CN202103945U - Circuit board for assembling LED (light-emitting diode) - Google Patents
Circuit board for assembling LED (light-emitting diode) Download PDFInfo
- Publication number
- CN202103945U CN202103945U CN2011202111481U CN201120211148U CN202103945U CN 202103945 U CN202103945 U CN 202103945U CN 2011202111481 U CN2011202111481 U CN 2011202111481U CN 201120211148 U CN201120211148 U CN 201120211148U CN 202103945 U CN202103945 U CN 202103945U
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- Prior art keywords
- weld pad
- circuit board
- substrate body
- electrode line
- welding pad
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
The utility model discloses a circuit board for assembling an LED (light-emitting diode), comprising a baseplate body, a first welding pad, a second welding pad and an insulating protection layer arranged on the surface of the baseplate body, wherein the first welding pad is electrically connected with the second welding pad; a conductive through hole is arranged on the second welding pad; the insulating protection layer is arranged on the surface of the baseplate body and is arranged between the first welding pad and the second welding pad, thus forming a plurality of openings that are exposed out of the first welding pad and the second welding pad respectively. In the utility model, the circuit board has the advantages of reducing the manufacturing cost as the conductive through hole is arranged on the welding pad.
Description
Technical field
The utility model relates to a kind of circuit board, particularly relates to the circuit board that LED is installed in lower being used to of a kind of cost of manufacture.
Background technology
Flourish along with electronic industry, electronic product is also gradually to multi-functional, high performance direction research and development.For satisfying semiconductor package part high integration and microminiaturized package requirements; Provide a plurality of masters, passive device and circuit to carry the circuit board that connects; Also develop into multi-layer sheet by lamina gradually; Thereby under limited space, ask that through layer interconnection technique enlarges available circuit area on the circuit board with the user demand in response to the integrated circuit of high electron density.
Yet existing circuit board electrically connects in order the circuit on two apparent surfaces of this loading plate to be increased layer, must form two apparent surfaces' of running through this loading plate through hole; Then, form conductive layer in this through-hole surfaces, then; On this conductive layer, form metal level; And in this through hole, form conductive through hole, owing to also need on this conductive through hole, to form the circuit layer reinforced structure afterwards, so higher for the quality requirements of this conductive through hole; So the method for making of the conductive through hole of planting will make that the making step of integrated circuit plate is too numerous and diverse, and then influence the cost of manufacture of final products.Therefore, in view of the above-mentioned problems, how to avoid the method for making of conductive through hole of the prior art too numerous and diverse, and then cause the problems such as cost rising of product, real oneself becomes the problem that present anxious desire solves.
The utility model content
For solving the problem in the above-mentioned background technology, the purpose of the utility model provides the lower circuit board of a kind of conductive through hole cost of manufacture.For reaching above-mentioned and other purposes; The utility model provides a kind of circuit board with defencive function, and this circuit board comprises, a temperature sensing device, a bridge-type rectifier, a fuse are set on substrate body, the substrate body; First weld pad and second weld pad; Be located at the surface of this substrate body, and be electrically connected to each other, have conductive through hole on this second weld pad; And insulating protective layer, be located at the surface of this substrate body, and be located between this first weld pad and this second weld pad, to form a plurality of openings that expose this first weld pad and second weld pad respectively;
An electrode line, negative line and at least one holding wire are set on the said substrate body at least,
Said fuse is arranged on the said substrate body, and said fuse is connected with a electrode line on the said substrate body, when being used for temperature and surpassing a certain preset temperature, and fusing automatically;
Said bridge-type rectifier is arranged on the said substrate body, is connected with a said electrode line, a said negative line after being connected fuse, is used for rectification;
Said temperature sensing device is arranged on the said substrate body, is connected with a said electrode line, is used for monitor temperature, when surpassing a certain preset temperature, interrupts said electrode line.
Described circuit board, wherein, the width of being located at the insulating protective layer of this first weld pad and second weld pad is the 0.1-0.5 millimeter.
Described circuit board, wherein, this first weld pad supplies to be connected to electronic component.
Described circuit board wherein, also comprises scolder, coats respectively on this first weld pad and second weld pad.Described circuit board wherein, is provided with the described circuit board of at least one LED between the opening of the opening of this first weld pad and second weld pad, wherein, this insulating protective layer is a welding resisting layer.Than prior art, the circuit board of the utility model is that conductive through hole is formed on the weld pad, and can lower cost of manufacture.
Description of drawings
Fig. 1 is the embodiment sketch map of the utility model.
Embodiment:
Below through the execution mode of particular specific embodiment explanation the utility model, those skilled in the art can be understood other advantages and the effect of the utility model easily by the content that this specification disclosed.
As shown in Figure 1; One surface of the circuit board of present embodiment has on 10 and a plurality ofly is electrically connected to the weld pad 11 of electronic component in order to correspondence, has insulating protective layer 12 in addition on this surface 10, and this insulating protective layer 12 has a plurality of openings 120; Order respectively these weld pad 11 correspondences exposes to respectively this opening 120; In addition, this weld pad 11 is provided with conductive through hole 13, and this conductive through hole 13 runs through circuit board and electrically connects the circuit layer reinforced structure of circuit board both sides.
Above-mentioned circuit board is directly on the weld pad 11 on the surface 10, to form conductive through hole 13, owing to do not need on this conductive through hole 13, to form other structures, so the manufacture process requirement of this conductive through hole 13 is lower, so can reduce the integral manufacturing cost of circuit board.
Yet, need to form earlier scolder on this weld pad 11, electrically connecting and fixed electronic element, and because the radiating efficiency at these conductive through hole 13 places is higher,, and then drive electronic component and depart from original correct position so scolder flows toward this conductive through hole 13 easily.At least one LED is set between the opening of the opening of this first weld pad and second weld pad.A kind of circuit board with defencive function; This circuit board comprises; One temperature sensing device, a bridge-type rectifier, a fuse are set on substrate body, the substrate body, and first weld pad and second weld pad are located at the surface of this substrate body; And be electrically connected to each other, have conductive through hole on this second weld pad; And insulating protective layer, be located at the surface of this substrate body, and be located between this first weld pad and this second weld pad, to form a plurality of openings that expose this first weld pad and second weld pad respectively;
An electrode line, negative line and at least one holding wire are set on the said substrate body at least,
Said fuse is arranged on the said substrate body, and said fuse is connected with a electrode line on the said substrate body, when being used for temperature and surpassing a certain preset temperature, and fusing automatically;
Said bridge-type rectifier is arranged on the said substrate body, is connected with a said electrode line, a said negative line after being connected fuse, is used for rectification;
Said temperature sensing device is arranged on the said substrate body, is connected with a said electrode line, is used for monitor temperature, when surpassing a certain preset temperature, interrupts said electrode line.
Described circuit board, wherein, the width of being located at the insulating protective layer of this first weld pad and second weld pad is the 0.1-0.5 millimeter.
Described circuit board, wherein, this first weld pad supplies to be connected to electronic component.
Described circuit board wherein, also comprises scolder, coats respectively on this first weld pad and second weld pad.Described circuit board wherein, is provided with the described circuit board of at least one LED between the opening of the opening of this first weld pad and second weld pad, wherein, this insulating protective layer is a welding resisting layer.
Should be understood that, concerning those of ordinary skills, can improve or conversion, and all these improvement and conversion all should belong to the protection range of the utility model accompanying claims according to above-mentioned explanation.
Claims (6)
1. circuit board with defencive function; It is characterized in that this circuit board comprises, a temperature sensing device, a bridge-type rectifier, a fuse are set on substrate body, the substrate body; First weld pad and second weld pad; Be located at the surface of this substrate body, and be electrically connected to each other, have conductive through hole on this second weld pad; And insulating protective layer, be located at the surface of this substrate body, and be located between this first weld pad and this second weld pad, to form a plurality of openings that expose this first weld pad and second weld pad respectively;
An electrode line, negative line and at least one holding wire are set on the said substrate body at least;
Said fuse is arranged on the said substrate body, and said fuse is connected with a electrode line on the said substrate body, when being used for temperature and surpassing a certain preset temperature, and fusing automatically;
Said bridge-type rectifier is arranged on the said substrate body, is connected with a said electrode line, a said negative line after being connected fuse, is used for rectification;
Said temperature sensing device is arranged on the said substrate body, is connected with a said electrode line, is used for monitor temperature, when surpassing a certain preset temperature, interrupts said electrode line.
2. circuit board according to claim 1 is characterized in that, the width of being located at the insulating protective layer of this first weld pad and second weld pad is the 0.1-0.5 millimeter.
3. circuit board according to claim 1 is characterized in that, this first weld pad supplies to be connected to electronic component.
4. circuit board according to claim 1 is characterized in that, also comprises scolder, coats respectively on this first weld pad and second weld pad.
5. circuit board according to claim 1 is characterized in that, between the opening of the opening of this first weld pad and second weld pad at least one LED is set.
6. circuit board according to claim 1 is characterized in that, this insulating protective layer is a welding resisting layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011202111481U CN202103945U (en) | 2011-06-20 | 2011-06-20 | Circuit board for assembling LED (light-emitting diode) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011202111481U CN202103945U (en) | 2011-06-20 | 2011-06-20 | Circuit board for assembling LED (light-emitting diode) |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202103945U true CN202103945U (en) | 2012-01-04 |
Family
ID=45389942
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011202111481U Expired - Fee Related CN202103945U (en) | 2011-06-20 | 2011-06-20 | Circuit board for assembling LED (light-emitting diode) |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202103945U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104141904A (en) * | 2014-07-22 | 2014-11-12 | 上海博恩世通光电股份有限公司 | Insertion-type double-face die bond all-round LED power type lamp filament module |
| CN105228426A (en) * | 2015-11-11 | 2016-01-06 | 王天真 | A kind of can dedusting and band LED circuit board arrangement assembly |
| CN105376991A (en) * | 2015-11-11 | 2016-03-02 | 王天真 | Circuit board device assembly capable of dust removal |
| CN105392329A (en) * | 2015-11-11 | 2016-03-09 | 王天真 | Circuit board apparatus assembly with LED lamp and functions of temperature detection and alarm |
-
2011
- 2011-06-20 CN CN2011202111481U patent/CN202103945U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104141904A (en) * | 2014-07-22 | 2014-11-12 | 上海博恩世通光电股份有限公司 | Insertion-type double-face die bond all-round LED power type lamp filament module |
| CN105228426A (en) * | 2015-11-11 | 2016-01-06 | 王天真 | A kind of can dedusting and band LED circuit board arrangement assembly |
| CN105376991A (en) * | 2015-11-11 | 2016-03-02 | 王天真 | Circuit board device assembly capable of dust removal |
| CN105392329A (en) * | 2015-11-11 | 2016-03-09 | 王天真 | Circuit board apparatus assembly with LED lamp and functions of temperature detection and alarm |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: HUNAN FOUNDER SOONEST ELECTRONICS TECHNOLOGY CO., LTD. Assignor: Fang Xiaogang Contract record no.: 2012440020252 Denomination of utility model: Circuit board for assembling LED (light-emitting diode) Granted publication date: 20120104 License type: Exclusive License Record date: 20120830 |
|
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120104 Termination date: 20130620 |