 3, the first copper foil 10 is provided, and the first surface 101 is provided with a plurality of first grooves 102.
第一銅箔１０の厚さは０．１ｍｍ〜１ｍｍであるが、１４０μｍの厚さが望ましい。第一溝部１０２は細長い溝であって、その深さは第一銅箔１０の厚さより小さい。第一溝部１０２の切断面はどのような形でも良いが、弧形が望ましい。また、複数の第一溝部１０２は一定の規則に従って、第一表面１０１に配列されても良いが、本実施形態においては、複数の第一溝部１０２は無規則に配列されている。図２に示したように、各第一溝部１０２上には第一開口１０３がそれぞれ設けられている。第一開口１０３の総面積は、第一表面１０１の面積の４０％〜７０％に等しく、放熱面積を増加させる。第一溝部１０２は、エッチング又はレーザー開孔によって形成される。 Although the thickness of the 1st copper foil 10 is 0.1 mm-1 mm, the thickness of 140 micrometers is desirable. The first groove 102 is an elongated groove, and the depth thereof is smaller than the thickness of the first copper foil 10. The cut surface of the first groove 102 may have any shape, but an arc shape is desirable. Moreover, although the some 1st groove part 102 may be arranged in the 1st surface 101 according to a fixed rule, in this embodiment, the some 1st groove part 102 is arranged irregularly. As shown in FIG. 2, a first opening 103 is provided on each first groove 102. The total area of the first openings 103 is equal to 40% to 70% of the area of the first surface 101, increasing the heat dissipation area. The first groove 102 is formed by etching or laser opening.
ステップ２において、図３に示したように、第一銅箔１０の第一表面１０１上に、粘着剤層２０が設置される。 In step 2, as shown in FIG. 3, the pressure-sensitive adhesive layer 20 is placed on the first surface 101 of the first copper foil 10.
本実施形態において、粘着剤層２０は、はんだペーストであるが、低温はんだペースト、即ち、熔接点が１３９度又は１３９度以下のはんだペーストが好ましい。本実施形態において、低温はんだペーストの成分は表１に示した通りである。 In the present embodiment, the pressure-sensitive adhesive layer 20 is a solder paste, but a low-temperature solder paste, that is, a solder paste having a molten contact of 139 degrees or 139 degrees or less is preferable. In this embodiment, the components of the low-temperature solder paste are as shown in Table 1.
また、低温はんだペーストには少量の添加物が加えられている。粘着剤層２０は、印刷技術によって第一表面１０１に形成される。具体的には、予め設定されたパターンを有する鋼板のパターンが第一溝部１０２の第一開口１０３を覆うように、該鋼板を第一表面１０１に設置する。次いで、工具によって低温はんだペーストを第一表面１０１に印刷する。 A small amount of additive is added to the low-temperature solder paste. The pressure-sensitive adhesive layer 20 is formed on the first surface 101 by a printing technique. Specifically, the steel plate is placed on the first surface 101 so that the pattern of the steel plate having a preset pattern covers the first opening 103 of the first groove portion 102. Next, a low temperature solder paste is printed on the first surface 101 with a tool.
ステップ３において、図４に示したように、第一溝部１０２内には、作動流体３０、例えば水が充填される。この水の比熱は４２００Ｊ／（ｋｇ．℃)であって、鋼片の比熱４５０Ｊ／（ｋｇ．℃)より遥かに大きい。 In step 3, as shown in FIG. 4, the first groove 102 is filled with a working fluid 30, for example, water. The specific heat of this water is 4200 J / (kg. ° C.), which is much higher than the specific heat of the steel slab, 450 J / (kg. ° C.).
ステップ４において、図５に示したように、第二銅箔４０が提供される。この第二表面４０１には、複数の第二溝部４０２が設けられている。第二銅箔４０は粘着剤層２０上に押圧され、且つ粘着剤層２０を固化させる。これによって、第二溝部４０２は、第一溝部１０２とそれぞれ連通して、複数の細長い収容空間４０４が形成される。以上により、放熱装置が完成する。 In step 4, as shown in FIG. 5, a second copper foil 40 is provided. A plurality of second groove portions 402 are provided on the second surface 401. The second copper foil 40 is pressed onto the pressure-sensitive adhesive layer 20 and solidifies the pressure-sensitive adhesive layer 20. As a result, the second groove portion 402 communicates with the first groove portion 102 to form a plurality of elongated housing spaces 404. Thus, the heat dissipation device is completed.
第二銅箔４０の厚さは０．１ｍｍ〜１ｍｍであるが、１４０μｍの厚さが望ましい。また、第一銅箔１０の厚さと同じである方が更に望ましい。第二溝部４０２は細長い溝であって、その深さは第二銅箔４０の厚さより小さい。第二溝部４０２は第一溝部１０２に対応して設けられる。各第二溝部４０２は第二開口４０３を備え、第二開口４０３は、第一開口１０３にそれぞれ対応して位置し、且つ対応する第一開口１０３と同じ形状及び同じ大きさをそれぞれ有する。これによって、第二銅箔４０が粘着剤層２０に押圧されると、第二溝部４０２は第一溝部１０２とそれぞれ連通し、複数の細長く且つ密封された収容空間４０４を形成する。粘着剤層２０を固化する方法は、第一銅箔１０、粘着剤層２０及び第二銅箔４０が押圧されて重なってできた物体を溶解炉に入れて、粘着剤層２０内のはんだペーストを溶かした後、冷却させることによって、粘着剤層２０を固化する。 The thickness of the second copper foil 40 is 0.1 mm to 1 mm, but a thickness of 140 μm is desirable. Moreover, it is more desirable that it is the same as the thickness of the first copper foil 10. The second groove portion 402 is an elongated groove, and the depth thereof is smaller than the thickness of the second copper foil 40. The second groove portion 402 is provided corresponding to the first groove portion 102. Each second groove portion 402 includes a second opening 403, the second opening 403 is located corresponding to the first opening 103, and has the same shape and the same size as the corresponding first opening 103, respectively. As a result, when the second copper foil 40 is pressed against the pressure-sensitive adhesive layer 20, the second groove portions 402 communicate with the first groove portions 102 to form a plurality of elongated and sealed housing spaces 404. The method of solidifying the pressure-sensitive adhesive layer 20 is to put an object formed by pressing and overlapping the first copper foil 10, the pressure-sensitive adhesive layer 20 and the second copper foil 40 into a melting furnace, and solder paste in the pressure-sensitive adhesive layer 20 Then, the pressure-sensitive adhesive layer 20 is solidified by cooling.
本実施形態において、予定温度及び圧力によって、第二銅箔４０を粘着剤層２０に押圧する。予定温度は粘着剤層２０の溶解点より高いので、粘着剤層２０が固化した後第二銅箔４０及び第一銅箔１０を固定できる。 In the present embodiment, the second copper foil 40 is pressed against the pressure-sensitive adhesive layer 20 by a predetermined temperature and pressure. Since the expected temperature is higher than the melting point of the pressure-sensitive adhesive layer 20, the second copper foil 40 and the first copper foil 10 can be fixed after the pressure-sensitive adhesive layer 20 is solidified.
また、好ましくは、第一溝部１０２及び第二溝部４０２の内壁に液体を吸収できる吸収部を設置するのが望ましい。 In addition, it is preferable that an absorption part capable of absorbing the liquid is installed on the inner walls of the first groove part 102 and the second groove part 402.
本発明の実施形態に係る放熱装置１００は、第一銅箔１０と、第二銅箔４０と、粘着剤層２０と、作動流体３０と、を備える。第一銅箔１０の第一表面１０１には複数の細長い第一溝部１０２が設けられている。第一溝部１０２の深さは第一銅箔１０の厚さより小さい。各第一溝部１０２上には第一開口１０３がそれぞれ設けられている。第二銅箔４０の第二表面４０１には、第一溝部１０２と対応して複数の第二溝部４０２が設けられている。第二溝部４０２の深さは第二銅箔４０の厚さより小さい。各第二溝部４０２は第二開口４０３を備え、第二開口４０３は、第一開口１０３にそれぞれ対応して位置し、且つ対応する第一開口１０３と同じ形状及び同じ大きさをそれぞれ有する。第二銅箔４０は第一銅箔１０に押圧される。この際、第二溝部４０２は第一溝部１０２とそれぞれ連通して、複数の細長く且つ密封された収容空間４０４を形成する。第二銅箔４０は粘着剤層２０を介して、第一銅箔１０に粘着される。作動流体３０は収容空間４０４に収容される。 A heat dissipation device 100 according to an embodiment of the present invention includes a first copper foil 10, a second copper foil 40, an adhesive layer 20, and a working fluid 30. A plurality of elongated first grooves 102 are provided on the first surface 101 of the first copper foil 10. The depth of the first groove portion 102 is smaller than the thickness of the first copper foil 10. A first opening 103 is provided on each first groove 102. The second surface 401 of the second copper foil 40 is provided with a plurality of second groove portions 402 corresponding to the first groove portions 102. The depth of the second groove portion 402 is smaller than the thickness of the second copper foil 40. Each second groove portion 402 includes a second opening 403, the second opening 403 is located corresponding to the first opening 103, and has the same shape and the same size as the corresponding first opening 103, respectively. The second copper foil 40 is pressed against the first copper foil 10. At this time, the second groove portion 402 communicates with the first groove portion 102 to form a plurality of elongated and sealed housing spaces 404. The second copper foil 40 is adhered to the first copper foil 10 via the adhesive layer 20. The working fluid 30 is stored in the storage space 404.
本実施形態において、第一銅箔１０は、発熱部、例えば図６に示す回路基板本体５０に当接される。本発明の放熱装置１００の作動原理は、先ず発熱部が発熱する。この際、発生した熱量が第一銅箔１０に伝導され、その熱量の一部は第一溝部１０２内の作動流体３０に吸収される。熱量を吸収した作動流体３０は蒸発し、第二溝部４０２の内壁に接触すると冷却して熱量を放出し、液体となって、第二溝部４０２の内壁に沿って第一溝部１０２内に落下し、再び熱量を吸収して蒸発する。以上の作業を繰り返すことで、発熱部の熱の一部を放熱する。第二溝部４０２内で放熱された熱量は、第二銅箔４０に伝導され、外部に発散される。また、発熱部が生じた一部の熱量は、第一銅箔１０、粘着剤層２０及び第二銅箔４０の順を経て放熱される。 In this embodiment, the 1st copper foil 10 is contact | abutted to the heat generating part, for example, the circuit board main body 50 shown in FIG. The principle of operation of the heat dissipation device 100 of the present invention is that the heat generating portion first generates heat. At this time, the generated heat amount is conducted to the first copper foil 10, and a part of the heat amount is absorbed by the working fluid 30 in the first groove portion 102. The working fluid 30 that has absorbed the heat evaporates, and when it contacts the inner wall of the second groove portion 402, it cools to release heat and becomes a liquid that falls into the first groove portion 102 along the inner wall of the second groove portion 402. Again, it absorbs heat and evaporates. By repeating the above operation, a part of the heat of the heat generating part is radiated. The amount of heat dissipated in the second groove portion 402 is conducted to the second copper foil 40 and dissipated to the outside. Further, a part of the heat generated by the heat generating portion is radiated through the first copper foil 10, the pressure-sensitive adhesive layer 20, and the second copper foil 40 in this order.
図６に示したように、本発明に係るフレキシブル回路基板２００は、電子ユニット５６と、回路基板本体５０と、放熱装置１００と、を備える。回路基板本体５０は、ベース層５１と、ベース層５１の対向する両側にそれぞれ設置された第一導電線路層５２及び第二導電線路層５３と、第一導電線路層５２上に設置された第一カバー層５４と、第二導電線路層５３上に設置された第二カバー層５５と、を備える。ベース層５１は、絶縁層又は複数の絶縁層と導電線路層とが交互に重なって形成されてもよい。第一カバー層５４には、開口部が設けられている。これにより、第一導電線路層５２の一部が露出する。電子ユニット５６は、軟ろう部５７を介して、第一導電線路層５２の露出部分に電気的に接続される。電子ユニット５６の表面が第一銅箔１０に隣接するので、放熱装置は、電子ユニット５６が作動中に生じる熱量を素早く放熱させることができる。 As shown in FIG. 6, the flexible circuit board 200 according to the present invention includes an electronic unit 56, a circuit board body 50, and a heat dissipation device 100. The circuit board main body 50 includes a base layer 51, a first conductive line layer 52 and a second conductive line layer 53 installed on opposite sides of the base layer 51, and a first conductive line layer 53 installed on the first conductive line layer 52, respectively. One cover layer 54 and a second cover layer 55 installed on the second conductive line layer 53 are provided. The base layer 51 may be formed by alternately overlapping insulating layers or a plurality of insulating layers and conductive line layers. The first cover layer 54 is provided with an opening. Thereby, a part of the first conductive line layer 52 is exposed. The electronic unit 56 is electrically connected to the exposed portion of the first conductive line layer 52 through the soft solder portion 57. Since the surface of the electronic unit 56 is adjacent to the first copper foil 10, the heat dissipation device can quickly dissipate the amount of heat generated during operation of the electronic unit 56.
本発明の放熱装置１００は、作動流体３０を放熱媒介として使用するので、固体金属層より早く熱量を伝導し放熱させることができる。 Since the heat dissipation device 100 of the present invention uses the working fluid 30 as a heat dissipation medium, it can conduct heat and dissipate heat faster than the solid metal layer.
１０ 第一銅箔
１００ 放熱装置
１０１ 第一表面
１０２ 第一溝部
１０３ 第一開口
２０ 粘着剤層
２００ フレキシブル回路基板
３０ 作動流体
４０ 第二銅箔
４０１ 第二表面
４０２ 第二溝部
４０３ 第二開口
４０４ 収容空間
５０ 回路基板本体
５１ ベース層
５２ 第一導電線路層
５３ 第二導電線路層
５４ 第一カバー層
５５ 第二カバー層
５６ 電子ユニット
５７ 軟ろう部
DESCRIPTION OF SYMBOLS 10 1st copper foil 100 Heat dissipation device 101 1st surface 102 1st groove part 103 1st opening 20 Adhesive layer 200 Flexible circuit board 30 Working fluid 40 2nd copper foil 401 2nd surface 402 2nd groove part 403 2nd opening 404 accommodation Space 50 Circuit board body 51 Base layer 52 First conductive line layer 53 Second conductive line layer 54 First cover layer 55 Second cover layer 56 Electronic unit 57 Soft brazing part
Claims (8)
第二銅箔と、
前記第一銅箔と前記第二銅箔との間に設置される粘着剤層と、
作動流体と、
を備える放熱装置であって、
前記第一銅箔は第一表面を備え、前記第一表面には複数の第一溝部が設けられ、前記第二銅箔は第二表面を備え、前記第二表面には前記第一溝部と対応して複数の第二溝部が設けられ、前記第二銅箔は前記粘着剤層を介して前記第一銅箔に粘着され、前記第二溝部は前記第一溝部にそれぞれ連通されて、複数の密封された収容空間を形成し、前記作動流体は前記収容空間に収容されること
を特徴とする放熱装置。 The first copper foil,
A second copper foil,
An adhesive layer installed between the first copper foil and the second copper foil;
Working fluid;
A heat dissipation device comprising:
The first copper foil includes a first surface, the first surface includes a plurality of first groove portions, the second copper foil includes a second surface, and the second surface includes the first groove portion and Correspondingly, a plurality of second groove portions are provided, the second copper foil is adhered to the first copper foil via the pressure-sensitive adhesive layer, and the second groove portions are respectively communicated with the first groove portions. A heat radiating device, wherein the working fluid is accommodated in the accommodating space.
第一銅箔が提供され、前記第一銅箔の第一表面に複数の第一溝部が設けられるステップと、前記第一表面において、前記第一溝部を露出させるように粘着剤を設置するステップと、
第二銅箔が提供され、前記第二銅箔の第二表面に複数の第二溝部を設けられ、前記第二銅箔を粘着剤層に粘着させ且つ固定させることによって、前記第一溝部は前記第二溝部にそれぞれ連通され、作動流体を収容できる複数の密封された収容空間を形成させるステップと、を備えることを特徴とする放熱装置の製造方法。 A method of manufacturing a heat dissipation device,
A step of providing a first copper foil, and providing a plurality of first groove portions on a first surface of the first copper foil; and a step of installing an adhesive so as to expose the first groove portion on the first surface. When,
A second copper foil is provided, a plurality of second groove portions are provided on a second surface of the second copper foil, and the first groove portion is adhered and fixed to the adhesive layer. And a step of forming a plurality of sealed housing spaces which are respectively communicated with the second groove portions and can contain the working fluid.
回路基板本体と、
請求項１から４までの何れか一項に記載の放熱装置と、を備え、
前記回路基板本体は、ベース層と、前記ベース層の一側に設置された導電線路層と、前記導電線路層に設置されたカバー層と、を備え、前記カバー層には、前記導電線路層の一部を露出させる開口部が設けられ、前記電子ユニットは軟ろう部を介して、前記導電線路層の露出部分に電気的に接続され、前記放熱装置は前記電子ユニットに当接されることを特徴とするフレキシブル回路基板。 An electronic unit,
A circuit board body;
A heat dissipation device according to any one of claims 1 to 4,
The circuit board body includes a base layer, a conductive line layer disposed on one side of the base layer, and a cover layer disposed on the conductive line layer, and the cover layer includes the conductive line layer. An opening that exposes a part of the electronic unit is provided, the electronic unit is electrically connected to an exposed part of the conductive line layer through a soft brazing part, and the heat dissipation device is in contact with the electronic unit A flexible circuit board.
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| CN201310474244.9A CN104582234A (en) | 2013-10-12 | 2013-10-12 | Heat radiating device, fabricating method and flexible circuit board with heat radiating device |
| CN201310474244.9 | 2013-10-12 |
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| JP2015076619A true JP2015076619A (en) | 2015-04-20 |
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| Country | Link |
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| US (1) | US20150101785A1 (en) |
| JP (1) | JP2015076619A (en) |
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| CN105451507B (en) * | 2014-09-02 | 2018-02-02 | 鹏鼎控股(深圳)股份有限公司 | The preparation method of radiator structure and the radiator structure |
| CN107027264B (en) * | 2015-06-24 | 2019-04-16 | 碁鼎科技秦皇岛有限公司 | Cooling fin and preparation method thereof and electronic equipment |
| CN106856645B (en) * | 2015-12-09 | 2019-04-26 | 宏启胜精密电子(秦皇岛)有限公司 | Radiator structure and preparation method thereof |
| CN107360695B (en) * | 2016-05-09 | 2019-07-23 | 鹏鼎控股(深圳)股份有限公司 | Radiator structure and preparation method thereof |
| CN107846810A (en) * | 2016-09-18 | 2018-03-27 | 鹏鼎控股(深圳)股份有限公司 | Radiator structure and preparation method thereof and electronic equipment |
| CN109219306B (en) * | 2017-06-30 | 2020-07-14 | 鹏鼎控股(深圳)股份有限公司 | Heat sink and method for manufacturing the same |
| CN109413929B (en) * | 2017-08-16 | 2020-11-24 | 鹏鼎控股(深圳)股份有限公司 | Heat sink and method for manufacturing the same |
| CN109413930A (en) * | 2017-08-18 | 2019-03-01 | 鹏鼎控股(深圳)股份有限公司 | The electronic device of temperature-uniforming plate and the application temperature-uniforming plate |
| CN116963582A (en) * | 2018-10-29 | 2023-10-27 | 联华电子股份有限公司 | Semiconductor element and manufacturing method thereof |
| TW202024553A (en) * | 2018-12-27 | 2020-07-01 | 圓剛科技股份有限公司 | Heat dissipation device |
| CN110548947B (en) * | 2019-08-21 | 2021-05-25 | 湖北三江航天险峰电子信息有限公司 | Welding method of cold plate assembly |
| CN113170569B (en) * | 2019-08-31 | 2022-06-24 | 庆鼎精密电子（淮安）有限公司 | Circuit board with heat dissipation structure and manufacturing method thereof |
| CN110739284B (en) * | 2019-09-24 | 2020-12-08 | 杭州臻镭微波技术有限公司 | Flexible circuit board radio frequency module with heat dissipation function and manufacturing method thereof |
| CN111343834A (en) * | 2020-01-17 | 2020-06-26 | 广东工业大学 | Electronic equipment heat dissipation micro-fluidic chip and preparation method thereof |
| EP4098086A4 (en) * | 2020-01-31 | 2024-03-06 | Ttm Technologies Inc. | Printed circuit board assemblies with engineered thermal paths and methods of manufacturing |
| US10777483B1 (en) * | 2020-02-28 | 2020-09-15 | Arieca Inc. | Method, apparatus, and assembly for thermally connecting layers |
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| US5697428A (en) * | 1993-08-24 | 1997-12-16 | Actronics Kabushiki Kaisha | Tunnel-plate type heat pipe |
| EP1289707A1 (en) * | 2000-05-24 | 2003-03-12 | Stephen F. Corbin | Variable melting point solders and brazes |
| US6830098B1 (en) * | 2002-06-14 | 2004-12-14 | Thermal Corp. | Heat pipe fin stack with extruded base |
| US7002247B2 (en) * | 2004-06-18 | 2006-02-21 | International Business Machines Corporation | Thermal interposer for thermal management of semiconductor devices |
| WO2007018288A1 (en) * | 2005-08-11 | 2007-02-15 | Senju Metal Industry Co., Ltd. | Lead free solder paste and application thereof |
| TWI294763B (en) * | 2005-11-25 | 2008-03-11 | Foxconn Tech Co Ltd | Heat dissipation device |
| US20130058042A1 (en) * | 2011-09-03 | 2013-03-07 | Todd Richard Salamon | Laminated heat sinks |
| TWM435646U (en) * | 2012-04-25 | 2012-08-11 | Chaun Choung Technology Corp | Heat dissipating device and heat transfer structure thereof |
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| TWI563906B (en) | 2016-12-21 |
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