CN201207757Y - Printed circuit board - Google Patents
Printed circuit board Download PDFInfo
- Publication number
- CN201207757Y CN201207757Y CNU2008200481196U CN200820048119U CN201207757Y CN 201207757 Y CN201207757 Y CN 201207757Y CN U2008200481196 U CNU2008200481196 U CN U2008200481196U CN 200820048119 U CN200820048119 U CN 200820048119U CN 201207757 Y CN201207757 Y CN 201207757Y
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- China
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- metal substrate
- circuit board
- printed circuit
- conductive layer
- layer
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- Expired - Fee Related
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Abstract
The utility model discloses a printed circuit board, which comprises a base layer, an insulation layer and a conductive layer, and is characterized in that the base layer adopts metal substrate. The metal substrate, the insulation layer and the conductive layer are sequentially pressed together, the insulation layer is positioned between the metal substrate and the conductive layer. Because the base layer of the printed circuit board adopts metal substrate, and one side of metal substrate is pressed with one side of the conductive layer through the insulation layer, the other side of the metal substrate is a heat radiating surface; because the metal substrate itself has good thermal conductivity characteristics, the heat generated by electronic components power consumption can be radiated in time, thereby, ensuring a stable work of the electronic components. Therefore, the utility model of the printed circuit board has good heat radiating effect. In addition, the utility model of the printed circuit board also has a good electromagnetic shielding performance, the production is simple, and the production cost is also relatively low.
Description
Technical field
The utility model relates to a kind of printed circuit board (PCB), more particularly, relates to a kind of printed circuit board (PCB) of good heat dissipation effect.
Background technology
Existing printed circuit board (PCB) generally comprises basic unit, insulating barrier and conductive layer, the one side of basic unit is by the one side pressing of insulating barrier and conductive layer, insulating barrier is between basic unit and conductive layer after the pressing, wherein, basic unit generally adopts ceramic basic unit, insulating barrier generally adopts prepreg, and conductive layer generally adopts copper foil layer.
Because its basic unit of existing printed circuit board (PCB) generally adopts ceramic basic unit, the heat-conductive characteristic of this material is poor, electronic devices and components can not in time distribute because of the heat that power consumption produces, therefore, components and parts are easily because of the too high service behaviour instability that causes of self temperature, and components and parts sometimes even can be damaged.
Complicated day by day along with printed circuit board (PCB), large-scale circuit and high performance components constantly are applied on the printed circuit board (PCB), and the heat dissipation problem that solves printed circuit board (PCB) becomes more and more important.
Summary of the invention
The technical problems to be solved in the utility model provides a kind of printed circuit board (PCB) of good heat dissipation effect.
In order to solve the problems of the technologies described above, the technical solution adopted in the utility model is as follows:
A kind of printed circuit board (PCB) comprises basic unit, insulating barrier and conductive layer, it is characterized in that: above-mentioned basic unit adopts metal substrate, and metal substrate, insulating barrier and conductive layer press together successively, and insulating barrier is between metal substrate and conductive layer.
In order to prevent that further metal substrate from conducting electricity, the surface of described metal substrate is preferably formed as one deck oxidation insulating layer.Like this, the oxidation insulating layer on metal substrate one surface is by insulating barrier and conductive layer pressing, and insulating barrier is between basic unit and conductive layer after the pressing.
Described metal substrate preferably adopts aluminium sheet, aluminium alloy plate or copper coin.Because the good heat dissipation effect of aluminium sheet, aluminium alloy plate or copper coin, and the cost of raw material is low.
Described insulating barrier adopts prepreg.Prepreg solidifies automatically because of heating and pressurizing in pressing, thereby oxidation insulating layer and conductive layer on the metal substrate are combined; Wherein, prepreg plays effect bonding and insulation.
Described conductive layer adopts copper foil layer.Copper foil layer forms figure by etch, is used to connect components and parts.
The utility model beneficial effect against existing technologies is, because the basic unit of printed circuit board (PCB) adopts metal substrate, the one side of metal substrate is by the one side pressing of insulating barrier and conductive layer, the another side of metal substrate is as radiating surface, and metal substrate itself has the good characteristics of heat-conductive characteristic, so electronic devices and components just can in time distribute because of the heat that power consumption produces, thereby, guaranteed that components and parts can stably work.Therefore, printed circuit board radiating of the present utility model is effective.In addition, printed circuit board (PCB) of the present utility model also has good capability of electromagnetic shielding, and it is simple for production, production cost is also lower.
Below in conjunction with the drawings and specific embodiments the utility model is described further.
Description of drawings
Accompanying drawing is the structural representation of the utility model preferred embodiment.
Embodiment
As shown in drawings, the printed circuit board (PCB) in this preferred embodiment comprises basic unit, insulating barrier and conductive layer, and above-mentioned basic unit adopts metal substrate 1, and said metal substrates 1 can be aluminium sheet, aluminium alloy plate or copper coin; Above-mentioned insulating barrier adopts prepreg 2; Above-mentioned conductive layer adopts copper foil layer 3; The upper and lower surface of metal substrate 1 forms one deck oxidation insulating layer 11, and the oxidation insulating layer 11 of metal substrate 1 upper surface is by prepreg 2 and copper foil layer 3 pressings, and prepreg 2 is between metal substrate 1 and copper foil layer 3 after the pressing.
During making, make the upper and lower surface of metal substrate 1 form one deck oxidation insulating layer 11 earlier, again prepreg 2 is placed between the oxidation insulating layer 11 and copper foil layer 3 of metal substrate 1 upper surface, again with metal substrate 1, prepreg 2 and copper foil layer 3 pressings, prepreg 2 solidifies automatically because of heating and pressurizing in pressing, thereby the oxidation insulating layer 11 of metal substrate 1 upper surface is combined with copper foil layer 3, like this, the one side of metal substrate 1 is by the one side pressing of prepreg 2 with copper foil layer 3, the another side of metal substrate 1 is as radiating surface, and metal substrate 1 itself has the good characteristics of heat-conductive characteristic, so, electronic devices and components just can in time distribute because of the heat that power consumption produces, thereby, guaranteed that components and parts can stably work.
The above is preferred embodiment of the present utility model only, is not to be used for limiting practical range of the present utility model; Be all equivalents of being done according to claim scope of the present utility model, be claim scope of the present utility model and cover.
Claims (5)
1, a kind of printed circuit board (PCB) comprises basic unit, insulating barrier and conductive layer, it is characterized in that: above-mentioned basic unit adopts metal substrate, and metal substrate, insulating barrier and conductive layer press together successively, and insulating barrier is between metal substrate and conductive layer.
2, printed circuit board (PCB) as claimed in claim 1 is characterized in that: the surface of described metal substrate forms one deck oxidation insulating layer.
3, printed circuit board (PCB) as claimed in claim 1 or 2 is characterized in that: described metal substrate adopts aluminium sheet, aluminium alloy plate or copper coin.
4, printed circuit board (PCB) as claimed in claim 1 or 2 is characterized in that: described insulating barrier adopts prepreg.
5, printed circuit board (PCB) as claimed in claim 1 or 2 is characterized in that: described conductive layer adopts copper foil layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008200481196U CN201207757Y (en) | 2008-05-17 | 2008-05-17 | Printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008200481196U CN201207757Y (en) | 2008-05-17 | 2008-05-17 | Printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201207757Y true CN201207757Y (en) | 2009-03-11 |
Family
ID=40466810
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2008200481196U Expired - Fee Related CN201207757Y (en) | 2008-05-17 | 2008-05-17 | Printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201207757Y (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102223767A (en) * | 2011-06-01 | 2011-10-19 | 何忠亮 | Production process for high heat-conduction circuit board |
| CN102458051A (en) * | 2010-10-19 | 2012-05-16 | 台光电子材料股份有限公司 | Manufacture method of substrate and structure used for simplifying preparation technology |
| CN103491706A (en) * | 2013-10-09 | 2014-01-01 | 东莞生益电子有限公司 | Method for manufacturing high-thermal-conductivity printed circuit board and printed circuit board |
-
2008
- 2008-05-17 CN CNU2008200481196U patent/CN201207757Y/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102458051A (en) * | 2010-10-19 | 2012-05-16 | 台光电子材料股份有限公司 | Manufacture method of substrate and structure used for simplifying preparation technology |
| CN102458051B (en) * | 2010-10-19 | 2013-08-14 | 台光电子材料股份有限公司 | Manufacture method of substrate and structure used for simplifying preparation technology |
| CN102223767A (en) * | 2011-06-01 | 2011-10-19 | 何忠亮 | Production process for high heat-conduction circuit board |
| CN103491706A (en) * | 2013-10-09 | 2014-01-01 | 东莞生益电子有限公司 | Method for manufacturing high-thermal-conductivity printed circuit board and printed circuit board |
| CN103491706B (en) * | 2013-10-09 | 2016-04-20 | 东莞生益电子有限公司 | The manufacture method of high heat conduction printed circuit board and printed circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090311 Termination date: 20140517 |