CN102300397A - Metal matrix circuit board and manufacturing method thereof - Google Patents
Metal matrix circuit board and manufacturing method thereof Download PDFInfo
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- CN102300397A CN102300397A CN201110181156A CN201110181156A CN102300397A CN 102300397 A CN102300397 A CN 102300397A CN 201110181156 A CN201110181156 A CN 201110181156A CN 201110181156 A CN201110181156 A CN 201110181156A CN 102300397 A CN102300397 A CN 102300397A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
- H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB
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- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention discloses a metal matrix circuit board and a manufacturing method thereof. The method comprises the following steps: arranging a stitching layer on a surface of an upper layer circuit, wherein a groove is arranged on the stitching layer and a bottom of the groove at least reaches the upper layer circuit; electroplating the groove, wherein a metal which is electroplated on the groove forms the metal matrix. By using technology schemes of an embodiment of the invention, the metal matrix, which is used for heat dissipation, can be embedded in the circuit board. Therefore, heat in the circuit board can be dissipated through the metal matrix. And if a component is installed above the metal matrix, the metal matrix can dissipate the heat for the component.
Description
Technical field
The present invention relates to technical field of electronic encapsulation, be specifically related to a kind of metal-base circuit plate and manufacture method thereof.
Background technology
Current electronic product develops towards both direction: the integrated level of one side product is more and more higher, power consumption constantly increases; Product is more and more lighter, thin, short on the other hand.This just makes that the heat radiation contradiction of product is more and more outstanding.One of crucial pillar that the integrated circuit encapsulation develops as electronics and information industry also constantly develops to high integration, high-performance, high reliability, low-power consumption and low-cost direction.Circuit board particularly wherein as the base plate for packaging of the main carrier of encapsulated integrated circuit, is required to have better heat dispersion.
As shown in Figure 1, the method for raising base plate for packaging heat dispersion commonly used is at present, goes up lamination layer of metal plate at base plate for packaging (a) and dispels the heat as Metal Substrate (b).Realize the purpose of high efficiency and heat radiation, will the thicker Metal Substrate of lamination.Yet this method only can can't in time derive the heat of circuit board inside from the outermost surperficial heat conduction of circuit board, and radiating effect is not good.
Summary of the invention
The embodiment of the invention provides a kind of metal-base circuit plate and manufacture method thereof, and the metal-base circuit plate that adopts this method to make can in time be derived the heat of circuit board inside, improves radiating efficiency.
A kind of manufacture method of metal-base circuit plate comprises:
On the surface of last layer circuit the pressing layer is set;
Offer groove on described pressing layer, the bottom of described groove is arrived at described last layer circuit at least;
Described groove is electroplated, and the metal of electroplating in described groove forms Metal Substrate.
A kind of metal-base circuit plate comprises:
Substrate is positioned at the circuit layer of substrate surface, and the pressing layer that is arranged on the circuit layer surface;
Offer the groove that arrives at described circuit layer on the described pressing layer, be provided with in the described groove and electroplate the Metal Substrate that forms.
The embodiment of the invention adopts and offer groove on the pressing layer of circuit board, groove is electroplated the technical scheme that forms the Metal Substrate that is positioned at groove, make the Metal Substrate that is used to dispel the heat to embed circuit board inside, thereby the metal-base circuit plate of making can distribute by the heat of this Metal Substrate that embeds circuit board inside with circuit board inside, and when components and parts being installed, can also be this components and parts heat radiation as if this Metal Substrate top.
Description of drawings
The schematic diagram of the circuit board of Fig. 1 is existing lamination layer of metal base;
Fig. 2 is the flow chart of the manufacture method of the metal-base circuit plate that provides of the embodiment of the invention;
Fig. 3 a-3n is the schematic diagram of metal-base circuit plate in manufacture process of one embodiment of the invention;
Fig. 4 a-4j is the schematic diagram of metal-base circuit plate in manufacture process of one embodiment of the invention.
Embodiment
The embodiment of the invention provides a kind of manufacture method of metal-base circuit plate, comprising: on the surface of last layer circuit the pressing layer is set; Offer groove on described pressing layer, the bottom of described groove is arrived at described last layer circuit at least; Described groove is electroplated, and the metal of electroplating in described groove forms Metal Substrate.The embodiment of the invention also provides the corresponding metal base circuit board.Below be elaborated respectively.
Embodiment one,
Please refer to Fig. 2, the embodiment of the invention provides a kind of manufacture method of metal-base circuit plate.
The manufacturing of circuit board is from the processing to substrate.Substrate (Core) is a stock of making circuit board.Shown in Fig. 3 a, substrate comprises the insulating medium layer 210 and the metal conducting layer 220 that covers the dielectric outside of internal layer, and said insulating medium layer 210 can be epoxy resin, glass cloth etc., and said metal conducting layer 220 can be a Copper Foil.Usually, said substrate can be a copper clad laminate.
Can produce circuitous pattern by carry out steps such as pad pasting, exposure, development, etching, striping on the metal conducting layer of substrate, the metal conducting layer of having made circuit can be called circuit layer.Said pad pasting can be to paste dry film (Dry film).Dry film is a kind of high molecular compound, and it can produce a kind of polymerization reaction after by ultraviolet irradiation and form a kind of stable material and be attached to substrate surface, stops and electroplates and etched function thereby reach.Stick dry film at the metallic conduction laminar surface, the dry film that does not need to form the position of circuit is blocked with light-locking material, utilize ultraviolet ray that dry film is exposed then, utilize developer solution to develop again, wherein, the dry film exposure back that is not blocked is blocked the dry film of failing to expose and is dissolved in the developer solution attached to the metallic conduction laminar surface.Carry out etching then, the part of not protected by dry film of metal conducting layer is fallen etched liquid corrosion, and protected portions then remains the formation circuitous pattern.At last dry film is removed, then make circuit and just accuse to finish with the step that forms circuit layer.
Can only make circuit, make single sided board in the one side of substrate; Also can make circuit at the upper and lower surface of substrate simultaneously, make double sided board; Can also make multi-layer sheet with gap method (Clearance Hole) method, Layer increasing method (Build Up) method, the logical method methods such as (PTH) of plating.The method of the embodiment of the invention is directed to multi-layer sheet.
Please refer to Fig. 2, the manufacture method of the metal-base circuit plate that the embodiment of the invention provides comprises:
110, on the surface of last layer circuit the pressing layer is set.
Said last layer circuit can refer to the circuit that substrate surface is made.But along with the increase of the number of plies, said last layer circuit also can be meant the circuit of other layer.Can the pressing layer be set by dual mode.A kind of mode, described pressing layer comprises: the insulating medium layer and the metal conducting layer that is arranged on described dielectric laminar surface that are arranged on the last layer circuit surface.Shown in Fig. 3 g, the pressing layer that this mode is provided with comprises: the insulating medium layer 240 and the metal conducting layer 250 that is arranged on described dielectric laminar surface that are arranged on circuit layer 231 surfaces.Another kind of mode, described pressing layer comprises: be arranged on the prepreg and next laminar substrate that is arranged on described prepreg surface of described last layer circuit surface, the one side that contacts described prepreg at least of described next laminar substrate has been made circuit.In the above dual mode, described setting can be that the mode by pressing is provided with.
In a kind of execution mode, for the heat with a circuit of substrate is delivered to another side preferably, before the step 110, can make the heat conduction through hole earlier on substrate, concrete steps comprise:
101, on substrate, offer through hole and described through hole metallized.
Shown in Fig. 3 b, on substrate, offered through hole 301 in advance.Then through hole 301 is metallized, so that realize the heat conduction of upper and lower surface.Shown in Fig. 3 c, metallization is meant precipitation layer of metal 302, for example copper on the hole wall of through hole 301.Here the through hole of offering 301 is the through holes that are used for heat conduction, in actual processing procedure, also can offer the through hole that other is used to conduct electricity according to the needs of circuit, to realize the electrical connection between two-tier circuit.
102, fill Heat Conduction Material in described through hole, described Heat Conduction Material is cured resin or metal paste.
In order to increase the sectional area that through hole heat is transmitted, improve heat and pass on efficient, can fill Heat Conduction Material 303 in the through hole after metallization, shown in Fig. 3 d.The Heat Conduction Material 303 of being filled can be cured resin or metal paste.
103, the substrates that carry out step 101 and 102 processing are carried out electroless copper plating or plating, form the metal conducting layer on covered substrate surface.
Shown in Fig. 3 e, can carry out electroless copper plating or plating to the substrates that carried out step 101 and 102 processing, thereby on original metal conducting layer, form the metal conducting layer 230 on new covered substrate surface.If the Heat Conduction Material of filling is the cured resin of insulation, then the method by electroless copper plating forms metal conducting layer 230; If the Heat Conduction Material of filling is the metal paste of conduction, then form metal conducting layer 230 by electric plating method.The purpose that metal conducting layer 230 is set is to prepare for follow-up plating forms Metal Substrate, if Heat Conduction Material is the cured resin of insulation, is not carrying out earlier under the situation of electroless copper plating, follow-up can't the plated metal base; If Heat Conduction Material is the metal paste of conduction, under the situation of advanced electroplating not, the follow-up Metal Substrate that also is difficult to electroplate adequate thickness.Form metal conducting layer, mean that the heat conduction through hole finishes.Certainly, also can be above this copper facing hole lamination one heat conductive insulating layer, and then heavy copper electroplates, thus, this copper facing hole can realize also that except that as the thermal hole interlayer circuit connects.
104, on described metal conducting layer, make circuit.
Shown in Fig. 3 f, after the heat conduction through hole completes, can on metal conducting layer 230, carry out steps such as pad pasting, exposure, development, etching, striping and make circuitous pattern, form circuit layer 231.
Then, execution in step 110 again, are that the surface of circuit layer 231 is provided with the pressing layer at the last layer circuit.
120, offer groove on described pressing layer, the bottom of described groove is arrived at described circuit layer at least.
Shown in Fig. 3 h, on the pressing layer, offer groove 304, so that follow-up making embeds the Metal Substrate of groove.Groove 304 will possess certain degree of depth, and the last layer circuit can be arrived in its bottom, and promptly circuit layer 231, certainly, and also can be darker.The position of groove can be corresponding to the position of through hole 301 on the pressing layer.
130, described groove is electroplated, the metal of electroplating in described groove forms Metal Substrate.
Groove is electroplated, electroplated metal in groove and promptly be formed for the Metal Substrate of dispelling the heat.This step specifically can comprise:
131, at the position of not offering groove of described pressing layer dry film is set.
Shown in Fig. 3 i, this step is provided with dry film 260 at other position of not offering groove of pressing layer, and purpose is to prevent that the position beyond the groove from being electroplated.The step that dry film is set specifically comprises pad pasting, exposure and development, and as mentioned before, this place is no longer described in detail.
132, described groove is electroplated, made that electroplated metal reaches default thickness in the groove.
After dry film sets, can electroplate, can control the thickness of coating, when reaching default thickness, stop to electroplate groove.Shown in Fig. 3 j, plating finishes, the metal in the groove, and promptly Metal Substrate 305 can be a little more than the included metal conducting layer 250 of pressing layer.
133, remove dry film, surface evening.
Shown in Fig. 3 k and Fig. 3 l, remove dry film at last, with Metal Substrate 305 and concordant the getting final product of metal conducting layer 250 arrangements.
So far, Metal Substrate is made and is finished.The Metal Substrate of making is arranged in the groove of offering, and its top is concordant with outer field metal conducting layer 250, and the bottom contacts with the circuit layer 231 of internal layer, can high efficiency conduction heat.And, because groove is opened in the position at through hole place, the Heat Conduction Material of the filling in the Metal Substrate in the groove and the through hole can be connected by circuit layer 231, all offer groove on the two sides of circuit board and be provided with under the situation of Metal Substrate, the Metal Substrate on two sides can be by the good transmission heat of Heat Conduction Material in the through hole.
After Metal Substrate completes, on outermost two metal conducting layers, carry out steps such as pad pasting, exposure, development, etching, striping and make outermost circuitous pattern, form outermost circuit layer, set solder mask and pad then, the metal-base circuit plate promptly completes.
The ifs circuit plate need be provided with more multi-layered circuit, and a plurality of pressing layers just need be set, and making at least on each pressing layer, one deck circuit forms circuit layer.Under this application scenarios, can finish the making of metal-base circuit plate by following dual mode:
Mode one: after step 130 forms Metal Substrate, make one deck circuit on the pressing layer that is provided with, repeated execution of steps 110-130 promptly, repeats the described pressing layer that is provided with then, offers groove, the step that groove is electroplated.Describe in detail below, please refer to Fig. 3 m, after step 130, can comprise:
On current pressing layer, make one deck circuit to form novel circuit layer 251;
On these novel circuit layer 251 surfaces new pressing layer is set;
Offer new groove on described new pressing layer, described novel circuit layer 251 is arrived in the bottom of described new groove;
Described new groove is electroplated, and the metal of electroplating in described new groove forms new Metal Substrate 306.
Adopt this kind mode, every increase pressing layer (abbreviation increases layer) once, is made one time Metal Substrate, and last, a plurality of Metal Substrate of repeatedly making connect into integral body, form final Metal Substrate.
Mode two: repeated execution of steps 110 before step 120, and a plurality of pressing layers are set, and up to reaching the circuitry needed number of plies, wherein, the every setting before the next pressing layer produced circuit on a last pressing layer.And then execution in step 120, on a plurality of pressing layers, offer groove, and make the bottom of groove arrive at the circuit layer of innermost layer, execution in step 130 then, this bottom arrived at the groove of innermost layer circuit layer and electroplated, and form Metal Substrate.Please refer to Fig. 3 n, the Metal Substrate that this mode forms is the Metal Substrate 305 of a monoblock.
More than, the manufacture method of the manufacture method of 3a-3n metal-base circuit plate that the embodiment of the invention is provided has been described in detail in conjunction with the accompanying drawings.Wherein, the pressing layer is set described in the 110-130, offers groove, to the step that groove is electroplated, can carry out in the both sides of substrate simultaneously, two faces of the circuit board of making at last are provided with embedded metal base 305.
Yet the method that the embodiment of the invention provides also is applicable to other scene.For example shown in Fig. 4 a-4j, described in the 110-140 pressing layer is set, offers groove, to the step that groove is electroplated, can only carry out, promptly on a surface of substrate, only form the formula Metal Substrate 305 that embeds, produce outer circuit in this one side that is embedded with Metal Substrate then at a face; The metallic plate that is used to dispel the heat 300 that monoblock then can be set at the another side of substrate is as the metal heat-conducting layer, and is concrete, can be the adhesive linkage 400 that the opposite face of described circuit layer forms insulation at another side, and on adhesive linkage 400 bonding heat-conducting metal layer.
Further, under the situation that offers heat conduction through hole 301 on the substrate, said embedded metal base 305 and described metallic plate 300 can contact with each other by the Heat Conduction Material 303 of filling in the through hole 301, with better transmission heat, and heat radiation more efficiently.
Further, if this circuit board is packaged with components and parts in this groove top, as chip, this Metal Substrate also can be this components and parts heat radiation.Certainly, also can make circuit layer, the pressing layer is set on circuit layer at two faces of substrate, and on the pressing layer, offer groove and groove is electroplated, then, the insulating barrier of lamination heat conduction on the circuit layer of the pressing layer of a side therein, and this metallic plate is set on this insulating barrier.
To sum up, present embodiment has been introduced a kind of manufacture method of metal-base circuit plate, employing is offered groove on the pressing layer of circuit board, groove is electroplated the technical scheme that forms the Metal Substrate that is positioned at groove, on the one hand, realized that the Metal Substrate that will be used to dispel the heat embeds circuit board inside, thereby the heat of the inside of circuit board can be distributed by this Metal Substrate that embeds in the groove, and it is selectable in two outermost layer wirings (that is: in a face or two face wirings), and then be suitable for various types of packing forms, when only in the groove of pressing layer, Metal Substrate being set, can also reduce the thickness of Metal Substrate cooling circuit board; On the other hand, Metal Substrate and circuit board are connected as a single entity, and can reduce the thermal resistance between them, to realize high efficiency and heat radiation.This technical scheme is particularly useful for the making of the envelope transglutaminase substrate class circuit board of encapsulated integrated circuit, certainly, also can be used for the making of other all kinds circuit board.
Embodiment two,
Please refer to Fig. 3 a-3n, the embodiment of the invention provides a kind of metal-base circuit plate, comprising:
Offer the groove 304 that arrives at described circuit layer on the described pressing layer, be provided with in the described groove and electroplate the Metal Substrate 305 that forms.
Wherein, described pressing layer can comprise: the insulating medium layer and the metal conducting layer that is arranged on described dielectric laminar surface that are arranged on described last layer circuit surface; Perhaps, described pressing layer also can comprise: be arranged on the prepreg and next laminar substrate that is arranged on described prepreg surface of described last layer circuit surface, the one side that contacts described prepreg at least of described next laminar substrate has been made circuit.
In a kind of execution mode, the position corresponding to described groove 304 on the described substrate 210 offers plated-through hole 301, is filled with Heat Conduction Material 303 in the described through hole 301, and described Heat Conduction Material 303 is cured resin or metal paste.
In the another kind of execution mode, described circuit layer 231 comprises last circuit layer and the following circuit layer that is positioned at substrate 210 upper surfaces, and described pressing layer comprises the last pressing layer that described upward circuit laminar surface is set and is arranged on the described following pressing layer on circuit layer surface down.
In another execution mode, described pressing layer comprises the sub-pressing layer more than two that sets gradually, and described groove 304 and the Metal Substrate 305 that is arranged in the described groove 304 run through described two-layer above sub-pressing layer.
In another execution mode, this circuit board also comprises adhesive linkage and metal heat-conducting layer, described circuit layer is positioned at a surface of described substrate, this adhesive linkage one surface adhesion in this substrate with this circuit layer facing surfaces, another surface of this adhesive linkage is provided with this metal heat-conducting layer.
The metal-base circuit plate that present embodiment provides can be the Metal Substrate base plate for packaging specifically, is used for the encapsulation of integrated circuit; Also can be other various types of circuit boards, for example system circuit board, radio frequency circuit board, power supply circuit board or the like.
The metal-base circuit plate that present embodiment provides, on the one hand, realized that the Metal Substrate that will be used to dispel the heat embeds circuit board inside, thereby two outermost layers of circuit board can be connected up, be suitable for various types of packing forms, and can reduce the thickness of Metal Substrate cooling circuit board; On the other hand, Metal Substrate and circuit board are connected as a single entity, and can reduce the thermal resistance between them, to realize high efficiency and heat radiation.
Below only be the preferable embodiment of the present invention; just be used for helping to understand method of the present invention and core concept thereof; but protection scope of the present invention is not limited thereto; anyly be familiar with those skilled in the art in the technical scope that the present invention discloses; the variation that can expect easily or replacement all should be encompassed within protection scope of the present invention.Protection scope of the present invention should be as the criterion with the protection range of claim.
Claims (14)
1. the manufacture method of a metal-base circuit plate is characterized in that, comprising:
On the surface of last layer circuit the pressing layer is set;
Offer groove on described pressing layer, the bottom of described groove is arrived at described last layer circuit at least;
Described groove is electroplated, and the metal of electroplating in described groove forms Metal Substrate.
2. method according to claim 1 is characterized in that, describedly also comprises before the last layer circuit surface is provided with the pressing layer:
On substrate, offer through hole and described through hole is metallized;
Fill Heat Conduction Material in described through hole, described Heat Conduction Material is cured resin or metal paste;
The substrate that has carried out above-mentioned processing is electroplated, formed the metal conducting layer on covered substrate surface;
On described metal conducting layer, make circuit.
3. method according to claim 2 is characterized in that, describedly offers groove comprise on the pressing layer:
On described pressing layer, offer groove corresponding to the position of described through hole.
4. method according to claim 1 is characterized in that, described groove is electroplated comprises:
The position of not offering groove at described pressing layer is provided with dry film;
Described groove is electroplated, made that electroplated metal reaches default thickness in the groove;
Remove dry film, surface evening.
5. method according to claim 1 is characterized in that:
Described pressing layer comprises: the insulating medium layer and the metal conducting layer that is arranged on described dielectric laminar surface that are arranged on described last layer circuit surface; Perhaps,
Described pressing layer comprises: be arranged on the prepreg and next laminar substrate that is arranged on described prepreg surface of described last layer circuit surface, the one side that contacts described prepreg at least of described next laminar substrate has been made circuit.
6. according to each described method in the claim 1 to 5, it is characterized in that, described groove is electroplated after, also comprise:
On described pressing layer, make one deck circuit;
Repeat the described pressing layer that is provided with, offer groove, the step that groove is electroplated.
7. according to each described method in the claim 1 to 5, it is characterized in that:
Described surface at the last layer circuit is provided with the pressing layer and comprises: the surface at the last layer circuit is provided with at least two pressing layers, and wherein, the every setting before the next pressing layer produced circuit on a last pressing layer;
Describedly comprise offering groove on the pressing layer: begin groove on described at least two pressing layers, described last layer circuit is arrived in the bottom of described groove.
8. method according to claim 1 and 2 is characterized in that, described groove is electroplated, and the metal formation Metal Substrate of electroplating in described groove also comprises afterwards:
Form adhesive linkage at the opposite face of described last layer circuit, and on adhesive linkage bonding heat-conducting metal layer.
9. a metal-base circuit plate is characterized in that, comprising:
Substrate is positioned at the circuit layer of substrate surface, and the pressing layer that is arranged on the circuit layer surface;
Offer the groove that arrives at described circuit layer on the described pressing layer, be provided with in the described groove and electroplate the Metal Substrate that forms.
10. metal-base circuit plate according to claim 9 is characterized in that:
Described pressing layer comprises: the insulating medium layer and the metal conducting layer that is arranged on described dielectric laminar surface that are arranged on described last layer circuit surface; Perhaps,
Described pressing layer comprises: be arranged on the prepreg and next laminar substrate that is arranged on described prepreg surface of described last layer circuit surface, the one side that contacts described prepreg at least of described next laminar substrate has been made circuit.
11. metal-base circuit plate according to claim 9 is characterized in that:
Position corresponding to described groove on the described substrate offers plated-through hole, is filled with Heat Conduction Material in the described through hole, and described Heat Conduction Material is cured resin or metal paste.
12. metal-base circuit plate according to claim 9 is characterized in that:
Described circuit layer comprises last circuit layer that is positioned at upper surface of base plate and the following circuit layer that is positioned at base lower surface, and described pressing layer comprises the last pressing layer that described upward circuit laminar surface is set and is arranged on the described following pressing layer on circuit layer surface down.
13. metal-base circuit plate according to claim 9 is characterized in that:
Described pressing layer comprises the sub-pressing layer more than two that sets gradually, and described groove and the Metal Substrate that is arranged in the described groove run through described two-layer above sub-pressing layer.
14. according to claim 9 or 13 described metal-base circuit plates, it is characterized in that: this circuit board also comprises adhesive linkage and metal heat-conducting layer, described circuit layer is positioned at a surface of described substrate, this adhesive linkage one surface adhesion in this substrate with this circuit layer facing surfaces, another surface of this adhesive linkage is provided with this metal heat-conducting layer.q
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110181156A CN102300397A (en) | 2011-06-30 | 2011-06-30 | Metal matrix circuit board and manufacturing method thereof |
| PCT/CN2011/080077 WO2013000207A1 (en) | 2011-06-30 | 2011-09-23 | Metal-based circuit board and manufacturing method therefor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110181156A CN102300397A (en) | 2011-06-30 | 2011-06-30 | Metal matrix circuit board and manufacturing method thereof |
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| CN102300397A true CN102300397A (en) | 2011-12-28 |
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| CN201110181156A Pending CN102300397A (en) | 2011-06-30 | 2011-06-30 | Metal matrix circuit board and manufacturing method thereof |
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| WO (1) | WO2013000207A1 (en) |
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| CN103227263B (en) * | 2012-01-30 | 2018-01-12 | 新光电气工业株式会社 | The manufacture method of wiring substrate and wiring substrate |
| CN105611731A (en) * | 2015-12-18 | 2016-05-25 | 景旺电子科技(龙川)有限公司 | Method for producing electricity-heat separated high-thermal-conductivity metal substrate through filling plating |
| CN108617079A (en) * | 2018-05-02 | 2018-10-02 | 皆利士多层线路版(中山)有限公司 | Thick copper circuit board and preparation method thereof |
| CN112040629A (en) * | 2019-06-04 | 2020-12-04 | 鹏鼎控股(深圳)股份有限公司 | Circuit board and manufacturing method thereof |
| CN110785025A (en) * | 2019-11-08 | 2020-02-11 | 生益电子股份有限公司 | PCB manufacturing method and PCB |
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| CN114286508A (en) * | 2020-09-28 | 2022-04-05 | 深南电路股份有限公司 | Circuit board and manufacturing method thereof |
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| CN114521041A (en) * | 2020-11-18 | 2022-05-20 | 深南电路股份有限公司 | Circuit board and manufacturing method thereof |
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| CN114040564B (en) * | 2021-11-10 | 2023-10-27 | 珠海方正科技多层电路板有限公司 | Circuit board preparation method and circuit board |
| CN114928961A (en) * | 2022-05-20 | 2022-08-19 | 重庆方正高密电子有限公司 | Preparation method of PCB and PCB |
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| WO2013000207A1 (en) | 2013-01-03 |
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