CN105072827A - Thick copper plate manufacturing method - Google Patents
Thick copper plate manufacturing method Download PDFInfo
- Publication number
- CN105072827A CN105072827A CN201510423599.4A CN201510423599A CN105072827A CN 105072827 A CN105072827 A CN 105072827A CN 201510423599 A CN201510423599 A CN 201510423599A CN 105072827 A CN105072827 A CN 105072827A
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- CN
- China
- Prior art keywords
- manufacture method
- thick copper
- copper coin
- thick
- described step
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4632—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating thermoplastic or uncured resin sheets comprising printed circuits without added adhesive materials between the sheets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
Abstract
The invention belongs to the circuit board processing field, and more specifically relates to a thick copper plate manufacturing method. Through changing a resin glue filling flow, the method can well improve the problems of stitching white edges, stitching starvation and pcb unevenness in a stitching process, effectively improve a thick copper pcb, allow the internal layer copper thickness to be greater than 30 Z, and increase a qualified rate of stitching manufacture; accordingly, the method reduces resource waste, accords with the idea of energy conversation and environmental protection, reduces costs, and has a great prospect of use and large economic value.
Description
Technical field
The invention belongs to wiring board manufacture field, be specifically related to a kind of manufacture method of thick copper coin.
Background technology
Current thick copper coin make to make by normal flow pressing or with cushion pad make there is pressing after white edge and add the problems such as glue is bad, pressing prior art is normal pasting board pressing and adds cushion pad after adopting normal lamination, adopt after normal pressing because of internal layer copper blocked up (the thick > 30Z of internal layer copper), in bonding processes, gummosis deficiency adds the problem such as glue hole or pressing white edge after causing pressing, and adopt cushion pad pressing, squeezing action can be played, can improving pressing, to add glue bad, but center fullness after having caused pcb pressing after pressing.
Therefore provide a kind of overcome bonding processes occur pressing white edge, pressing starved and pcb uneven, mortality is high cause the wasting of resources etc. technical bottleneck, making the manufacture method being pressed into the high thick copper coin of power, is instant thing in current wiring board manufacture field.
Summary of the invention
For this reason, it is uneven that technical problem to be solved by this invention is to overcome pressing white edge, pressing starved and pcb that bonding processes occurs, mortality is high cause the wasting of resources etc. technical bottleneck, thus it is simple to propose a kind of technique, cost is low, is pressed into the manufacture method of the high thick copper coin of power.
For solving the problems of the technologies described above, the invention discloses a kind of manufacture method of thick copper coin, wherein, described method comprises following steps:
S1. to after thick copper coin sawing sheet, complete internal layer circuit exposure, development after etching goes out line pattern;
S2. the gear point film, goes out gear point net by welding resistance silk-screen, is blocked inner figure position, fill up at Wu Tongqu resin, carry out base material silk-screen resin treatment;
S3. first time baking sheet is carried out, cured resin; And then carry out brown according to end copper copper is thick;
S4. second time baking sheet is carried out again;
S5. after pressing inner stacks central layer; Suitable lamination is selected to carry out pressing plate process according to the maximum temperature of plate base material maintaining rigidness again.
Further, the manufacture method of described thick copper coin, wherein, in described step S1, the exposure guide rule lattice number that exposure adopts is 6-21 lattice.
Further, the manufacture method of described thick copper coin, wherein, in described step S3, the temperature of baking sheet is 155 DEG C for the first time.
More further, the manufacture method of described thick copper coin, wherein, in described step S3, the time of baking sheet first time is 1 hour.
Preferably, the manufacture method of described thick copper coin, wherein, in described step S4, second time baking sheet temperature is 120 DEG C.
More preferred, the manufacture method of described thick copper coin, wherein, in described step S4, second time baking sheet duration is 2 hours.
Further, the manufacture method of described thick copper coin, wherein, between described step S1 and S2, also comprises the step checking inner figure.
Further, the manufacture method of described thick copper coin, wherein, in described step S3, brown speed adjusts according to end copper copper is thick.
More further, the manufacture method of described thick copper coin, wherein, in described step S5, in sheeting process, the outer copper foil of plate selects Copper Foil according to assembled watch copper thickness.
Technique scheme of the present invention has the following advantages compared to existing technology: by change resin filler flow process, well can improve the pressing white edge because occurring in bonding processes, pressing starved and pcb uneven, effectively improve thick copper pcb, make the thick > 30Z of internal layer copper, improve the qualification rate that pressing makes; Thus decrease the wasting of resources, meet the theory of energy-conserving and environment-protective, reduce cost, there is great Utilization prospects and market economy value.
Accompanying drawing explanation
In order to make content of the present invention be more likely to be clearly understood, below according to a particular embodiment of the invention and by reference to the accompanying drawings, the present invention is further detailed explanation, wherein
Fig. 1 is the structural representation in the manufacture method of thick copper coin of the present invention before central layer potting resin;
Fig. 2 is the structural representation in the manufacture method of thick copper coin of the present invention after central layer potting resin.
In figure, Reference numeral is expressed as: 1-central layer; 2-resin.
Embodiment
Embodiment
Present embodiment discloses a kind of manufacture method of thick copper coin, concrete steps are as follows:
S1, sawing sheet process: output central layer 1 by jigsaw size;
S2, inner figure process: complete internal layer circuit exposure with 15 lattice exposure guide rules, development after etching goes out line pattern, as shown in Figure 1;
S3, internal layer AOI process: check opening the defects such as short circuit and making correction of inner figure;
S4, base material silk-screen resin treatment: go out the gear point film, go out gear point net by welding resistance silk-screen, blocked inner figure position, fill up at Wu Tongqu resin 2, as shown in Figure 2;
S5, carry out first time baking sheet process: baking sheet temperature is 155 DEG C, and duration is 1 hour, thus have cured resin 2;
S6, carry out brown process: brown speed is according to the thick brown of end copper copper;
S7, the process of second time baking sheet: baking sheet temperature is 120 DEG C, and duration is 2 hours, the object of baking sheet prevents resin 2 from hiding moisture;
S8, pressing inner stacks central layer 1 process;
S9, pressing plate: pressing adopts normal lamination pressing, select suitable lamination to carry out pressing according to plate Tg, and plank outer copper foil selects Copper Foil according to assembled watch copper thickness.
Obviously, above-described embodiment is only for clearly example being described, and the restriction not to execution mode.For those of ordinary skill in the field, can also make other changes in different forms on the basis of the above description.Here exhaustive without the need to also giving all execution modes.And thus the apparent change of extending out or variation be still among the protection range of the invention.
Claims (9)
1. a manufacture method for thick copper coin, is characterized in that, described method comprises following steps:
S1. to after thick copper coin sawing sheet, complete internal layer circuit exposure, development after etching goes out line pattern;
S2. the gear point film, goes out gear point net by welding resistance silk-screen, is blocked inner figure position, fill up at Wu Tongqu resin, carry out base material silk-screen resin treatment;
S3. first time baking sheet is carried out, cured resin; And then carry out brown according to end copper copper is thick;
S4. second time baking sheet is carried out again;
S5. after pressing inner stacks central layer; Suitable lamination is selected to carry out pressing plate process according to the maximum temperature of plate base material maintaining rigidness again.
2. the manufacture method of thick copper coin as claimed in claim 1, is characterized in that, in described step S1, the exposure guide rule lattice number that exposure adopts is 6-21 lattice.
3. the manufacture method of thick copper coin as claimed in claim 1, is characterized in that, in described step S3, the temperature of baking sheet is 155 DEG C for the first time.
4. the manufacture method of thick copper coin as claimed in claim 1, is characterized in that, in described step S3, the time of baking sheet first time is 1 hour.
5. the manufacture method of thick copper coin as claimed in claim 1, is characterized in that, in described step S4, second time baking sheet temperature is 120 DEG C.
6. the manufacture method of thick copper coin as claimed in claim 1, is characterized in that, in described step S4, second time baking sheet duration is 2 hours.
7. the manufacture method of the thick copper coin as described in claim 1-6, is characterized in that, between described step S1 and S2, also comprises the step checking inner figure.
8. the manufacture method of the thick copper coin as described in claim 1-6, is characterized in that, in described step S3, brown speed adjusts according to end copper copper is thick.
9. the manufacture method of the thick copper coin as described in claim 1-6, is characterized in that, in described step S5, in sheeting process, the outer copper foil of plate selects Copper Foil according to assembled watch copper thickness.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510423599.4A CN105072827A (en) | 2015-07-17 | 2015-07-17 | Thick copper plate manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510423599.4A CN105072827A (en) | 2015-07-17 | 2015-07-17 | Thick copper plate manufacturing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105072827A true CN105072827A (en) | 2015-11-18 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510423599.4A Pending CN105072827A (en) | 2015-07-17 | 2015-07-17 | Thick copper plate manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105072827A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106163138A (en) * | 2016-08-26 | 2016-11-23 | 广州兴森快捷电路科技有限公司 | A kind of manufacture method of gold finger plate |
| CN107864576A (en) * | 2017-11-29 | 2018-03-30 | 惠州市特创电子科技有限公司 | A kind of internal layer super thick copper coin compression method |
| CN108200736A (en) * | 2017-12-04 | 2018-06-22 | 深圳崇达多层线路板有限公司 | A kind of production method that pressing is avoided to fill not full PCB |
| CN110225650A (en) * | 2019-05-27 | 2019-09-10 | 皆利士多层线路版(中山)有限公司 | Multi-layer board and preparation method thereof |
Citations (6)
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| WO2003096775A2 (en) * | 2002-05-07 | 2003-11-20 | Future Technology | Thermal dissipating printed circuit board and methods |
| CN101328301A (en) * | 2008-07-18 | 2008-12-24 | 曾灿旺 | Liquid thermosetting resin composition and method for manufacturing printed circuit board using the same |
| JP2011171353A (en) * | 2010-02-16 | 2011-09-01 | Meiko:Kk | Method of manufacturing printed board, and printed board using this |
| CN102510668A (en) * | 2011-11-08 | 2012-06-20 | 景旺电子（深圳）有限公司 | Super thick copper PCB plate production method and its circuit board |
| CN102883534A (en) * | 2012-09-27 | 2013-01-16 | 沪士电子股份有限公司 | Method for solving problem of voltage loss in inner copper-free area of thick copper printed circuit board |
| CN103347368A (en) * | 2013-07-17 | 2013-10-09 | 皆利士多层线路版(中山)有限公司 | Outer layer 12OZ thick-copper circuit board and solder-mask manufacturing method thereof |
-
2015
- 2015-07-17 CN CN201510423599.4A patent/CN105072827A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003096775A2 (en) * | 2002-05-07 | 2003-11-20 | Future Technology | Thermal dissipating printed circuit board and methods |
| CN101328301A (en) * | 2008-07-18 | 2008-12-24 | 曾灿旺 | Liquid thermosetting resin composition and method for manufacturing printed circuit board using the same |
| JP2011171353A (en) * | 2010-02-16 | 2011-09-01 | Meiko:Kk | Method of manufacturing printed board, and printed board using this |
| CN102510668A (en) * | 2011-11-08 | 2012-06-20 | 景旺电子（深圳）有限公司 | Super thick copper PCB plate production method and its circuit board |
| CN102883534A (en) * | 2012-09-27 | 2013-01-16 | 沪士电子股份有限公司 | Method for solving problem of voltage loss in inner copper-free area of thick copper printed circuit board |
| CN103347368A (en) * | 2013-07-17 | 2013-10-09 | 皆利士多层线路版(中山)有限公司 | Outer layer 12OZ thick-copper circuit board and solder-mask manufacturing method thereof |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106163138A (en) * | 2016-08-26 | 2016-11-23 | 广州兴森快捷电路科技有限公司 | A kind of manufacture method of gold finger plate |
| CN107864576A (en) * | 2017-11-29 | 2018-03-30 | 惠州市特创电子科技有限公司 | A kind of internal layer super thick copper coin compression method |
| CN108200736A (en) * | 2017-12-04 | 2018-06-22 | 深圳崇达多层线路板有限公司 | A kind of production method that pressing is avoided to fill not full PCB |
| CN108200736B (en) * | 2017-12-04 | 2020-06-30 | 深圳崇达多层线路板有限公司 | Manufacturing method of PCB capable of avoiding incomplete press-fit filling |
| CN110225650A (en) * | 2019-05-27 | 2019-09-10 | 皆利士多层线路版(中山)有限公司 | Multi-layer board and preparation method thereof |
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Application publication date: 20151118 |