CN200941707Y

CN200941707Y - High heat conductive metallic substrate

Info

Publication number: CN200941707Y
Application number: CN 200620116276
Authority: CN
Inventors: 陈介修
Original assignee: Leison Tech Co Ltd
Current assignee: Leison Tech Co Ltd
Priority date: 2006-06-07
Filing date: 2006-06-07
Publication date: 2007-08-29
Anticipated expiration: 2016-06-07

Abstract

The utility model provides a high heat conduction metal base plate which mainly comprises a metal plate and an oxidation insulation film base plate (contain alumina powder and colloid). Especially the utility model adopts the metal plate that has low heat impedance and higher heat conduction coefficient to increase the radiation area of the metal plate, and takes advantage of the mixture of the sticker and the high heat conduction insulation paste to act as the media, thereby, quickly conducting the heat energy to the large metal plate; so, the application of the type of direct combination or side conduction all can make the electrical assembly arranged on the metal base plate achieve the effect of quick radiation.

Description

High-thermal conductive metal base plate

Technical field

The utility model relates to the heat abstractor of circuit board, particularly a kind of high-thermal conductive metal base plate.

Background technology

Along with electronic product develops to light, thin, little, high density, multifunction, component on circuit board packaging density and integrated level are more and more higher, power consumption is increasing, thermal diffusivity to circuit board (PCB substrate) requires more and more urgent, if the thermal diffusivity of circuit board is bad or very poor, gently can cause on the printed circuit board components and parts overheated, heavy then make the reliability decrease of whole system or device.

Please join Fig. 1, shown in Figure 2, at present common on the radiating treatment practice of circuit board 1, mainly adopt the method that on a glass mat 10 1 surfaces, is combined with one or more metallic plate 11, and circuit, electronic building brick arranged be assemblied in metallic plate 11 surfaces; So when practice, can rely on large-area metallic plate to reach the acceleration radiating effect by the heat that electronic building brick produced.

Yet this kind strengthened the circuit board of thermolysis, though more early stage circuit board has preferable radiating effect, but its structure of careful close examination is implied with incomplete place:

1. described circuit board is when heat radiation, the excellent in heat dissipation effect of directly touching with the electronic building brick of metal substrate is only arranged, remainder then can't permeate or conduct to metal substrate fully, cause being restricted on radiating effect and the efficient, when especially being used in the board structure of circuit of multiple field, this situation will be more obvious, and radiating effect can be poorer.

2. on the metal substrate on the positive and negative two sides of described circuit board the electronic building brick that is provided with respectively, because of wherein a side and electronic building brick near and conduct well, radiating effect is preferable naturally; Otherwise opposite side is because of can't effectively conducting, and its radiating effect is had a greatly reduced quality naturally.

3. therefore the circuit board of described kind of kenel can't implement processing such as boring, plating for fear of because of the contact between conductor produces short circuit phenomenon, so the structure kenel of single sided board is only arranged at present.

Conclude and above-mentionedly can not get completely,, the market demand of high-thermal conductive metal base plate is heated up along with the fast development of electronic technology, also more and more higher to its specification requirement simultaneously, and by above explanation as can be known, the existing practice obviously can't have been closed it and asked, and improved necessity in addition certainly will be arranged.In view of this utility model designer is the active research design, obtains an adequate solution scheme eventually, and the phase can provide industry extensively to use.

Summary of the invention

Main purpose of the present utility model is to provide a kind of high-thermal conductive metal base plate, it comprises by metallic plate, oxidation insulating film substrate and being formed, and use the pattern of directly combination or side conducting, make the electronic building brick that is assemblied on the described metal substrate all can reach the effectiveness of dispelling the heat fast.

For achieving the above object, the technical solution adopted in the utility model is:

A kind of high-thermal conductive metal base plate, it is characterized in that: it is provided with a metallic plate, the upper and lower surface of described metallic plate is laid respectively, etching has default electronic circuit, by the adhesive agent that is mixed with high heat conductive insulating glue is cemented the oxidation insulating film substrate arranged on the described metallic plate, electroplate the copper foil layer that forms and have in addition on the oxidation insulating film substrate, be drilled with perforation again on described metallic plate, its inner hole wall has been arranged high heat conductive insulating glue again.

Adopt the advantage that the utlity model has of technique scheme to be: it is faster to dispel the heat, and radiating effect is better.

Description of drawings

Fig. 1 is existing radiator structure outward appearance and the end view that is applied on the circuit board;

Fig. 2 is another existing radiator structure outward appearance and end view that is applied on the circuit board;

Fig. 3 is the appearance assumption diagram of the utility model one preferred embodiment;

Fig. 4 is the cross-sectional schematic of the utility model one preferred embodiment;

Fig. 5 is the appearance assumption diagram of another preferred embodiment of the utility model;

Fig. 6 is the cross-sectional schematic of another preferred embodiment of the utility model.

Description of reference numerals: 1 circuit board; 10 glass mats; 11 metallic plates; 2 metallic plates; 20 electronic circuits; 21 perforation; 22 high heat conductive insulating glue; 3 oxidation insulating film substrates; 4 copper foil layers; 5 metal materials.

Embodiment

Your juror can further more further understanding and understanding be arranged for ease of, to enumerate a preferred embodiment now and cooperate that graphic details are as follows structure of the present utility model, use and feature thereof:

The utility model design also provides a high-thermal conductive metal base plate, please cooperate and consult Fig. 3～shown in Figure 4, in first embodiment, adopt direct conduction mode, and provide a metallic plate 2 and be main body, it can adopt aluminium, copper constant resistance temperature is little, heat conduction is fast metal material, and determines according to designer's actual needs; Upper and lower surface at described metallic plate 2 is laid respectively, etching has default electronic circuit 20 (drawing does not show), and utilize adhesive agent to be mixed with that high heat conductive insulating glue is cemented again an oxidation insulating film substrate 3, and be formed with the copper foil layer 4 that electroplate to form on the oxidation insulating film substrate 3 in addition, so utilize the pressing mode with obtain more driving fit in conjunction with effect; On bond plate 2, be drilled with again at last the perforation 21, its inner hole wall has been arranged high heat conductive insulating glue 22 again, with the insulation with heat conduction effectiveness; So when the electronic building brick group is located on the metallic plate 2, see through copper foil layer 4 path as its signal conducting is provided, and unlikely the contacting of the insulating effect that relies on high heat conductive insulating glue 22 produces the situation of short circuit, and the metallic plate 2 of the big area of dissipation of high heat utilization tool that described electronic building brick produced can be done quick conduction, and obtain more excellent, excellent radiating effect as heat conducting medium.

Above-mentioned perforation 21 provides the electronic building brick group and establishes, and the high heat conductive insulating glue 22 arranged of its inner hole wall, more can avoid 2 of electronic building brick and metallic plates to produce short circuit condition because of contacting, and provide in the electronic building brick heat radiation process as heat conducting medium; In addition, combining of metallic plate 2 and oxidation insulating film substrate 3, also be to utilize the adhesive agent that is mixed with high heat conductive insulating glue to reach, with the insulation that becomes both combinations smoothly and cemented media.The high heat conductive insulating glue mode of arranging in the present embodiment includes printing, melts and fill out etc. again, and can decide in its sole discretion according to designer's needs.

Please continue and consult Fig. 5～shown in Figure 6, then be to adopt side conducting kenel in a second embodiment, it provides a metallic plate 2 equally, etching has electronic circuit on described metallic plate 2, and rely on adhesive agent to be mixed with high heat conductive insulating glue 22 and to be combined with oxidation insulating film substrate 3, so pressing becomes a complete metal substrate structure, and increase its area of dissipation, again for further reaching better radiating effect, the metal material 5 that is the ㄈ type especially at described metal substrate side with high heat conductive insulating gluing intrinsic, the heat energy that electronic building brick produced that is assembled on the metal substrate is provided in view of the above, can rely on high heat conductive insulating glue 22 as heat conducting medium, and heat energy promptly conducted to metallic plate 2, so just can reach the purpose of quick heat radiating, and obtain the real benefit that promotes radiating efficiency.

More than explanation is just illustrative for the utility model, and it is nonrestrictive, those of ordinary skills understand, under the situation of the spirit and scope that do not break away from following claim and limited, can make many modifications, change, or equivalence, but but all will fall within the claim restricted portion of the present utility model.

Claims

1. high-thermal conductive metal base plate, it is characterized in that: it is provided with a metallic plate, the upper and lower surface of described metallic plate is laid respectively, etching has default electronic circuit, by the adhesive agent that is mixed with high heat conductive insulating glue is cemented the oxidation insulating film substrate arranged on the described metallic plate, electroplate the copper foil layer that forms and have in addition on the oxidation insulating film substrate, be drilled with perforation again on described metallic plate, its inner hole wall is provided with high heat conductive insulating glue.

2. according to the described high-thermal conductive metal base plate of claim 1, it is characterized in that: the metal material that is the ㄈ type at described metal substrate side with high heat conductive insulating gluing solid.

3. according to the described high-thermal conductive metal base plate of claim 1, it is characterized in that: described metallic plate adopts aluminium, copper to become.