CN201774736U - Flexible circuit board with heat dissipation structure - Google Patents
Flexible circuit board with heat dissipation structure Download PDFInfo
- Publication number
- CN201774736U CN201774736U CN2010202803882U CN201020280388U CN201774736U CN 201774736 U CN201774736 U CN 201774736U CN 2010202803882 U CN2010202803882 U CN 2010202803882U CN 201020280388 U CN201020280388 U CN 201020280388U CN 201774736 U CN201774736 U CN 201774736U
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- heat
- circuit board
- substrate
- flexible circuit
- conducting layer
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Abstract
A flexible circuit board with a heat dissipation structure comprises a base plate, a heat conducting layer, a conductor layer and a plurality of hole positions, wherein a copper foil or an aluminum foil can be taken as the base plate; the heat conducting layer is arranged on the upper surface of the base plate; the conductor layer is arranged on the upper surface of the heat conducting layer; and the hole positions extend downwards to the base plate from the surface of the conductor layer, each hole position is internally filled with a heat dissipation material which is contacted with the base plate. The heat generated by the base plate can be conducted to the heat dissipation material, by the assistance of the self heat transferring capability of the heat dissipation material, the heat dissipation efficiency is improved, and the heat dissipation efficiency can be improved by 20% to 50% according to the specific test result.
Description
Technical field
The utility model relates to a kind of flexible circuit board, refers to have the flexible circuit board of radiator structure especially.
Background technology
Printed circuit board (PCB) (printed circuit board) is the indispensable main member of electronic product now, and it adopts worker's method of printing etching resistance agent, makes the circuit and the drawing of circuit, thereby is called as printed circuit board (PCB).Because the continuous microminiaturization of electronic product is with becoming more meticulous, present most circuit board all is to adopt to attach etching resistance agent, through behind the exposure imaging, makes printed circuit board (PCB) with etching again.
The flexible circuit board of traditional printing circuit board is to be coated with a heat-conducting layer to promote radiating efficiency between substrate and conductor layer.Or a plurality of through holes are set on flexible circuit board, substrate is directly contacted with the external world reaching radiating effect, yet the radiating effect that utilizes aforesaid way to reach is still limited.
Inventor of the present utility model is because the defective of above-mentioned known constructional device when actual using, and the accumulation individual is engaged on the related industry exploitation practice experience for many years, studies intensively, and proposes a kind of reasonable in design and effectively improve the structure of the problems referred to above finally.
The utility model content
Main purpose of the present utility model: be to utilize the heat-transfer capability of heat sink material itself, have the radiating efficiency of the flexible circuit board of radiator structure with raising.
To achieve the above object: the utility model provides a kind of flexible circuit board with radiator structure, comprises: a substrate, and it is a Copper Foil or aluminium foil; One is located at the heat-conducting layer of the upper surface of this substrate; One is located at the conductor layer of upper surface of this heat-conducting layer and the position, hole that a plurality of surface by this conductor layer extends downwardly into this substrate, and wherein, each described Kong Weizhong is filled with a heat sink material, and this heat sink material is contacted with this substrate.
The utlity model has following effect: the heat that this substrate produces can conduct to this heat sink material, improving radiating efficiency, can promote 20 to 50 percentage points by the heat-transfer capability of heat sink material itself according to concrete test result radiating efficiency of the present utility model as can be known.
For enabling further to understand feature of the present utility model and technology contents, see also following about detailed description of the present utility model and accompanying drawing, yet appended accompanying drawing only provide with reference to and the explanation usefulness, be not to be used for the utility model is limited.
Description of drawings
Fig. 1 is the schematic diagram of known technology;
Fig. 2 is the schematic diagram with flexible circuit board first embodiment of radiator structure of the present utility model;
Fig. 3 is the schematic diagram with flexible circuit board second embodiment of radiator structure of the present utility model;
Fig. 4 is the schematic diagram with flexible circuit board the 3rd embodiment of radiator structure of the present utility model.
[main element description of reference numerals]
The 1a flexible circuit board
The 10a substrate
The 11a heat-conducting layer
The 12a conductor layer
1,1 ', 1 " flexible circuit board with radiator structure
10 substrates
11 heat-conducting layers
12 conductor layers
Position, 13 hole
14 heat sink materials
15 first heat conduction glue-lines
16 second heat conduction glue-lines
Embodiment
As shown in Figure 1, the flexible circuit board 1a of known technology is characterized in that, comprises: a substrate 10a; The one heat-conducting layer 11a and that is located at the upper surface of this substrate 10a is located at the conductor layer 12a of the upper surface of this heat-conducting layer 11a.The heat that this substrate 10a produces is by this heat-conducting layer 11a heat conduction.
As shown in Figure 2, the utility model discloses a kind of flexible circuit board 1 with radiator structure, and it comprises: a substrate 10; One is located at the heat-conducting layer 11 of the upper surface of this substrate 10; One is located at the conductor layer 12 of upper surface of this heat-conducting layer 11 and the position, hole 13 that a plurality of surface by this conductor layer 12 extends downwardly into this substrate 10, wherein, is filled with a heat sink material 14 in each position, described hole 13, and this heat sink material 14 is contacted with this substrate 10.Wherein, the heat that this substrate 10 produces can conduct to this heat sink material 14, and to improve radiating efficiency, according to concrete test result as can be known, radiating efficiency of the present utility model can promote 20 to 50 percentage points by the heat-transfer capability of heat sink material 14 itself.
The utlity model has various embodiments, in first kind of embodiment, this substrate 10 is a stratiform structure, it can be a Copper Foil or aluminium foil, this heat-conducting layer 11 is fixedly arranged on the upper surface of this substrate 10, for example, can utilize felting method to be attached at the upper surface of this substrate 10, this heat-conducting layer 11 is similarly a stratiform structure, and this heat-conducting layer 11 can be a fin, for example: pi (PI) or thermoplasticity pi (TPI) etc., this heat-conducting layer 11 changes inner character via chemical method, so that this heat-conducting layer 11 has higher tackness, and then provide this flexible circuit board 1 preferable mechanical strength with radiator structure; This conductor layer 12 is fixedly arranged on the upper surface of this heat-conducting layer 11, for example, can utilize felting method to be attached at the upper surface of this heat-conducting layer 11, and this conductor layer 12 can be a bronze medal spare, and it is in order to the media as the transmission of electronic installation signal.
In addition, the utility model more can utilize mould that the flexible circuit board 1 that this has radiator structure is cut, and the left surface of this substrate 10, the left surface of this heat-conducting layer 11 and the left surface of this conductor layer 12 are positioned on the vertical plane; The right flank of the right flank of the right flank of this substrate 10, this heat-conducting layer 11 and this conductor layer 12 is positioned on another vertical plane, and in other words, the left surface of the left surface of this substrate 10, this heat-conducting layer 11 and the left surface of this conductor layer 12 trim mutually; The right flank of the right flank of the right flank of this substrate 10, this heat-conducting layer 11 and this conductor layer 12 trims mutually.Particularly, this flexible circuit board 1 with radiator structure forms about the one multilayer shape board structure of circuit that trim.
On the one hand, each position, described hole 13 extends through this heat-conducting layer 11 downwards to this substrate 10 by this conductor layer 12 again, and for example each position, described hole 13 can extend to the upper surface of this substrate 10 vertically downward, or extends to the inside of this substrate 10.Each position, described hole 13 is filled with this heat sink material 14, this heat sink material 14 can be the material of copper or metallic resin or other high heat transfer efficient, in other words, this heat sink material 14 contacts to dispel the heat with the upper surface of this substrate 10, the side of this heat sink material 14 more can be contacted with this heat-conducting layer 11 and this conductor layer 12 to improve radiating effect, for example: this heat sink material 14 can fill up each position, described hole 13 or this heat sink material 14 and extend the sidewall that covers this heat-conducting layer 11 and this conductor layer 12 toward the top by the upper surface of this substrate 10.
Each position, described hole 13 can utilize multiple manufacture method to make, for example: above-mentioned position, hole 13 can utilize volume to volume continuous horizontal formula UV Laser drill mode or individual discontinuous formula UV Laser drill mode moulding, concrete manufacture method is as follows: at first, provide a flexible circuit board; Produce a UV laser beam, this UV laser beam is directed on this flexible circuit board, the default zone vaporization that makes this flexible circuit board is to form each position, described hole 13 of the present utility model, wherein each 13 surface by this conductor layer 12, position, described hole extends downwardly into the substrate 10 of this flexible circuit board, and makes the bottom surface of each position, described hole 13 be positioned at the upper surface of this substrate or be positioned at the inside of this substrate 10.
Above-mentioned position, hole 13 with flexible circuit board 1 of radiator structure also can utilize the moulding of machine drilling mode, and concrete manufacture method is as follows: at first, provide a flexible circuit board; Next hole to form each position, described hole 13 of the present utility model at the default zone of this flexible circuit board with a bite tool, wherein each 13 surface by this conductor layer 12, position, described hole extends downwardly into the substrate 10 of this flexible circuit board, and makes the bottom surface of each position, described hole 13 be positioned at the upper surface of this substrate 10 or be positioned at the inside of this substrate 10.
In addition, 14 of above-mentioned heat sink materials can utilize the plating mode moulding, and concrete manufacture method is as follows: at first, provide a flexible circuit board with each position, described hole 13; One power supply is provided; Next on this flexible circuit board, an insulating barrier is set and exposes each position, described hole 13, and this flexible circuit board is connected in the negative electrode of power supply; With plated metal, for example: copper etc. are deposited on and form this heat sink material 14 in each position, described hole 13, via the manufacture method of above-mentioned plated metal, to form the flexible circuit board 1 with radiator structure of the present utility model.
The utility model also can make it have more the effect of heat radiation in conjunction with the material with radiating effect, in second kind of embodiment shown in Figure 3, this has the flexible circuit board 1 of radiator structure ' more comprise one first heat conduction glue-line 15, this first heat conduction glue-line 15 is a stratiform structure, this first heat conduction glue-line 15 is arranged between this heat-conducting layer 11 and this substrate 10, wherein, each position, described hole 13 extends through this heat-conducting layer 11 and this first heat conduction glue-line 15 downwards by this conductor layer 12, and extend to this substrate 10, for example each position, described hole 13 can extend to the upper surface of this substrate 10 vertically downward, or extends to the inside of this substrate 10.
As shown in Figure 4, in the third execution mode, this has the flexible circuit board 1 of radiator structure " more comprises one first heat conduction glue-line 15 and one second heat conduction glue-line 16; this first heat conduction glue-line 15 is arranged between this heat-conducting layer 11 and this substrate 10; this second heat conduction glue-line 16 is arranged between this heat-conducting layer 11 and this conductor layer 12; wherein; each position, described hole 13 extends through this second heat conduction glue-line 16 downwards by this conductor layer 12; this heat-conducting layer 11 and this first heat conduction glue-line 15, and extend to this substrate 10, for example each position, described hole 13 can extend to the upper surface of this substrate 10 vertically downward, or extends to the inside of this substrate 10.
In sum, advantage of the present utility model: because these heat sink material 14 these substrates 10 of contact, the heat that this substrate 10 produces conducts to each described heat sink material 14, heat-transfer capability by heat sink material 14 itself, to improve radiating efficiency, can promote 20 to 50 percentage points according to concrete test result radiating efficiency of the present utility model as can be known.
The above only is a preferable possible embodiments of the present utility model, and non-so limitation the technical solution of the utility model so the equivalence techniques that all utilization the utility model specifications and accompanying drawing are done changes, all is contained in the protection range of the present utility model.
Claims (7)
1. the flexible circuit board with radiator structure is characterized in that, comprises:
One substrate, it is a Copper Foil or aluminium foil;
One is located at the heat-conducting layer of the upper surface of this substrate;
One is located at the conductor layer of the upper surface of this heat-conducting layer; And
A plurality of surfaces by this conductor layer extend downwardly into the position, hole of this substrate, and wherein each described Kong Weizhong is filled with a heat sink material, and this heat sink material is contacted with this substrate.
2. the flexible circuit board with radiator structure as claimed in claim 1 is characterized in that, this heat sink material is electro-coppering or metallic resin, and this heat-conducting layer is a fin.
3. the flexible circuit board with radiator structure as claimed in claim 1 is characterized in that, the bottom surface of each position, described hole is positioned at the upper surface of this substrate.
4. the flexible circuit board with radiator structure as claimed in claim 1 is characterized in that, this substrate, this heat-conducting layer and this conductor layer are a stratiform structure.
5. the flexible circuit board with radiator structure as claimed in claim 1 is characterized in that, this flexible circuit board with radiator structure forms about the one multilayer shape structures that trim.
6. the flexible circuit board with radiator structure as claimed in claim 1 is characterized in that, more comprises one first heat conduction glue-line, and this first heat conduction glue-line is arranged between this heat-conducting layer and this substrate.
7. the flexible circuit board with radiator structure as claimed in claim 1, it is characterized in that, more comprise one first heat conduction glue-line and one second heat conduction glue-line, this first heat conduction glue-line is arranged between this heat-conducting layer and this substrate, and this second heat conduction glue-line is arranged between this heat-conducting layer and this conductor layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010202803882U CN201774736U (en) | 2010-07-28 | 2010-07-28 | Flexible circuit board with heat dissipation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010202803882U CN201774736U (en) | 2010-07-28 | 2010-07-28 | Flexible circuit board with heat dissipation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201774736U true CN201774736U (en) | 2011-03-23 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010202803882U Expired - Fee Related CN201774736U (en) | 2010-07-28 | 2010-07-28 | Flexible circuit board with heat dissipation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201774736U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103488262A (en) * | 2012-06-07 | 2014-01-01 | 苹果公司 | Solid-state drive with passive heat transfer |
| CN104703383A (en) * | 2013-12-10 | 2015-06-10 | 深南电路有限公司 | Printed circuit board and method for machining same |
| CN105338737A (en) * | 2014-07-18 | 2016-02-17 | 南昌欧菲光电技术有限公司 | Circuit board assembly and mobile phone camera module |
| CN105835467A (en) * | 2016-03-26 | 2016-08-10 | 林俊宝 | Aluminum substrate material being bendable randomly and production method thereof |
| CN108430173A (en) * | 2018-03-08 | 2018-08-21 | 皆利士多层线路版(中山)有限公司 | Wiring board and preparation method thereof |
-
2010
- 2010-07-28 CN CN2010202803882U patent/CN201774736U/en not_active Expired - Fee Related
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103488262A (en) * | 2012-06-07 | 2014-01-01 | 苹果公司 | Solid-state drive with passive heat transfer |
| US9408328B2 (en) | 2012-06-07 | 2016-08-02 | Apple Inc. | Solid-state drive with passive heat transfer |
| CN103488262B (en) * | 2012-06-07 | 2017-03-22 | 苹果公司 | Solid-state drive with passive heat transfer |
| CN104703383A (en) * | 2013-12-10 | 2015-06-10 | 深南电路有限公司 | Printed circuit board and method for machining same |
| CN104703383B (en) * | 2013-12-10 | 2018-02-02 | 深南电路有限公司 | The method and printed circuit board (PCB) of processing printed circuit board |
| CN105338737A (en) * | 2014-07-18 | 2016-02-17 | 南昌欧菲光电技术有限公司 | Circuit board assembly and mobile phone camera module |
| CN105835467A (en) * | 2016-03-26 | 2016-08-10 | 林俊宝 | Aluminum substrate material being bendable randomly and production method thereof |
| CN108430173A (en) * | 2018-03-08 | 2018-08-21 | 皆利士多层线路版(中山)有限公司 | Wiring board and preparation method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Career Electronic (Kunshan) Co., Ltd. Assignor: Career Technology Mfg. Co., Ltd. Contract record no.: 2014990000003 Denomination of utility model: Flexible circuit board with heat dissipation structure Granted publication date: 20110323 License type: Exclusive License Record date: 20140106 |
|
| LICC | Enforcement, change and cancellation of record of contracts on the licence for exploitation of a patent or utility model | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Career Electronic (Kunshan) Co., Ltd. Assignor: Career Technology Mfg. Co., Ltd. Contract record no.: 2014990000003 Denomination of utility model: Flexible circuit board with heat dissipation structure Granted publication date: 20110323 License type: Exclusive License Record date: 20140106 |
|
| LICC | Enforcement, change and cancellation of record of contracts on the licence for exploitation of a patent or utility model | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110323 Termination date: 20170728 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |