CN108289374A - A kind of production method of filling holes with resin wiring board - Google Patents
A kind of production method of filling holes with resin wiring board Download PDFInfo
- Publication number
- CN108289374A CN108289374A CN201711396846.1A CN201711396846A CN108289374A CN 108289374 A CN108289374 A CN 108289374A CN 201711396846 A CN201711396846 A CN 201711396846A CN 108289374 A CN108289374 A CN 108289374A
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- CN
- China
- Prior art keywords
- resin
- filling holes
- plate
- production
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1492—Periodical treatments, e.g. pulse plating of through-holes
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The present invention relates to printed wiring board manufacture technology field, specially a kind of production method of filling holes with resin wiring board.The present invention is by the way that once property drills out all holes on production plate, it not only avoids because drilling flow will appear the problem of hole is scrapped partially twice, primary drilling flow is also reduced, production efficiency is improved and saves production cost, about 36 yuan/m can be saved for general production plate2；One layer about 4 μm of thin copper layer is first plated in first time electric plating of whole board process simultaneously, subtract the layers of copper of about 2 μ m-thicks again through abrasive belt grinding process, it is about 4 μm or so still to be controlled in second of electric plating of whole board process and increase the thickness of copper plate newly, in this way when rear process makes the etching work procedure of outer-layer circuit link, need the copper layer thickness etched away not thick, for the plate of accurate fine rule road, the smaller i.e. smaller circuit of pre- large space is pre- also to make made circuit reach design requirement greatly, solve the problems, such as that line children scraps, line children scraps almost nil.
Description
Technical field
The present invention relates to printed wiring board manufacture technology fields, and in particular to a kind of making side of filling holes with resin wiring board
Method.
Background technology
There are mainly two types of the production processes of existing filling holes with resin wiring board.One is whole plate jack process, i.e., in production plate
Upper first to drill out all holes (preceding filling holes with resin) for needing to clog resin, hole metallization simultaneously bores other holes after clogging resin and carries out again
The other process of conventional production line road plate, detailed process are as follows：Resin plug before production plate → brill of preceding process formation Multi-layer force fit
Copper → electric plating of whole board → slice analysis → outer layer plating hole pattern → plated hole → of hole → outer layer sinking takes off film → filling resin formation resin
Wiring board is made in the heavy copper → electric plating of whole board → rear process of consent → abrasive belt grinding → slice analysis → outer layer drilling → outer layer.Due to
The metallization of preceding filling holes with resin is completed by plated hole process again after outer layer sinks copper and electric plating of whole board, resin before institute
The electric plating of whole board of consent metallization processes need to only plate one layer of very thin copper, therefore process will not to make outer-layer circuit
The table copper thickness of preceding production plate increases excessive and causes etching difficult；But there are a prodigious deficiencies to be for whole plate jack process
The flow that drilled twice is needed, the flow that drills twice has the rugosity deviation between second for the first time, to easily cause
It scraps in inclined hole；Need progress abrasive belt grinding (plate plate face will be produced after especially drilling for the first time and after carrying out filling holes with resin process
Resin grind off), the size harmomegathus coefficient of production plate can be made to change in this way, inconsequent, so as to cause secondary drilling
And outer-layer circuit deviation is scrapped, scrappage is generally up to 20%.Another kind is selective jack process, i.e., primary on production plate
Property drills out all holes, then through outer layer sinks copper and electric plating of whole board process makes hole metallization and hole wall copper thickness is made to reach design to want
It asks, then preceding filling holes with resin filling resin is made to form filling holes with resin, carry out the heavy copper of outer layer and full plate again after abrasive belt grinding
Electroplating work procedure, detailed process are as follows：The production plate → outer layer drills → that preceding process forms Multi-layer force fit crosses plasma processing → outside
Heavy 1 → the electric plating of whole board of copper 1 (negative film) of layer → to the partial hole filling resin on production plate formed filling holes with resin → abrasive belt grinding →
Wiring board is made in 2 → electric plating of whole board of the heavy copper of outer layer 2 → rear process.The selective jack process flow that only carries out once drilling overcomes
The problem of inclined hole is scrapped, but by the porose hole wall copper thickness of institute and produce the table copper thickness of plate and be plated to and set when by electric plating of whole board 1
Meter requires, and causes to etch using the table copper thickness of production plate before making outer-layer circuit can be made to increase excessive after electric plating of whole board 2
Difficult (the table copper thickness of production plate be pressing start copper thickness add about 25-40 μm of coating copper thickness), for accurate fine rule road, due to
Not enough pre- large spaces, etching is difficult, easily causes line children to scrap, scrappage is generally up to 20%.
Invention content
The present invention easily occurs that hole is scrapped partially or accurate fine rule road easily goes out for the production method of existing filling holes with resin wiring board
The problem of existing line children scraps, provide a kind of can solve the problems, such as that hole is inclined and the filling holes with resin of line children's problem occurs in accurate fine rule road simultaneously
The production method of wiring board.
To achieve the above object, the present invention uses following technical scheme.
A kind of production method of filling holes with resin wiring board, includes the following steps：
Then S1, the production plate that Multi-layer force fit is produced by preceding process drill on production plate, the hole includes preceding tree
Fat consent and non-preceding filling holes with resin.
Further, further include that Surface Treatment with Plasma (plasma processing) is carried out to production plate before step S2.
S2, the heavy copper process processing of first time outer layer and the processing of first time electric plating of whole board process are carried out successively to production plate, made
Produce the preceding filling holes with resin on plate and non-preceding filling holes with resin metallization；And control is formed by the first time electric plating of whole board process
The thickness of copper coating is 4 μm ± 10%.
Further, the first time electric plating of whole board process described in step S2, current density 1.0ASD, electroplating time are
20min。
Further, further include that slice analysis is carried out to production plate before carrying out step S3.
S3, outer layer is made on production plate plate hole pattern, and is only thickeied by plated hole process and to produce plate and go forward filling holes with resin
Hole copper thickness to design requirement.
Further, the hole copper thickness of preceding filling holes with resin is 20-35 μm.
S4, after taking off the film of outer layer plating hole pattern, preceding filling holes with resin is clogged with resin, resin plug is made in preceding filling holes with resin
Hole.
S5, abrasive belt grinding process processing is carried out to production plate, grinds off the resin of production plate surface.
Further, the resin for producing plate surface is ground off and grinds off 2 μ m thicks by abrasive belt grinding process described in step S5
Layers of copper.
Further, further include that slice analysis is carried out again to production plate before carrying out step S6.
S6, the heavy copper process processing of second of outer layer and second of electric plating of whole board process processing are carried out successively to production plate, and
The thickness for the copper coating that control is formed by second of electric plating of whole board process is 4 μm ± 10%.
Further, second of electric plating of whole board process described in step S6, current density 1.0ASD, electroplating time are
20min。
S7, outer-layer circuit making, solder mask making, surface treatment, molding procedure are carried out on production plate by rear process,
Wiring board is made.
Compared with prior art, the present invention has the advantages that：The present invention is by the way that once property drills out on production plate
All holes are not only avoided because drilling flow will appear the problem of hole is scrapped partially twice, are also reduced primary drilling flow, are carried
High efficiency and saving production cost, about 36 yuan/m can be saved for general production plate2；Simultaneously in first time electric plating of whole board
One layer about 4 μm of thin copper layer is first plated when process, then by making outer layer plating hole pattern on production plate and passing through plated hole work
Sequence only thicken production plate go forward filling holes with resin hole copper thickness to design requirement, subtract about 2 μ again followed by through abrasive belt grinding process
The layers of copper of m thickness, it is about 4 μm or so still to be controlled in second of electric plating of whole board process and increase the thickness of copper plate newly, is existed in this way
When process makes the etching work procedure of outer-layer circuit link afterwards, it is that pressing startup copper layer thickness adds 6 μ to need the copper layer thickness etched away
M or so, copper layer thickness is not thick, for the plate of accurate fine rule road, the smaller i.e. smaller circuit of pre- large space it is pre- it is big can also make it is made
The circuit of work reaches design requirement, solves the problems, such as that line children scraps, line children scraps almost nil.
Specific implementation mode
In order to more fully understand the technology contents of the present invention, below in conjunction with specific embodiment to the technical side of the present invention
Case is described further and illustrates.
Embodiment
The present embodiment provides a kind of production method of filling holes with resin wiring board, specific making step is as follows：
(1), sawing sheet：Core plate is outputed by jigsaw size 620mm × 720mm, core plate plate thickness is 0.5mm.
(2), internal layer circuit is made：Inner figure shifts, and light-sensitive surface, the film thickness monitoring of light-sensitive surface are coated with vertical application machine
8 μm, using Full-automatic exposure machine, internal layer circuit exposure is completed with 5-6 lattice exposure guide rule (21 lattice exposure guide rule)；Internal layer etches, and will expose
Core plate after photodevelopment etches line pattern, and it is 3mil that internal layer line width, which measures,；Then internal layer AOI checks opening for internal layer circuit
The defects of short circuit, circuit notch, circuit pin hole, defective to scrap processing, flawless product goes out to downstream.
(6) it presses：Brown speed is selected according to plate thickness.After lamination, lamination appropriate is selected to carry out according to plate Tg
Pressing, forms the production plate of Multi-layer force fit.
(7) plasma processing：Surface Treatment with Plasma is carried out to production plate.
(8) it drills：It drills, is drilled including preceding filling holes with resin and non-preceding filling holes with resin, non-preceding resin plug on production plate
Hole refers to other holes in addition to for making filling holes with resin, this some holes is for making the via hole for forming interlayer circuit.
(9) the heavy copper of outer layer and electric plating of whole board：First time outer layer is carried out successively to production plate to sink copper process processing and first time
The processing of electric plating of whole board process makes the preceding filling holes with resin on production plate and non-preceding filling holes with resin metallization；And control is by described first
The thickness for the copper coating that secondary electric plating of whole board process is formed is 4 μm ± 10%.Specifically, in first time electric plating of whole board process, electric current
Density is 1.0ASD, electroplating time 20min.
(10) slice analysis：Slice analysis is carried out to production plate.
(11) plated hole：Outer layer is made on production plate and plates hole pattern, and production plate is only thickeied by plated hole process and goes forward to set
The hole copper thickness of fat consent is to design requirement (the hole copper thickness of preceding filling holes with resin be 20-35 μm).
(12) consent：After the film for taking off outer layer plating hole pattern, preceding filling holes with resin is made filling holes with resin before being clogged with resin
Filling holes with resin.
(13) abrasive belt grinding：Abrasive belt grinding process processing is carried out to production plate, the resin of production plate surface is ground off, will produce
The resin of plate surface grinds off and grinds off the layers of copper of 2 μ m thicks.
(14) slice analysis：Slice analysis is carried out to production plate.
(15) the heavy copper of outer layer and electric plating of whole board：The heavy copper process processing of second of outer layer and second are carried out successively to production plate
The processing of electric plating of whole board process, and the thickness for controlling the copper coating formed by second of electric plating of whole board process is 4 μm ± 10%.
Specifically, in second of electric plating of whole board process, current density 1.0ASD, electroplating time 20min.
(16), outer-layer circuit (positive blade technolgy) is made：Outer graphics shift, luxuriant and rich with fragrance using Full-automatic exposure machine and positive circuit
Woods completes outer-layer circuit exposure with 5-7 lattice exposure guide rule (21 lattice exposure guide rule), developed, and outer layer line is formed on Multi-layer force fit plate
Road figure；Outer graphics are electroplated, and copper facing and tin plating are then distinguished on Multi-layer force fit plate, copper facing is the current density with 1.8ASD
Electric plating of whole board 60min, tin plating is that 10min, 3-5 μm of tin thickness is electroplated with the current density of 1.2ASD；Then film, etching are moved back successively again
With move back tin, etch outer-layer circuit on production plate, then check that outer-layer circuit opens short circuit, circuit notch, circuit pin hole etc.
Defect, defective to scrap processing, flawless product goes out to downstream.
(17), welding resistance, silk-screen character：Solder mask and silk-screen are made according to the prior art and by design requirement on production plate
Character.
(18), it is surface-treated：It is surface-treated according to the prior art and by design requirement on production plate.
(19), it is molded：According to the prior art and design requirement gong shape is pressed, wiring board is made.
(20), electric performance test：The electric property for detecting wiring board detects qualified wiring board and enters next processing
Link；
(21), final inspection：Appearance, hole copper thickness, thickness of dielectric layers, green oil thickness, the internal layer copper thickness etc. of finished product are taken a sample test respectively,
Qualified product can shipment.
With the wiring board that the present embodiment method makes 36 yuan/m can be saved because reducing primary drilling flow2Be produced into
This, and line children's scrappage is zero.
It is provided for the embodiments of the invention technical solution above to be described in detail, specific case used herein
The principle and embodiment of the embodiment of the present invention are expounded, the explanation of above example is only applicable to help to understand this
The principle of inventive embodiments；Meanwhile for those of ordinary skill in the art, embodiment according to the present invention, in specific embodiment party
There will be changes in formula and application range, in conclusion the content of the present specification should not be construed as limiting the invention.
Claims (8)
1. a kind of production method of filling holes with resin wiring board, which is characterized in that include the following steps：
Then S1, the production plate that Multi-layer force fit is produced by preceding process drill on production plate, the hole includes preceding resin plug
Hole and non-preceding filling holes with resin；
S2, the heavy copper process processing of first time outer layer and the processing of first time electric plating of whole board process are carried out successively to production plate, makes production
Preceding filling holes with resin on plate and non-preceding filling holes with resin metallization；And control is plated by the copper that the first time electric plating of whole board process is formed
The thickness of layer is 4 μm ± 10%；
S3, outer layer is made on production plate plate hole pattern, and is only thickeied by plated hole process and to produce plate and go forward the hole of filling holes with resin
Copper thickness is to design requirement；
S4, after taking off the film of outer layer plating hole pattern, preceding filling holes with resin is clogged with resin, filling holes with resin is made in preceding filling holes with resin；
S5, abrasive belt grinding process processing is carried out to production plate, grinds off the resin of production plate surface；
S6, the heavy copper process processing of second of outer layer and second of electric plating of whole board process processing are carried out successively to production plate, and controlled
The thickness of the copper coating formed by second of electric plating of whole board process is 4 μm ± 10%；
S7, outer-layer circuit making, solder mask making, surface treatment, molding procedure are carried out on production plate by rear process, be made
Wiring board.
2. a kind of production method of filling holes with resin wiring board according to claim 1, which is characterized in that described in step S2
First time electric plating of whole board process, current density 1.0ASD, electroplating time 20min.
3. a kind of production method of filling holes with resin wiring board according to claim 1, which is characterized in that carried out in step S2
The first time outer layer sinks before copper process, further includes carrying out Surface Treatment with Plasma to production plate.
4. a kind of production method of filling holes with resin wiring board according to claim 1, which is characterized in that carry out the step
Further include that slice analysis is carried out to production plate before S3.
5. a kind of production method of filling holes with resin wiring board according to claim 1, which is characterized in that described in step S5
The resin for producing plate surface is ground off and grinds off the layers of copper of 2 μ m thicks by abrasive belt grinding process.
6. a kind of production method of filling holes with resin wiring board according to claim 1, which is characterized in that described in step S6
Second of electric plating of whole board process, current density 1.0ASD, electroplating time 20min.
7. a kind of production method of filling holes with resin wiring board according to claim 1, which is characterized in that carry out the step
Further include that slice analysis is carried out again to production plate before S6.
8. a kind of production method of filling holes with resin wiring board according to claim 1, which is characterized in that preceding in step S3
The hole copper thickness of filling holes with resin is 20-35 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711396846.1A CN108289374A (en) | 2017-12-21 | 2017-12-21 | A kind of production method of filling holes with resin wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711396846.1A CN108289374A (en) | 2017-12-21 | 2017-12-21 | A kind of production method of filling holes with resin wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108289374A true CN108289374A (en) | 2018-07-17 |
Family
ID=62832316
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711396846.1A Pending CN108289374A (en) | 2017-12-21 | 2017-12-21 | A kind of production method of filling holes with resin wiring board |
Country Status (1)
| Country | Link |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109121301A (en) * | 2018-09-28 | 2019-01-01 | 广州兴森快捷电路科技有限公司 | Wiring board and its selective resin jack designs method |
| CN109548302A (en) * | 2018-11-14 | 2019-03-29 | 深圳崇达多层线路板有限公司 | A kind of production method of the wiring board with thick copper hole |
| CN111565514A (en) * | 2020-05-27 | 2020-08-21 | 广东依顿电子科技股份有限公司 | Production method of 5G power amplifier circuit board |
| CN111970857A (en) * | 2020-07-14 | 2020-11-20 | 江门崇达电路技术有限公司 | Method for improving poor hole plugging of PCB resin |
| CN112672508A (en) * | 2020-11-30 | 2021-04-16 | 重庆凯歌电子股份有限公司 | Resin hole plugging method for PCB |
| CN111970857B (en) * | 2020-07-14 | 2024-05-31 | 江门崇达电路技术有限公司 | Method for improving poor plugging of PCB resin |
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| EP1509071A4 (en) * | 2002-05-28 | 2008-12-31 | Sumitomo Electric Industries | Aluminum nitride sintered compact having metallized layer and method for preparation thereof |
| JP2011155196A (en) * | 2010-01-28 | 2011-08-11 | Kyocera Corp | Wiring board and method of manufacturing wiring board |
| CN102244987A (en) * | 2011-04-21 | 2011-11-16 | 深圳市迅捷兴电路技术有限公司 | Method for resin plugging of holes of back plate with high thickness-to-diameter ratio |
| CN106341950A (en) * | 2016-09-29 | 2017-01-18 | 深圳市迅捷兴科技股份有限公司 | Circuit board manufacturing method adopting resin plugging |
| CN106973507A (en) * | 2017-04-20 | 2017-07-21 | 深圳崇达多层线路板有限公司 | A kind of preparation method of filling holes with resin wiring board |
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2017
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1509071A4 (en) * | 2002-05-28 | 2008-12-31 | Sumitomo Electric Industries | Aluminum nitride sintered compact having metallized layer and method for preparation thereof |
| JP2011155196A (en) * | 2010-01-28 | 2011-08-11 | Kyocera Corp | Wiring board and method of manufacturing wiring board |
| CN102244987A (en) * | 2011-04-21 | 2011-11-16 | 深圳市迅捷兴电路技术有限公司 | Method for resin plugging of holes of back plate with high thickness-to-diameter ratio |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109121301A (en) * | 2018-09-28 | 2019-01-01 | 广州兴森快捷电路科技有限公司 | Wiring board and its selective resin jack designs method |
| CN109548302A (en) * | 2018-11-14 | 2019-03-29 | 深圳崇达多层线路板有限公司 | A kind of production method of the wiring board with thick copper hole |
| CN111565514A (en) * | 2020-05-27 | 2020-08-21 | 广东依顿电子科技股份有限公司 | Production method of 5G power amplifier circuit board |
| CN111970857A (en) * | 2020-07-14 | 2020-11-20 | 江门崇达电路技术有限公司 | Method for improving poor hole plugging of PCB resin |
| CN111970857B (en) * | 2020-07-14 | 2024-05-31 | 江门崇达电路技术有限公司 | Method for improving poor plugging of PCB resin |
| CN112672508A (en) * | 2020-11-30 | 2021-04-16 | 重庆凯歌电子股份有限公司 | Resin hole plugging method for PCB |
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Application publication date: 20180717 |
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