CN102223767A - Production process for high heat-conduction circuit board - Google Patents
Production process for high heat-conduction circuit board Download PDFInfo
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- CN102223767A CN102223767A CN2011101450789A CN201110145078A CN102223767A CN 102223767 A CN102223767 A CN 102223767A CN 2011101450789 A CN2011101450789 A CN 2011101450789A CN 201110145078 A CN201110145078 A CN 201110145078A CN 102223767 A CN102223767 A CN 102223767A
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Abstract
The invention discloses a production process for a high heat-conduction circuit board. The production process comprises the following steps of: manufacturing a circuit board substrate which is a metal substrate having heat-conduction performance; manufacturing a substrate insulated layer, namely forming an oxide insulated layer, which is the substrate insulated layer, on the surface of the metal substrate; and manufacturing a conductive circuit layer, namely arranging the conductive circuit layer on the substrate insulated layer, wherein the conductive circuit layer uses paste having an adhering temperature with the substrate insulated layer lower than the temperature for destroying the oxide layer formed on the surface of the metal substrate. In the invention, nano silver paste or nano copper paste is used to form the conductive circuit layer on the oxide insulated layer, so that good heat-conduction of the oxide insulated layer is used on one hand, and on the other hand, the oxide insulated layer is not damaged in the process of forming the conductive circuit layer; the quality of the circuit board is ensured; simultaneously, the adhesive force of the conductive circuit board layer to the oxide insulated layer is ensured, so that the conductive circuit layer is not fallen off during welding.
Description
Technical field
The present invention discloses a kind of production technology of circuit board, particularly a kind of production technology of high heat conduction circuit board.
Background technology
Circuit board is the supporting body of electronic device, is requisite part in an electronic product or the electric equipment.Along with electronics, the development of electrical technology, people are also more and more higher to the requirement of circuit board, especially along with LED as illuminating device, after entering into people's life, heat dispersion to circuit board requires also more and more higher, at present, some circuit boards that need high heat dispersion all are to adopt aluminium base circuit board, it is to be provided with one deck heat-conducting glue on aluminium sheet, can play the effect of heat conduction on the one hand, also have the effect of insulation on the other hand, on heat-conducting glue, be attached with layer of copper membrane circuit board circuit, but the heat conductivility of heat-conducting glue is not fine, thereby can influence the heat conductivility of entire circuit plate.
Summary of the invention
At the imperfect shortcoming of the heat conductivility of the above-mentioned aluminium base circuit board of mentioning of the prior art, the invention provides a kind of production technology of high heat conduction circuit board newly, it directly forms oxidation insulating layer on substrate, on insulating barrier, print the conducting wire layer, thereby rely on oxidation insulating layer to insulate and dispel the heat, the heat transfer efficiency height, effective.
The technical scheme that the present invention solves its technical problem employing is: a kind of production technology of high heat conduction circuit board, and this production technology comprises:
Circuit board substrate: described circuit substrate is the metal substrate with heat conductivility;
Substrate insulating layer: the surface at metal substrate forms oxidation insulating layer, i.e. substrate insulating layer;
The conducting wire layer: be provided with the conducting wire layer on substrate insulating layer, the conducting wire layer selects the temperature of adhering to of itself and substrate insulating layer to be lower than the temperature of destroying the metallic substrate surfaces oxide layer.
The technical scheme that the present invention solves its technical problem employing further comprises:
Described circuit board substrate is aluminium base or copper base.
Described conducting wire layer adopts nanometer silver paste or nano copper slurry.
When described conducting wire layer adopts nanometer silver paste or nano copper slurry, by silk screen printing or adopt printing of inkjet printer on substrate insulating layer.
The oxidation insulating layer of described metallic substrate surfaces forms for oxidation by the people.
The oxidation insulating layer of described metallic substrate surfaces adopts the mode of anodic oxidation or chemical oxidation to form.
The oxidation insulating layer of described metallic substrate surfaces adopts oxidation technology or sulfuration process to form.
Described high heat conduction circuit board is single sided board, double sided board or multi-layer sheet.
Described conducting wire layer is divided into and is used to weld the pad portion of electronic device and the conductor part that connection pads is used, and pad portion adopts nanometer silver paste or nano copper slurry, and conductor part adopts normal conductor.
The invention has the beneficial effects as follows: adopt nanometer silver paste or nano copper slurry on oxidation insulating layer, to form the conducting wire layer among the present invention, it can utilize the characteristics of the good heat conduction effect of oxidation insulating layer on the one hand, can in the forming process of conducting wire layer, not damage oxidation insulating layer again on the other hand, guarantee the quality of circuit board, simultaneously, can also guarantee the adhesive force of conducting wire layer, it can not come off in welding process oxidation insulating layer.
The present invention will be further described below in conjunction with the drawings and specific embodiments.
Description of drawings
Fig. 1 is a part section structural representation of the present invention.
Fig. 2 is a partial structurtes schematic diagram of the present invention.
Among the figure, 1-substrate, 2-insulating barrier, 3-conducting wire layer, 4-pad portion, 5-conductor part.
Embodiment
Present embodiment is the preferred embodiment for the present invention, and other all its principles are identical with present embodiment or approximate with basic structure, all within protection range of the present invention.
Please referring to accompanying drawing 1 and accompanying drawing 2, the present invention is mainly a kind of production technology of circuit board, and the circuit board that adopts production technology of the present invention to produce comprises:
Circuit board substrate 1: circuit board substrate 1 is for having the metal substrate of heat conductivility, and in the present embodiment, circuit board substrate 1 is aluminium base or copper base, when specifically implementing, also can adopt other metal materials;
Substrate insulating layer 2: the substrate insulating layer 2 in the present embodiment is one deck oxidation insulating layer that forms on the surface of metal substrate 1, in the present embodiment, the oxidation insulating layer 2 of metallic substrate surfaces is to form for oxidation by the people, during concrete enforcement, can adopt the mode of anodic oxidation or chemical oxidation to form surperficial oxide layer; Said oxidation is the oxidation on the broad scope among the present invention, and when metal substrate 1 adopted aluminium sheet, it adopted oxidation technology to form oxidation insulating layer 2, and when metal substrate 1 adopted copper coin, it adopted sulfuration process to generate copper sulfide, as oxidation insulating layer 2.
Conducting wire layer 3: in the present embodiment, conducting wire layer 3 is arranged on substrate insulating layer 2, conducting wire layer 3 should be selected the material that temperature is lower than the temperature of destroying the formed oxide layer of metallic substrate surfaces that adheres to of itself and substrate insulating layer, in the present embodiment, the material of conducting wire layer 3 can adopt nanometer silver paste or nano copper slurry (when specifically implementing, the model that can adopt the normal auspicious Industrial Co., Ltd. in Shanghai to produce is the conducting resinl of SC6180), when conducting wire layer 3 adopts nanometer silver pastes or nano copper slurry, by silk screen printing or adopt printing of inkjet printer on substrate insulating layer 2.In the present embodiment, conducting wire layer 2 is divided into and is used to weld the pad portion 4 of electronic device and the conductor part 5 of connection pads part 4 usefulness, pad portion 4 adopts nanometer silver paste or nano copper slurry, conductor part 5 adopts normal conductor, as: copper slurry, carbon oil, carbon slurry etc. or other can be used for the conductor material of circuit board manufacturing lead.
Circuit board among the present invention can be designed to lamina, promptly forms one deck oxidation insulating film on layer of aluminum substrate 1, prints conductive layer then and get final product on oxidation insulating film.Circuit board among the present invention can be designed to single sided board or double sided board, also is designed to multi-layer sheet, and it can adopt method of the present invention to make in two top layers up and down.
Adopt nanometer silver paste or nano copper slurry on oxidation insulating layer, to form the conducting wire layer among the present invention, it can utilize the characteristics of the good heat conduction effect of oxidation insulating layer on the one hand, can in the forming process of conducting wire layer, not damage oxidation insulating layer again on the other hand, guarantee the quality of circuit board, simultaneously, can also guarantee the adhesive force of conducting wire layer, it can not come off in welding process oxidation insulating layer.
Claims (9)
1. the production technology of a high heat conduction circuit board, it is characterized in that: described production technology comprises:
Circuit board substrate: described circuit substrate is the metal substrate with heat conductivility;
Substrate insulating layer: the surface at metal substrate forms oxidation insulating layer, i.e. substrate insulating layer;
The conducting wire layer: be provided with the conducting wire layer on substrate insulating layer, the conducting wire layer selects the temperature of adhering to of itself and substrate insulating layer to be lower than the slurry that destroys the formed oxide layer temperature of metallic substrate surfaces.
2. the production technology of high heat conduction circuit board according to claim 1 is characterized in that: described circuit board substrate is aluminium base or copper base.
3. the production technology of high heat conduction circuit board according to claim 1 is characterized in that: described conducting wire layer adopts nanometer silver paste or nano copper slurry.
4. the production technology of high heat conduction circuit board according to claim 3 is characterized in that: when described conducting wire layer adopts nanometer silver paste or nano copper slurry, by silk screen printing or adopt printing of inkjet printer on substrate insulating layer.
5. the production technology of high heat conduction circuit board according to claim 1 is characterized in that: the oxidation insulating layer of described metallic substrate surfaces forms for oxidation by the people.
6. the production technology of high heat conduction circuit board according to claim 5 is characterized in that: the oxidation insulating layer of described metallic substrate surfaces adopts the mode of anodic oxidation or chemical oxidation to form.
7. the production technology of high heat conduction circuit board according to claim 5 is characterized in that: the oxidation insulating layer of described metallic substrate surfaces adopts oxidation technology or sulfuration process to form.
8. the production technology of high heat conduction circuit board according to claim 1 is characterized in that: described high heat conduction circuit board is single sided board, double sided board or multi-layer sheet.
9. the production technology of high heat conduction circuit board according to claim 1, it is characterized in that: described conducting wire layer is divided into and is used to weld the pad portion of electronic device and the conductor part that connection pads is used, pad portion adopts nanometer silver paste or nano copper slurry, and conductor part adopts normal conductor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011101450789A CN102223767A (en) | 2011-06-01 | 2011-06-01 | Production process for high heat-conduction circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011101450789A CN102223767A (en) | 2011-06-01 | 2011-06-01 | Production process for high heat-conduction circuit board |
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| CN102223767A true CN102223767A (en) | 2011-10-19 |
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| CN2011101450789A Pending CN102223767A (en) | 2011-06-01 | 2011-06-01 | Production process for high heat-conduction circuit board |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103037670A (en) * | 2012-12-07 | 2013-04-10 | 陕西千山航空电子有限责任公司 | Heat radiating process method for printed-circuit board |
| CN103607853A (en) * | 2013-10-21 | 2014-02-26 | 溧阳市东大技术转移中心有限公司 | Preparation method of printed circuit wires |
| CN104425696A (en) * | 2013-08-23 | 2015-03-18 | 郭剑 | LED substrate and manufacturing method thereof |
| CN104582250A (en) * | 2015-01-29 | 2015-04-29 | 高德(苏州)电子有限公司 | Heat-conduction PCB (printed circuit board) glue combination aluminum-based circuit board and manufacturing method thereof |
| CN103889141B (en) * | 2012-12-20 | 2017-12-26 | 北京中科纳通科技有限公司 | A kind of high heat radiation aluminium-based LED circuit board and preparation method thereof |
| CN111443109A (en) * | 2019-01-16 | 2020-07-24 | 国网宁夏电力有限公司 | Condensation alarm induction plate for mechanism box of transformer substation |
| CN113038699A (en) * | 2021-03-09 | 2021-06-25 | 昆山十井电子科技有限公司 | Aluminum-based carbon film plate and processing method thereof |
| WO2022120704A1 (en) * | 2020-12-10 | 2022-06-16 | 深圳市艾比森光电股份有限公司 | Printed circuit board, led display module, and led display screen |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02198196A (en) * | 1989-01-27 | 1990-08-06 | Hitachi Condenser Co Ltd | Manufacture of printed circuit board |
| CN1946271A (en) * | 2005-10-04 | 2007-04-11 | 三星电机株式会社 | Printed circuit board and manufacturing method thereof |
| CN101287335A (en) * | 2007-04-12 | 2008-10-15 | 环宇真空科技股份有限公司 | Highly heat conductive circuit base board |
| CN201207757Y (en) * | 2008-05-17 | 2009-03-11 | 汕头市锐科电子有限公司 | Printed circuit board |
| CN101560349A (en) * | 2009-04-22 | 2009-10-21 | 北京印刷学院 | Jet conductive ink |
| CN101710498A (en) * | 2009-12-24 | 2010-05-19 | 彩虹集团公司 | Method for preparing nano copper slurry for ceramic capacitor used for screen printing |
| CN102036476A (en) * | 2010-12-04 | 2011-04-27 | 廖萍涛 | Two-sided metal based circuit board and production method thereof |
-
2011
- 2011-06-01 CN CN2011101450789A patent/CN102223767A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02198196A (en) * | 1989-01-27 | 1990-08-06 | Hitachi Condenser Co Ltd | Manufacture of printed circuit board |
| CN1946271A (en) * | 2005-10-04 | 2007-04-11 | 三星电机株式会社 | Printed circuit board and manufacturing method thereof |
| CN101287335A (en) * | 2007-04-12 | 2008-10-15 | 环宇真空科技股份有限公司 | Highly heat conductive circuit base board |
| CN201207757Y (en) * | 2008-05-17 | 2009-03-11 | 汕头市锐科电子有限公司 | Printed circuit board |
| CN101560349A (en) * | 2009-04-22 | 2009-10-21 | 北京印刷学院 | Jet conductive ink |
| CN101710498A (en) * | 2009-12-24 | 2010-05-19 | 彩虹集团公司 | Method for preparing nano copper slurry for ceramic capacitor used for screen printing |
| CN102036476A (en) * | 2010-12-04 | 2011-04-27 | 廖萍涛 | Two-sided metal based circuit board and production method thereof |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103037670A (en) * | 2012-12-07 | 2013-04-10 | 陕西千山航空电子有限责任公司 | Heat radiating process method for printed-circuit board |
| CN103889141B (en) * | 2012-12-20 | 2017-12-26 | 北京中科纳通科技有限公司 | A kind of high heat radiation aluminium-based LED circuit board and preparation method thereof |
| CN104425696A (en) * | 2013-08-23 | 2015-03-18 | 郭剑 | LED substrate and manufacturing method thereof |
| CN103607853A (en) * | 2013-10-21 | 2014-02-26 | 溧阳市东大技术转移中心有限公司 | Preparation method of printed circuit wires |
| CN104582250A (en) * | 2015-01-29 | 2015-04-29 | 高德(苏州)电子有限公司 | Heat-conduction PCB (printed circuit board) glue combination aluminum-based circuit board and manufacturing method thereof |
| CN111443109A (en) * | 2019-01-16 | 2020-07-24 | 国网宁夏电力有限公司 | Condensation alarm induction plate for mechanism box of transformer substation |
| WO2022120704A1 (en) * | 2020-12-10 | 2022-06-16 | 深圳市艾比森光电股份有限公司 | Printed circuit board, led display module, and led display screen |
| CN113038699A (en) * | 2021-03-09 | 2021-06-25 | 昆山十井电子科技有限公司 | Aluminum-based carbon film plate and processing method thereof |
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Application publication date: 20111019 |