CN1802069A - Substrate with high heat conduction and its making process - Google Patents

Substrate with high heat conduction and its making process Download PDF

Info

Publication number
CN1802069A
CN1802069A CN 200510000235 CN200510000235A CN1802069A CN 1802069 A CN1802069 A CN 1802069A CN 200510000235 CN200510000235 CN 200510000235 CN 200510000235 A CN200510000235 A CN 200510000235A CN 1802069 A CN1802069 A CN 1802069A
Authority
CN
China
Prior art keywords
metal
heat
conductive substrate
thermal conductive
copper foil
Prior art date
Application number
CN 200510000235
Other languages
Chinese (zh)
Inventor
黄羽立
卢民中
Original Assignee
照敏企业股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 照敏企业股份有限公司 filed Critical 照敏企业股份有限公司
Priority to CN 200510000235 priority Critical patent/CN1802069A/en
Publication of CN1802069A publication Critical patent/CN1802069A/en

Links

Abstract

Present invention discloses a high heat conduction base plate and manufacture. It mainly uses metal material ( such as aluminium product ) with high coefficient of heat conductivity with pre-drilled hole, setting above-mentioned metal material between two copper foils, utilizing high temperature generated in plates press-fitting to make high heat conduction glue to adhere metal and copper foil layer, said high glue be able to filling-in pre-drilled holes of metal material to form an insulating layer to avoid short circuit in electroplating, quickly conducting electronic component generated high temperature to metal material, increasing radiation area.

Description

Tool high thermal conductive substrate and processing procedure thereof

Technical field

The present invention relates to a kind of tool high thermal conductive substrate and processing procedure thereof, be meant a kind of like this tool high thermal conductive substrate and processing procedure thereof especially, its metal material (as: aluminium) that conductive coefficient is high is sticking to be placed up and down between two copper foil layers, make the heat energy of copper foil layer can be transmitted to the metal material fast, and increase its area of dissipation and radiating effect, and can be on demand metal material and copper foil layer are piled up or make up, produce better heat-dissipating space, and further promote the usefulness of its heat radiation.

Background technology

Applied aspect of circuit board and field are quite wide at present, electronic component in the general electronic products all will be inserted in the circuit board, and circuit board is the element that meets high power and high heat now, is all strengthening to some extent aspect the circuit board heat radiation, to improve its radiating efficiency high power.

In fact, textural in traditional circuit-board, because number of electronic components and consumed power are low, the heat that electronic component produced mostly can conduct out by copper foil layer, directly dissipate in the surrounding air, yet electronic component power height of being laid on the circuit board and quantity are many again now, incident problem is to increase with electric current, the electrical power that is consumed increases, and the problem that the generation amount of localized heat excessively raises, the mode of utilizing electronic component to lead the haptic element heat extraction can't shed most of heat energy, make electronic component and circuit board maintain the demand of normal working temperature, guarantee that overheated working temperature can cause the electronic component physical characteristic to change, and makes electronic component can't reach predetermined task performance, and might burn and reduction of service life.

See also shown in Figure 1, therefore present cooling circuit board way is as primary structure with a copper foil layer A1 and an aluminium sheet A2, and between copper foil layer A1 and aluminium sheet A2, lay a film A3, when the substrate pressing by film A3 cementation copper foil layer A1 and aluminium sheet A2, thereby form a cooling circuit board, electronic component is located on the copper foil layer A1, as above-mentioned structure, the heat that electronic component is produced can conduct to aluminium sheet A2 by copper foil layer A1, enlarges area of dissipation, reinforced platoon's thermal effect.

Yet, the above-mentioned cooling circuit board of commonly using, see the disappearance that its structure but is implied with many manufacturings and uses:

1. commonly use cooling circuit board when heat radiation, only copper foil layer A1 contacts with aluminium sheet A2 partly and can carry out heat conduction, the heat energy of copper foil layer A1 can't permeate fully and conduct to aluminium sheet A2, if radiating effect can be poorer when commonly using cooling circuit board and making multi-layer sheet, increase the volume and the weight of circuit board on the contrary on foot, tangible limitation is arranged on radiating efficiency.

2. aluminium sheet A2 is attached on the copper foil layer A1, thus bigger near the effectiveness of that end performance of copper foil layer A1, and other end aluminium sheet A2 can't effectively conduct because of heat, relatively poor its cost that also increases of effect.

3. the space is subjected to the restriction of substrate volume, also will add the volume of aluminium flake when reality is used except substrate, and the big more employed aluminium sheet A2 of substrate also can increase thereupon.

4. only can do single sided board (because can't electroplate) at present.

5. commonly use cooling circuit board after completing, the processing of can't being holed again can make electro-coppering contact with aluminium sheet A2 two conductors during because of plating and produce short circuit.

The inventor is because the disappearance of the above-mentioned cooling circuit board of commonly using when actual using, and the accumulation individual is engaged on the related industry exploitation practice experience for many years, studies intensively, and develops a kind of high thermal conductive substrate and processing procedure thereof finally.

Therefore, how obtaining the more good cooling circuit board of thermal diffusivity, is to be the general problem of industry.

Summary of the invention

Main purpose of the present invention is to provide a kind of tool high thermal conductive substrate and processing procedure thereof, and the metal material (as: aluminium) that conductive coefficient is high places up and down between two copper foil layers, to increase its area of dissipation.

Secondary objective of the present invention is to provide a kind of tool high thermal conductive substrate and processing procedure thereof, utilizes high-heat-conductivity glue to insert between metal material and the copper foil layer, as the insulation and the medium of cementation, and by high-heat-conductivity glue the heat energy of copper foil layer is transmitted to the metal material fast.

Another object of the present invention is to provide a kind of tool high thermal conductive substrate and processing procedure thereof, with the pre-drilled suitable aperture of metal material, the high temperature that utilizes the pressing process to be produced, and high-heat-conductivity glue can fill up when melting process in the pre-drilled aperture of metal material, when substrate was electroplated after boring, unlikely generation metal material and electro-coppering contact produced short circuit.

For achieving the above object, the present invention proposes a kind of manufacturing method thereof of tool high thermal conductive substrate, the method includes the steps of: (a) the metal material is given alligatoring; (b) pass the pre-drilled suitable aperture of metal material by a drilling machine; (c) high-heat-conductivity glue is inserted between this metal material and the copper foil layer; (d) above-mentioned metal material of pressing and copper foil layer.

Wherein, in the described step (a), this alligatoring action can be adopted the mechanical alligatoring or the alligatoring of sandblasting.

Wherein, in the described step (b), this boring aperture is slightly larger than the size in copper foil layer aperture.

Wherein, in the described step (c), this high-heat-conductivity glue can be solid-state or liquid.

Wherein, in the described step (c), this high-heat-conductivity glue can fill in the metal material by mode of printing.

The invention allows for a kind of high thermal conductive substrate, comprise: a metal material; One high-heat-conductivity glue is layed on this metal material, and wherein this high-heat-conductivity glue can be used as the medium of insulation and cementation; And at least one copper foil layer is formed on this high-heat-conductivity glue.

Preferable, the pre-drilled suitable aperture of this metal material.

Preferable, this metal material is aluminium or copper or iron or aluminium alloy.

Preferable, this high-heat-conductivity glue can be solid-state or liquid.

Tool high thermal conductive substrate and processing procedure thereof involved in the present invention, it mainly is the pre-drilled suitable aperture of metal material (as: aluminium) that conductive coefficient is high, again above-mentioned metal material is placed up and down between two copper foil layers, and insert between this metal material and the copper foil layer medium as insulation and cementation with high-heat-conductivity glue, the high temperature that utilizes sheet material pressing process to be produced, high-heat-conductivity glue is melted metal material and copper foil layer cementation in addition, and high-heat-conductivity glue can fill up when melting process in the pre-drilled aperture of metal material, form an insulating barrier, when substrate is electroplated after boring, unlikely generation metal material and electro-coppering contact produce short circuit, and the high heat that electronic component produced is transmitted to the metal material fast, thereby increase its area of dissipation, make high thermal conductive substrate reach better radiating effect.

Description of drawings

Fig. 1 is an organigram of commonly using cooling circuit board;

Fig. 2 is a processing procedure schematic diagram of the present invention;

Fig. 3 is the enforcement illustration of processing procedure of the present invention;

Fig. 4 is another enforcement illustration of processing procedure of the present invention;

Fig. 5 is a high thermal conductive substrate organigram of the present invention;

Fig. 6 is a thermal energy conduction schematic diagram of the present invention;

Fig. 7 is that multilayer circuit board of the present invention is implemented illustration.

The drawing reference numeral explanation:

A1... copper foil layer A2... aluminium sheet A3... film

(a) .. gives alligatoring with the metal material

(b) .. passes the pre-drilled suitable aperture of metal material by a drilling machine

(c) .. inserts high-heat-conductivity glue between this metal material and the copper foil layer

(d) above-mentioned metal material of .. pressing and copper foil layer

1.... metal material 11... aperture 2... high-heat-conductivity glue

21.. the solid-state high-heat-conductivity glue 3... of liquid high-heat-conductivity glue 22.. copper foil layer

4... high thermal conductive substrate 5... through hole 6... electrodeposited coating

7... electronic component

Embodiment

See also shown in Figure 2ly, the present invention relates to a kind of tool high thermal conductive substrate and processing procedure thereof, wherein this processing procedure comprises following steps:

(a) the metal material is given alligatoring;

(b) pass the pre-drilled suitable aperture of metal material by a drilling machine;

(c) high-heat-conductivity glue is inserted between this metal material and the copper foil layer;

(d) above-mentioned metal material of pressing and copper foil layer.

In the described step (a), be that metal material 1 is performed alligatoring action, in conjunction with more driving fit, and coarsening rate decides according to the thickness of metal material high-heat-conductivity glue 2 with metal material 1 during in order to pressing; The mode of this alligatoring can be carried out in " mechanical alligatoring " or " alligatoring of sandblasting ".

See also Fig. 3 and shown in Figure 4, and step (b) is to pass metal material 1 pre-drilled suitable aperture 11 by a drilling machine, and boring aperture 11 is slightly larger than the size of copper foil layer, so that high-heat-conductivity glue is inserted in the aperture 11, and this high-heat-conductivity glue 2 can be divided into liquid high-heat-conductivity glue 21 and solid-state high-heat-conductivity glue 22.

Moreover step (c) is inserted high-heat-conductivity glue 2 between this metal material 1 and the copper foil layer 3, inserts the mode of high-heat-conductivity glue and can divide into:

Printing-type: utilize mode of printing that liquid high-heat-conductivity glue 21 printings are filled in the metal material, liquid high-heat-conductivity glue 21 is flowed in the aperture 11 of metal material 1, fill up aperture 11.(as shown in Figure 3)

Melt the formula of filling out: solid-state high-heat-conductivity glue 22 is layed between metal material 1 and the copper foil layer 3, the high temperature that is produced when utilizing pressing, after solid-state high-heat-conductivity glue 22 melted, and solid-state high-heat-conductivity glue 22 can flow into when melting process in the pre-drilled aperture 11 of metal material 1, also fills up aperture 11 (as shown in Figure 4).

See also shown in Figure 5ly, (d) is described for step, above-mentioned metal material 1, copper foil layer 3 and high-heat-conductivity glue 2 is carried out the pressing action, to form a high thermal conductive substrate 4.

Above-mentioned high thermal conductive substrate 4 comprises: a metal material 1; One high-heat-conductivity glue 2 is layed on this metal material 1, and wherein this high-heat-conductivity glue 2 can be used as the medium of insulation and cementation; And at least one copper foil layer 3 is formed on this high-heat-conductivity glue.

See also shown in Figure 6, when this high thermal conductive substrate 4 is made into circuit board, must be drilled with some through holes 5 earlier, and electroplate an electrodeposited coating 6 in the hole wall of this through hole 5, electronic component plugs or as the path of two copper foil layers, 3 signal conductings, at this moment, form an insulating barrier, electrodeposited coating 6 is not in contact with one another with metal material 1 and produces short circuit by forming high-heat-conductivity glue 2.

As mentioned above, when this electronic component 7 is embedded at copper foil layer 3 and when producing heat energy, heat energy can be by high-heat-conductivity glue 2 as heat conducting medium, thermal energy conduction is arrived metal material 1, heat energy is absorbed and energy average mark source of heat release, or conduct to the copper foil layer 3 of 4 times laminar surfaces of high thermal conductive substrate indirectly, constantly thermal energy exchange is derived via copper foil layer 3, and reach the purpose of quick heat radiating.

In addition, be the radiating effect of Da Gengjia, can replace above-mentioned metal material 1 by the preferable metal material (as: iron, aluminium alloy etc.) of conductive coefficient, to increase the conduction efficiency of heat energy.

Another embodiment of the present invention, as shown in Figure 7, described in above-mentioned high thermal conductive substrate, for further reaching better radiating effect, this high thermal conductive substrate 4 can multilayer metal material 1 and copper foil layer 3 combinations, and insert between this metal material 1 and the copper foil layer 3 as insulating and the medium of cementation, thereby can increase the area of dissipation of high thermal conductive substrate 4 with high-heat-conductivity glue 2, use the efficient that promotes heat radiation again, to reach the purpose that increases area and conduct heat energy fast.

Above-listed detailed description is specifying at a possible embodiments of the present invention, only this embodiment limits scope of the invention process in order to this, allly do not break away from the equivalence of doing and implement and change according to skill spirit of the present invention, for example: wait the equivalence embodiment of variation, all should be contained in the claim of the present invention.

Claims (15)

1. the manufacturing method thereof of a tool high thermal conductive substrate, the method includes the steps of:
(a) the metal material is given alligatoring;
(b) pass the pre-drilled suitable aperture of metal material by a drilling machine;
(c) high-heat-conductivity glue is inserted between this metal material and the copper foil layer;
(d) above-mentioned metal material of pressing and copper foil layer.
2. the manufacturing method thereof of tool high thermal conductive substrate as claimed in claim 1 is characterized in that, in the described step (a), this alligatoring action can be adopted mechanical alligatoring.
3. the manufacturing method thereof of tool high thermal conductive substrate as claimed in claim 1 is characterized in that, in the described step (a), this alligatoring action can be adopted the alligatoring of sandblasting.
4. the manufacturing method thereof of tool high thermal conductive substrate as claimed in claim 1 is characterized in that, in the described step (b), this boring aperture is slightly larger than the size in copper foil layer aperture.
5. the manufacturing method thereof of tool high thermal conductive substrate as claimed in claim 1 is characterized in that, in the described step (c), this high-heat-conductivity glue can be solid-state.
6. the manufacturing method thereof of tool high thermal conductive substrate as claimed in claim 1 is characterized in that, in the described step (c), this high-heat-conductivity glue can be liquid state.
7. the manufacturing method thereof of tool high thermal conductive substrate as claimed in claim 1 is characterized in that, in the described step (c), this high-heat-conductivity glue can fill in the metal material by mode of printing.
8. high thermal conductive substrate comprises:
One metal material;
One high-heat-conductivity glue is layed on this metal material, and wherein this high-heat-conductivity glue can be used as the medium of insulation and cementation; And
At least one copper foil layer is formed on this high-heat-conductivity glue.
9. high thermal conductive substrate as claimed in claim 8 is characterized in that, the pre-drilled suitable aperture of this metal material.
10. high thermal conductive substrate as claimed in claim 8 is characterized in that, this metal material is an aluminium.
11. high thermal conductive substrate as claimed in claim 8 is characterized in that, this metal material is a copper.
12. high thermal conductive substrate as claimed in claim 8 is characterized in that, this metal material is an iron.
13. high thermal conductive substrate as claimed in claim 8 is characterized in that, this metal material is an aluminium alloy.
14. high thermal conductive substrate as claimed in claim 8 is characterized in that, this high-heat-conductivity glue can be solid-state.
15. high thermal conductive substrate as claimed in claim 8 is characterized in that, this high-heat-conductivity glue can be liquid state.
CN 200510000235 2005-01-05 2005-01-05 Substrate with high heat conduction and its making process CN1802069A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 200510000235 CN1802069A (en) 2005-01-05 2005-01-05 Substrate with high heat conduction and its making process

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 200510000235 CN1802069A (en) 2005-01-05 2005-01-05 Substrate with high heat conduction and its making process

Publications (1)

Publication Number Publication Date
CN1802069A true CN1802069A (en) 2006-07-12

Family

ID=36811741

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 200510000235 CN1802069A (en) 2005-01-05 2005-01-05 Substrate with high heat conduction and its making process

Country Status (1)

Country Link
CN (1) CN1802069A (en)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101677488B (en) * 2008-09-18 2010-12-08 王俣韡 High thermal conductive substrate structure and production method thereof
CN102076165A (en) * 2011-01-30 2011-05-25 乐健线路板(珠海)有限公司 Double-layer high-heat dissipation sandwich metal base printed circuit board
CN102548368A (en) * 2012-02-13 2012-07-04 中兴通讯股份有限公司 Radiation structure, electronic equipment and radiation method
CN102573413A (en) * 2011-12-07 2012-07-11 深圳市爱诺菲科技有限公司 Graphene radiation material, and preparation method and application thereof
CN102625563A (en) * 2011-01-31 2012-08-01 华通电脑股份有限公司 Multilayer circuit board with embedded heat-conducting metal blocks and manufacturing method thereof
CN102892250A (en) * 2011-07-18 2013-01-23 上海贺鸿电子有限公司 Printed circuit board and manufacturing method thereof
CN106163082A (en) * 2015-05-12 2016-11-23 三星电机株式会社 Circuit board and manufacture method thereof
CN106304657A (en) * 2016-11-09 2017-01-04 恩达电路(深圳)有限公司 The production method of multi-layer thick copper heat conduction localized metallic substrate
CN109312728A (en) * 2016-04-20 2019-02-05 希斯特曼提克有限责任公司 Control system, fastening system, compressor apparatus and the method for manipulating compressor apparatus
WO2019041885A1 (en) * 2017-08-31 2019-03-07 昆山国显光电有限公司 Flexible display device and manufacturing method therefor

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101677488B (en) * 2008-09-18 2010-12-08 王俣韡 High thermal conductive substrate structure and production method thereof
CN102076165A (en) * 2011-01-30 2011-05-25 乐健线路板(珠海)有限公司 Double-layer high-heat dissipation sandwich metal base printed circuit board
CN102625563A (en) * 2011-01-31 2012-08-01 华通电脑股份有限公司 Multilayer circuit board with embedded heat-conducting metal blocks and manufacturing method thereof
CN102625563B (en) * 2011-01-31 2014-11-12 华通电脑股份有限公司 Multilayer circuit board with embedded heat-conducting metal blocks and manufacturing method thereof
CN102892250A (en) * 2011-07-18 2013-01-23 上海贺鸿电子有限公司 Printed circuit board and manufacturing method thereof
CN102573413A (en) * 2011-12-07 2012-07-11 深圳市爱诺菲科技有限公司 Graphene radiation material, and preparation method and application thereof
WO2013120312A1 (en) * 2012-02-13 2013-08-22 中兴通讯股份有限公司 Heat-radiating structure, electronic device and heat-radiating method
CN102548368A (en) * 2012-02-13 2012-07-04 中兴通讯股份有限公司 Radiation structure, electronic equipment and radiation method
CN106163082A (en) * 2015-05-12 2016-11-23 三星电机株式会社 Circuit board and manufacture method thereof
CN109312728A (en) * 2016-04-20 2019-02-05 希斯特曼提克有限责任公司 Control system, fastening system, compressor apparatus and the method for manipulating compressor apparatus
CN106304657A (en) * 2016-11-09 2017-01-04 恩达电路(深圳)有限公司 The production method of multi-layer thick copper heat conduction localized metallic substrate
CN106304657B (en) * 2016-11-09 2019-02-26 恩达电路(深圳)有限公司 The production method of the thermally conductive localized metallic substrate of multi-layer thick copper
WO2019041885A1 (en) * 2017-08-31 2019-03-07 昆山国显光电有限公司 Flexible display device and manufacturing method therefor
US10796613B2 (en) 2017-08-31 2020-10-06 Kunshan Go-Visionox Opto-Electronics Co., Ltd. Flexible display device and manufacturing method therefor

Similar Documents

Publication Publication Date Title
KR101992924B1 (en) Manufacturing method of printing circuit board with micro-radiators
CN1282403C (en) Multilayer wiring board
CN101299908B (en) Method for manufacturing printed circuit board having embedded component
CN1171514C (en) Low-CTE power source and stratum
CN1201642C (en) Printed circuit plate and its mfg. method
CN1276454C (en) Fusing device and method of low impedance polymer substrate
KR101153766B1 (en) Multilayer wiring substrate having cavity portion
CN100518452C (en) Printed circuit board and manufacturing method thereof
CN1242496C (en) Substrate for LED
CN1217566C (en) Method for making multi-layer circuit assembly
CN1189068C (en) Multi-layered printed wiring board and prodn. method thereof
CN101572285B (en) Light-emitting device packageing and method for fabricating the same
JP3988764B2 (en) Printed wiring board substrate, printed wiring board, and printed wiring board substrate manufacturing method
US8263870B2 (en) Heat dissipating wiring board, method for manufacturing same, and electric device using heat dissipating wiring board
CN1238913C (en) Accumulator
KR101411194B1 (en) Electronic parts built-in distributing board, and radiating method for the electronic parts built-in distributing board
CN101861049B (en) Thick copper circuit board and circuit etching and solder-resisting manufacturing methods thereof
EP2312916A2 (en) Circuit board and semiconductor module
CN1229006C (en) Circuit forming board producing method, circuit foaming board, material for circuit forming board
JP2010241101A (en) Heat-radiation substrate and module substrate for lighting each having hybrid layer
CN101536623B (en) Led with integral thermal via
US20080278917A1 (en) Heat dissipation module and method for fabricating the same
KR100912051B1 (en) Printed board and printed board manuafctruing method
EP2658356A1 (en) Manufacturing method for printed circuit board with insulated micro radiator
CN1198486C (en) Printed-wiring board with cavity for mounting electronic component and manufacture thereof

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication