CN203277368U - Packaging substrate - Google Patents
Packaging substrate Download PDFInfo
- Publication number
- CN203277368U CN203277368U CN201320296491XU CN201320296491U CN203277368U CN 203277368 U CN203277368 U CN 203277368U CN 201320296491X U CN201320296491X U CN 201320296491XU CN 201320296491 U CN201320296491 U CN 201320296491U CN 203277368 U CN203277368 U CN 203277368U
- Authority
- CN
- China
- Prior art keywords
- electric contact
- face
- blind hole
- conductive
- contact mat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/11—Manufacturing methods
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
A packaging substrate comprises a plate body possessing a dielectric layer, a plurality of conductive blind holes forming in the dielectric layer, a plurality of electrical contact pads forming on an end surface of the conductive blind holes, an insulation protection layer and a conductive tower, wherein the insulation protection layer is formed on the dielectric layer and the conductive blind holes and the electrical contact pads are exposed; the conductive tower is arranged on the exposed conductive blind hole end surface of the insulation protection layer and wraps the electrical contact pads. An end surface width of the electrical contact pads is less than an end surface width of the conductive blind holes so that distances between the electrical contact pads are increased and a wiring space is increased too.
Description
Technical field
The utility model relates to a kind of base plate for packaging, espespecially a kind of base plate for packaging that can promote reliability.
Background technology
Along with the prosperity of electronic industry, electronic product has now tended to direction design compact and functional diversities, and semiconductor packaging is also developed different encapsulation kenels thereupon.And for different encapsulating structures, also develop the base plate for packaging of various encapsulation use.General crystal covering type base plate for packaging, its substrate body surface have the crystalline setting area, form a plurality of electric contact mats in this crystalline setting area, and form welding resisting layer on this substrate body, and this welding resisting layer has a plurality of perforates and appears this electric contact mat with correspondence.In putting brilliant manufacture method, connect on this crystalline setting area and put semiconductor chip, and this semiconductor chip is electrically connected this electric contact mat to cover crystal type.
Figure 1A to Fig. 1 D is the cross-sectional schematic of the method for making of existing base plate for packaging 1.
As shown in Figure 1A, a plate body 10 is provided, this plate body 10 has at least one internal wiring 11 and at least one dielectric layer 12, and forms a plurality of blind holes 120 on this dielectric layer 12, makes the part surface of this internal wiring 11 expose to this blind hole 120.
As shown in Figure 1B, form a conductive layer 13 on this dielectric layer 12 with in this blind hole 120, formation resistance layer 14 on this conductive layer 13, and this resistance layer 14 again is formed with a plurality of open regions 140, makes partially conductive layer 13 and this blind hole 120 on this dielectric layer 12 expose to those open regions 140.
Then, electroplate formation one line layer 15 and conductive blind hole 16 in this open region 140.Wherein, this conductive blind hole 16 is formed in this blind hole 120 to be electrically connected this internal wiring 11.
In addition, this line layer 15 is formed on this dielectric layer 12, and this line layer 15 has a plurality of conductive trace 15a, the end place of this conductive trace 15a has circular electric contact mat 150(as shown in Fig. 1 C '), and this electric contact mat 150 is formed on the end face 16a of this conductive blind hole 16, makes this conductive blind hole 16 be electrically connected this line layer 15.
As shown in Fig. 1 C and Fig. 1 C ', remove this resistance layer 14 and under conductive layer 13.Then, form a welding resisting layer 17 on this dielectric layer 12, line layer 15, and this welding resisting layer 17 has a plurality of perforates 170, expose to those perforates 170 to make those electric contact mat 150 correspondences, wherein, this perforate 170 is circular hole.
As shown in Fig. 1 D, form soldering tin material in this perforate 170, become conductive projection 19 with reflow.
Yet, in existing base plate for packaging 1, because this electric contact mat 150 is formed with an alar part structure 150a, so this electric contact mat 150 covers the end face 16a of whole this conductive blind hole 16, and the diameter of this electric contact mat 150 is also greater than the diameter of this perforate 170, so that respectively the wiring space between this electric contact mat 150 is dwindled, not only can't promote wiring density, and respectively need between this conductive projection 19 to keep certain distance to avoid bridge joint, thereby can't dwindle the respectively distance between this conductive projection 19, and then can't satisfy thin space, multijunction demand.
Therefore, how to overcome the variety of problems of above-mentioned prior art, become in fact the difficult problem that present industry is demanded urgently overcoming.
The utility model content
In view of the disadvantages of above-mentioned prior art, main purpose of the present utility model is for providing a kind of base plate for packaging, increasing the respectively distance between this electric contact mat, and increases wiring space.
Base plate for packaging of the present utility model comprises: plate body, and it has at least one dielectric layer, and this dielectric layer has a plurality of blind holes; A plurality of conductive blind holes, it is located at respectively in the blind hole of this dielectric layer, and the height of the end face of this conductive blind hole is lower than the apparent height of this dielectric layer; A plurality of electric contact mats, it is located at respectively on the end face of this conductive blind hole, and the end face width of this electric contact mat is less than the width of the end face of this conductive blind hole; And insulating protective layer, it is located on this dielectric layer, and this insulating protective layer has a plurality of perforates, exposes to this perforate with end face and the electric contact mat that makes this conductive blind hole, and the diameter of the perforate of this insulating protective layer is less than the width of the end face of this conductive blind hole again; And a plurality of conduction towers, it is located at respectively on the end face of the conductive blind hole that exposes in this perforate and coats this electric contact mat, this conduction tower has relative bottom and end, and this bottom coats this electric contact mat, and the width of this bottom is greater than the width of this end again.
In aforesaid base plate for packaging, this plate body also has the line layer that is formed on this dielectric layer.This line layer has a plurality of conductive traces, and this electric contact mat is electrically connected the end place of this conductive trace.
In aforesaid base plate for packaging, the end face length of this electric contact mat is greater than the end face width of this electric contact mat.
As from the foregoing, base plate for packaging of the present utility model, end face width by this electric contact mat is less than the width of the end face of this conductive blind hole, and the end face length of this electric contact mat is greater than the end face width of this electric contact mat, this electrical contact is padded on single axial can form the alar part structure, thereby can increase the respectively distance between this electric contact mat, with the increase wiring space, and then can improve wiring density.
Description of drawings
Figure 1A to Fig. 1 D is the cross-sectional schematic of the method for making of existing base plate for packaging; Wherein, Fig. 1 C ' is the local top view of Fig. 1 C;
Fig. 2 A to Fig. 2 G is the cross-sectional schematic of the method for making of the utility model base plate for packaging; Wherein, Fig. 2 C ' and Fig. 2 G ' are the local top view of Fig. 2 C and Fig. 2 G; And
Fig. 2 H is another embodiment of Fig. 2 G.
Symbol description
1,2,2 ' base plate for packaging
10,20 plate bodys
11,21 internal wirings
12,22 dielectric layers
120,220 blind holes
13,23a, the 23b conductive layer
14 resistance layers
140 open regions
15,25 line layers
15a, the 25a conductive trace
150,250 electric contact mats
150a alar part structure
16,26 conductive blind holes
16a, the 26a end face
17 welding resisting layers
170,270 perforates
19 conductive projections
The 22a surface
24a the first resistance layer
240a the first open region
24b the second resistance layer
240b the second open region
27 insulating protective layers
28 metal levels
29,29 ' conduction tower
The 29a bottom
The 29b end
290 king-posts
291 soldering tin materials
T, the h height
D, w, s width
The r diameter
X end face width
Y end face length
The P distance.
Embodiment
Below by particular specific embodiment, execution mode of the present utility model is described, the personage who is familiar with this skill can understand other advantage of the present utility model and effect easily by content disclosed in the present specification.
Notice, the appended graphic structure that illustrates of this specification, ratio, size etc., equal contents in order to coordinate specification to disclose only, understanding and reading for the personage who is familiar with this skill, be not to limit the enforceable qualifications of the utility model, so technical essential meaning of tool not, the adjustment of the modification of any structure, the change of proportionate relationship or size, do not affecting under the effect that the utility model can produce and the purpose that can reach, all should still drop on the technology contents that the utility model discloses and get in the scope that can contain.Simultaneously, quote in this specification as " on ", D score, " first ", " second ", and the term of " " etc., also only for ease of understanding of narrating, but not in order to limit the enforceable scope of the utility model, the change of its relativeness or adjustment, under without essence change technology contents, when also being considered as the enforceable category of the utility model.
Fig. 2 A to Fig. 2 G is the cross-sectional schematic of the method for making of the utility model base plate for packaging 2.
As shown in Fig. 2 A, a plate body 20 is provided, this plate body 20 has at least one internal wiring 21 and at least one dielectric layer 22, and forms a plurality of blind holes 220 on this dielectric layer 22, makes the part surface of this internal wiring 21 expose to this blind hole 220.
In the present embodiment, be the outermost manufacturing technology of this plate body 20, so only illustrate outermost dielectric layer 22.Therefore, the overall structure of this plate body 20 is not limited with graphic, and it can have multilayer dielectric layer and multilayer internal wiring, or only has one dielectric layer and one deck internal wiring.
As shown in Fig. 2 B, form a conductive layer 23a on the surperficial 22a of this dielectric layer 22 and in this blind hole 220, form again the first resistance layer 24a on this conductive layer 23a and blind hole 220, and this first resistance layer 24a is formed with a plurality of the first open region 240a, make partially conductive layer 23a on the surperficial 22a of this dielectric layer 22 and the subregion of this blind hole 220 expose to those first open regions 240a, this first resistance layer 24a extends in the segment space of this blind hole 220 again.
Then, electroplate formation one line layer 25 and a plurality of conductive blind holes 26 in this first open region 240a.
In the present embodiment, this conductive blind hole 26 is formed in this blind hole 220 to be electrically connected this internal wiring 21.
In addition, this line layer 25 is formed on the surperficial 22a of this dielectric layer 22, and this line layer 25 has a plurality of conductive trace 25a and a plurality of electric contact mat 250, the end place of this conductive trace 25a is electrically connected this electric contact mat 250, as shown in Fig. 2 C ', and these a plurality of electric contact mats 250 are formed at respectively on the end face 26a of this conductive blind hole 26, make this conductive blind hole 26 be electrically connected this line layer 25.
As shown in Fig. 2 C, remove this first resistance layer 24a and under conductive layer 23a.
In the present embodiment, 24a extends in the segment space of this blind hole 220 because of this first resistance layer, and after causing this conductive blind hole 26 of plating, the height h of the end face 26a of this conductive blind hole 26 is lower than the height t of the surperficial 22a of this dielectric layer 22.Thus, the material of this conductive blind hole 26 can not extended on the surperficial 22a of this dielectric layer 22, so can reduce the problem of the electrical bridge joint of dendroid (dendrite) of metal material (as copper).
In addition, the end face width X of this electric contact mat 250 is less than the width d of the end face 26a of this conductive blind hole 26, and the end face length Y of this electric contact mat 250 is greater than the end face width X of this electric contact mat 250, makes the end face of this electric contact mat 250 become the rectangle of tool fillet, as shown in Fig. 2 C '.Therefore, this electric contact mat 250 can not form the alar part structure on single axial (being the direction of end face width X), thereby can increase the respectively distance between this electric contact mat 250, with the increase wiring space, and can satisfy thin space, multijunction demand.
As shown in Fig. 2 D; form an insulating protective layer 27 on this dielectric layer 22, line layer 25 and conductive blind hole 26; and this insulating protective layer 27 has a plurality of perforates 270, exposes to those perforates 270 so that the part surface that makes those conductive blind holes 26 is corresponding with electric contact mat 250.
In the present embodiment; this perforate 270 is circular hole; and the diameter r of this perforate 270 is less than the width d of the end face 26a of this conductive blind hole 26 and greater than the end face width X of this electric contact mat 250; make the design that is formed at non-welding resisting layer definition (non solder mask define, NSMD) on single axial between this insulating protective layer 27 and this electric contact mat 250.
As shown in Fig. 2 E, form a conductive layer 23b on the part surface of this insulating protective layer 27, conductive blind hole 26 and those electric contact mats 250, form a metal level 28 to electroplate.
Then, form the second resistance layer 24b on this metal level 28, and this second resistance layer 24b is formed with a plurality of second open region 240b of this metal level 28 of exposed parts, makes the corresponding metal level 28 that covers on this conductive blind hole 26 of this second resistance layer 24b.
As shown in Fig. 2 F, remove metal level 28 in this second open region 240b with etching mode, the metal level 28 that order keeps is as conduction towers 29.
In the present embodiment; this electric contact mat 250 is gone up and coated to this conduction tower 29 for the part end face 26a of this conductive blind hole 26 that the perforate 270 of being located at this insulating protective layer 27 exposes; and this conduction tower 29 has relative bottom 29a and end 29b, and this bottom 29a coats this electric contact mat 250.
In addition, the diameter r by this perforate 270 is less than the width d of the end face 26a of this conductive blind hole 26, to increase the distance P of this conductive trace 25a and this conduction tower 29, so can avoid the problem of the electrical bridge joint of dendroid (dendrite) of metal material (as copper).
As shown in Fig. 2 G, remove this second resistance layer 24b and under conductive layer 23b, exposing the end 29b of this conduction tower 29, in conjunction with semiconductor chip (figure is slightly).
In the present embodiment; utilize the characteristic of etch metal layers; make the width w of this bottom 29a greater than the width s of this end 29b; thereby this end 29b can not form the alar part structure on this insulating protective layer 27; so can increase the respectively distance between this conduction tower 29; as shown in Fig. 2 G ', to satisfy thin space, multijunction demand.
In addition, because this conduction tower 29 can not form the alar part structure, thus when carrying out temperature cycling test (TCT), there is no metal material on this insulating protective layer 27, thereby cracked (Crack) phenomenon that can avoid the thermal stress inequality to cause.Therefore, can not only promote the reliability of base plate for packaging 2 of the present utility model, and make the test success of this base plate for packaging 2.
In another embodiment, as shown in Fig. 2 H, in follow-up manufacture method, with the king-post 290 that soldering tin material 291 coats as above-mentioned conduction tower 29 structures, this conduction tower 29 ' is made of with soldering tin material 291 this king-post 290.Particularly, this soldering tin material 291 forms by modes such as printing technology (SOP), electroplating technology, electroless plating technology, spray tin technology or dry film printings.Therefore, than the tin ball that existing pure soldering tin material consists of, this soldering tin material 291 coats the contact point structure that this king-post 290 consists of, and can reduce the resistance value of contact point structure.
Again, this conduction tower 29(or king-post 290) be up-narrow and down-wide structure, cause the diameter r of this perforate 270 to conduct electricity tower 29(or king-post 290 with this) maximum gauge identical (i.e. the width w of this bottom 29a), so can strengthen this conduction tower 29(or king-post 290) reliability, so that when this soldering tin material 291 and this conduction tower 29(or king-post 290) contact point structure that consists of carries out push-pull ball when testing, and can avoid the ball problem.
In addition, this conduction tower 29(or king-post 290) up-narrow and down-wide structure have more surface area, so can increase this conduction tower 29(or king-post 290) with the then area of this soldering tin material 291, thereby can increase this conduction tower 29(or king-post 290) and the adhesion of 291 of this soldering tin materials.
As shown in Fig. 2 G and Fig. 2 H, the utility model provides a kind of base plate for packaging 2,2 ', comprising: a plate body 20, a plurality of conductive blind hole 26, a plurality of electric contact mat 250, an insulating protective layer 27 and a plurality of conduction tower 29,29 '.
Described plate body 20 has at least one dielectric layer 22, and this dielectric layer 22 has a plurality of blind holes 220.
Described conductive blind hole 26 is formed in the blind hole 220 of this dielectric layer 22, and the height h of the end face 26a of this conductive blind hole 26 is lower than the surperficial 22a height t of this dielectric layer 22.
Described electric contact mat 250 is formed on the part end face 26a of this conductive blind hole 26, and the end face width X of this electric contact mat 250 is less than the width d of the end face 26a of this conductive blind hole 26.
Described insulating protective layer 27 is formed on this dielectric layer 22; and this insulating protective layer 27 has a plurality of perforates 270; expose to this perforate 270 with part end face 26a and the electric contact mat 250 that makes this conductive blind hole 26, the diameter r of the perforate of this insulating protective layer is less than the width d of the end face of this conductive blind hole again.
Described conduction tower 29,29 ' the end face 26a that is located at respectively this conductive blind hole 26 that exposes in this perforate 270 goes up and coats this electric contact mat 250, the king-post 290 of the conduction tower 29 ' of this conduction tower 29(or another embodiment) have relative bottom 29a and end 29b, this bottom 29a coats this electric contact mat 250, and the width w of this bottom 29a is greater than the width s of this end 29b again.
In an embodiment, this plate body 20 also has the line layer 25 that is formed on this dielectric layer 22, and this line layer 25 has a plurality of conductive trace 25a, and this electric contact mat 250 is electrically connected the end place of this conductive trace 25a.
In an embodiment, the end face length Y of this electric contact mat 250 is greater than the end face width X of this electric contact mat 250, and for example, the end face of this electric contact mat becomes the rectangle (as shown in Fig. 2 C ') of ellipse, rectangle, tool fillet or playground shape etc.
In sum, base plate for packaging of the present utility model, the main end face width of this electric contact mat that passes through is less than the width of the end face of this conductive blind hole, and the end face length of this electric contact mat is greater than the end face width of this electric contact mat, this electrical contact is padded on single axial can form the alar part structure, thereby can increase the respectively distance between this electric contact mat, with the increase wiring space, and then can improve wiring density.
In addition, the height of the end face by this conductive blind hole lower than the height on the surface of this dielectric layer, and increase the distance of this conductive trace and this conduction tower, the problem of the electrical bridge joint of dendroid of metal material (as copper) when overcoming detection, thus can promote reliability.
Above-described embodiment is only in order to illustrative principle of the present utility model and effect thereof, but not is used for restriction the utility model.Any those skilled in the art all can under spirit of the present utility model and category, modify to above-described embodiment.So rights protection scope of the present utility model, should be as listed in claims.
Claims (4)
1. base plate for packaging, it comprises:
Plate body, it has at least one dielectric layer, and this dielectric layer has a plurality of blind holes;
A plurality of conductive blind holes, it is located at respectively in the blind hole of this dielectric layer, and the height of the end face of this conductive blind hole is lower than the apparent height of this dielectric layer;
A plurality of electric contact mats, it is located at respectively on the end face of this conductive blind hole, and the end face width of this electric contact mat is less than the width of the end face of this conductive blind hole; And
Insulating protective layer, it is located on this dielectric layer, and this insulating protective layer has a plurality of perforates, exposes to this perforate with end face and the electric contact mat that makes this conductive blind hole, and the diameter of the perforate of this insulating protective layer is less than the width of the end face of this conductive blind hole again; And
A plurality of conduction towers, it is located at respectively on the end face of the conductive blind hole that exposes in this perforate and coats this electric contact mat, and this conduction tower has relative bottom and end, and this bottom coats this electric contact mat, and the width of this bottom is greater than the width of this end again.
2. base plate for packaging according to claim 1, is characterized in that, this plate body also has the line layer that is formed on this dielectric layer.
3. base plate for packaging according to claim 2, is characterized in that, this line layer has a plurality of conductive traces, and this electric contact mat is electrically connected the end place of this conductive trace.
4. base plate for packaging according to claim 1, is characterized in that, the end face length of this electric contact mat is greater than the end face width of this electric contact mat.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320296491XU CN203277368U (en) | 2013-05-28 | 2013-05-28 | Packaging substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320296491XU CN203277368U (en) | 2013-05-28 | 2013-05-28 | Packaging substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203277368U true CN203277368U (en) | 2013-11-06 |
Family
ID=49507721
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320296491XU Expired - Lifetime CN203277368U (en) | 2013-05-28 | 2013-05-28 | Packaging substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203277368U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105228341A (en) * | 2014-06-30 | 2016-01-06 | Lg伊诺特有限公司 | Printed circuit board (PCB), base plate for packaging and manufacture method thereof |
| CN105282968A (en) * | 2014-05-28 | 2016-01-27 | 京瓷电路科技株式会社 | Method for producing wiring board |
| TWI581386B (en) * | 2014-06-16 | 2017-05-01 | 恆勁科技股份有限公司 | Package apparatus and manufacturing method thereof |
| CN106817835A (en) * | 2015-11-30 | 2017-06-09 | 碁鼎科技秦皇岛有限公司 | Circuit board and preparation method thereof |
-
2013
- 2013-05-28 CN CN201320296491XU patent/CN203277368U/en not_active Expired - Lifetime
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105282968A (en) * | 2014-05-28 | 2016-01-27 | 京瓷电路科技株式会社 | Method for producing wiring board |
| TWI581386B (en) * | 2014-06-16 | 2017-05-01 | 恆勁科技股份有限公司 | Package apparatus and manufacturing method thereof |
| CN105228341A (en) * | 2014-06-30 | 2016-01-06 | Lg伊诺特有限公司 | Printed circuit board (PCB), base plate for packaging and manufacture method thereof |
| CN105228341B (en) * | 2014-06-30 | 2019-06-28 | Lg伊诺特有限公司 | Printed circuit board, package substrate and its manufacturing method |
| CN106817835A (en) * | 2015-11-30 | 2017-06-09 | 碁鼎科技秦皇岛有限公司 | Circuit board and preparation method thereof |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20131106 |
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| CX01 | Expiry of patent term |