CN211210027U - Integrated structure of radiator and circuit board - Google Patents
Integrated structure of radiator and circuit board Download PDFInfo
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- CN211210027U CN211210027U CN201922255171.XU CN201922255171U CN211210027U CN 211210027 U CN211210027 U CN 211210027U CN 201922255171 U CN201922255171 U CN 201922255171U CN 211210027 U CN211210027 U CN 211210027U
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- circuit board
- heat sink
- heat
- copper foil
- integrated structure
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Abstract
The utility model relates to a radiator and circuit board integration field especially relate to an integral structure of radiator and circuit board, include: a heat sink body, the heat sink body comprising: a heat dissipation plate, wherein a groove is arranged on the heat dissipation plate; the supporting and auxiliary heat dissipation part is fixed at the bottom of the heat dissipation plate; the heat conduction insulating film is arranged in the groove; the copper foil layer is laid on the surface of the heat-conducting insulating film, corrosion-resistant ink is attached to the surface of the copper foil layer, and a plurality of pairs of bonding pads and lead circuits are arranged in an image transfer mode and a chemical etching mode; and the ink layer is laid in the area outside the bonding pad. Has the advantages that: through the integrated structure formed by laminating the radiator body and the copper foil, the wiring space and the heat conductivity of the circuit board and the laminating precision of the circuit board and the radiator are improved, the processes of a product process are reduced, and the production efficiency of products is improved.
Description
Technical Field
The utility model relates to a radiator and circuit board integration field especially relate to an integral structure of radiator and circuit board.
Background
Along with the upgrading of electronic products, the volume of the products can be gradually reduced, meanwhile, the area of the circuit substrate can be reduced, and for power devices radiating through circuit boards, the radiating requirements on the circuit boards are higher and higher.
The existing combination of the metal substrate and the radiator has the following defects: 1. the base plate and the radiator are fixed by screw holes, auxiliary positioning holes and the like, and the limited space of the circuit board is wasted. 2. The heat of the circuit board is conducted to the radiator through the heat conducting medium, and the heat conduction efficiency is low. 3. The product process has multiple working procedures.
Disclosure of Invention
In view of the above-mentioned shortcomings of the prior art, the present invention provides a heat sink integrated with a circuit board to replace the original combination of a substrate and a heat sink, so as to improve the performance and simplify the process.
The specific technical scheme is as follows:
a heat sink and wiring board integrated structure, wherein the integrated structure comprises:
a heat sink body, the heat sink body comprising:
the heat dissipation plate is provided with a groove;
the supporting and auxiliary heat dissipation plate heat dissipation part is fixed at the bottom of the heat dissipation plate;
the heat conduction insulating film is arranged in the groove;
the copper foil layer is laid on the surface of the heat-conducting insulating film, corrosion-resistant ink is attached to the surface of the copper foil layer, and a plurality of pairs of bonding pads and lead circuits are arranged in an image transfer mode and a chemical etching mode;
and the solder resist ink layer is laid in the area outside the welding hole.
Preferably, the supporting and auxiliary heat dissipation plate heat dissipation component comprises a plurality of supporting plates, and every two supporting plates are arranged in parallel and vertically fixed at the bottom of the heat dissipation plate.
Preferably, the distance between each two of the support plates is the same.
Preferably, the size of the heat-conducting insulating film is matched with the size of the copper foil layer and the size of the groove respectively.
Preferably, the sum of the thickness of the heat conductive insulating film and the thickness of the copper foil layer is the same as the depth of the groove.
Preferably, the pad has a square or circular shape.
Has the advantages that: through the integrated structure formed by laminating the radiator body and the copper foil, the wiring space and the heat conductivity of the circuit board and the laminating precision of the circuit board and the radiator are improved, the processes of a product process are reduced, and the production efficiency of products is improved.
Drawings
Fig. 1 is a schematic view of an integrated structure of a heat sink and a circuit board according to the present invention;
fig. 2 is a schematic structural diagram of a heat sink of the integrated structure of the heat sink and the circuit board of the present invention;
fig. 3 is a schematic structural view of a heat conductive insulating film of an integrated structure of a heat sink and a circuit board according to the present invention;
fig. 4 is a schematic structural diagram of a copper foil layer of an integrated structure of a heat sink and a circuit board according to the present invention;
fig. 5 is a schematic structural view of the integrated structure of the heat sink and the circuit board of the present invention before the heat sink, the heat conductive insulating film and the copper foil layer are laminated;
fig. 6 is a schematic structural view of the heat sink, the heat conductive insulating film and the copper foil layer of the integrated structure of the heat sink and the circuit board of the present invention, after being pressed together, the surface of which is attached with the corrosion-resistant ink;
fig. 7 is a schematic structural diagram of a wire circuit of an integrated structure of a heat sink and a circuit board according to the present invention;
fig. 8 is a schematic structural diagram of a solder resist ink layer of an integrated structure of a heat sink and a circuit board according to the present invention;
a radiator body 1; a heat dissipation plate 11; a groove 12; a support and auxiliary heat sink heat dissipation member 13; a support plate 131; a heat conductive insulating film 2; a copper foil layer 3; a pad 31; a wire line 32; a solder resist ink layer 4; and a resist ink 5.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without creative efforts belong to the protection scope of the present invention.
It should be noted that, in the present invention, the embodiments and features of the embodiments may be combined with each other without conflict.
The present invention will be further described with reference to the accompanying drawings and specific embodiments, but the present invention is not limited thereto.
An integrated structure of a heat sink and a circuit board includes:
a heat sink body 1, the heat sink body 1 comprising:
a heat dissipation plate 11, wherein a groove 12 is arranged on the heat dissipation plate 11;
a supporting and auxiliary heat sink heat dissipating member 13 fixed to the bottom of the heat sink 1;
the heat-conducting insulating film 2 is arranged in the groove 12;
a copper foil layer 3, wherein the copper foil layer 3 is laid on the surface of the heat-conducting insulating film 2, anti-corrosion ink 5 is attached to the surface of the copper foil layer 3, and a plurality of pairs of pads 31 and lead lines 32 are arranged in an image transfer mode and a chemical etching mode;
and the solder resist ink layer 4 is paved on the area except the bonding pad 31.
Specifically, in the present technical solution, as shown in fig. 1 to 8, firstly, when the heat sink body 1 is manufactured, an area having a shape required by the circuit board is formed on the heat sink body 1, secondly, the heat sink body 1, the heat conductive insulating film 2 and the copper foil layer 3 are sequentially combined in the order, and after the combination, the three are combined to form an integrated structure; thirdly, attaching a corrosion-resistant ink layer 5 to the surface of the copper foil layer 3 which is subjected to the previous step, and manufacturing a lead circuit by matching an image transfer method with a chemical etching mode; finally, the solder resist ink 4 is printed at the positions where soldering is not required, and surface treatment is performed again. This is to avoid the copper surface of the bonding pad 31 from being exposed to air and oxidized to affect the bonding effect, and to improve the bonding quality.
In a preferred embodiment, the supporting and auxiliary heat sink heat dissipating part 13 includes a plurality of supporting plates 131, and each two supporting plates 131 are disposed in parallel and vertically fixed to the bottom of the heat sink 11.
Specifically, in the present embodiment, as shown in fig. 1, 2, 5, 6, 7 and 8, the supporting and auxiliary heat dissipation plate 13 includes a plurality of supporting plates 131, and each two supporting plates 131 are disposed in parallel and vertically fixed to the bottom of the heat dissipation plate 11, so that the stability of the supporting and auxiliary heat dissipation plate 13 is improved.
In a preferred embodiment, the distance between each two support plates 131 is the same.
Specifically, in the present embodiment, as shown in fig. 1, 2, 5, 6, 7 and 8, the distance between every two support plates 131 is the same, which improves the balance of the support and auxiliary heat sink heat dissipation members 13.
In a preferred embodiment, the size of the thermal conductive insulation film 2 is matched with the size of the copper foil layer 3 and the size of the groove 12.
Specifically, in the present embodiment, as shown in fig. 3, 4, 6, 7 and 8, the size of the thermal conductive insulation film 2 is matched with the size of the copper foil layer 3 and the size of the groove 12, respectively, so as to beautify the structure.
In a preferred embodiment, the sum of the thickness of the thermally conductive insulating film 2 and the thickness of the copper foil layer 3 is the same as the depth of the groove 12.
Specifically, in the present embodiment, as shown in fig. 5, the sum of the thickness of the heat conductive insulating film 2 and the thickness of the copper foil layer 3 is the same as the depth of the groove 12, so that the heat conductive insulating film 2 and the copper foil layer 3 fill the groove 12 to form a plane.
In a preferred embodiment, the pad 31 is square or circular in shape.
Has the advantages that: through the integrated structure formed by laminating the radiator body and the copper foil, the wiring space and the heat conductivity of the circuit board and the laminating precision of the circuit board and the radiator are improved, the processes of a product process are reduced, and the production efficiency of products is improved.
The above description is only an example of the preferred embodiment of the present invention, and not intended to limit the scope of the present invention, and those skilled in the art should be able to realize the equivalent alternatives and obvious variations of the present invention.
Claims (6)
1. The integrated structure of the radiator and the circuit board is characterized by comprising:
a heat sink body, the heat sink body comprising:
the heat dissipation plate is provided with a groove;
the supporting and auxiliary heat dissipation plate heat dissipation part is fixed at the bottom of the heat dissipation plate;
the heat conduction insulating film is arranged in the groove;
the copper foil layer is laid on the surface of the heat-conducting insulating film, anti-corrosion ink is attached to the surface of the copper foil layer, a chemical etching mode is matched in an image transfer mode, and a plurality of pairs of bonding pads and wire circuits are arranged on the surface of the copper foil layer;
and the ink layer is laid in the area outside the bonding pad.
2. The integrated structure of heat sink and circuit board as claimed in claim 1, wherein said supporting and auxiliary heat sink member comprises a plurality of supporting plates, each two of said supporting plates are disposed in parallel and vertically fixed to the bottom of said heat sink.
3. The integrated structure of heat sink and circuit board as claimed in claim 2, wherein the distance between each two supporting plates is the same.
4. The integrated structure of a heat sink and a circuit board of claim 1, wherein the size of the thermal conductive insulating film is matched with the size of the copper foil layer and the size of the groove.
5. The integrated structure of a heat sink and a circuit board of claim 1, wherein the sum of the thickness of the thermal conductive insulating film and the thickness of the copper foil layer is the same as the depth of the groove.
6. The integrated structure of a heat sink and a circuit board of claim 1, wherein the shape of the bonding pad is square or circular.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922255171.XU CN211210027U (en) | 2019-12-16 | 2019-12-16 | Integrated structure of radiator and circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922255171.XU CN211210027U (en) | 2019-12-16 | 2019-12-16 | Integrated structure of radiator and circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211210027U true CN211210027U (en) | 2020-08-07 |
Family
ID=71886104
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922255171.XU Active CN211210027U (en) | 2019-12-16 | 2019-12-16 | Integrated structure of radiator and circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211210027U (en) |
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2019
- 2019-12-16 CN CN201922255171.XU patent/CN211210027U/en active Active
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