CN108323037A - A kind of PCB processing technologys of two-sided ladder position electricity gold - Google Patents
A kind of PCB processing technologys of two-sided ladder position electricity gold Download PDFInfo
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- CN108323037A CN108323037A CN201810045409.3A CN201810045409A CN108323037A CN 108323037 A CN108323037 A CN 108323037A CN 201810045409 A CN201810045409 A CN 201810045409A CN 108323037 A CN108323037 A CN 108323037A
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- internal layer
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention discloses a kind of PCB processing technologys of two-sided ladder position electricity gold, including internal layer daughter board and outer layer daughter board, include the following steps：Internal layer circuit and internal layer electroplate lead wire are made on inner- electron plate；Making solder mask at ladder platform is corresponded on inner- electron plate；Patch Protection glue band at ladder platform is corresponded on inner- electron plate；Internal layer daughter board and outer layer daughter board are pressed together and to form multi-layer board；It drilled successively to multi-layer board, heavy copper, electric plating of whole board, make outer-layer circuit and make solder mask process, outer layer electroplate lead wire is produced together when making outer-layer circuit；The outer layer daughter board gong corresponded on multi-layer board at ladder platform is fallen, two-sided ladder platform is formed；Pad pasting protects non-welding resistance windowing position on multilayer boards, and electronickelling gold and thick metal plated is carried out successively in welding resistance windowing position；Then molding and electric performance test process are carried out to multi-layer board successively, stepped plate is made.The electric carat (measure of the purity of gold) of internal layer and outer layer can be once electroplated in the method for the present invention, save the golden flow of secondary internal layer electricity.
Description
Technical field
The present invention relates to printed wiring board manufacture technology fields, and in particular to a kind of PCB processing of two-sided ladder position electricity gold
Technique.
Background technology
Some have the printed circuit board of specific demand in the production process, and assist side two sides is needed to design ladder platform,
And electric golden face need to be exposed at ladder platform.
Current stepped plate is mostly edges of boards golden finger position stepped plate, and such stepped plate can pass through the molding mode of rear process
Remove electroplate lead wire (electric gold wire)；The mode of this removal electroplate lead wire, is only applicable to golden finger top neatly and golden finger
Positioned at the stepped plate of edges of boards, it is not suitable for locally needing the stepped plate of electric gold in plate；And for needing to expose at ladder platform
The product in electric gold face, needs to do an electroplating gold flow respectively in internal layer and outer layer, long flow path, and production efficiency is slow.
Invention content
There is drawbacks described above in the present invention, provide a kind of PCB of two-sided ladder position electricity gold and add for existing stepped plate
The electric carat (measure of the purity of gold) of internal layer and outer layer can be disposably electroplated by optimized production process flow in work technique, this method, save primary
The golden flow of internal layer electricity.
In order to solve the above technical problem, the present invention provides a kind of PCB processing technologys of two-sided ladder position electricity gold, including
Internal layer daughter board and outer layer daughter board, the processing technology include the following steps：
S1, internal layer circuit is made on inner- electron plate, and produce internal layer electroplate lead wire together；
S2, making solder mask at ladder platform is corresponded on inner- electron plate, and plating area is being needed to carry out welding resistance windowing；
S3：Patch Protection glue band at ladder platform is corresponded on inner- electron plate；
S4, it presses together internal layer daughter board and outer layer daughter board to form multi-layer board by not gummosis PP, and in not gummosis PP
It opens a window at upper corresponding ladder platform；
S5, it drills to multi-layer board, and hole metallization is made by heavy copper and electric plating of whole board；
S6, it makes outer-layer circuit successively on multilayer boards and makes solder mask, produced together when making outer-layer circuit outer
Layer electroplate lead wire；When making solder mask, welding resistance windowing is carried out needing plating area；
S7, the outer layer daughter board gong corresponded on multi-layer board at ladder platform is fallen, forms two-sided ladder platform；
Protection glue band at S8, removal ladder platform, then pad pasting on multilayer boards, and opened in welding resistance windowing position
Window；
S9, welding resistance windowing position carry out successively electronickelling gold and it is thick metal plated；
S10 then successively to multi-layer board carry out molding and electric performance test process, be made stepped plate.
Preferably, in step S3, Protection glue band and internal layer daughter board are fit together by quick pressing.
Preferably, further include step S31 between step S3 and S4：The periphery milling at ladder platform is corresponded on outer straton plate
Blind slot.
Preferably, in step S4, when pressing, the inside that is placed on one side of milling blind slot is bonded with not gummosis PP on outer layer daughter board.
Preferably, in step S4, the size of the windowing is unilateral bigger 0.2-0.5mm than ladder platform size.
Preferably, the internal layer electroplate lead wire and outer layer electroplate lead wire may be contained between two cell boards close to form wire
On pad side, in step S10, when molding, internal layer electroplate lead wire was removed by way of gong set shapes and outer layer plating is drawn
Line.
Preferably, the internal layer daughter board is single core plate or is pressed by multiple core plates.
Preferably, the outer layer daughter board is single core plate or is pressed by multiple core plates.
Compared with prior art, the present invention has the advantages that：
The present invention is by optimize technique production procedure, after inner- electron plate makes internal layer circuit, in corresponding ladder platform
Place first make solder mask, and expose welding resistance windowing position be protected from oxidation with Protection glue band, then again with the resistance in outer-layer circuit
Weldering windowing position carries out electronickelling gold together, saves the flow of secondary internal layer electricity gold, improves production efficiency；And plating is drawn
Line is set between two cell boards on the pad side on form wire, can be electroplated by being removed when later stage gong set shape
Lead makes the method for the present invention be applicable to the product of electricity gold in part in plate.
Specific implementation mode
In order to more fully understand the technology contents of the present invention, below in conjunction with specific embodiment to the technical side of the present invention
Case is described further and illustrates.
Embodiment 1
A kind of production method of stepped plate shown in the present embodiment, the PCB processing technologys of especially two-sided ladder position electricity gold,
Including core material and outer layer core plate, the production method includes following treatment process successively：
(1), sawing sheet：Core material and outer layer core plate, core material and outer layer are outputed by jigsaw size 320mm × 420mm
Core plate plate thickness is 0.5mm, and the outer layer copper face thickness of core material and outer layer core plate is 0.5OZ.
(2), internal layer circuit (negative film technique) is made：According to figure location hole, on core material and outer layer core plate respectively
It is coated with light-sensitive surface, 8 μm of the film thickness monitoring of light-sensitive surface, using Full-automatic exposure machine, with 5-6 lattice exposure guide rule (21 with vertical application machine
Lattice exposure guide rule) complete internal layer circuit exposure；Internal layer etch, by after exposure imaging core material and outer layer core plate etch respectively
Internal layer circuit, and produce internal layer electroplate lead wire together on core material, it is 3mil that internal layer line width, which measures, is wrapped in internal layer circuit
Include the region (such as golden finger) that need to be electroplated and pad；Internal layer AOI, then check internal layer circuit opens short circuit, circuit notch, line
The defects of road pin hole, defective to scrap processing, flawless product goes out to downstream.
(3), it opens a window：According to design requirement, making solder mask at ladder platform is corresponded on core material, and needing to be electroplated
Region (such as golden finger) carries out welding resistance windowing, and solder mask protects the circuit of non-welding resistance windowing position at ladder platform.
(4), fast pressure：Correspond at ladder platform patch Protection glue band on core material, protection plating area it is not oxidized and
Facilitate the later stage to take off lid, Protection glue band is fit together with core material by quick pressing, the parameter such as following table of quick pressing
It is shown：
| Temperature (DEG C) | Pressure (kg) | Preheating time (s) | Molding time (s) |
| 110±5 | 5-35 | 5-20 | 20-45 |
(5), milling blind slot：According to design requirement, the periphery at ladder platform is corresponded on outer layer core plate and passes through controlled depth milling slot
Mode milling blind slot.
(6) it opens a window：It corresponds on not gummosis PP and opens a window at ladder platform, the size of windowing is unilateral than ladder platform ruler
Very little big 0.2-0.5mm, facilitates the later stage to take off lid.
(7), it presses：Brown speed according to bottom copper copper thickness brown, by not gummosis PP by core material and outer layer core plate according to
It after secondary overlapping, is pressed according to the characteristic of plate selection lamination appropriate, formation multi-layer board, milling blind slot on outer layer core plate
Be placed on one side inside be bonded with not gummosis PP.
(8), outer layer drills：Drilling processing is carried out to multi-layer board using borehole data.
(9), heavy copper:The hole metallization on multi-layer board, backlight is set to test 10 grades, the heavy copper thickness in hole is 0.5 μm.
(10), electric plating of whole board：According to the prior art and by design requirement to multi-layer board carry out electric plating of whole board, thicken plate face and
Layers of copper in hole.
(11), outer-layer circuit makes (positive blade technolgy)：Outer graphics shift, luxuriant and rich with fragrance using Full-automatic exposure machine and positive circuit
Woods completes outer-layer circuit exposure with 5-7 lattice exposure guide rule (21 lattice exposure guide rule), developed, forms outer-layer circuit figure on multilayer boards
Shape；Outer graphics are electroplated, and then distinguish copper facing and tin plating on multilayer boards, copper facing is the current density electric plating of whole board with 1.8ASD
60min, tin plating is that 10min, 3-5 μm of tin thickness is electroplated with the current density of 1.2ASD；Then it moves back film successively again, etch and move back tin,
Outer-layer circuit is etched on multilayer boards, and produces outer layer electroplate lead wire together, includes to need plating area in outer-layer circuit
(such as golden finger) and pad；Then outer layer AOI checks the defects of opening short circuit, circuit notch, circuit pin hole of outer-layer circuit, has
Defect scraps processing, and flawless product goes out to downstream.
(12), welding resistance, silk-screen character：Make solder mask and silk-screen on multilayer boards according to the prior art and by design requirement
Character, and plating area (such as golden finger) is being needed to carry out welding resistance windowing.
(13), gong platform：The outer layer core plate gong corresponded on multi-layer board two sides at ladder platform is fallen, it is flat to form two-sided ladder
Platform.
Specifically, inside controlled depth milling slot is corresponded at the position of ladder platform on the lateral surface of outer layer core plate in multi-layer board extremely
At blind slot, takes off lid and form two-sided ladder platform afterwards (with taking off on lid tool removal multi-layer board by the part of mill off).
(14) pad pasting：Remove the Protection glue band at ladder platform, then paste dry film on multilayer boards, and in superficies and
It opens a window at welding resistance windowing position at ladder platform.
(15), electronickelling gold：According to the prior art, using internal layer electroplate lead wire and outer layer electroplate lead wire to welding resistance windowing position
It is electroplated, uniformly-coating centainly requires the nickel layer and layer gold of thickness.
(16) thick metal plated：By thick metal plated processing, the thickness of layer gold is electroplated onto to the thickness of design requirement.
(17), it is molded：According to the prior art and design requirement gong set (cell board) shape is pressed, stepped plate is made
Among the above, internal layer electroplate lead wire and outer layer electroplate lead wire may be contained between two set plates (cell board) close at
Pad side on molded line is simultaneously connected to edges of boards, and internal layer electroplate lead wire and outer is removed by way of gong set (cell board) shape
Layer electroplate lead wire.
(18), electric performance test：The electric property for detecting stepped plate detects qualified stepped plate and enters next processing
Link；
(19), final inspection：Appearance, hole copper thickness, thickness of dielectric layers, green oil thickness, the internal layer copper thickness etc. of finished product are taken a sample test respectively,
Qualified product can shipment.
Embodiment 2
A kind of production method of stepped plate shown in the present embodiment, the PCB processing technologys of especially two-sided ladder position electricity gold,
Including internal layer daughter board and outer layer daughter board, the production method includes following treatment process successively：
(1), sawing sheet：Core plate is outputed by jigsaw size 320mm × 420mm, core plate plate thickness is 0.5mm, the outer layer copper of core plate
Face thickness is 0.5OZ.
(2), internal layer circuit (negative film technique) is made：According to figure location hole, with the coating sense of vertical application machine on core plate
Light film, 8 μm of the film thickness monitoring of light-sensitive surface complete interior layer line using Full-automatic exposure machine with 5-6 lattice exposure guide rule (21 lattice exposure guide rule)
Road exposes；Internal layer etches, and the core plate after exposure imaging is etched internal layer circuit, it is 3mil that internal layer line width, which measures,；Internal layer AOI,
Then the defects of opening short circuit, circuit notch, circuit pin hole of internal layer circuit is checked, it is defective to scrap processing, flawless product
Go out to downstream.
(3), it presses：By design requirement, internal layer daughter board, and other different polylith core plates are formed after polylith core plate is pressed
Outer layer daughter board is formed after pressing.
(4), internal layer circuit (negative film technique) is made：According to figure location hole, on inner- electron plate and outer layer daughter board respectively
It is coated with light-sensitive surface, 8 μm of the film thickness monitoring of light-sensitive surface, using Full-automatic exposure machine, with 5-6 lattice exposure guide rule (21 with vertical application machine
Lattice exposure guide rule) complete internal layer circuit exposure；Internal layer etch, by after exposure imaging internal layer daughter board and outer layer daughter board etch respectively
Internal layer circuit, and produce internal layer electroplate lead wire together on inner- electron plate, it is 3mil that internal layer line width, which measures, is wrapped in internal layer circuit
Include the region (such as golden finger) that need to be electroplated and pad；Internal layer AOI, then check internal layer circuit opens short circuit, circuit notch, line
The defects of road pin hole, defective to scrap processing, flawless product goes out to downstream.
(5), it opens a window：According to design requirement, making solder mask at ladder platform is corresponded on inner- electron plate, and needing to be electroplated
Region (such as golden finger) carries out welding resistance windowing, and solder mask protects the circuit of non-welding resistance windowing position at ladder platform.
(6), fast pressure：Correspond at ladder platform patch Protection glue band on inner- electron plate, protection plating area it is not oxidized and
Facilitate the later stage to take off lid, Protection glue band and internal layer daughter board are fit together by quick pressing, the parameter such as following table of quick pressing
It is shown：
| Temperature (DEG C) | Pressure (kg) | Preheating time (s) | Molding time (s) |
| 110±5 | 5-35 | 5-20 | 20-45 |
(7), milling blind slot：According to design requirement, the periphery at ladder platform is corresponded on outer straton plate and passes through controlled depth milling slot
Mode milling blind slot.
(8) it opens a window：It corresponds on not gummosis PP and opens a window at ladder platform, the size of windowing is unilateral than ladder platform ruler
Very little big 0.2-0.5mm, facilitates the later stage to take off lid.
(9), it presses：Brown speed according to bottom copper copper thickness brown, by not gummosis PP by internal layer daughter board and outer layer daughter board according to
It after secondary overlapping, is pressed according to the characteristic of plate selection lamination appropriate, formation multi-layer board, milling blind slot on outer layer core plate
Be placed on one side inside be bonded with not gummosis PP.
(10), outer layer drills：Drilling processing is carried out to multi-layer board using borehole data.
(11), heavy copper:The hole metallization on multi-layer board, backlight is set to test 10 grades, the heavy copper thickness in hole is 0.5 μm.
(12), electric plating of whole board：According to the prior art and by design requirement to multi-layer board carry out electric plating of whole board, thicken plate face and
Layers of copper in hole.
(13), outer-layer circuit makes (positive blade technolgy)：Outer graphics shift, luxuriant and rich with fragrance using Full-automatic exposure machine and positive circuit
Woods completes outer-layer circuit exposure with 5-7 lattice exposure guide rule (21 lattice exposure guide rule), developed, forms outer-layer circuit figure on multilayer boards
Shape；Outer graphics are electroplated, and then distinguish copper facing and tin plating on multilayer boards, copper facing is the current density electric plating of whole board with 1.8ASD
60min, tin plating is that 10min, 3-5 μm of tin thickness is electroplated with the current density of 1.2ASD；Then it moves back film successively again, etch and move back tin,
Outer-layer circuit is etched on multilayer boards, and produces outer layer electroplate lead wire together, includes the area that need to be electroplated in outer-layer circuit
Domain (such as golden finger) and pad；Then outer layer AOI checks the defects of opening short circuit, circuit notch, circuit pin hole of outer-layer circuit,
Defective to scrap processing, flawless product goes out to downstream.
(14), welding resistance, silk-screen character：Make solder mask and silk-screen on multilayer boards according to the prior art and by design requirement
Character, and plating area (such as golden finger) is being needed to carry out welding resistance windowing.
(15), gong platform：The outer layer core plate gong corresponded on multi-layer board two sides at ladder platform is fallen, it is flat to form two-sided ladder
Platform.
Specifically, inside controlled depth milling slot is corresponded at the position of ladder platform on the lateral surface of outer layer core plate in multi-layer board extremely
At blind slot, takes off lid and form two-sided ladder platform afterwards (with taking off on lid tool removal multi-layer board by the part of mill off).
(16) pad pasting：Remove the Protection glue band at ladder platform, then paste dry film on multilayer boards, and in superficies and
It opens a window at welding resistance windowing position at ladder platform.
(17), electronickelling gold：According to the prior art, using internal layer electroplate lead wire and outer layer electroplate lead wire to welding resistance windowing position
It is electroplated, uniformly-coating centainly requires the nickel layer and layer gold of thickness.
(18) thick metal plated：By thick metal plated processing, the thickness of layer gold is electroplated onto to the thickness of design requirement.
(19), it is molded：According to the prior art and design requirement gong set (cell board) shape is pressed, stepped plate is made
Among the above, internal layer electroplate lead wire and outer layer electroplate lead wire may be contained between two set plates (cell board) close at
Pad side on molded line is simultaneously connected to edges of boards, and internal layer electroplate lead wire and outer is removed by way of gong set (cell board) shape
Layer electroplate lead wire.
(20), electric performance test：The electric property for detecting stepped plate detects qualified stepped plate and enters next processing
Link；
(21), final inspection：Appearance, hole copper thickness, thickness of dielectric layers, green oil thickness, the internal layer copper thickness etc. of finished product are taken a sample test respectively,
Qualified product can shipment.
It is provided for the embodiments of the invention technical solution above to be described in detail, specific case used herein
The principle and embodiment of the embodiment of the present invention are expounded, the explanation of above example is only applicable to help to understand this
The principle of inventive embodiments；Meanwhile for those of ordinary skill in the art, embodiment according to the present invention, in specific embodiment party
There will be changes in formula and application range, in conclusion the content of the present specification should not be construed as limiting the invention.
Claims (8)
1. a kind of PCB processing technologys of two-sided ladder position electricity gold, including internal layer daughter board and outer layer daughter board, which is characterized in that described
Processing technology includes the following steps：
S1, internal layer circuit is made on inner- electron plate, and produce internal layer electroplate lead wire together；
S2, making solder mask at ladder platform is corresponded on inner- electron plate, and plating area is being needed to carry out welding resistance windowing；
S3：Patch Protection glue band at ladder platform is corresponded on inner- electron plate；
S4, it presses together internal layer daughter board and outer layer daughter board to form multi-layer board by not gummosis PP, and right on not gummosis PP
It answers and opens a window at ladder platform；
S5, it drills to multi-layer board, and hole metallization is made by heavy copper and electric plating of whole board；
S6, it makes outer-layer circuit successively on multilayer boards and makes solder mask, produce outer layer electricity when making outer-layer circuit together
Plate lead；When making solder mask, welding resistance windowing is carried out needing plating area；
S7, the outer layer daughter board gong corresponded on multi-layer board at ladder platform is fallen, forms two-sided ladder platform；
Protection glue band at S8, removal ladder platform, then pad pasting on multilayer boards, and open a window in welding resistance windowing position；
S9, welding resistance windowing position carry out successively electronickelling gold and it is thick metal plated；
S10 then successively to multi-layer board carry out molding and electric performance test process, be made stepped plate.
2. the PCB processing technologys of two-sided ladder position electricity gold according to claim 1, which is characterized in that in step S3, pass through
Quick pressing fits together Protection glue band and internal layer daughter board.
3. the PCB processing technologys of two-sided ladder position electricity gold according to claim 1 or 2, which is characterized in that step S3 and S4
Between further include step S31：The periphery milling blind slot at ladder platform is corresponded on outer straton plate.
4. the PCB processing technologys of two-sided ladder position electricity gold according to claim 3, which is characterized in that in step S4, pressing
When, the inside that is placed on one side of milling blind slot is bonded with not gummosis PP on outer layer daughter board.
5. the PCB processing technologys of two-sided ladder position electricity gold according to claim 1, which is characterized in that described in step S4
The size of windowing is unilateral bigger 0.2-0.5mm than ladder platform size.
6. the PCB processing technologys of two-sided ladder position electricity gold according to claim 1, which is characterized in that the internal layer plating
Lead and outer layer electroplate lead wire may be contained between two cell boards in the pad side on form wire, step S10, molding
When remove internal layer electroplate lead wire and outer layer electroplate lead wire by way of gong set shapes.
7. the PCB processing technologys of two-sided ladder position electricity gold according to claim 1, which is characterized in that the internal layer daughter board
It is single core plate or is pressed by multiple core plates.
8. the PCB processing technologys of two-sided ladder position electricity gold according to claim 1, which is characterized in that the outer layer daughter board
It is single core plate or is pressed by multiple core plates.
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| CN201810045409.3A CN108323037B (en) | 2018-01-17 | 2018-01-17 | PCB processing technology of double-sided step position electro-gold |
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|---|---|---|---|
| CN201810045409.3A CN108323037B (en) | 2018-01-17 | 2018-01-17 | PCB processing technology of double-sided step position electro-gold |
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| CN108323037B CN108323037B (en) | 2020-07-24 |
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| CN108966532A (en) * | 2018-08-20 | 2018-12-07 | 深圳崇达多层线路板有限公司 | A kind of production method of three rank HDI plates of the golden finger containing ladder |
| CN109041458A (en) * | 2018-09-25 | 2018-12-18 | 郑州云海信息技术有限公司 | A kind of wiring board and its manufacturing method |
| CN109302802A (en) * | 2018-12-03 | 2019-02-01 | 深圳市博敏电子有限公司 | A kind of manufacturing method exempted from V-cut and stamp hole and spell stepped groove wiring board more |
| CN110290641A (en) * | 2019-06-14 | 2019-09-27 | 广合科技（广州）有限公司 | A kind of high thickness to diameter ratio ladder method for manufacturing gold finger and preparation method thereof |
| CN110933872A (en) * | 2019-11-19 | 2020-03-27 | 广合科技（广州）有限公司 | Stepped gold-plated plug type PCB (printed circuit board) based sectional board manufacturing method |
| CN111757603A (en) * | 2020-06-08 | 2020-10-09 | 大连崇达电路有限公司 | Processing method for improving oxidation of metal surface of small PCS plate |
| CN112218449A (en) * | 2019-07-09 | 2021-01-12 | 梅州市鸿利线路板有限公司 | Double-sided circuit board processing technology |
| CN112752443A (en) * | 2020-12-05 | 2021-05-04 | 深圳市强达电路有限公司 | Processing method of printed circuit board with step position containing bonding structure |
| CN113613415A (en) * | 2021-10-11 | 2021-11-05 | 四川英创力电子科技股份有限公司 | Printed circuit board and non-metallized step groove processing technology thereof |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108966532A (en) * | 2018-08-20 | 2018-12-07 | 深圳崇达多层线路板有限公司 | A kind of production method of three rank HDI plates of the golden finger containing ladder |
| CN109041458A (en) * | 2018-09-25 | 2018-12-18 | 郑州云海信息技术有限公司 | A kind of wiring board and its manufacturing method |
| CN109302802A (en) * | 2018-12-03 | 2019-02-01 | 深圳市博敏电子有限公司 | A kind of manufacturing method exempted from V-cut and stamp hole and spell stepped groove wiring board more |
| CN110290641A (en) * | 2019-06-14 | 2019-09-27 | 广合科技（广州）有限公司 | A kind of high thickness to diameter ratio ladder method for manufacturing gold finger and preparation method thereof |
| CN112218449A (en) * | 2019-07-09 | 2021-01-12 | 梅州市鸿利线路板有限公司 | Double-sided circuit board processing technology |
| CN110933872A (en) * | 2019-11-19 | 2020-03-27 | 广合科技（广州）有限公司 | Stepped gold-plated plug type PCB (printed circuit board) based sectional board manufacturing method |
| CN111757603A (en) * | 2020-06-08 | 2020-10-09 | 大连崇达电路有限公司 | Processing method for improving oxidation of metal surface of small PCS plate |
| CN111757603B (en) * | 2020-06-08 | 2023-09-12 | 大连崇达电路有限公司 | Processing method for improving oxidation of small PCS (process control System) plate metal surface |
| CN112752443A (en) * | 2020-12-05 | 2021-05-04 | 深圳市强达电路有限公司 | Processing method of printed circuit board with step position containing bonding structure |
| CN113613415A (en) * | 2021-10-11 | 2021-11-05 | 四川英创力电子科技股份有限公司 | Printed circuit board and non-metallized step groove processing technology thereof |
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