CN110933850A - Manufacturing method of high-heat-dissipation double-sided sandwich copper-based printed circuit board - Google Patents
Manufacturing method of high-heat-dissipation double-sided sandwich copper-based printed circuit board Download PDFInfo
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- CN110933850A CN110933850A CN201911249498.4A CN201911249498A CN110933850A CN 110933850 A CN110933850 A CN 110933850A CN 201911249498 A CN201911249498 A CN 201911249498A CN 110933850 A CN110933850 A CN 110933850A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
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- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention discloses a manufacturing method of a high-heat-dissipation double-sided sandwich copper-based printed circuit board, which aims to solve the technical problems that the existing metal-based single-sided wiring board has larger limitation on wiring and component accommodation, and the double-sided or multi-layer wiring board influences the heat dissipation effect; the manufacturing method comprises the steps of pre-drilling holes at positions, needing to be conducted, of circuit layers on two sides of a copper base, filling resin in the holes, adding PP and copper foils on the two sides, pressing the two sides into a double-sided board, performing laser ablation windowing at positions, needing to expose the copper base on the circuit surfaces of the two layers and performing heat dissipation, etching away the copper foils and a dielectric layer by using laser, exposing the copper base, leveling the extension of the sandwiched copper base with the circuit surfaces by using a filling and plating process, and directly dissipating heat of components by using the copper base. The manufacturing method greatly enhances the heat conduction effect by directly pasting the heat dissipation surface of the component on the copper base, thereby avoiding an additional welding heat dissipation module, improving the performance of the PCB, and having strong practicability.
Description
Technical Field
The invention belongs to the field of preparation of copper-based printed circuit boards, and particularly belongs to a method for manufacturing a high-heat-dissipation double-sided sandwich copper-based printed circuit board.
Background
The printed circuit board is designed according to the preset design, and forms a conductive pattern on an insulating base material through the processes of pattern transfer, electroplating, etching and the like, so as to realize the electrical connection of electronic components and provide the required electrical characteristics, assembly characters and other characteristics, and the printed circuit board is a carrier of the electronic components. The printed circuit board can be divided into a single-sided board, a double-sided board and a multilayer board according to the classification of the circuit layer number, the common multilayer board at present is generally a 4-layer board or a 6-layer board, and the complex multilayer board can reach dozens of layers; the printed wiring board may be classified into an organic material-based phenol resin board, an epoxy resin board, a metal-based aluminum board, a copper board, and the like, depending on the material of the board.
The printed circuit board is characterized in that the printed circuit board is made of a metal base, and the printed circuit board is made of a single-sided circuit, namely, a circuit surface and a radiating surface are separated from each other.
Disclosure of Invention
(1) Technical problem to be solved
Aiming at the defects of the prior art, the invention aims to provide a manufacturing method of a high-heat-dissipation double-sided sandwich copper-based printed circuit board, which aims to solve the technical problems that the existing metal-based single-sided wiring board has larger limitation on wiring and component accommodation, and the heat dissipation effect of a double-sided or multi-layer circuit board is influenced; the manufacturing method greatly enhances the heat conduction effect by directly pasting the heat dissipation surface of the component on the copper base, thereby avoiding an additional welding heat dissipation module, improving the performance of the PCB, and having strong practicability.
(2) Technical scheme
After SMT, a heat dissipation device module is generally required to be welded to help components to dissipate heat, the heat dissipation function of a PCB is limited, the heat dissipation performance of the PCB can be improved by adopting double-sided circuit sandwich copper-embedded base manufacturing, part of the components borne by the PCB is low in heat productivity, a heat dissipation module is not required to be specially added, heat dissipation needs to be carried out on a high-power IC or an LED and the like by means of a heat dissipation device to prolong the service life and the effect of the components, the heat dissipation effect can be greatly improved by directly contacting the components with a copper base, the heat conductivity coefficient of copper is 400W/(m.K), and the heat conductivity coefficient of a common FR4 PCB is about 0.4W/(m.K).
Therefore, in order to solve the technical problems, the invention provides a manufacturing method of a high-heat-dissipation double-sided sandwich copper-based printed circuit board, which mainly comprises the steps of drilling a hole with the thickness of 0.2-0.3mm at the position where two circuit layers on the copper base need to be conducted, filling resin in the hole, adding PP and copper foil on the two sides, pressing the hole into a double-sided board, performing laser ablation windowing at the position where the copper base needs to be exposed on the two circuit layers for heat dissipation, etching the copper foil and a dielectric layer by laser, exposing the copper base, leveling the extension of the sandwich copper base with the circuit layers by the copper base through a filling and plating process, directly welding a component on a copper-based boss after SMT, directly dissipating the heat of the component by the copper base, thereby being not influenced by the heat conductivity of an insulating layer and effectively improving the heat dissipation rate of the metal base.
The basic flow of the manufacturing method is as follows: copper base drilling → copper base brown oxidation → copper base plug resin → copper base pressing → target hitting → laser drilling → filling and plating → mechanical drilling → electroplating → circuit → solder resist → surface treatment → molding.
The manufacturing method comprises the following specific steps:
step one, drilling a copper base; drilling a copper base, wherein the hole comprises a tool positioning hole, a target position hole and a line conducting hole; the conducting hole of the circuit needs to be 0.2-0.3mm larger than the hole drilled after pressing in order to prevent the conducting hole from being insulated from the copper base, so that the subsequent process can be conveniently manufactured.
Step two, copper-based browning; grinding a copper-based plate, removing burrs on the edge of a hole, and then passing the whole plate through brown chemical liquid; the copper-based browning chemical liquid is used for increasing the roughness of the hole wall of a copper surface and increasing the bonding force with resin.
Plugging holes by copper-based resin; filling resin into the copper-based open pores, baking the copper-based open pores at the temperature of 140-160 ℃ for 25-35 minutes, and grinding the copper-based excess resin after the baking is cured; the purpose of this step is to ensure the conduction of the circuit on both sides of the double-sided board, therefore it needs to penetrate the copper base but can not be conducted with the copper base, therefore it must drill the hole on the same position of the copper base, and the hole needs to be bigger than the circuit via hole, and it is filled with resin to solidify, thus it can ensure the insulating layer above 0.15 after drilling the via hole.
Preferably, in the third step, the open pores of the copper base are filled with resin, then the plate is baked for 30 minutes at the temperature of 150 ℃, and the copper base excess resin is ground after the plate is cured.
Step four, pressing; covering PP and copper foil on two sides of a copper substrate, controlling the thickness of the PP to be 0.075-0.125mm and the thickness of the copper foil to be 0.5-2.0oz, enabling the PP to be close to the copper substrate during plate arrangement, pressing the PP into a double-sided sandwich copper substrate, controlling the pressing temperature to be 170-190 ℃, the pressing time to be 50-70 minutes, and the curing pressure to be more than 350 PSI;
wherein PP is a prepreg, and oz is a commonly used copper foil thickness unit.
Preferably, in the fourth step, covering the two sides of the copper base with PP and copper foil, controlling the thickness of PP to be 0.1mm and the thickness of copper foil to be 1.4oz, enabling PP to be close to the copper base during plate arrangement, pressing the copper base into the double-sided sandwich copper base plate, controlling the pressing temperature to be 180 ℃, the pressing time to be 1 hour, and the curing pressure to be more than 350 PSI.
Step five, target shooting; drilling out a target position by using an X-RAY (rapid-action) target shooting machine; in the step, because the copper-based drilling holes are drilled with target holes and resin inlet holes are formed after pressing, the target positions can be identified through an X-RAY (X-RAY-laser-ranging) target shooting machine for shooting holes, and the target holes are used for post-process working tool holes.
Step six, laser ablation windowing; performing laser ablation on the part needing to expose the copper base, and completely ablating the copper foil and the base material to expose the copper;
step seven, covering a film; removing glue residues from the plate subjected to laser ablation windowing, cleaning the bottom copper surface, pasting a photosensitive film on the two sides, and developing and removing a dry film at the windowing position through exposure and development to expose the windowing position;
step seven, filling and plating; filling and plating the hole-filling electroplating line, and controlling the current density and time to enable the copper base to be flush with the circuit copper foil; the hanging plate needs to be clamped well and contacted with the copper base, so the thickness of copper plating in the electroplating windowing area needs to be flush with the surface of the copper foil, namely the hanging plate is completely contacted with the electroplating hanging plate clamp.
Step eight, post working procedure; and after the filling plating is finished, sequentially performing secondary drilling, copper deposition, electroplating, line etching, solder resistance, character, surface treatment and molding to obtain the high-heat-dissipation double-sided sandwich copper-based printed circuit board.
After the filling and plating are finished, the windowed copper base is not exposed and is flush with the circuit, and the process requirements reach the functional requirements of the double-sided sandwich copper base plate, so that the post-process can be carried out according to the conventional mode, namely, the post-process comprises secondary drilling, copper deposition, electroplating, circuit etching, solder resistance, character, surface treatment and forming, and the steps are the same as those of the common double-sided plate.
In addition, the manufacturing method of the invention obtains the parameter range by combining a large number of experiments and trials through the most suitable parameter selection of each step, can greatly improve the completion degree and the suitability of each step, and has extremely high practicability.
Meanwhile, compared with the traditional double-sided board, the manufacturing method of the invention not only realizes electric-heat separation and obviously improves the heat dissipation effect, but also has the same effect of wiring and component density as the common double-sided board, and has extremely strong mass production operability.
The technical scheme of the invention provides a double-sided sandwich copper substrate scheme suitable for mounting high-current and high-power components, the high-power components can directly contact with a copper substrate for heat dissipation, the heat conductivity coefficient of the copper substrate is 400W/m.k, and the heat conductivity coefficient of a common FR4 substrate is 0.4-0.5W/m.k.
(3) Advantageous effects
Compared with the prior art, the invention has the beneficial effects that: the invention realizes the extension of the sandwich copper base by improving the process flow in a breakthrough way and utilizing the mode of filling copper after windowing to ensure that the copper base is flush with the circuit, thereby ensuring that the copper base is directly contacted with a component for heat dissipation, namely, the heat dissipation surface of the component is directly attached on the copper base, realizing the electric-thermal separation and greatly enhancing the heat conduction effect, thereby avoiding an additional welding heat dissipation module, eliminating the need of installing a heat dissipation device on a high-power component, saving the space and further improving the performance of the PCB. Meanwhile, the wiring density of the metal substrate and the accommodation capacity of components are improved by utilizing a double-sided wiring mode, the density of the wiring and the components of a common double-sided board can be achieved, and the high-heat-dissipation double-sided sandwich copper-based printed circuit board has high practicability, so that the manufacture of the high-heat-dissipation double-sided sandwich copper-based printed circuit board is realized. .
Detailed Description
In order to make the technical means, the original characteristics, the achieved purposes and the effects of the invention easily understood and obvious, the technical solutions in the embodiments of the present invention are clearly and completely described below to further illustrate the invention, and obviously, the described embodiments are only a part of the embodiments of the present invention, but not all the embodiments.
Example 1
The specific embodiment is a method for manufacturing a high-heat-dissipation double-sided sandwich copper-based printed circuit board, which comprises the following core steps:
1. manufacturing process flow of sandwich copper substrate
a. Pre-drilling; drilling holes with the diameter of 0.3mm on the copper substrate at the position where the two sides need to be conducted and drilled, wherein if the hole diameter of the holes to be drilled on the double-sided board is 1.0mm, the holes to be drilled on the copper substrate are 1.3 mm;
b. manufacturing an insulating hole; coarsening the hole wall through browning after drilling to increase the bonding force, filling resin on the copper-based pre-drilled hole in a screen printing or dispensing mode by using an aluminum sheet net (the aperture of the aluminum sheet net needs to be 0.1mm larger than that of the copper substrate drilled hole), wherein the resin can be special Shanrong slot filling resin, baking for 35 minutes at 140 ℃ after hole filling is completed, and polishing and flattening by using a belt grinder to remove the redundant resin at the hole edge;
c. and (3) laminating: and (3) carrying out plate arrangement after the copper substrate is browned, controlling the thickness of the copper foil to be 0.5oz, controlling the thickness of the PP prepreg to be 0.075mm, controlling the laminating temperature to be 170 ℃, the laminating time to be 70 minutes, and the curing pressure to be more than 350 PSI.
2. The double-sided sandwich copper-based windowing plating platform is manufactured, in order to ensure that the sandwich copper-based can be in direct contact with a high-power component at the heat dissipation position of the component, windowing (removing a copper foil and a base material dielectric layer) is needed to expose the copper-based, and then windowing and vacant position are used for enabling the copper-based epitaxy to be flush with the copper foil on the circuit surface in a copper filling and plating mode.
a. Windowing a copper-based plating station; windowing by using a UV type laser etching machine, ablating the copper foil and the base material at the windowing position to expose the copper base, and removing glue residues after laser ablation;
b. covering a film; before filling plating, a non-filling plating area needs to be protected, a dry film is used for film pasting, a special film is manufactured for exposure and development, and a film covering protection is carried out on the area which does not need filling plating;
c. and (3) filling and plating, namely filling and plating a filling and plating line (generally using a HDI board filling and plating line), wherein during filling and plating, the full contact between the electroplating clamp and the copper base is ensured, and the current density and time are controlled to ensure that the copper base is flush with the circuit copper foil.
3. After copper-based windowing and filling plating is completed, the process and functional requirements reach the functional requirements of the double-sided sandwich copper substrate, and the post-procedure manufacturing comprises secondary drilling, copper deposition, electroplating, line etching, solder resistance, character, surface treatment and molding, and is the same as the manufacturing of a common double-sided board.
Example 2
The specific embodiment is a method for manufacturing a high-heat-dissipation double-sided sandwich copper-based printed circuit board, which comprises the following core steps:
1. manufacturing process flow of sandwich copper substrate
a. Pre-drilling; drilling holes with the diameter of 0.3mm on the copper substrate at the position where the two sides need to be conducted and drilled, wherein if the hole diameter of the holes to be drilled on the double-sided board is 1.0mm, the holes to be drilled on the copper substrate are 1.3 mm;
b. manufacturing an insulating hole; coarsening the hole wall through browning after drilling to increase the bonding force, filling resin on the copper-based pre-drilled hole in a screen printing or dispensing mode by using an aluminum sheet net (the aperture of the aluminum sheet net needs to be 0.1mm larger than that of the copper substrate drilled hole), wherein the resin can be special Shanrong slot filling resin, baking for 30 minutes at 150 ℃ after hole filling is completed, and polishing and flattening by using a belt grinder to remove the redundant resin at the hole edge;
c. and (3) laminating: and (3) carrying out plate arrangement after the copper substrate is browned, controlling the thickness of the copper foil to be 1.4oz, controlling the thickness of the PP prepreg to be 0.1mm, controlling the pressing temperature to be 180 ℃, the pressing time to be 60 minutes, and the curing pressure to be more than 350 PSI.
2. The double-sided sandwich copper-based windowing plating platform is manufactured, in order to ensure that the sandwich copper-based can be in direct contact with a high-power component at the heat dissipation position of the component, windowing (removing a copper foil and a base material dielectric layer) is needed to expose the copper-based, and then windowing and vacant position are used for enabling the copper-based epitaxy to be flush with the copper foil on the circuit surface in a copper filling and plating mode.
a. Windowing a copper-based plating station; windowing by using a UV type laser etching machine, ablating the copper foil and the base material at the windowing position to expose the copper base, and removing glue residues after laser ablation;
b. covering a film; before filling plating, a non-filling plating area needs to be protected, a dry film is used for film pasting, a special film is manufactured for exposure and development, and a film covering protection is carried out on the area which does not need filling plating;
c. and (3) filling and plating, namely filling and plating a filling and plating line (generally using a HDI board filling and plating line), wherein during filling and plating, the full contact between the electroplating clamp and the copper base is ensured, and the current density and time are controlled to ensure that the copper base is flush with the circuit copper foil.
3. After copper-based windowing and filling plating is completed, the process and functional requirements reach the functional requirements of the double-sided sandwich copper substrate, and the post-procedure manufacturing comprises secondary drilling, copper deposition, electroplating, line etching, solder resistance, character, surface treatment and molding, and is the same as the manufacturing of a common double-sided board.
Example 3
The specific embodiment is a method for manufacturing a high-heat-dissipation double-sided sandwich copper-based printed circuit board, which comprises the following core steps:
1. manufacturing process flow of sandwich copper substrate
a. Pre-drilling; drilling holes with the diameter of 0.4mm on the copper substrate at the position where the two sides need to be conducted and drilled, wherein if the hole diameter of the holes to be drilled on the double-sided board is 1.0mm, the holes to be drilled on the copper substrate are 1.4 mm;
b. manufacturing an insulating hole; coarsening the hole wall through browning after drilling to increase the bonding force, filling resin on the copper-based pre-drilled hole in a screen printing or dispensing mode by using an aluminum sheet net (the aperture of the aluminum sheet net needs to be 0.1mm larger than that of the copper substrate drilled hole), wherein the resin can be special Shanrong slot filling resin, baking at 160 ℃ for 25 minutes after hole filling is completed, and then polishing and leveling by using a belt sander to remove the redundant resin at the hole edge;
c. and (3) laminating: and (3) carrying out plate arrangement after the copper substrate is browned, controlling the thickness of the copper foil to be 2.0oz, controlling the thickness of the PP prepreg to be 0.125mm, controlling the pressing temperature to be 190 ℃, controlling the pressing time to be 50 minutes, and controlling the curing pressure to be more than 350 PSI.
2. The double-sided sandwich copper-based windowing plating platform is manufactured, in order to ensure that the sandwich copper-based can be in direct contact with a high-power component at the heat dissipation position of the component, windowing (removing a copper foil and a base material dielectric layer) is needed to expose the copper-based, and then windowing and vacant position are used for enabling the copper-based epitaxy to be flush with the copper foil on the circuit surface in a copper filling and plating mode.
a. Windowing a copper-based plating station; windowing by using a UV type laser etching machine, ablating the copper foil and the base material at the windowing position to expose the copper base, and removing glue residues after laser ablation;
b. covering a film; before filling plating, a non-filling plating area needs to be protected, a dry film is used for film pasting, a special film is manufactured for exposure and development, and a film covering protection is carried out on the area which does not need filling plating;
c. and (3) filling and plating, namely filling and plating a filling and plating line (generally using a HDI board filling and plating line), wherein during filling and plating, the full contact between the electroplating clamp and the copper base is ensured, and the current density and time are controlled to ensure that the copper base is flush with the circuit copper foil.
3. After copper-based windowing and filling plating is completed, the process and functional requirements reach the functional requirements of the double-sided sandwich copper substrate, and the post-procedure manufacturing comprises secondary drilling, copper deposition, electroplating, line etching, solder resistance, character, surface treatment and molding, and is the same as the manufacturing of a common double-sided board.
Having thus described the principal technical features and basic principles of the invention, and the advantages associated therewith, it will be apparent to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, but is capable of other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.
Furthermore, it should be understood that although the present description is described in terms of various embodiments, not every embodiment includes only a single embodiment, and such descriptions are provided for clarity only, and those skilled in the art will recognize that the embodiments described herein can be combined as a whole to form other embodiments as would be understood by those skilled in the art.
Claims (3)
1. A manufacturing method of a high-heat-dissipation double-sided sandwich copper-based printed circuit board is characterized by comprising the following specific steps:
step one, drilling a copper base; drilling a copper base, wherein the hole comprises a tool positioning hole, a target position hole and a line conducting hole;
step two, copper-based browning; grinding a copper-based plate, removing burrs on the edge of a hole, and then passing the whole plate through brown chemical liquid;
plugging holes by copper-based resin; filling resin into the copper-based open pores, baking the copper-based open pores at the temperature of 140-160 ℃ for 25-35 minutes, and grinding the copper-based excess resin after the baking is cured;
step four, pressing; covering PP and copper foil on two sides of the copper substrate, controlling the thickness of the PP to be 0.075-0.125mm, controlling the thickness of the copper foil to be 0.5-2.0oz, enabling the PP to be close to the copper substrate during plate arrangement, pressing the copper substrate into a double-sided sandwich copper substrate, controlling the pressing temperature to be 170-190 ℃, the pressing time to be 50-70 minutes, and the curing pressure to be more than 350 PSI;
step five, target shooting; drilling out a target position by using an X-RAY (rapid-action) target shooting machine;
step six, laser ablation windowing; performing laser ablation on the part needing to expose the copper base, and completely ablating the copper foil and the base material to expose the copper;
step seven, covering a film; removing glue residues from the plate subjected to laser ablation windowing, cleaning the bottom copper surface, pasting a photosensitive film on the two sides, and developing and removing a dry film at the windowing position through exposure and development to expose the windowing position;
step seven, filling and plating; filling and plating the hole-filling electroplating line, and controlling the current density and time to enable the copper base to be flush with the circuit copper foil;
step eight, post working procedure; and after the filling plating is finished, sequentially performing secondary drilling, copper deposition, electroplating, line etching, solder resistance, character, surface treatment and molding to obtain the high-heat-dissipation double-sided sandwich copper-based printed circuit board.
2. The method for manufacturing a high-heat-dissipation double-sided sandwich copper-based printed circuit board according to claim 1, wherein in the third step, the copper-based open pores are filled with resin, then the board is baked at 150 ℃ for 30 minutes, and after the board is cured, the excess copper-based resin is ground.
3. The manufacturing method of the high heat dissipation double-sided copper-based printed circuit board with the sandwich structure as claimed in claim 1, wherein in the fourth step, the two sides of the copper base are covered with the PP and the copper foil, the thickness of the PP is controlled to be 0.1mm, the thickness of the copper foil is controlled to be 0.14oz, the PP is close to the copper base during board arrangement, the copper base is pressed into the double-sided copper-sandwiched base board, the pressing temperature is controlled to be 180 ℃, the pressing time is 1 hour, and the curing pressure is greater than 350 PSI.
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| CN111954368A (en) * | 2020-08-03 | 2020-11-17 | 深圳恒宝士线路板有限公司 | Thermoelectric separation filling electroplated double-sided metal substrate and manufacturing method thereof |
| CN113141711A (en) * | 2021-03-15 | 2021-07-20 | 华宇华源电子科技（深圳）有限公司 | Manufacturing method of local high-heat-dissipation circuit board and high-heat-dissipation circuit board |
| CN113301715A (en) * | 2021-04-01 | 2021-08-24 | 珠海精路电子有限公司 | Circuit board and manufacturing process thereof |
| CN114390780A (en) * | 2021-12-31 | 2022-04-22 | 赣州市超跃科技有限公司 | High-heat-dissipation multilayer high-frequency copper-based microwave signal board and preparation process thereof |
| TWI833428B (en) * | 2022-11-08 | 2024-02-21 | 健鼎科技股份有限公司 | Method for producing heat dissipation circuit board |
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