CN103347368A - Outer layer 12OZ thick-copper circuit board and solder-mask manufacturing method thereof - Google Patents
Outer layer 12OZ thick-copper circuit board and solder-mask manufacturing method thereof Download PDFInfo
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Abstract
The invention discloses an outer layer 12OZ thick-copper circuit board and a solder-mask manufacturing method of the outer layer 12OZ thick-copper circuit board. The method comprises the following steps of carrying out brown oxidation on outer layer circuits, carrying out resin coating among circuits, grinding a plate, drilling a hole and carrying out green oil silk screen. When resin coating among the circuits is carried out, resin ink is coated among the circuits by adopting a silk-screen method, standing is carried out for 10min to 30min for bubbles to be overflown, and pre-baking and solidification are carried out. The technical parameters of the silk-screen method are as follows: a squeegee angle of a screen printing machine is 20 degrees to 30 degrees, a scrapper is 25mm to 35mm, a silk screen is tensioned obliquely in 13 degrees to 17 degrees. When the plate is grinded, sandbag plate grinding is adopted for one to three times and ceramic plate grinding for one or twice. The hole is drilled by being divided into three sections, the proportion of all sections is 1 : 0.9 to 1.1 : 0.9 to 1.1. According to the solder-mask manufacturing method of the outer layer 12OZ thick-copper circuit board, solder-mask performance of outer layer circuits is improved by adopting an increasing method, the phenomena that oil ink is uneven, copper is exposed due to oil leakage and partial circuits corrode after surface treatment, and the outer layer 12OZ thick-copper circuit board is made to be good in appearance, electrical performance and reliability.
Description
Technical field
The present invention relates to a kind of anti-welding making method of wiring board, particularly relate to a kind of outer 12OZ thick copper circuit board and anti-welding making method thereof.
Background technology
Outer 12OZ thick copper circuit board particularly is applied in high-power high voltage parts such as engine power suppling part branch, automobile central authorities electric power supply part as the automotive electronics parts, and it requires wiring board to have characteristics such as heat-resistant aging, high-low temperature resistant circulation.
Yet the anti-welding technology of the thick copper coin green oil of present outer 12OZ exists following technological difficulties and reliability hidden danger:
(1) coating of solder resist (being commonly called as green oil), add the printing method according to existing electrostatic spraying, end copper thickness is up to the circuit green oil coating thickness lack of homogeneity of 12OZ, because the green oil thickness such as position, copper cash angle of this thickness are difficult to be guaranteed, the green oil thickness evenness of line face also can not get guaranteeing, cause the surface to reveal copper oxidation or short circuit easily, influence product electric property and the long-term fail safe of using.
(2) the line top edge has wedge angle, and ink adhesion is poor.Because the copper slab of outer 12OZ can produce bigger lateral erosion effect when the etching, circuit top wedge angle poor adhesive force has a strong impact on adhesive force and thickness and the reliability requirement of circuit green oil.
(3) the thick copper coin circuit of outer 12OZ is because of repeatedly etching, and the circuit lateral erosion is thick serious than ordinary copper, and printing ink and circuit contact position have the slit easily, sting erosion because galvanic effect makes circuit easily during surface treatments such as heavy tin, influence electric property and reliability of products.
(4) in the drilling operating, because not matching of resin boring and the boring of thick copper easily causes the bore edges resin cracks.
Hence one can see that, and existing manufacture method exists q﹠r to influence potential safety hazard aspect the anti-welding making.Therefore, be badly in need of a kind of reliability height, can improve automotive electronics parts operating safety factor greatly, guarantee the novel soldering-inhibiting method of personal traffic safety.
Summary of the invention
Based on this, the object of the present invention is to provide a kind of anti-welding making method of outer 12OZ thick copper circuit board.
The concrete technical scheme that solves the problems of the technologies described above is as follows:
A kind of anti-welding making method of outer 12OZ thick copper circuit board comprises the steps:
(1) the outer 12OZ circuit of wiring board carries out the brown processing;
(2) carry out between the 12OZ circuit resin-coated: adopt the silk-screen method between the 12OZ circuit, to carry out the coating of resin printing ink, leave standstill 10-30min and treat that bubble overflows, carry out prebake conditions, curing again; The technical parameter of described silk-screen method is: the screen printer scraper angle is 20-30 °, and blade thickness is 25-35mm, and silk screen is 13-17 ° and tiltedly draws; Described resin printing ink is resin printing ink between the flourish industrial siding in mountain;
(3) nog plate: adopt 1-3 sandbag nog plate and 1-2 ceramic nog plate;
(4) boring: divide 3 sections borings, every section ratio is 1:0.9-1.1:0.9-1.1;
(5) heavy copper, plating;
(6) green oil silk-screen, curing and surface treatment.
Be among the embodiment more therein, the technical parameter of the described silk-screen method of step (2) is: the screen printer scraper angle is 24-26 °, and scraper is 28-32mm, and silk screen is 15 ° and tiltedly draws, the silk-screen net adopts white twine seal or selectivity figure silk-screen, selects graphic printing can save resin printing ink.
Be among the embodiment more therein, the described nog plate of step (3) adopts 400-600# sandbag nog plate, 600-800# sandbag nog plate and 400-600# pottery nog plate successively.
Be among the embodiment more therein, the parameter of described sandbag nog plate is 3.8-4.2A, and the parameter of ceramic nog plate is 3-3.5A.
Be among the embodiment more therein, the technical parameter of the described brown of step (1) is: the weight percent concentration of strong oxidizer is 4-5%, and the percentage by weight of hydrogen peroxide is 4-6%, and temperature is 32-38 ℃, and etch-rate is 1.45-1.6 μ m/cm
2Described strong oxidizer is clorox.
Be among the embodiment more therein, the brill that adopts in the described boring of step (4) is chewed: diameter is 0.1mm, and rotating speed is 115-125krpm, and terminal-velocity is 19-21ipm, and Hui Su is 500ipm, and the number of holing mostly is 200 most;
Or diameter is 0.15mm, and rotating speed is 115-125krpm, and terminal-velocity is 21-24ipm, and the number of holing mostly is 300 most, and Hui Su is 500ipm;
Or diameter is 0.20mm, and rotating speed is 115-125krpm, and terminal-velocity is 24-26ipm, and the number of holing mostly is 500 most, and Hui Su is 500ipm;
Or diameter is 0.25mm, and rotating speed is 115-120krpm, and terminal-velocity is 25-27ipm, and the number of holing mostly is 500 most, and Hui Su is 500ipm;
Or diameter is 0.30mm, and rotating speed is 95-100krpm, and terminal-velocity is 27-29ipm, and the number of holing mostly is 500 most, and Hui Su is 500ipm;
Or diameter is 0.35mm, and rotating speed is 80-85krpm, and terminal-velocity is 29-31ipm, and the number of holing mostly is 800 most, and Hui Su is 500ipm;
Or diameter is 0.40mm, and rotating speed is 70-75krpm, and terminal-velocity is 30-32ipm, and the number of holing mostly is 800 most, and Hui Su is 500ipm;
Or diameter is 0.45mm, and rotating speed is 63-67krpm, and terminal-velocity is 31-33ipm, and the number of holing mostly is 800 most, and Hui Su is 500ipm;
Or diameter is 0.50mm, and rotating speed is 55-60krpm, and terminal-velocity is 33-35ipm, and the number of holing mostly is 800 most, and Hui Su is 500ipm;
Or diameter is 0.55mm, and rotating speed is 50-55krpm, and terminal-velocity is 33-35ipm, and the number of holing mostly is 800 most, and Hui Su is 700ipm;
Or diameter is 0.60mm, and rotating speed is 45-50krpm, and terminal-velocity is 68-72ipm, and the number of holing mostly is 1200 most, and Hui Su is 700ipm;
Or diameter is 0.65mm, and rotating speed is 42-46krpm, and terminal-velocity is 68-72ipm, and the number of holing mostly is 1200 most, and Hui Su is 700ipm;
Or diameter is 0.70mm, and rotating speed is 40-45krpm, and terminal-velocity is 36-38ipm, and the number of holing mostly is 1200 most, and Hui Su is 700ipm;
Or diameter is 0.75mm, and rotating speed is 35-40krpm, and terminal-velocity is 37-40ipm, and the number of holing mostly is 1200 most, and Hui Su is 700ipm.
Be among the embodiment more therein, the brill that adopts in the described boring is chewed: diameter is 0.1mm, and rotating speed is 120krpm, and terminal-velocity is 20ipm, and the number of holing mostly is 200 most, and Hui Su is 500ipm;
Or diameter is 0.15mm, and rotating speed is 120krpm, and terminal-velocity is 23ipm, and the number of holing mostly is 300 most, and Hui Su is 500ipm;
Or diameter is 0.20mm, and rotating speed is 120krpm, and terminal-velocity is 25ipm, and the number of holing mostly is 500 most, and Hui Su is 500ipm;
Or diameter is 0.25mm, and rotating speed is 117krpm, and terminal-velocity is 26ipm, and the number of holing mostly is 500 most, and Hui Su is 500ipm;
Or diameter is 0.30mm, and rotating speed is 97.2krpm, and terminal-velocity is 28ipm, and the number of holing mostly is 500 most, and Hui Su is 500ipm;
Or diameter is 0.35mm, and rotating speed is 83.1krpm, and terminal-velocity is 30ipm, and the number of holing mostly is 800 most, and Hui Su is 500ipm;
Or diameter is 0.40mm, and rotating speed is 73.5krpm, and terminal-velocity is 31ipm, and the number of holing mostly is 800 most, and Hui Su is 500ipm;
Or diameter is 0.45mm, and rotating speed is 64.8krpm, and terminal-velocity is 32ipm, and the number of holing mostly is 800 most, and Hui Su is 500ipm;
Or diameter is 0.50mm, and rotating speed is 58.2krpm, and terminal-velocity is 34ipm, and the number of holing mostly is 800 most, and Hui Su is 500ipm;
Or diameter is 0.55mm, and rotating speed is 52.8krpm, and terminal-velocity is 34ipm, and the number of holing mostly is 800 most, and Hui Su is 700ipm;
Or diameter is 0.60mm, and rotating speed is 48krpm, and terminal-velocity is 70ipm, and the number of holing mostly is 1200 most, and Hui Su is 700ipm;
Or diameter is 0.65mm, and rotating speed is 44krpm, and terminal-velocity is 70ipm, and the number of holing mostly is 1200 most, and Hui Su is 700ipm;
Or diameter is 0.70mm, and rotating speed is 41.5krpm, and terminal-velocity is 37.4ipm, and the number of holing mostly is 1200 most, and Hui Su is 700ipm;
Or diameter is 0.75mm, and rotating speed is 38.9krpm, and terminal-velocity is 38ipm, and the number of holing mostly is 1200 most, and Hui Su is 700ipm.
Be among the embodiment more therein, the percentage by weight of described strong oxidizer is 4-4.5%, and the percentage by weight of hydrogen peroxide is 4-5%, and temperature is 34-36 ℃; Described strong oxidizer is clorox.
Be among the embodiment more therein, the described prebake conditions temperature of step (2) is 110-130 ℃, and the time is 40-50min; Described curing temperature is 170-190 ℃, and the time is 50-70min.
The prepared a kind of outer 12OZ thick copper circuit board of above-mentioned anti-welding making method.
Advantage and the beneficial effect of a kind of outer 12OZ thick copper circuit board of the present invention and anti-welding making method thereof are as follows:
(1) anti-welding making method of the present invention has substituted green oil soldering-inhibiting method single in the prior art, has improved the anti-welding performance of outer-layer circuit, avoid producing the printing ink inequality, get rid of oil and cause leaking copper and surface treatment after the circuit part sting erosion; Prepared outer 12OZ thick copper circuit board green oil thickness evenly, have good surface appearance, electric property and a reliability.
(2) resin-coated between circuit described in the soldering-inhibiting method of the present invention, it adopts resin printing ink between silk-screen method and line, do not need the vacuum hole covering machine, bubble overflows automatically during printing, solidifying in the resin printing ink of the super thick coating in back does not have bubble residual, and resin printing ink shrinks hardly, has not only improved wiring board reliability quality, and the saving cost, make cost performance of product improve greatly.
(3) also increased the brown operation in the soldering-inhibiting method of the present invention, it can make the circuit alligatoring of wiring board, and increase specific area and increase, thus the adhesion of increase circuit and resin printing ink, make resin printing ink and wiring board in conjunction with closely, strengthen the adhesive force of resin printing ink.
(4) mode of nog plate not only reaches the effect that polishes resin described in the soldering-inhibiting method of the present invention, and all adopts ceramic nog plate, escapable cost and Production Time in the contrast prior art.
(5) hole described in the soldering-inhibiting method of the present invention, consider the problem of thick copper boring and the boring of resin printing ink simultaneously, divide three sections borings, prevent limit, hole resin cracks.
(6) boring of the present invention is also chewed diameter according to different brills, adjusts appropriate resin boring and factors such as thick copper boring rotating speed, terminal-velocity, hole count and Hui Su, has further prevented limit, hole resin cracks.
Description of drawings
Fig. 1 is embodiment 1 anti-welding making method flow chart;
Fig. 2-A is the schematic diagram before embodiment 1 sandbag nog plate and the ceramic nog plate;
Fig. 2-B is the schematic diagram behind embodiment 1 sandbag nog plate and the ceramic nog plate;
Fig. 2-C is the little slice map of outer 12OZ thick copper circuit plate level before the embodiment 1 sandbag nog plate;
Fig. 2-D is the little slice map of outer 12OZ thick copper circuit plate level behind the embodiment 1 sandbag nog plate;
Fig. 2-E is the little slice map of section of outer 12OZ thick copper circuit board before the embodiment 1 ceramic nog plate;
Fig. 2-F is the little slice map of section of outer 12OZ thick copper circuit board behind the embodiment 1 ceramic nog plate;
Fig. 3-A is the schematic diagram of embodiment 1 prepared wiring board;
Fig. 3-B is embodiment 1 prepared circuit board drawing.
Embodiment
Resin printing ink is resin printing ink between the flourish industrial siding in mountain between line of the present invention, the flourish printing ink in manufacturer mountain company.
The present invention will be further described below with reference to specific embodiment.
Embodiment 1
A kind of anti-welding making method of outer 12OZ thick copper circuit board comprises the steps (flow chart is referring to Fig. 1):
(1) outer-layer circuit plate brown; The percentage by weight of clorox is 4.3%, and the percentage by weight of hydrogen peroxide is 4.8%, and temperature is 35 ℃, and etch-rate is 1.5 μ m/cm
2
(2) resin-coated between the 12OZ circuit: adopt the silk-screen method at resin printing ink between the flourish industrial siding in coating mountain between circuit, leave standstill 20min and treat that bubble overflows, carry out prebake conditions and curing again; The technical parameter of described silk-screen method is: the screen printer scraper angle is 25 °, and blade thickness is 30mm, and silk screen is 15 ° and tiltedly draws, printing; Printed finish after, again with same procedure seal plug-in unit face, circuit surface and the baked parameter of plug-in unit face De Yu: temperature is 120 ℃, and the time is 45min, cure parameter: temperature is 180 ℃, and the time is 60min after the circuit surface prebake conditions;
(3) nog plate: adopt 2 sandbag nog plates and 1 ceramic nog plate, namely adopt 400# sandbag nog plate-600# sandbag nog plate-600# pottery nog plate successively; Wherein, the parameter of sandbag nog plate is 4A, and the parameter of ceramic nog plate is 3.2A; Before the nog plate and the contrast schematic diagram behind the nog plate, referring to Fig. 2-A-2-F, wherein, Fig. 2-A is the schematic diagram before sandbag nog plate and the ceramic nog plate, Fig. 2-B is the schematic diagram behind sandbag nog plate and ceramic nog plate, Fig. 2-C is the little slice map of outer 12OZ thick copper circuit plate level before the sandbag nog plate, Fig. 2-D is the little slice map of outer 12OZ thick copper circuit plate level behind the sandbag nog plate, Fig. 2-E is the little slice map of section of the outer 12OZ thick copper circuit board before the ceramic nog plate, and Fig. 2-F is the little slice map of section of the outer 12OZ thick copper circuit board behind ceramic nog plate; As we know from the figure, the sandbag nog plate is removed the resin projection, carries out preliminary nog plate, and ceramic nog plate finally polishes the resin between the circuit;
(4) boring: adopt brand-new boring to chew, divide 3 sections borings, every section ratio is 1:1:1;
The diameter that the brill that adopts in the boring is chewed (being the aperture of boring), rotating speed, terminal-velocity, hole count and Hui Su see table 1:
Bore in table 1 boring procedure and chew parameter
| Diameter (MM) | Rotating speed | Terminal-velocity | Hole count | Hui Su |
| 0.1 | 120 | 20 | 200 | 500 |
| 0.15 | 120 | 23 | 300 | 500 |
| 0.2 | 120 | 25 | 500 | 500 |
| 0.25 | 117 | 26 | 500 | 500 |
| 0.3 | 97.2 | 28 | 500 | 500 |
| 0.35 | 83.1 | 30 | 800 | 500 |
| 0.4 | 73.5 | 31 | 800 | 500 |
| 0.45 | 64.8 | 32 | 800 | 500 |
| 0.5 | 58.2 | 34 | 800 | 500 |
| 0.55 | 52.8 | 34 | 800 | 700 |
| 0.6 | 48 | 70 | 1200 | 700 |
| 0.65 | 44 | 70 | 1200 | 700 |
| 0.7 | 41.5 | 37.4 | 1200 | 700 |
| 0.75 | 38.9 | 38 | 1200 | 700 |
(5) heavy copper, plating; Heavy copper is identical with common process with plating, and heavy copper cylinder temperature control is at 31～36 ℃, and naoh concentration is controlled at 11～14g/l, and formaldehyde is controlled at 3.5～5.5g/l, makes hole wall deposition one deck chemical copper through heavy process for copper.Electroplating technology makes the circuit thickening, and parameter is 13ASF, holds time to be 30min.
(6) green oil silk-screen, curing and surface treatment: identical with common process, adopt the silk-screen method to carry out the anti-welding technology of green oil at resin printing ink and circuit copper, and carry out final curing according to different printing ink.By common process exposed copper face is carried out surface treatment (alternative is done spray tin, heavy silver, turmeric or surface treatment such as anti-oxidant according to demand) according to demand, the solderability of the oxidized and copper face of protection copper face.
The outer 12OZ thick copper circuit board that employing present embodiment 1 described anti-welding making method makes is referring to Fig. 3-A and Fig. 3-B, and wherein, Fig. 3-A is outer 12OZ thick copper circuit board schematic diagram, the outer 12OZ thick copper circuit board of Fig. 3-B figure; As we know from the figure, the green oil thickness of the prepared outer 12OZ thick copper circuit board of the implementation case evenly, have good surface appearance, do not separate with circuit through resin after the reliability testing, reliability is stablized.
Estimate the performance of the prepared outer 12OZ thick copper circuit board of present embodiment
One, test objective
By the green oil thickness of line angle, line face on the double-sided wiring board of measuring embodiment 1 prepared outer 12OZ thick copper circuit board, estimate the validity of soldering-inhibiting method of the present invention.
Two, test method
By different measurement points, existing angle, line face MIN, line face MAX and the copper of the 12OZ thick copper circuit board that measurement embodiment 1 makes are thick.
Criterion of acceptability is: line angle green oil thickness 〉=6 μ m, 10 μ m≤line face green oil thickness≤70 μ m.
Three, result of the test
Result of the test is referring to table 2:
Each parameter of 12OZ thick copper circuit board that table 2 embodiment 1 makes
As known from Table 2, the outer 12OZ thick copper circuit board that utilizes embodiment 1 anti-welding making method to make, green oil cladding thickness uniformities such as its line angle line face are very good, and do not need vacuum coated can make not have bubble (it is residual that the figure from Fig. 2-C to 2-F does not have bubble as can be seen) in the resin, proved validity and the cost performance of the inventive method yet.This resin printing ink is potting resin printing ink between the new exclusive line, cured resin does not have contraction, resin is combined closely with the copper cash after the brown (from 3-B figure as can be seen, thermal reliability test back circuit copper does not separate and resin shrinkage with resin), strengthen the adhesive force of resin printing ink, can guarantee high reliability request.Therefore, anti-welding making method of the present invention has improved the anti-welding performance of improving outer-layer circuit, avoid producing the ink thickness inequality, get rid of oil and cause leaking copper and surface treatment after the circuit part sting erosion; Prepared outer 12OZ copper slab outward appearance, electric property and reliability are good.
Embodiment 2
The anti-welding making method of the described outer 12OZ thick copper circuit board of present embodiment, step is substantially the same manner as Example 1, and difference is:
(1) outer-layer circuit plate brown: the percentage by weight of clorox is 4%, and the percentage by weight of hydrogen peroxide is 4%, and temperature is 32 ℃, and etch-rate is 1.45 μ m/cm
2
(2) resin-coated between circuit: the technical parameter of described silk-screen method is: the screen printer scraper angle is 20 °, and scraper is long to be 25mm, and silk screen is 13 ° and tiltedly draws; Print the plug-in unit face with same procedure again after having printed the circuit surface prebake conditions, circuit surface and the baked parameter of plug-in unit face De Yu: temperature is 110 ℃, and the time is 40min, cure parameter: temperature is 170 ℃, and the time is 50min;
(3) nog plate: adopt 1 sandbag nog plate and 1 ceramic nog plate, namely adopt 400# sandbag nog plate-600# pottery nog plate successively; Wherein, the parameter of sandbag nog plate is 3.8A, and the parameter of ceramic nog plate is 3A;
(4) boring: the diameter that the brill that adopts in the boring is chewed (being the aperture of boring), rotating speed, terminal-velocity, hole count and Hui Su see table 3:
Bore in table 3 boring procedure and chew parameter
| Diameter (MM) | Rotating speed | Terminal-velocity | Hole count | Hui Su |
| 0.1 | 115 | 19 | 200 | 500 |
| 0.15 | 115 | 21 | 300 | 500 |
| 0.2 | 115 | 24 | 500 | 500 |
| 0.25 | 115 | 25 | 500 | 500 |
| 0.3 | 95 | 27 | 500 | 500 |
| 0.35 | 80 | 29 | 800 | 500 |
| 0.4 | 70 | 30 | 800 | 500 |
| 0.45 | 63 | 31 | 800 | 500 |
| 0.5 | 55 | 33 | 800 | 500 |
| 0.55 | 50 | 33 | 800 | 700 |
| 0.6 | 45 | 68 | 1200 | 700 |
| 0.65 | 42 | 68 | 1200 | 700 |
| 0.7 | 40 | 36 | 1200 | 700 |
| 0.75 | 35 | 37 | 1200 | 700 |
Estimate the performance of the prepared outer 12OZ thick copper circuit board of present embodiment
Evaluation method is referring to embodiment 1, and the parameter of the 12OZ thick copper circuit board that present embodiment makes sees Table 4:
Each parameter of 12OZ thick copper circuit board that table 4 embodiment 2 makes
| Measurement point | Line angle | Line face MIN | Line face MAX | Copper is thick | The result |
| A | 25.4 | 32.6 | 45.5 | 401.4 | OK |
| B | 17.9 | 32.8 | 37.9 | 402.5 | OK |
| C | 19.5 | 30.9 | 35.9 | 403.8 | OK |
| D | 20.9 | 29.8 | 38.7 | 401.7 | OK |
| E | 18.9 | 34.8 | 54.6 | 403.2 | OK |
| F | 22.1 | 32.4 | 43.9 | 401.8 | OK |
As known from Table 4, green oil cladding thickness uniformities such as its line angle line face are very good, and do not have bubble in the resin printing ink, and solidifying the back does not have contraction, and the copper cash of resin after brown is combined closely, can guarantee high reliability request.Therefore, anti-welding making method of the present invention has improved the anti-welding performance of improving outer-layer circuit, avoid producing the ink thickness inequality, get rid of oil and cause leaking copper and surface treatment after the circuit part sting erosion; Prepared outer 12OZ copper slab outward appearance, electric property and reliability are good.
Embodiment 3
The anti-welding making method of the described outer 12OZ thick copper circuit board of present embodiment, step is substantially the same manner as Example 1, and difference is:
(1) outer-layer circuit plate brown: the percentage by weight of clorox is 5%, and the percentage by weight of hydrogen peroxide is 6%, and temperature is 38 ℃, and etch-rate is 1.6 μ m/cm
2
(2) resin-coated between the circuit: the technical parameter of described silk-screen method is: the screen printer scraper angle is 30 °, and scraper is long to be 35mm, and silk screen is 17 ° and tiltedly draws; Print the plug-in unit face with same procedure again after having printed the circuit surface prebake conditions, circuit surface and the baked parameter of plug-in unit face De Yu: temperature is 130 ℃, and the time is 50min, cure parameter: temperature is 190 ℃, and the time is 70min;
(3) nog plate: adopt 3 sandbag nog plates and 2 ceramic nog plates, namely adopt 400# sandbag nog plate-600# sandbag nog plate-800# sandbag nog plate-400# pottery nog plate-600# pottery nog plate successively; Wherein, the parameter of sandbag nog plate is 4.2A, and the parameter of ceramic nog plate is 3.5A;
(4) boring: the diameter that the brill that adopts in the boring is chewed (being the aperture of boring), rotating speed, terminal-velocity, hole count and Hui Su see table 5:
Bore in table 5 boring procedure and chew parameter
| Diameter (MM) | Rotating speed | Terminal-velocity | Hole count | Hui Su |
| 0.1 | 125 | 21 | 200 | 500 |
| 0.15 | 125 | 24 | 300 | 500 |
| 0.2 | 125 | 26 | 500 | 500 |
| 0.25 | 120 | 27 | 500 | 500 |
| 0.3 | 100 | 29 | 500 | 500 |
| 0.35 | 85 | 31 | 800 | 500 |
| 0.4 | 75 | 32 | 800 | 500 |
| 0.45 | 67 | 33 | 800 | 500 |
| 0.5 | 60 | 35 | 800 | 500 |
| 0.55 | 55 | 35 | 800 | 700 |
| 0.6 | 50 | 72 | 1200 | 700 |
| 0.65 | 46 | 72 | 1200 | 700 |
| 0.7 | 45 | 38 | 1200 | 700 |
| 0.75 | 40 | 40 | 1200 | 700 |
Estimate the performance of the prepared outer 12OZ thick copper circuit board of present embodiment
Evaluation method is referring to embodiment 1, and the parameter of the 12OZ thick copper circuit board that present embodiment makes sees Table 6:
Each parameter of 12OZ thick copper circuit board that table 6 embodiment 3 makes
| Measurement point | Line angle | Line face MIN | Line face MAX | Copper is thick | The result |
| A | 26.9 | 31.9 | 47.4 | 402.5 | OK |
| B | 23.4 | 35.6 | 42.3 | 403.4 | OK |
| C | 22.6 | 33.8 | 41.8 | 402.7 | OK |
| D | 23.7 | 34.6 | 37.7 | 401.6 | OK |
| E | 19.9 | 31.4 | 48.6 | 402.8 | OK |
| F | 25.4 | 33.3 | 45.1 | 403.3 | OK |
As known from Table 6, the outer 12OZ thick copper circuit board that present embodiment makes, green oil cladding thickness uniformities such as its line angle, line face are very good, and there is not bubble in the resin, and cured resin does not have contraction, and the copper cash of resin after brown is combined closely, can guarantee high reliability request.Therefore, anti-welding making method of the present invention has improved the anti-welding performance of improving outer-layer circuit, avoid producing the ink thickness inequality, get rid of oil and cause leaking copper and surface treatment after the circuit part sting erosion; Prepared outer 12OZ copper slab outward appearance, electric property and reliability are good.
The above embodiment has only expressed several execution mode of the present invention, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to claim of the present invention.Should be pointed out that for the person of ordinary skill of the art without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection range of patent of the present invention should be as the criterion with claims.
Claims (9)
1. the anti-welding making method of an outer 12OZ thick copper circuit board is characterized in that, comprises the steps:
(1) the outer 12OZ circuit with wiring board carries out the brown processing;
(2) resin-coated between the 12OZ circuit: adopt the silk-screen method between the 12OZ circuit, to carry out the coating of resin printing ink, leave standstill 10-30min and treat that bubble overflows, carry out prebake conditions, curing again; The technical parameter of described silk-screen method is: the screen printer scraper angle is 20-30 °, and blade thickness is 25-35mm, and silk screen is 13-17 ° and tiltedly draws;
(3) nog plate: adopt 1-3 sandbag nog plate and 1-2 ceramic nog plate;
(4) boring: divide 3 sections borings, every section ratio is 1:0.9-1.1:0.9-1.1;
(5) heavy copper, plating;
(6) green oil silk-screen, curing and surface treatment.
2. the anti-welding making method of outer 12OZ thick copper circuit board according to claim 1, it is characterized in that, the technical parameter of the described silk-screen method of step (2) is: the screen printer scraper angle is 24-26 °, blade thickness is 28-32mm, the silk-screen net adopts white twine seal or selectivity figure silk-screen, and silk screen is 15 ° and tiltedly draws.
3. the anti-welding making method of outer 12OZ thick copper circuit board according to claim 1 is characterized in that, the described nog plate of step (3) adopts 400-600# sandbag nog plate, 600-800# sandbag nog plate and 400-600# pottery nog plate successively.
4. according to the anti-welding making method of claim 1 or 3 described outer 12OZ thick copper circuit boards, it is characterized in that the parameter of described sandbag nog plate is 3.8-4.2A, the parameter of ceramic nog plate is 3-3.5A.
5. the anti-welding making method of outer 12OZ thick copper circuit board according to claim 1, it is characterized in that, the technical parameter of the described brown of step (1) is: the percentage by weight of strong oxidizer is 4-5%, the percentage by weight of hydrogen peroxide is 4-6%, temperature is 32-38 ℃, and etch-rate is 1.45-1.6 μ m/cm
2Described strong oxidizer is clorox.
6. the anti-welding making method of outer 12OZ thick copper circuit board according to claim 1 is characterized in that, the brill that adopts in the described boring of step (4) is chewed: if diameter is 0.1mm, rotating speed is 115-125krpm, terminal-velocity is 19-21ipm, and Hui Su is 500ipm, and the number of holing mostly is 200 most;
If diameter is 0.15mm, rotating speed is 115-125krpm, and terminal-velocity is 21-24ipm, and the number of holing mostly is 300 most, and Hui Su is 500ipm;
If diameter is 0.20mm, rotating speed is 115-125krpm, and terminal-velocity is 24-26ipm, and the number of holing mostly is 500 most, and Hui Su is 500ipm;
If diameter is 0.25mm, rotating speed is 115-120krpm, and terminal-velocity is 25-27ipm, and the number of holing mostly is 500 most, and Hui Su is 500ipm;
If diameter is 0.30mm, rotating speed is 95-100krpm, and terminal-velocity is 27-29ipm, and the number of holing mostly is 500 most, and Hui Su is 500ipm;
If diameter is 0.35mm, rotating speed is 80-85krpm, and terminal-velocity is 29-31ipm, and the number of holing mostly is 800 most, and Hui Su is 500ipm;
If diameter is 0.40mm, rotating speed is 70-75krpm, and terminal-velocity is 30-32ipm, and the number of holing mostly is 800 most, and Hui Su is 500ipm;
If diameter is 0.45mm, rotating speed is 63-67krpm, and terminal-velocity is 31-33ipm, and the number of holing mostly is 800 most, and Hui Su is 500ipm;
If diameter is 0.50mm, rotating speed is 55-60krpm, and terminal-velocity is 33-35ipm, and the number of holing mostly is 800 most, and Hui Su is 500ipm;
If diameter is 0.55mm, rotating speed is 50-55krpm, and terminal-velocity is 33-35ipm, and the number of holing mostly is 800 most, and Hui Su is 700ipm;
If diameter is 0.60mm, rotating speed is 45-50krpm, and terminal-velocity is 68-72ipm, and the number of holing mostly is 1200 most, and Hui Su is 700ipm;
If diameter is 0.65mm, rotating speed is 42-46krpm, and terminal-velocity is 68-72ipm, and the number of holing mostly is 1200 most, and Hui Su is 700ipm;
If diameter is 0.70mm, rotating speed is 40-45krpm, and terminal-velocity is 36-38ipm, and the number of holing mostly is 1200 most, and Hui Su is 700ipm;
If diameter is 0.75mm, rotating speed is 35-40krpm, and terminal-velocity is 37-40ipm, and the number of holing mostly is 1200 most, and Hui Su is 700ipm.
7. the anti-welding making method of outer 12OZ thick copper circuit board according to claim 6 is characterized in that, if diameter is 0.1mm, rotating speed is 120krpm, and terminal-velocity is 20ipm, and the number of holing mostly is 200 most, and Hui Su is 500ipm;
If diameter is 0.15mm, rotating speed is 120krpm, and terminal-velocity is 23ipm, and the number of holing mostly is 300 most, and Hui Su is 500ipm;
If diameter is 0.20mm, rotating speed is 120krpm, and terminal-velocity is 25ipm, and the number of holing mostly is 500 most, and Hui Su is 500ipm;
If diameter is 0.25mm, rotating speed is 117krpm, and terminal-velocity is 26ipm, and the number of holing mostly is 500 most, and Hui Su is 500ipm;
If diameter is 0.30mm, rotating speed is 97.2krpm, and terminal-velocity is 28ipm, and the number of holing mostly is 500 most, and Hui Su is 500ipm;
If diameter is 0.35mm, rotating speed is 83.1krpm, and terminal-velocity is 30ipm, and the number of holing mostly is 800 most, and Hui Su is 500ipm;
If diameter is 0.40mm, rotating speed is 73.5krpm, and terminal-velocity is 31ipm, and the number of holing mostly is 800 most, and Hui Su is 500ipm;
If diameter is 0.45mm, rotating speed is 64.8krpm, and terminal-velocity is 32ipm, and the number of holing mostly is 800 most, and Hui Su is 500ipm;
If diameter is 0.50mm, rotating speed is 58.2krpm, and terminal-velocity is 34ipm, and the number of holing mostly is 800 most, and Hui Su is 500ipm;
If diameter is 0.55mm, rotating speed is 52.8krpm, and terminal-velocity is 34ipm, and the number of holing mostly is 800 most, and Hui Su is 700ipm;
If diameter is 0.60mm, rotating speed is 48krpm, and terminal-velocity is 70ipm, and the number of holing mostly is 1200 most, and Hui Su is 700ipm;
If diameter is 0.65mm, rotating speed is 44krpm, and terminal-velocity is 70ipm, and the number of holing mostly is 1200 most, and Hui Su is 700ipm;
If diameter is 0.70mm, rotating speed is 41.5krpm, and terminal-velocity is 37.4ipm, the maximum hole counts of the number of holing be that 1200, Hui Su is 700ipm;
If diameter is 0.75mm, rotating speed is 38.9krpm, and terminal-velocity is 38ipm, and the number of holing mostly is 1200 most, and Hui Su is 700ipm.
8. the anti-welding making method of outer 12OZ thick copper circuit board according to claim 1 is characterized in that, the described prebake conditions temperature of step (2) is 110-130 ℃, and the time is 40-50min; Described curing temperature is 170-190 ℃, and the time is 50-70min.
9. according to the prepared outer 12OZ thick copper circuit board of each described anti-welding making method of claim 1-8.
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| CN104144556B (en) | 2017-08-25 |
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