CN108055787A - A kind of solder-resisting manufacturing methods of stepped plate - Google Patents
A kind of solder-resisting manufacturing methods of stepped plate Download PDFInfo
- Publication number
- CN108055787A CN108055787A CN201711266709.6A CN201711266709A CN108055787A CN 108055787 A CN108055787 A CN 108055787A CN 201711266709 A CN201711266709 A CN 201711266709A CN 108055787 A CN108055787 A CN 108055787A
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- Prior art keywords
- layer
- board
- daughter board
- ladder platform
- solder
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention discloses a kind of solder-resisting manufacturing methods of stepped plate, including internal layer daughter board and outer layer daughter board, comprise the following steps：Internal layer circuit is made on inner- electron plate；Making solder mask at ladder platform is corresponded on inner- electron plate；Internal layer daughter board and outer layer daughter board are pressed together to form multi-layer board by not gummosis PP, and corresponds on not gummosis PP and opens a window at ladder platform；It drills to multi-layer board, and hole metallization is made by heavy copper and electric plating of whole board；It makes outer-layer circuit successively on multilayer boards and makes solder mask；The outer layer daughter board gong corresponded on multi-layer board at ladder platform is fallen, forms ladder platform；Then multi-layer board is surface-treated successively and molding procedure, stepped plate is made.The method of the present invention can avoid the occurrence of welding resistance and gather the quality defects such as oily, ill-exposed, development is not net.
Description
Technical field
The present invention relates to printed wiring board manufacture technology fields, and in particular to a kind of solder-resisting manufacturing methods of stepped plate.
Background technology
Stepped plate refers to the multilayer printed circuit board with stepped groove.At present, the production process of ladder wiring board is mainly：
Inner plating is formed by sawing sheet, inner figure transfer and etching；It presses each inner plating and forms multi-layer board；Then multi-layer board is carried out
Drilling, heavy copper, electric plating of whole board, outer graphics, graphic plating, outer layer etching and coating solder mask form more with outer-layer circuit
Sandwich circuit board；Finally it is surface-treated, is molded, it is carried out after shaping controlled depth milling slot formed stepped groove, after by end
The finished products such as inspection；Second method is exactly first to carry out outer layer again in inner plating uplifting window when pressing aftershaping and uncap to form rank
Terraced slot；The third method is exactly to be embedded in Teflon gasket in windowing after inner plating windowing, carries out taking off lid when pressing aftershaping
Teflon gasket is removed afterwards forms stepped groove；4th kind is to correspond to ladder by using not gummosis PP pieces and in not gummosis PP on pieces
It opens a window at platform, carrying out outer layer again when then pressing aftershaping uncaps to form stepped groove.
In the production method of above-mentioned stepped plate, solder mask is made by silk-screen welding resistance or electrostatic spraying mode in the later stage
When, it can there are following defects：Since stepped plate is there are high low head, welding resistance surface irregularity, welding resistance exposure imaging can exist poly-
Oily, ill-exposed, the development quality defects such as unnet.
The content of the invention
There is drawbacks described above in the present invention, provide a kind of solder-resisting manufacturing methods of stepped plate for existing stepped plate,
This method can avoid the occurrence of welding resistance and gather the quality defects such as oily, ill-exposed, development is not net.
In order to solve the above technical problem, the present invention provides a kind of solder-resisting manufacturing methods of stepped plate, including inner- electron
Plate and outer layer daughter board, the solder-resisting manufacturing methods comprise the following steps：
S1, internal layer circuit is made on inner- electron plate.
S2, making solder mask at ladder platform is corresponded on inner- electron plate.
Preferably, step S21 is further included between step S2 and S3：The periphery milling at ladder platform is corresponded on outer straton plate
Blind slot.
S3, internal layer daughter board and outer layer daughter board are pressed together to form multi-layer board by not gummosis PP, and in not gummosis PP
It opens a window at upper corresponding ladder platform.
Preferably, in step S3, during pressing, the inside that is placed on one side of milling blind slot is bonded with not gummosis PP on outer layer daughter board.
Preferably, in step S3, the size of the windowing is unilateral bigger 0.2-0.5mm than ladder platform size.
S4, drill to multi-layer board, and hole metallization is made by heavy copper and electric plating of whole board.
S5, make outer-layer circuit successively on multilayer boards and make solder mask.
S6, the outer layer daughter board gong corresponded on multi-layer board at ladder platform is fallen, forms ladder platform.
Preferably, at by way of controlled depth milling slot from the inside gong of outer layer to blind slot, by the outer layer at corresponding ladder platform
Daughter board position gong falls.
S7 and then multi-layer board is surface-treated successively and molding procedure, stepped plate is made.
Preferably, the internal layer daughter board is single core plate or is pressed by multiple core plates.
Preferably, the outer layer daughter board is single core plate or is pressed by multiple core plates.
Compared with prior art, the present invention has the advantages that：
The present invention at correspondence ladder platform by after inner- electron plate makes circuit, first making in solder mask, then general
Straton plate and outer layer daughter board are pressed into multi-layer board, and after multi-layer board makes outer-layer circuit, first make gong ladder after solder mask
Solder mask at ladder platform and the solder mask of outer layer are fabricated separately by platform, can avoid that there are high low head systems because of stepped plate
Gather the quality defects such as oily, ill-exposed, development is not net caused by when making solder mask.
Description of the drawings
Fig. 1 is the schematic diagram that internal layer daughter board makes after solder mask in embodiment 1；
Fig. 2 is the schematic diagram that multi-layer board outer layer makes after solder mask in embodiment 1；
Fig. 3 is the schematic diagram after multi-layer board gong platform in embodiment 1.
Specific embodiment
In order to more fully understand the technology contents of the present invention, below in conjunction with the accompanying drawings and the specific embodiments to the present invention's
Technical solution is described further and illustrates.
Embodiment 1
As shown in Figure 1 to Figure 3, the production method of a kind of stepped plate shown in the present embodiment, including internal layer daughter board and outer layer
Daughter board, the production method include following treatment process successively：
(1), sawing sheet：Core plate is outputed by jigsaw size 320mm × 420mm, and core plate thickness of slab is 0.5mm, the outer layer copper of core plate
Face thickness is 0.5OZ.
(2), internal layer circuit (negative film technique) is made：According to figure location hole, with the coating sense of vertical application machine on core plate
Light film, 8 μm of the film thickness monitoring of light-sensitive surface, using Full-automatic exposure machine, with layer line in 5-6 lattice exposure guide rule (21 lattice exposure guide rule) completion
Road exposes；Internal layer etches, and the core plate after exposure imaging is etched internal layer circuit, internal layer line width is measured as 3mil；Internal layer AOI,
Then the defects of opening short circuit, circuit notch, circuit pin hole of internal layer circuit is checked, it is defective to scrap processing, flawless product
Go out to downstream.
(3), press：By design requirement, internal layer daughter board is formed after polylith core plate is pressed, and is formed after the pressing of polylith core plate
Outer layer daughter board.
(4) internal layer drills：Drilling operation is carried out to inner- electron plate using borehole data, the hole bored includes filling holes with resin.
(5), heavy copper:Make the hole metallization on internal layer daughter board, backlight tests 10 grades, and the heavy copper thickness in hole is 0.5 μm.
(6), electric plating of whole board：Electric plating of whole board is carried out to inner- electron plate according to the prior art and by design requirement, thickeies plate face
With layers of copper in hole.
(7), filling holes with resin：Clog and resin 1 and cure in the plated through-hole of resin to be clogged, after ground by abrasive belt grinding
Remove the resin of protrusion plate face.
(8), heavy copper：One layer of thin copper is deposited by way of chemical reaction on filling holes with resin position surface layer, it is complete for below
Plate plating provides basis.
(9), electric plating of whole board --- according to the mechanism of electrochemical reaction, last layer copper is electroplated on the basis of heavy copper, after being
Continuous graphic plating provides basis, and electroplating parameter is：1.2ASD*60min copper layer thickness is 15+/- 5um.
(10), internal layer circuit (negative film technique) is made：According to figure location hole, distinguish on inner- electron plate and outer layer daughter board
Light-sensitive surface, 8 μm of the film thickness monitoring of light-sensitive surface, using Full-automatic exposure machine, with 5-6 lattice exposure guide rule (21 are coated with vertical application machine
Lattice exposure guide rule) complete internal layer circuit exposure；Internal layer etches, and the internal layer daughter board after exposure imaging and outer layer daughter board are etched respectively
Internal layer circuit 2, internal layer line width are measured as 3mil；Internal layer AOI, then check internal layer circuit opens short circuit, circuit notch, circuit pin
The defects of hole, defective to scrap processing, flawless product goes out to downstream.
(11), open a window：According to design requirement, making solder mask 3 at ladder platform is corresponded on inner- electron plate, protects rank
The circuit of non-welding resistance windowing position at terraced platform.
(12), milling blind slot：The milling blind slot by way of controlled depth milling slot of the periphery at ladder platform is corresponded on outer straton plate
5；Blind slot 5 it is deep-controlled in 0.15-0.35mm, later stage gong ladder platform is facilitated to use.
(13), press：Brown speed is according to bottom copper copper thickness brown, by not gummosis PP6 by internal layer daughter board and outer layer daughter board
After overlapping successively, according to the characteristic of plate appropriate lamination is selected to be pressed, form multi-layer board, milling is blind on outer layer daughter board
The inside that is placed on one side of slot is bonded with not gummosis PP, and is corresponded on not gummosis PP and windowing 4 is carried out at ladder platform.
Wherein, open a window 4 size it is unilateral bigger 0.2-0.5mm than ladder platform size, the later stage is facilitated to take off lid.
(14), outer layer drills：Drilling operation is carried out to multi-layer board using borehole data.
(15), heavy copper:Make the hole metallization on multi-layer board, backlight tests 10 grades, and the heavy copper thickness in hole is 0.5 μm.
(16), electric plating of whole board：According to the prior art and by design requirement to multi-layer board carry out electric plating of whole board, thicken plate face and
Layers of copper in hole.
(17), outer-layer circuit makes (positive blade technolgy)：Outer graphics shift, luxuriant and rich with fragrance using Full-automatic exposure machine and positive circuit
Woods completes outer-layer circuit exposure with 5-7 lattice exposure guide rule (21 lattice exposure guide rule), developed, forms outer-layer circuit figure on multilayer boards
Shape；Outer graphics are electroplated, and then distinguish copper facing and tin plating on multilayer boards, copper facing is the current density electric plating of whole board with 1.8ASD
60min, tin plating is to electroplate 10min, 3-5 μm of tin thickness with the current density of 1.2ASD；Then move back film successively again, etch and move back tin,
Outer-layer circuit is etched on multilayer boards；Outer layer AOI, then check outer-layer circuit opens short circuit, circuit notch, circuit pin hole etc.
Defect, defective to scrap processing, flawless product goes out to downstream.
(18), welding resistance, silk-screen character：Make solder mask 3 and silk on multilayer boards according to the prior art and by design requirement
Lettering accords with.
(19), gong platform：The outer layer daughter board gong corresponded on multi-layer board at ladder platform is fallen, forms ladder platform 7.
It is corresponded on the lateral surface of multi-layer board China and foreign countries straton plate at the position of ladder platform inside controlled depth milling slot to blind slot,
It takes off lid and forms ladder platform afterwards (with taking off on lid instrument removal multi-layer board by the part of mill off).
(20), surface treatment (heavy nickel gold)：It is surface-treated on multilayer boards according to the prior art and by design requirement, outside
The copper face of welding resistance windowing position at sandwich circuit and ladder platform leads to the principles of chemistry, and uniform deposition centainly requires the nickel layer and gold of thickness
Layer gold.
(21), it is molded：According to the prior art and by design requirement gong shape, stepped plate is made.
(22), electric performance test：The electric property of stepped plate is detected, qualified stepped plate is detected and enters next processing
Link；
(23), final inspection：Appearance, hole copper thickness, thickness of dielectric layers, green oil thickness, internal layer copper thickness of finished product etc. is taken a sample test respectively,
Qualified product can shipment.
Embodiment 2
A kind of production method of stepped plate shown in the present embodiment, including core material and outer layer core plate, the making side
Method includes following treatment process successively：
(1), sawing sheet：Core material and outer layer core plate, core material and outer layer are outputed by jigsaw size 320mm × 420mm
Core plate thickness of slab is 0.5mm, and the outer layer copper face thickness of core material and outer layer core plate is 0.5OZ.
(2), internal layer circuit (negative film technique) is made：According to figure location hole, distinguish on core material and outer layer core plate
Light-sensitive surface, 8 μm of the film thickness monitoring of light-sensitive surface, using Full-automatic exposure machine, with 5-6 lattice exposure guide rule (21 are coated with vertical application machine
Lattice exposure guide rule) complete internal layer circuit exposure；Internal layer etches, and the core material after exposure imaging and outer layer core plate are etched respectively
Internal layer circuit, internal layer line width are measured as 3mil；Internal layer AOI, then check internal layer circuit opens short circuit, circuit notch, circuit pin
The defects of hole, defective to scrap processing, flawless product goes out to downstream.
(3), open a window：According to design requirement, making solder mask at ladder platform is corresponded on core material, protects ladder
The circuit of non-welding resistance windowing position at platform.
(4), milling blind slot：The milling blind slot by way of controlled depth milling slot of the periphery at ladder platform is corresponded on outer layer core plate；
Blind slot it is deep-controlled in 0.15-0.35mm.
(5), press：Brown speed according to bottom copper copper thickness brown, by not gummosis PP by core material and outer layer core plate according to
It after secondary overlapping, is pressed according to the lamination that the selection of the characteristic of plate is appropriate, formation multi-layer board, milling blind slot on outer layer core plate
The inside that is placed on one side be bonded with not gummosis PP, and correspond on not gummosis PP and open a window at ladder platform.
Wherein, the size of windowing is unilateral bigger 0.2-0.5mm than ladder platform size, and the later stage is facilitated to take off lid.
(6), outer layer drills：Drilling operation is carried out to multi-layer board using borehole data.
(7), heavy copper:Make the hole metallization on multi-layer board, backlight tests 10 grades, and the heavy copper thickness in hole is 0.5 μm.
(8), electric plating of whole board：According to the prior art and by design requirement to multi-layer board carry out electric plating of whole board, thicken plate face and
Layers of copper in hole.
(9), outer-layer circuit makes (positive blade technolgy)：Outer graphics shift, luxuriant and rich with fragrance using Full-automatic exposure machine and positive circuit
Woods completes outer-layer circuit exposure with 5-7 lattice exposure guide rule (21 lattice exposure guide rule), developed, forms outer-layer circuit figure on multilayer boards
Shape；Outer graphics are electroplated, and then distinguish copper facing and tin plating on multilayer boards, copper facing is the current density electric plating of whole board with 1.8ASD
60min, tin plating is to electroplate 10min, 3-5 μm of tin thickness with the current density of 1.2ASD；Then move back film successively again, etch and move back tin,
Outer-layer circuit is etched on multilayer boards；Outer layer AOI, then check outer-layer circuit opens short circuit, circuit notch, circuit pin hole etc.
Defect, defective to scrap processing, flawless product goes out to downstream.
(10), welding resistance, silk-screen character：Make solder mask and silk-screen on multilayer boards according to the prior art and by design requirement
Character.
(11), gong platform：The outer layer core plate gong corresponded on multi-layer board at ladder platform is fallen, forms ladder platform.
It is corresponded in multi-layer board on the lateral surface of outer layer core plate at the position of ladder platform inside controlled depth milling slot to blind slot,
It takes off lid and forms ladder platform afterwards (with taking off on lid instrument removal multi-layer board by the part of mill off).
(12), surface treatment (heavy nickel gold)：It is surface-treated on multilayer boards according to the prior art and by design requirement, outside
The copper face of welding resistance windowing position at sandwich circuit and ladder platform leads to the principles of chemistry, and uniform deposition centainly requires the nickel layer and gold of thickness
Layer gold.
(13), it is molded：According to the prior art and by design requirement gong shape, stepped plate is made.
(14), electric performance test：The electric property of stepped plate is detected, qualified stepped plate is detected and enters next processing
Link；
(15), final inspection：Appearance, hole copper thickness, thickness of dielectric layers, green oil thickness, internal layer copper thickness of finished product etc. is taken a sample test respectively,
Qualified product can shipment.
The technical solution provided above the embodiment of the present invention is described in detail, specific case used herein
The principle and embodiment of the embodiment of the present invention are set forth, the explanation of above example is only applicable to help to understand this
The principle of inventive embodiments；Meanwhile for those of ordinary skill in the art, according to the embodiment of the present invention, in specific embodiment party
There will be changes in formula and application range, in conclusion this specification content should not be construed as limiting the invention.
Claims (6)
1. a kind of solder-resisting manufacturing methods of stepped plate, including internal layer daughter board and outer layer daughter board, which is characterized in that the welding resistance makes
Method comprises the following steps：
S1, internal layer circuit is made on inner- electron plate；
S2, making solder mask at ladder platform is corresponded on inner- electron plate；
S3, internal layer daughter board and outer layer daughter board are pressed together to form multi-layer board by not gummosis PP, and it is right on not gummosis PP
It answers and opens a window at ladder platform；
S4, drill to multi-layer board, and hole metallization is made by heavy copper and electric plating of whole board；
S5, make outer-layer circuit successively on multilayer boards and make solder mask；
S6, the outer layer daughter board gong corresponded on multi-layer board at ladder platform is fallen, forms ladder platform；
S7 and then multi-layer board is surface-treated successively and molding procedure, stepped plate is made.
2. the solder-resisting manufacturing methods of stepped plate according to claim 1, which is characterized in that further included between step S2 and S3
Step S21：The periphery milling blind slot at ladder platform is corresponded on outer straton plate.
3. the solder-resisting manufacturing methods of stepped plate according to claim 2, which is characterized in that in step S3, during pressing, outer layer
The inside that is placed on one side of milling blind slot is bonded with not gummosis PP on daughter board.
4. the solder-resisting manufacturing methods of stepped plate according to claim 1, which is characterized in that in step S3, the windowing
Size is unilateral bigger 0.2-0.5mm than ladder platform size.
5. the solder-resisting manufacturing methods of stepped plate according to claim 1, which is characterized in that the internal layer daughter board is single core
Plate is pressed by multiple core plates.
6. the solder-resisting manufacturing methods of stepped plate according to claim 1, which is characterized in that the outer layer daughter board is single core
Plate is pressed by multiple core plates.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711266709.6A CN108055787A (en) | 2017-12-05 | 2017-12-05 | A kind of solder-resisting manufacturing methods of stepped plate |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711266709.6A CN108055787A (en) | 2017-12-05 | 2017-12-05 | A kind of solder-resisting manufacturing methods of stepped plate |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108966498A (en) * | 2018-08-03 | 2018-12-07 | 诚亿电子（嘉兴）有限公司 | The direct compression method of core material |
| CN111757603A (en) * | 2020-06-08 | 2020-10-09 | 大连崇达电路有限公司 | Processing method for improving oxidation of metal surface of small PCS plate |
| CN112654175A (en) * | 2020-11-12 | 2021-04-13 | 安徽四创电子股份有限公司 | Method for manufacturing solder resist PCB in blind groove by uncovering method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006165494A (en) * | 2004-12-02 | 2006-06-22 | Samsung Electro Mech Co Ltd | Manufacturing method of printed circuit board and thin printed circuit board |
| CN102548258A (en) * | 2011-12-28 | 2012-07-04 | 东莞生益电子有限公司 | Production method of stepped groove circuit board with through hole, soldermask and circuit graphics at groove bottom |
| CN103313515A (en) * | 2012-03-15 | 2013-09-18 | 北大方正集团有限公司 | Manufacturing method of printed circuit board stepped slot and printed circuit board comprising stepped slot |
-
2017
- 2017-12-05 CN CN201711266709.6A patent/CN108055787A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006165494A (en) * | 2004-12-02 | 2006-06-22 | Samsung Electro Mech Co Ltd | Manufacturing method of printed circuit board and thin printed circuit board |
| CN102548258A (en) * | 2011-12-28 | 2012-07-04 | 东莞生益电子有限公司 | Production method of stepped groove circuit board with through hole, soldermask and circuit graphics at groove bottom |
| CN103313515A (en) * | 2012-03-15 | 2013-09-18 | 北大方正集团有限公司 | Manufacturing method of printed circuit board stepped slot and printed circuit board comprising stepped slot |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108966498A (en) * | 2018-08-03 | 2018-12-07 | 诚亿电子（嘉兴）有限公司 | The direct compression method of core material |
| CN111757603A (en) * | 2020-06-08 | 2020-10-09 | 大连崇达电路有限公司 | Processing method for improving oxidation of metal surface of small PCS plate |
| CN111757603B (en) * | 2020-06-08 | 2023-09-12 | 大连崇达电路有限公司 | Processing method for improving oxidation of small PCS (process control System) plate metal surface |
| CN112654175A (en) * | 2020-11-12 | 2021-04-13 | 安徽四创电子股份有限公司 | Method for manufacturing solder resist PCB in blind groove by uncovering method |
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