CN106413241A - Manufacturing method of boss plate - Google Patents
Manufacturing method of boss plate Download PDFInfo
- Publication number
- CN106413241A CN106413241A CN201610814729.1A CN201610814729A CN106413241A CN 106413241 A CN106413241 A CN 106413241A CN 201610814729 A CN201610814729 A CN 201610814729A CN 106413241 A CN106413241 A CN 106413241A
- Authority
- CN
- China
- Prior art keywords
- blind slot
- copper
- manufacturing
- copper base
- rcc
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention relates to the field of manufacturing of metal-based circuit boards, in particular to a manufacturing method of a boss plate. The manufacturing method mainly comprises the steps of cutting, notching, laminating, blind groove cleaning, copper plating, pattern transferring, electroplating groove filling, film removing and outer-layer pattern transferring. Through adoption of the manufacturing method, the risks of delamination and breakage of the plate caused by a deviation between a boss height of a copper substrate and a thickness of RCC (Resin Coated Copper) can be effectively avoided, and the open-circuit and gap rejection rate of a line is lowered from 10-15 percent to 0.6-1 percent. The manufacturing method is particularly suitable for a single-side copper-based circuit board; the production quality and efficiency are improved and increased greatly; and the production cost is lowered.
Description
Technical field
The present invention relates to metal-based circuit board makes field, more particularly, to a kind of manufacture method of convex board.
Background technology
Metal-based circuit board is applied when producing power panel, high-power illumination plate or Automobile Plate, needs to lose on copper base
Carve boss and be typically improving the heat conductivity of substrate, the Making programme of wherein committed step：Copper base etch convex
Platform, position corresponding with copper base boss on RCC material is carved, then by the copper base after etching and the RCC material after cutting
Material presses in order.In above-mentioned flow process, because the boss height of copper base and the thickness of RCC have deviation, in lamination flow process
There may be decompression problem, have the risk of plate bursting layering；RCC and boss copper base there is also para-position essence in Manual-alignment simultaneously
Degree is poor, maximum difference 4mil, leads to open lines, breach scrappage between 10%-15%, and high.
Content of the invention
In view of the shortcomings of the prior art, for avoiding the boss height of copper base and the thickness deviation of RCC to lead to plate bursting
The risk of layering and improve open lines, situation that breach is scrapped, it is an object of the invention to provide a kind of making of convex board
Method.
For achieving the above object, the present invention can be achieved by the following technical programs：
A kind of manufacture method of convex board, comprises the following steps：
(1) sawing sheet：Large-sized copper base is cut into the size being suitable for production；
(2) cutting：The fluting being adapted with copper base boss predeterminated position is carved on RCC material；
(3) press：RCC after cutting is pressed together in order with copper base, described being recessed at is formed on copper base
Blind slot；
(4) clear up blind slot：The resin flowing into blind slot in bonding processes is removed；
(5) copper that sinks is electroplated：Blind slot inwall is made with heavy copper, electroplating processes；
(6) figure transfer：Using dry film, the position beyond blind slot is covered, expose blind slot；
(7) groove is filled out in plating：By blind slot copper facing fill and lead up to RCC flush；
(8) take off film：The dry film covering on plate is faded away；
(9) outer graphics transfer：Registration holes are captured according to ccd image sensor, makes line pattern in boss plate surface.
Further, the radium-shine machine engraving of UV is used to slot in step (2).
Further, utilize laser ablation resin in step (4).
Further, the parameter that groove is filled out in plating in step (7) is：Electric current density 11-14ASF, electroplating time 120min, electricity
Plating liquid medicine is filling perforation liquid medicine.
The present invention can be prevented effectively from the boss height of copper base and the thickness deviation of RCC and lead to be layered the risk of plate bursting,
Open lines, breach scrappage are dropped to 0.6%-1% from 10%-15% simultaneously, are particularly suited on one side Copper based electrical plate,
Greatly increase the quality of production and efficiency, reduce production cost.
Brief description
Fig. 1 is the structural representation of convex board；
Fig. 2 is method of the present invention flow chart；
In figure：1- copper base, 2-RCC, 3- fluting, 4- blind slot.
Specific embodiment
Below in conjunction with accompanying drawing and specific embodiment, the present invention is further illustrated：
As shown in Fig. 1～2, the manufacture method of convex board of the present invention, comprise the following steps：
(1) sawing sheet：Large-sized copper base 1 is cut into the size being suitable for production；
(2) cutting：Using UV laser machine, the fluting being adapted with copper base 1 boss predeterminated position is carved on RCC2 material
3；
(3) press：RCC2 after cutting is pressed together in order with copper base 1, fluting 3 is formed on copper base 1
Blind slot 4；
(4) clear up blind slot：Using laser, the resin flowing into blind slot 4 in bonding processes is removed；
(5) copper that sinks is electroplated：Heavy copper, electroplating processes are made to blind slot 4 inwall, thus turning on the figure of internal layer and outer layer；
(6) figure transfer：Using dry film, the position beyond blind slot 4 is covered, expose blind slot 4；
(7) groove is filled out in plating：By blind slot 4 copper facing fill and lead up to RCC2 flush, plating fills out the parameter of groove and is：Electric current density
11-14ASF, electroplating time 120min, electroplating liquid medicine is filling perforation liquid medicine；
(8) take off film：The dry film covering on plate is faded away；
(9) outer graphics transfer：Registration holes are captured according to ccd image sensor, in boss plate surface (the i.e. Copper Foil of RCC2
Surface and blind slot 4 electroplate the surface after filling and leading up) make line pattern.
The present invention does not directly carve boss on copper base 1, but by fluting 3 being carved on RCC2 material, by cutting
RCC2 afterwards is pressed with the copper base 1 after sawing sheet, makes fluting 3 form blind slot 4 on copper base 1, blind slot 4 is filled and led up in plating, thus
Form boss.The boss height of so copper base 1 can be filled out groove by plating and control, and will not produce partially with the thickness of RCC2
Difference, can be matched with RCC2 completely, be applied on one side Copper based electrical plate, can be by open lines, breach scrappage from 10%-
15% drops to 0.6%-1%, and avoids being layered the risk of plate bursting.
For a person skilled in the art, other can be made various corresponding according to above technical scheme and design
Change and deformation, and all these change and deformation all should belong within the protection domain of the claims in the present invention.
Claims (4)
1. a kind of manufacture method of convex board is it is characterised in that comprise the following steps：
(1) sawing sheet：Large-sized copper base is cut into the size being suitable for production；
(2) cutting：The fluting being adapted with copper base boss predeterminated position is carved on RCC material；
(3) press：RCC after cutting is pressed together in order with copper base, described being recessed on copper base forms blind slot；
(4) clear up blind slot：The resin flowing into blind slot in bonding processes is removed；
(5) copper that sinks is electroplated：Blind slot inwall is made with heavy copper, electroplating processes；
(6) figure transfer：Using dry film, the position beyond blind slot is covered, expose blind slot；
(7) groove is filled out in plating：By blind slot copper facing fill and lead up to RCC flush；
(8) take off film：The dry film covering on plate is faded away；
(9) outer graphics transfer：Registration holes are captured according to ccd image sensor, makes line pattern in boss plate surface.
2. convex board according to claim 1 manufacture method it is characterised in that：The radium-shine machine engraving of UV is used in step (2)
Fluting.
3. convex board according to claim 1 and 2 manufacture method it is characterised in that：Step utilizes laser ablation in (4)
Resin.
4. the manufacture method of convex board according to claim 1 is it is characterised in that electroplate the parameter filling out groove in step (7)
For：Electric current density 11-14ASF, electroplating time 120min, electroplating liquid medicine is filling perforation liquid medicine.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610814729.1A CN106413241A (en) | 2016-09-09 | 2016-09-09 | Manufacturing method of boss plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610814729.1A CN106413241A (en) | 2016-09-09 | 2016-09-09 | Manufacturing method of boss plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106413241A true CN106413241A (en) | 2017-02-15 |
Family
ID=57999114
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610814729.1A Pending CN106413241A (en) | 2016-09-09 | 2016-09-09 | Manufacturing method of boss plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106413241A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110933850A (en) * | 2019-12-09 | 2020-03-27 | 赣州金顺科技有限公司 | Manufacturing method of high-heat-dissipation double-sided sandwich copper-based printed circuit board |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102938971A (en) * | 2012-11-20 | 2013-02-20 | 深圳市博敏电子有限公司 | Single-side printed circuit board with ultrahigh heat conducting performance and manufacturing method thereof |
| CN203289746U (en) * | 2012-12-18 | 2013-11-13 | 景旺电子科技(龙川)有限公司 | Copper substrate structure with direct radiating copper-based boss |
| CN103763849A (en) * | 2013-10-28 | 2014-04-30 | 高德(苏州)电子有限公司 | High-heat radiation copper-based circuit board |
| CN105611731A (en) * | 2015-12-18 | 2016-05-25 | 景旺电子科技(龙川)有限公司 | Method for producing electricity-heat separated high-thermal-conductivity metal substrate through filling plating |
-
2016
- 2016-09-09 CN CN201610814729.1A patent/CN106413241A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102938971A (en) * | 2012-11-20 | 2013-02-20 | 深圳市博敏电子有限公司 | Single-side printed circuit board with ultrahigh heat conducting performance and manufacturing method thereof |
| CN203289746U (en) * | 2012-12-18 | 2013-11-13 | 景旺电子科技(龙川)有限公司 | Copper substrate structure with direct radiating copper-based boss |
| CN103763849A (en) * | 2013-10-28 | 2014-04-30 | 高德(苏州)电子有限公司 | High-heat radiation copper-based circuit board |
| CN105611731A (en) * | 2015-12-18 | 2016-05-25 | 景旺电子科技(龙川)有限公司 | Method for producing electricity-heat separated high-thermal-conductivity metal substrate through filling plating |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110933850A (en) * | 2019-12-09 | 2020-03-27 | 赣州金顺科技有限公司 | Manufacturing method of high-heat-dissipation double-sided sandwich copper-based printed circuit board |
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| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170215 |