JP2011171353A - Method of manufacturing printed board, and printed board using this - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a printed board which can prevent the glass cloth in a prepreg reliably from coming into contact with the wiring without distorting the prepreg when a conductor pattern and the prepreg are pressed, and can manufacture the printed board quickly and efficiently even in case of a thick copper substrate, and to provide a printed board using this. <P>SOLUTION: The method of manufacturing a printed board includes a first step for forming a printed board on a support plate 1, and a second step for removing the support plate 1 from the printed board. In the first step, an insulating mask 2 having an opening for forming a conductor pattern 4 is formed on the support plate 1, the conductor pattern 4 is formed by filling the opening with a conductor material, an exposed surface 5 is formed by making the exposed surfaces of the insulating mask 2 and the conductor pattern 4 flush with each other, and then the exposed surface 5 and an insulating base 6 are pressed and stuck together. <P>COPYRIGHT: (C)2011,JPO&amp;INPIT

Description

  The present invention relates to a printed circuit board manufacturing method and a printed circuit board using the same.

  It is conceivable to increase the cross-sectional area of a conductor pattern made of copper, for example, so that it can be used as a large current substrate. The copper thickness of such a so-called thick copper circuit is approximately 70 μm to 400 μm. The copper foil used as the material of the conductor pattern is commercially available in thicknesses of 1/2, 1/3, 1/4 times, and 2 times, 3 times the thickness of 35 μm as a basic unit. If the copper thickness of the required thick copper circuit is thicker than the commercially available copper foil, use a copper plate whose thickness has been adjusted by rolling, or perform further copper plating on the copper foil of the maximum thickness that is commercially available become. The thick copper foil thus obtained is used for the production of a thick copper substrate using a subtractive method or the like.

  On the other hand, when manufacturing a printed circuit board, vacuum hot press is performed by superposing a prepreg impregnated with epoxy resin on a glass cloth and a copper foil of thick copper. At this time, the prepreg epoxy resin is filled between the conductor patterns (portions where there is no wiring on the printed board). A method of manufacturing a multilayer board via such a prepreg is disclosed, for example, in Patent Document 1. Also in the case of Patent Document 1, the epoxy resin of the prepreg is filled between the circuit patterns at the time of pressing.

  In the conventional etching apparatus used for the subtractive method, the line length and the operation speed are determined on the assumption that the copper thickness is 12 μm to 35 μm. However, in such an apparatus, the longer the copper thickness, the longer the time required for etching. In order to etch the copper thickness of 70 μm to 400 μm as described above, it takes several times to 20 times, and the production efficiency is lowered. Therefore, when the copper thickness is manufactured by a subtractive method, a technique such as providing a dedicated etching line according to the copper thickness or etching half by half in the thickness direction is troublesome and cumbersome.

  Moreover, when laminating a printed circuit board having a thick copper conductor pattern (wiring layer) as described above, unfilling occurs unless the resin amount of the prepreg is increased more than usual. During the filling, the glass cloth in the prepreg may come into contact with the conductor pattern. In such a case, the wiring layer may be short-circuited by electrochemical migration, resulting in a significant loss of reliability as a product.

  Also, when the copper thickness is as thick as the above printed board, the solder resist applied on the conductor pattern (wiring) is used for wiring in the screen printing method, spray coating method, and curtain coating method used as the solder resist coating method. It may flow to a portion having no coating, and the solder resist in the coating portion may become thin and may not function as a resist.

JP-A-6-169172

  The present invention is based on the above-described prior art, and when the conductor pattern and the prepreg are pressed, the prepreg is not distorted, and the glass cloth in the prepreg can be reliably prevented from coming into contact with the wiring. An object of the present invention is to provide a printed circuit board manufacturing method that can be manufactured quickly and efficiently even with thick copper and a printed circuit board using the same.

  In order to achieve the object, the invention of claim 1 includes a first step of forming a printed circuit board on a support plate and a second step of removing the support plate from the printed circuit board, wherein the first step comprises: An insulating mask having a portion to be a conductive pattern as an opening is formed on the support plate, a conductive material is formed by filling the opening with a conductive material, and an exposed surface of the insulating mask and the conductive pattern is formed. Provided is a method for producing a printed circuit board, characterized in that an exposed surface that is flush with the surface is formed, and the exposed surface and the insulating base material are pressed and adhered.

The invention of claim 2 is characterized in that, in the invention of claim 1, the insulating base material is used as a second support plate, and the first step is repeatedly performed on the second support plate. .
According to a third aspect of the present invention, there is provided a printed circuit board using the printed circuit board manufacturing method according to the second aspect, wherein the first and second insulating bases and the insulating mask are formed of the same material. Provided is a printed circuit board.

  According to the invention of claim 1, since the insulating substrate is pressed with the insulating mask left after the conductor pattern is formed, the insulating substrate is placed in the gap of the conductor pattern as compared with pressing after removing the insulating mask. Can be prevented, and the insulating base material can be prevented from being distorted. In particular, in the case of a thick copper conductor pattern, a process of filling an insulating material may be necessary, but such a process is also unnecessary. Thereby, the migration which arises when the glass cloth and conductor pattern which are contained in the insulating base material contact can also be prevented. Further, since the exposed surface of the insulating mask and the conductor pattern is flush, the above effect is further enhanced.

According to the invention of claim 2, the insulating mask is embedded in the substrate together with the insulating base material without being removed. That is, since the insulating mask used for forming the conductor pattern is directly used as an insulating layer together with the insulating base material, the amount of the insulating base material used can be reduced, the production efficiency is increased, and rapid production is possible.
According to invention of Claim 3, since the 1st and 2nd insulation base material and the said insulation mask are formed with the same material, when it is set as a multilayer printed circuit board, an insulation mask remains embedded in the board | substrate. Even if it becomes, there is no problem in particular, and a highly reliable printed circuit board can be obtained.

It is the schematic which shows the manufacturing method of the printed circuit board which concerns on this invention in order. It is the schematic which shows the manufacturing method of the printed circuit board which concerns on this invention in order. It is the schematic which shows the manufacturing method of the printed circuit board which concerns on this invention in order. It is the schematic which shows an example of the printed circuit board which concerns on this invention. It is the schematic which shows the manufacturing method of the printed circuit board which concerns on this invention in order. It is the schematic which shows an example of the printed circuit board which concerns on this invention. It is the schematic which shows an example of the printed circuit board which concerns on this invention.

  As shown in FIG. 1, an insulating mask 2 is formed on the support plate 1. The support plate 1 is, for example, a SUS plate and has a high rigidity. The insulating mask 2 is made of an insulating material. The insulating mask 2 forms an opening 3 in which a portion to be a conductor pattern is opened. Then, as shown in FIG. 2, the conductor pattern 4 is formed by filling the opening 3 with a conductor material. This conductor pattern 4 is performed, for example, by plating copper on the SUS plate (support plate 1) exposed from the opening 3 by the thickness of the wiring layer by electroplating. At this time, the exposed surface of the insulating mask 2 and the conductor pattern 4 (a surface parallel to the surface of the support plate 1) is formed to be the same as the first exposed surface 5. And as shown in FIG. 3, the 1st exposed surface 5 and the 1st insulating base material 6 on another support plate 1 are pressed and closely_contact | adhered. The steps up to this FIG. 3 are the first step in the present invention. The first insulating substrate 6 is a prepreg having, for example, a glass cloth as a core material. Then, the support plate 1 is removed, and a printed board 7 composed of a single-sided plate as shown in FIG. 4 is formed (in the figure, the state of FIG. 3 is displayed upside down). The step of removing the support plate 1 is the second step referred to in the present invention.

  As described above, since the first insulating base 6 is pressed with the insulating mask 2 left after the conductive pattern 4 is formed, the gap between the conductive patterns 4 is smaller than when the insulating mask 2 is removed and pressed. Thus, the first insulating base 6 is prevented from entering and the first insulating base 6 can be prevented from being distorted. In particular, in the case of the thick copper conductor pattern 4, a process of filling an insulating material may be necessary, but such a process is also unnecessary. Thereby, the usage-amount of the 1st insulating base material 6 can be reduced, and also the migration which arises when the glass cloth and the conductor pattern 4 which are contained in the 1st insulating base material 6 contact can be prevented. . At this time, since the exposed surfaces of the insulating mask 2 and the conductor pattern 4 are flush, the above effect can be further enhanced.

  On the other hand, when two support plates 1 on which the conductor pattern 4 is formed are prepared (two sheets in the state of FIG. 2 are prepared) and pressed from both sides of the first insulating substrate 6, as shown in FIG. In addition, the insulating mask 2 and the conductor pattern 4 are formed on both surfaces of the first insulating base 6. When the support plate 1 is removed in this state, as shown in FIG. 6, a printed board 8 composed of a double-sided board is formed.

  Here, the first exposed surface of the printed board 7 made of a single-sided plate is a surface opposite to the pressed surface, and the exposed surface from which the first insulating base 6 is exposed is the second exposed surface. 9 (see FIG. 4). Then, a printed circuit board different from the printed circuit board 7 (here, the printed circuit board 8 made of a double-sided board with respect to the printed circuit board 7 made of a single-sided board) is prepared, and the surface on which the insulating mask 2 and the conductor pattern 4 are exposed is the third. Of the exposed surface 10 (see FIG. 6). Then, the second exposed surface 9 and the third exposed surface 10 are pressed and brought into close contact with each other, thereby forming a printed board 11 made of a multilayer board as shown in FIG. In other words, the manufacturing method of the multilayer board 11 described above is performed by repeating the first process described above on the second support plate, with the insulating base 6 of the single-sided plate 7 as the second support plate. Is formed.

  Thus, when the printed circuit board 11 made of a multilayer board is formed, the insulating mask 2 remains in the substrate as the substrate material together with the first insulating base material 6. That is, since the insulating mask 2 used for forming the conductor pattern 4 is used as an insulating layer together with the insulating base 6, the amount of the insulating base 6 used can be reduced, the production efficiency of the printed circuit board 11 is increased, and the speed is increased. Production becomes possible. Therefore, it is preferable that the insulating mask 2 is a material that does not affect the insulating base 6, has high reliability as a substrate material, and can be used as an insulating layer of the substrate. Since an epoxy resin is generally used as the insulating base 6, it can be said that it is preferable to use an epoxy resin for the insulating mask 2. More preferably, the insulating base 6 and the insulating mask 2 are made of the same material. Thus, even when the insulating mask 2 remains embedded in the substrate together with the insulating base 6 when the multilayer printed circuit board 11 is formed, there is no particular problem and the highly reliable printed circuit board 11 can be obtained. The printed circuit board 11 made of such a multilayer board can thereafter form through holes by a normal method, and interlayer connection by through hole plating can also be performed by a normal method.

DESCRIPTION OF SYMBOLS 1 Support plate 2 Insulation mask 3 Opening part 4 Conductor pattern 5 1st exposed surface 6 1st insulating base material 7 Printed circuit board which consists of a single-sided board Printed circuit board 9 which consists of a double-sided board 2nd exposed surface 10 Surface 11 Printed circuit board consisting of multilayer board

Claims (3)

A first step of forming a printed circuit board on the support plate;
A second step of removing the support plate from the printed circuit board,
The first step includes
Forming an insulating mask having a portion to be a conductor pattern on the support plate as an opening;
Filling the opening with a conductor material to form a conductor pattern,
Forming an exposed surface in which the exposed surfaces of the insulating mask and the conductor pattern are flush with each other;
A printed circuit board manufacturing method, wherein the exposed surface and an insulating base material are pressed and brought into close contact with each other. The insulating base material as a second support plate,
The method of manufacturing a printed circuit board according to claim 1, wherein the first step is repeatedly performed on the second support plate. A printed circuit board using the method for manufacturing a printed circuit board according to claim 2,
The printed circuit board, wherein the first and second insulating base materials and the insulating mask are made of the same material.

Images