CN108601209B - High-heat-conductivity high-insulation soft and hard combined packaging substrate and preparation method thereof - Google Patents
High-heat-conductivity high-insulation soft and hard combined packaging substrate and preparation method thereof Download PDFInfo
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- CN108601209B CN108601209B CN201810675806.9A CN201810675806A CN108601209B CN 108601209 B CN108601209 B CN 108601209B CN 201810675806 A CN201810675806 A CN 201810675806A CN 108601209 B CN108601209 B CN 108601209B
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- heat dissipation
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- copper
- soft board
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- 239000000758 substrate Substances 0.000 title claims abstract description 27
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 19
- 238000009413 insulation Methods 0.000 title claims abstract description 17
- 238000002360 preparation method Methods 0.000 title claims abstract description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 90
- 229910052802 copper Inorganic materials 0.000 claims abstract description 88
- 239000010949 copper Substances 0.000 claims abstract description 88
- 239000000919 ceramic Substances 0.000 claims abstract description 54
- 230000017525 heat dissipation Effects 0.000 claims abstract description 52
- 238000004519 manufacturing process Methods 0.000 claims abstract description 33
- 238000000034 method Methods 0.000 claims abstract description 19
- 238000000227 grinding Methods 0.000 claims abstract description 13
- 230000008569 process Effects 0.000 claims abstract description 13
- 238000003825 pressing Methods 0.000 claims abstract description 9
- 239000003292 glue Substances 0.000 claims abstract description 5
- 239000010410 layer Substances 0.000 claims description 47
- 238000005553 drilling Methods 0.000 claims description 12
- 238000009713 electroplating Methods 0.000 claims description 12
- 239000012790 adhesive layer Substances 0.000 claims description 7
- 238000011161 development Methods 0.000 claims description 5
- 238000005520 cutting process Methods 0.000 claims description 3
- 238000005530 etching Methods 0.000 claims description 3
- 238000004080 punching Methods 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 238000000151 deposition Methods 0.000 claims description 2
- 238000003698 laser cutting Methods 0.000 claims description 2
- 239000002184 metal Substances 0.000 abstract description 2
- 229910052751 metal Inorganic materials 0.000 abstract description 2
- 230000003014 reinforcing effect Effects 0.000 abstract description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 6
- 230000008901 benefit Effects 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000003466 welding Methods 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012536 packaging technology Methods 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
A high heat conduction high insulation soft and hard combination packaging substrate and a preparation method thereof, comprising the steps of: manufacturing a soft board; a glue layer is attached to the lower surface of the soft board, and a window is opened at a position corresponding to the heat dissipation copper column; attaching the ceramic plate to the lower surface of the soft plate; manufacturing a conductive copper column and a heat dissipation copper column on the soft board, wherein the heat dissipation copper column penetrates through a window of the soft board to be connected with the upper surface of the metal reinforcing plate; pressing an insulating layer on the soft board, and attaching a grinding base; grinding the insulating layer to expose the conductive copper column and the heat dissipation copper column, and removing the grinding base; and manufacturing a top layer circuit on the insulating layer by adopting an addition method process. The manufacturing process is simple, the soft and hard combined plate formed by combining the soft plate and the ceramic plate is used as the substrate, the product is stable in size, high in heat conduction and insulation, low in cost, and the manufactured soft and hard combined packaging substrate is stable in size, simple in heat conduction path and good in heat dissipation performance.
Description
Technical Field
The invention relates to the technical field of printed circuit board manufacturing, in particular to a high-heat-conductivity high-insulation soft and hard combined packaging substrate and a preparation method thereof.
Background
A package Substrate is commonly used in the field of semiconductor packaging technology, and the package Substrate is a submount (SUB for short), i.e. a term in a printed wiring board. The substrate can provide the effects of electric connection, protection, support, heat dissipation, assembly and the like for the chip so as to realize the purposes of multi-pin, reduction of the volume of a packaged product, improvement of electric performance and heat dissipation, and ultrahigh density or multi-chip modularization. At present, the packaging substrate is being developed toward higher density.
Packaging technology is critical to functioning as a power semiconductor device. Good electrical isolation and thermal management, minimal parasitic capacitance, and minimal distributed inductance are all achieved by careful design of the package structure. The power consumption generated when the power semiconductor device operates is converted into heat energy, so that the temperature of the device is increased. The power consumption of the semiconductor device exceeds a critical value, which may cause thermal instability and thermal breakdown. At the same time, many parameters of the device are adversely affected by the temperature rise, so it is important to limit the die temperature of the power semiconductor device to a certain value. This is achieved by encapsulation.
At present, the package substrate with high heat conductivity and high insulation is generally divided into three types: 1. the through hole is communicated with the FPC board and the ceramic board, and the heat conduction path of the structure is as follows: ceramic plate- & gt tin foil- & gt IMC layer- & gt tin plus soft board hole copper- & gt conductive adhesive- & gt steel sheet, the circuit board has the advantages of simpler manufacturing process and the defects that: the ceramic substrate must be matched, the heat conduction path is complex, the heat conduction area is small, heat dissipation is general, and tin in the through hole cannot be fully filled. 2. The blind hole is communicated with the FPC board and the ceramic board, and the heat conduction path of the structure is as follows: ceramic plate- & gt tin foil- & gt IMC layer- & gt tin plus soft board hole copper- & gt conductive adhesive- & gt steel sheet, the advantages are that: the circuit board manufacturing process is simpler, does not have the risk of soldering tin cavity, and the shortcoming lies in: the ceramic substrate has the advantages of complex heat conduction path, small heat conduction area, poor heat dissipation and laser drilling process. 3. The heat conduction path of the structure is as follows: ceramic plate bonding pad- & gt copper column- & gt pure copper reinforcing plate, the advantage is: good heat dissipation, the heat dissipation medium is pure copper, need not to use ceramic substrate, and total board thickness is adjustable, and the shortcoming lies in: the cost increases.
Through investigation, the Chinese patent with the prior patent number of CN201710119406.5 is a high heat conduction packaging substrate, which consists of ceramics with conductive layers coated on two surfaces and a micro heat pipe, and is characterized in that: the conductive layer is provided with a pattern, and one surface of the pattern is used for packaging a power electronic device, a power microwave device, a logic control circuit, a detection circuit, a lead wire and the like; the other surface pattern is connected with the micro heat pipe. The packaging substrate adopts a micro heat pipe and a high heat conduction ceramic circuit board to achieve metallurgical bonding through means of vacuum welding, vacuum friction welding, active metal brazing, nano silver welding and the like, reduces thermal resistance, and achieves high-efficiency heat dissipation, but the preparation process is complex and the cost is high.
Disclosure of Invention
The first technical problem to be solved by the invention is to provide the high-heat-conductivity high-insulation soft and hard combined packaging substrate which is simple in structure, good in heat dissipation performance and low in cost aiming at the current state of the art.
The second technical problem to be solved by the invention is to provide a preparation method of the high-heat-conductivity high-insulation soft and hard combined packaging substrate with simple process, good heat dissipation performance and low cost aiming at the current state of the art.
The technical scheme adopted by the invention for solving the first technical problem is as follows: a high heat conduction high insulation soft and hard combination package substrate is characterized in that: the high-heat-conductivity high-insulation soft and hard combined packaging substrate comprises a ceramic plate, a soft plate, an insulating layer and a top layer circuit, wherein the ceramic plate, the soft plate, the insulating layer and the top layer circuit are sequentially arranged from bottom to top, the top layer circuit is added on the upper surface of the insulating layer, the ceramic plate is attached to the lower surface of the soft plate, the insulating layer is pressed on the upper surface of the soft plate, a conductive copper column and a heat dissipation copper column which are communicated with the top layer circuit are added on the soft plate, and the lower end of the heat dissipation copper column penetrates through the soft plate and is connected with the upper surface of the ceramic plate.
Preferably, the ceramic plate is a pure ceramic plate or a single-sided copper-clad ceramic plate or a double-sided copper-clad ceramic plate, and the lower surface of the soft plate is adhered with a glue layer adhered to the copper-clad surface of the ceramic plate.
Finally, the soft board is provided with a window for the heat dissipation copper column to pass through, the diameter of the heat dissipation copper column is 50 mu m-3.0 mm, and the diameter of the conduction copper column is 0.05mm at the minimum.
The invention solves the second technical problem by adopting the technical proposal that: the preparation method of the high-heat-conductivity high-insulation soft and hard combined packaging substrate is characterized by comprising the following steps of:
1) Manufacturing a soft board;
2) A glue layer is attached to the lower surface of the soft board, and a window is formed in the position, corresponding to the heat dissipation copper column, on the soft board;
3) The ceramic plate is attached to the lower surface of the soft plate through an adhesive layer;
4) Manufacturing a conductive copper column and a heat dissipation copper column on the soft board, and electroplating the conductive copper column and the heat dissipation copper column, wherein the heat dissipation copper column penetrates through a window of the soft board to be connected with the upper surface of the ceramic board;
5) Pressing an insulating layer on the soft board, and attaching a grinding base;
6) Grinding the upper surface of the insulating layer to expose the conductive copper column and the heat dissipation copper column;
7) Removing the grinding base;
8) Depositing a layer of conductive seed copper on the insulating layer, and manufacturing a top layer circuit by adopting an addition method process;
9) And finally, performing solder mask exposure on the top layer circuit.
Further, the specific process of manufacturing the soft board in the step 1) is as follows: firstly, cutting a soft board, conducting drilling and electroplating, adopting mechanical drilling or laser drilling, then etching a soft board circuit, and manufacturing soft board circuit seed copper and a film.
Preferably, the ceramic plate in the step 3) is a pure ceramic plate or a single-sided copper-clad ceramic plate or a double-sided copper-clad ceramic plate.
Further, the windowing in the step 2) is performed by laser cutting/die punching.
Preferably, the diameter of the conductive copper pillar in the step 4) is 0.05mm at the minimum, and the diameter of the heat dissipation copper pillar is 50 μm-3.0 mm.
Further, the manufacturing process flow of the conductive copper column and the heat dissipation copper column in the step 4) is as follows: seed copper, film pressing, exposure, development, electroplating to conduct copper columns and heat dissipation copper columns, and seed copper removal.
Finally, the process flow for manufacturing the top layer circuit by the addition process in the step 6) is as follows: seed copper, film pressing, exposure, development, electroplating circuit and seed copper removal.
Compared with the prior art, the invention has the advantages that: the soft and hard combined plate formed by combining the soft plate and the ceramic plate is used as a base plate, so that the product is stable in size, high in heat conduction and high in insulation; the conductive copper column of the addition plating replaces the mechanical drilling and laser drilling conductive mode of the original hard board, so that finer circuits can be manufactured, a lot of wiring space is saved, the density of wiring is greatly improved, wiring requirements can be met for products with the same pixel even if the size of the products is not increased, and the wiring is not limited by the manufacturing process; in addition, the addition of the electroplated heat dissipation copper column has simple heat conduction path and improves the heat dissipation effect; the insulating layer is thick, so that high insulation is realized. The manufacturing process is simple, the cost is low, and the manufactured high-heat-conductivity high-insulation soft and hard combined packaging substrate is stable in size, simple in heat conduction path and good in heat dissipation performance.
Drawings
Fig. 1 is a schematic structural view of a flexible board according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a structure of a glue layer attached to a flexible board;
FIG. 3 is a schematic view of a window formed in a flexible board;
fig. 4 is a schematic structural view of the flexible board after the ceramic board is attached;
FIG. 5 is a schematic diagram of the structure of the addition of heat dissipating copper pillars and conductive copper pillars on a flexible board;
FIG. 6 is a schematic diagram of a structure of a soft board after an insulating layer is laminated and a grinding base is attached;
FIG. 7 is a schematic view of the structure of the insulating layer after polishing and removing the polishing pad;
fig. 8 is a schematic diagram of a structure in which a top layer wiring is added to an insulating layer.
Detailed Description
The invention is described in further detail below with reference to the embodiments of the drawings.
As shown in fig. 1 to 8, a high heat conduction soft and hard combined packaging substrate comprises a ceramic plate 2, a soft board 1, an insulating layer 3 and a top layer circuit 6 which are sequentially arranged from bottom to top, wherein the ceramic plate 2 is attached to the lower surface of the soft board 1, the insulating layer 3 is pressed on the upper surface of the soft board 1, a conductive copper column 4 and a heat dissipation copper column 5 which are communicated with the top layer circuit 4 are added on the soft board 1, and the lower end of the heat dissipation copper column 5 passes through the soft board 1 and is connected with the upper surface of the ceramic plate 2; the ceramic plate 2 may be a pure ceramic plate or a single-sided copper-clad ceramic plate or a double-sided copper-clad ceramic plate, the ceramic plate 2 in this embodiment is a double-sided copper-clad ceramic plate, the lower surface of the soft board 1 is attached with an adhesive layer 7 attached to the ceramic plate 2, and the adhesive layer 7 may be insulating or non-insulating; the soft board 1 is provided with a window 11 for the heat dissipation copper column 5 to pass through, the diameter of the heat dissipation copper column 5 is 50 mu m-3.0 mm, the minimum diameter of the conduction copper column 4 is 0.05mm, and finer circuits can be manufactured, so that the circuits of the soft board 1 are connected with the top layer circuit 6 through the conduction copper column 4; the diameter of the heat dissipation copper column 5 is thicker, generally 50-3.0 mm, and the heat conduction area is large, so that heat dissipation is facilitated;
the preparation method of the high-heat-conductivity high-insulation soft and hard combined packaging substrate comprises the following specific steps:
1) The soft board 1 (as shown in fig. 1) is manufactured by the following specific processes: firstly, cutting a soft board, drilling holes and conducting electroplating, mechanically drilling holes or laser drilling holes, then etching a soft board circuit, and manufacturing soft board circuit seed copper and a pressed film;
2) An adhesive layer 7 (as shown in figure 2) is attached to the lower surface of the soft board 1, and the adhesive layer 7 can be insulated and uninsulated;
3) Windowing 11 is carried out on the soft board 1 at a position corresponding to the heat dissipation copper column 5 by laser, die punching or milling machine (as shown in figure 3);
4) The ceramic plate 2 is attached to the lower surface of the flexible board 1 through an adhesive layer 7 (as shown in fig. 4), the ceramic plate 2 can be a pure ceramic plate, a single-sided copper-clad ceramic plate or a double-sided copper-clad ceramic plate, and the ceramic plate 2 in the embodiment is a double-sided copper-clad ceramic plate;
5) Then, manufacturing a conductive copper column 4 and a heat dissipation copper column 5 (as shown in fig. 5) on the flexible board 1, and electroplating the conductive copper column 4 and the heat dissipation copper column 5, wherein the heat dissipation copper column 5 passes through a window 11 of the flexible board 1 to be connected with the upper surface of the ceramic board 1; the manufacturing process flow of the conductive copper column 4 and the heat dissipation copper column 5 comprises the following steps: seed copper, film pressing, exposure, development, electroplating to conduct copper column 5 and heat dissipation copper column 6, and seed copper removal;
6) Pressing an insulating layer 3 (shown in fig. 6) on the soft board 1, and attaching a grinding base 8;
7) Grinding the upper surface of the insulating layer 3 to expose the conductive copper pillars 4 and the heat dissipation copper pillars 5, and removing the grinding base 8 (see fig. 7);
8) A layer of conductive seed copper is deposited on the insulating layer 3, and a top layer circuit 6 (as shown in fig. 8) is manufactured by adopting an addition method process, wherein the process flow for manufacturing the top layer circuit 6 by adopting the addition method process is as follows: seed copper-film pressing-exposure-development-electroplating line-seed copper removal; connecting the conductive copper column 4 with the heat dissipation copper column 5 and the top layer circuit 6;
9) Finally, solder resist lithography exposure is performed on the top layer circuit 6.
The diameter of the conducting copper column 4 can be 0.05mm at the minimum, so that finer circuits can be manufactured, a lot of wiring space is saved, the diameter of the radiating copper column 5 is thicker, usually 50-3.0 mm, the conducting top layer circuit 6 passes through the flexible board 1, and the upper surfaces of the ceramic plates 2 are connected, so that the heat conduction path is simple, the heat conduction area is large, and more heat dissipation is facilitated.
Compared with the existing packaging substrate, the high-heat-conductivity high-insulation soft and hard combined packaging substrate is simple in structure, convenient to manufacture, low in cost, simple in heat conduction path, large in heat conduction area and better in heat dissipation performance.
The foregoing is merely a preferred embodiment of the present invention, and it should be noted that it will be apparent to those skilled in the art that several modifications and variations can be made without departing from the technical principle of the present invention, and these modifications and variations should also be regarded as the scope of the invention.
Claims (7)
1. The preparation method of the high-heat-conductivity high-insulation soft and hard combined packaging substrate is characterized by comprising the following steps of:
1) Manufacturing a soft board;
2) A glue layer is attached to the lower surface of the soft board, and a window is formed in the position, corresponding to the heat dissipation copper column, on the soft board;
3) The ceramic plate is attached to the lower surface of the soft plate through an adhesive layer;
4) Manufacturing a conductive copper column and a heat dissipation copper column on the soft board, and electroplating the conductive copper column and the heat dissipation copper column, wherein the heat dissipation copper column penetrates through a window of the soft board to be connected with the upper surface of the ceramic board;
5) Pressing an insulating layer on the soft board, and attaching a grinding base;
6) Grinding the upper surface of the insulating layer to expose the conductive copper column and the heat dissipation copper column;
7) Removing the grinding base;
8) Depositing a layer of conductive seed copper on the insulating layer, and manufacturing a top layer circuit by adopting an addition method process;
9) And finally, performing solder mask exposure on the top layer circuit.
2. The method of manufacturing according to claim 1, characterized in that: the soft board manufactured in the step 1) is specifically as follows: firstly, cutting a soft board, conducting drilling and electroplating, adopting mechanical drilling or laser drilling, then etching a soft board circuit, and manufacturing soft board circuit seed copper and a film.
3. The method of manufacturing according to claim 1, characterized in that: the ceramic plate in the step 3) is a pure ceramic plate or a single-sided copper-clad ceramic plate or a double-sided copper-clad ceramic plate.
4. The method of manufacturing according to claim 1, characterized in that: and (3) windowing in the step 2) by laser cutting or die punching.
5. The method of manufacturing according to claim 1, characterized in that: the diameter of the conducting copper column in the step 4) is 0.05mm at minimum, and the diameter of the radiating copper column is 50-3.0 mm.
6. The method of manufacturing according to claim 1, characterized in that: the manufacturing process flow of the conductive copper column and the heat dissipation copper column in the step 4) is as follows: seed copper, film pressing, exposure, development, electroplating to conduct copper columns and heat dissipation copper columns, and seed copper removal.
7. The method of manufacturing according to claim 1, characterized in that: the process flow for manufacturing the top layer circuit by the addition method in the step 8) is as follows: seed copper, film pressing, exposure, development, electroplating circuit and seed copper removal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810675806.9A CN108601209B (en) | 2018-06-27 | 2018-06-27 | High-heat-conductivity high-insulation soft and hard combined packaging substrate and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810675806.9A CN108601209B (en) | 2018-06-27 | 2018-06-27 | High-heat-conductivity high-insulation soft and hard combined packaging substrate and preparation method thereof |
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| Publication Number | Publication Date |
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| CN108601209A CN108601209A (en) | 2018-09-28 |
| CN108601209B true CN108601209B (en) | 2024-03-22 |
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| CN109699120A (en) * | 2019-02-22 | 2019-04-30 | 业成科技（成都）有限公司 | Has the circuit board of high-efficiency heat conduction structure |
| CN110708861B (en) * | 2019-09-25 | 2022-03-01 | 宁波华远电子科技有限公司 | Preparation method of circuit board for CCM module |
| CN110677979B (en) * | 2019-09-25 | 2022-01-18 | 宁波华远电子科技有限公司 | Preparation method of circuit board for CCM module |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103369820A (en) * | 2013-07-25 | 2013-10-23 | 东莞生益电子有限公司 | PCB (printed circuit board) with high-density interconnection design and heat dissipation structure and manufacturing method thereof |
| CN106961808A (en) * | 2017-02-20 | 2017-07-18 | 宁波华远电子科技有限公司 | The preparation method of sunk type high density interconnecting board |
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| CN103400771B (en) * | 2013-08-06 | 2016-06-29 | 江阴芯智联电子科技有限公司 | First sealing chip upside-down mounting three-dimensional systematic metal circuit board structure and process after erosion |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103369820A (en) * | 2013-07-25 | 2013-10-23 | 东莞生益电子有限公司 | PCB (printed circuit board) with high-density interconnection design and heat dissipation structure and manufacturing method thereof |
| CN106961808A (en) * | 2017-02-20 | 2017-07-18 | 宁波华远电子科技有限公司 | The preparation method of sunk type high density interconnecting board |
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